WO2009069560A1 - 電子回路基板、電子回路基板のシールド方法および構造 - Google Patents

電子回路基板、電子回路基板のシールド方法および構造 Download PDF

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Publication number
WO2009069560A1
WO2009069560A1 PCT/JP2008/071260 JP2008071260W WO2009069560A1 WO 2009069560 A1 WO2009069560 A1 WO 2009069560A1 JP 2008071260 W JP2008071260 W JP 2008071260W WO 2009069560 A1 WO2009069560 A1 WO 2009069560A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
electronic circuit
conductor components
plate
shielding
Prior art date
Application number
PCT/JP2008/071260
Other languages
English (en)
French (fr)
Inventor
Kazuto Satou
Original Assignee
Nec Display Solutions, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Display Solutions, Ltd. filed Critical Nec Display Solutions, Ltd.
Priority to EP08854603.1A priority Critical patent/EP2217050B1/en
Priority to US12/733,952 priority patent/US8362370B2/en
Priority to CN200880115349.2A priority patent/CN101855953A/zh
Publication of WO2009069560A1 publication Critical patent/WO2009069560A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49227—Insulator making

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

　本発明は電子部品の個々のシールドを、熱交換効率が良く、安価かつ容易に行うことができる技術を提供することを目的とし、本発明による電子回路基板は、電子回路基板上の電子部品の周囲のグランドパターンに立設された伸縮可能な複数の導体部品と、導電性の板と、前記複数の導体部品が自然長よりも縮んだ状態で前記板に接触するように前記板を保持する固定部材とを備える。
PCT/JP2008/071260 2007-11-26 2008-11-21 電子回路基板、電子回路基板のシールド方法および構造 WO2009069560A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08854603.1A EP2217050B1 (en) 2007-11-26 2008-11-21 Electronic circuit board, and method and structure for shielding electronic circuit board
US12/733,952 US8362370B2 (en) 2007-11-26 2008-11-21 Electronic circuit board and electronic circuit board shield method and construction
CN200880115349.2A CN101855953A (zh) 2007-11-26 2008-11-21 电子电路板以及电子电路板的屏蔽方法和结构

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007304384A JP2009130181A (ja) 2007-11-26 2007-11-26 電子回路基板、電子回路基板のシールド方法および構造
JP2007-304384 2007-11-26

Publications (1)

Publication Number Publication Date
WO2009069560A1 true WO2009069560A1 (ja) 2009-06-04

Family

ID=40678458

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/071260 WO2009069560A1 (ja) 2007-11-26 2008-11-21 電子回路基板、電子回路基板のシールド方法および構造

Country Status (5)

Country Link
US (1) US8362370B2 (ja)
EP (1) EP2217050B1 (ja)
JP (1) JP2009130181A (ja)
CN (1) CN101855953A (ja)
WO (1) WO2009069560A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD739349S1 (en) * 2013-02-12 2015-09-22 IDEMITSU KOGYO Co., LTD. Current plate for insulation washer for power transformer
CN106535606B (zh) * 2016-12-30 2024-05-10 深圳天珑无线科技有限公司 射频屏蔽装置
EP3860325A4 (en) * 2018-09-28 2022-06-22 Sony Interactive Entertainment Inc. ELECTRONIC DEVICE
CN111107204B (zh) * 2019-12-27 2021-11-16 惠州Tcl移动通信有限公司 一种触摸屏组件和移动终端

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000156588A (ja) * 1998-11-19 2000-06-06 Sharp Corp チップ部品のシールド構造
JP2002124794A (ja) * 2000-10-13 2002-04-26 Nec Corp 高周波シールド構造
JP2004071629A (ja) * 2002-08-01 2004-03-04 Toshiba Corp シールド構造およびシールド構造を有する電子機器
JP2006237036A (ja) 2005-02-22 2006-09-07 Matsushita Electric Ind Co Ltd 電子部品のシールド構造および電子機器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06275984A (ja) * 1993-03-22 1994-09-30 Toshiba Corp セラミック配線板
JPH06314286A (ja) 1993-04-30 1994-11-08 Casio Comput Co Ltd データ処理方法
JPH07183683A (ja) * 1993-12-24 1995-07-21 Nec Corp シールド構造
US5428508A (en) * 1994-04-29 1995-06-27 Motorola, Inc. Method for providing electromagnetic shielding of an electrical circuit
JP3338976B2 (ja) * 1995-07-27 2002-10-28 モレックス インコーポレーテッド 電磁シールド用接続端子
CN1196870A (zh) 1995-09-22 1998-10-21 梅特利通信公司 电路板的射频屏蔽盒
GB2349757B (en) * 1999-03-20 2003-07-16 Nec Technologies Watchdog circuit
JP2001077575A (ja) * 1999-09-08 2001-03-23 Mitsubishi Electric Corp 電磁シールド構造
JP2001119185A (ja) * 1999-10-22 2001-04-27 Oki Electric Ind Co Ltd 通信端末基板のシールド構造
JP2002314286A (ja) * 2001-04-10 2002-10-25 Hitachi Ltd 電子装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000156588A (ja) * 1998-11-19 2000-06-06 Sharp Corp チップ部品のシールド構造
JP2002124794A (ja) * 2000-10-13 2002-04-26 Nec Corp 高周波シールド構造
JP2004071629A (ja) * 2002-08-01 2004-03-04 Toshiba Corp シールド構造およびシールド構造を有する電子機器
JP2006237036A (ja) 2005-02-22 2006-09-07 Matsushita Electric Ind Co Ltd 電子部品のシールド構造および電子機器

Also Published As

Publication number Publication date
EP2217050B1 (en) 2014-06-04
US8362370B2 (en) 2013-01-29
CN101855953A (zh) 2010-10-06
US20100230153A1 (en) 2010-09-16
EP2217050A4 (en) 2012-12-12
EP2217050A1 (en) 2010-08-11
JP2009130181A (ja) 2009-06-11

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