WO2009069269A1 - 基板の切断方法及び装置 - Google Patents

基板の切断方法及び装置 Download PDF

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Publication number
WO2009069269A1
WO2009069269A1 PCT/JP2008/003403 JP2008003403W WO2009069269A1 WO 2009069269 A1 WO2009069269 A1 WO 2009069269A1 JP 2008003403 W JP2008003403 W JP 2008003403W WO 2009069269 A1 WO2009069269 A1 WO 2009069269A1
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WIPO (PCT)
Prior art keywords
package
inspected
mounting
transferred onto
locking plate
Prior art date
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PCT/JP2008/003403
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English (en)
French (fr)
Inventor
Yasuhiro Iwata
Shuzo Yamaji
Shinya Nakajima
Junko Kashimura
Tadashi Morisawa
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Towa Corporation
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=40678181&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2009069269(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Towa Corporation filed Critical Towa Corporation
Priority to KR1020107010584A priority Critical patent/KR101504790B1/ko
Priority to CN2008801184607A priority patent/CN101878523B/zh
Publication of WO2009069269A1 publication Critical patent/WO2009069269A1/ja

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Dicing (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

　成形済基板１を切断してパッケージ（製品）５を形成する場合に、高品質・高信頼性の製品５を得ると共に、製品５の生産性を向上させる。まず、第一パッケージ係着機構１１で係着された個々のパッケージ５（１ｃ）を反転係止プレート１２のパッケージ載置面（上面）１２ａに移載し、反転係止プレート１２を反転させてパッケージ載置面１２ａを下面側とし、第一検査機構１３にて下方位置から検査する。次に、反転係止プレート１２に保持されていた第一検査済パッケージ５（１ｃ）を載置プレート１４のパッケージ載置面１４ａに受け継いで移載し、第二検査機構１５で第一検査済パッケージ５（１ｃ）を上方位置から検査する。次に、パッケージ載置位置１８ａにおける載置テーブル１７に第二パッケージ係着機構１６にて第二検査済パッケージ５（１ｃ）を移載する。
PCT/JP2008/003403 2007-11-28 2008-11-20 基板の切断方法及び装置 WO2009069269A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020107010584A KR101504790B1 (ko) 2007-11-28 2008-11-20 기판의 절단방법 및 장치
CN2008801184607A CN101878523B (zh) 2007-11-28 2008-11-20 基板的切断方法及装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-307391 2007-11-28
JP2007307391A JP5192790B2 (ja) 2007-11-28 2007-11-28 基板の切断方法及び装置

Publications (1)

Publication Number Publication Date
WO2009069269A1 true WO2009069269A1 (ja) 2009-06-04

Family

ID=40678181

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003403 WO2009069269A1 (ja) 2007-11-28 2008-11-20 基板の切断方法及び装置

Country Status (6)

Country Link
JP (1) JP5192790B2 (ja)
KR (1) KR101504790B1 (ja)
CN (1) CN101878523B (ja)
MY (1) MY169601A (ja)
TW (1) TWI455195B (ja)
WO (1) WO2009069269A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102881610A (zh) * 2012-10-08 2013-01-16 如皋市易达电子有限责任公司 一种贴片二极管快速质检组合工装

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5544585B2 (ja) * 2010-07-13 2014-07-09 アピックヤマダ株式会社 樹脂モールド装置及びワーク板厚測定装置
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法
JP6235391B2 (ja) * 2014-03-27 2017-11-22 Ｔｏｗａ株式会社 検査用治具、切断装置及び切断方法
JP6218686B2 (ja) * 2014-07-17 2017-10-25 Ｔｏｗａ株式会社 基板切断装置および基板切断方法
JP6482454B2 (ja) * 2015-12-18 2019-03-13 Ｔｏｗａ株式会社 電子部品の製造方法ならびに電子部品製造装置
JP2023102048A (ja) 2022-01-11 2023-07-24 Ｔｏｗａ株式会社 加工装置、及び、加工品の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590365A (ja) * 1991-09-27 1993-04-09 Hitachi Ltd 検査装置
JPH1019789A (ja) * 1996-06-28 1998-01-23 Hitachi Ltd 半導体装置の製造方法
JP2000132687A (ja) * 1998-10-28 2000-05-12 Nec Corp 欠陥検査装置、及び欠陥検査方法
JP2002031603A (ja) * 2000-07-14 2002-01-31 Hitachi Ltd 半導体装置の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4137471B2 (ja) * 2002-03-04 2008-08-20 東京エレクトロン株式会社 ダイシング方法、集積回路チップの検査方法及び基板保持装置
JP4796271B2 (ja) * 2003-07-10 2011-10-19 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4454608B2 (ja) * 2006-09-13 2010-04-21 株式会社ルネサステクノロジ 半導体集積回路装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0590365A (ja) * 1991-09-27 1993-04-09 Hitachi Ltd 検査装置
JPH1019789A (ja) * 1996-06-28 1998-01-23 Hitachi Ltd 半導体装置の製造方法
JP2000132687A (ja) * 1998-10-28 2000-05-12 Nec Corp 欠陥検査装置、及び欠陥検査方法
JP2002031603A (ja) * 2000-07-14 2002-01-31 Hitachi Ltd 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102881610A (zh) * 2012-10-08 2013-01-16 如皋市易达电子有限责任公司 一种贴片二极管快速质检组合工装

Also Published As

Publication number Publication date
TWI455195B (zh) 2014-10-01
MY169601A (en) 2019-04-22
JP2009130342A (ja) 2009-06-11
TW200939334A (en) 2009-09-16
KR20100099117A (ko) 2010-09-10
CN101878523A (zh) 2010-11-03
JP5192790B2 (ja) 2013-05-08
CN101878523B (zh) 2012-07-25
KR101504790B1 (ko) 2015-03-20

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