WO2009057715A1 - マグネトロンユニット、マグネトロンスパッタリング装置及び電子デバイスの製造方法 - Google Patents
マグネトロンユニット、マグネトロンスパッタリング装置及び電子デバイスの製造方法 Download PDFInfo
- Publication number
- WO2009057715A1 WO2009057715A1 PCT/JP2008/069799 JP2008069799W WO2009057715A1 WO 2009057715 A1 WO2009057715 A1 WO 2009057715A1 JP 2008069799 W JP2008069799 W JP 2008069799W WO 2009057715 A1 WO2009057715 A1 WO 2009057715A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- magnet
- magnetron
- electronic device
- polarity
- sputtering apparatus
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP08843409A EP2204469A4 (en) | 2007-10-31 | 2008-10-30 | MAGNETRON, CATHODE MAGNETRON SPRAY APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE |
JP2009506456A JP4314318B2 (ja) | 2007-10-31 | 2008-10-30 | マグネトロンユニット、マグネトロンスパッタリング装置及び電子デバイスの製造方法 |
CN2008800028071A CN101595240B (zh) | 2007-10-31 | 2008-10-30 | 磁控管单元、磁控管溅射设备和制造电子器件的方法 |
US12/477,510 US7785449B2 (en) | 2007-10-31 | 2009-06-03 | Magnetron unit, magnetron sputtering apparatus, and method of manufacturing electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-283438 | 2007-10-31 | ||
JP2007283438 | 2007-10-31 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/477,510 Continuation US7785449B2 (en) | 2007-10-31 | 2009-06-03 | Magnetron unit, magnetron sputtering apparatus, and method of manufacturing electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009057715A1 true WO2009057715A1 (ja) | 2009-05-07 |
Family
ID=40591099
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/069799 WO2009057715A1 (ja) | 2007-10-31 | 2008-10-30 | マグネトロンユニット、マグネトロンスパッタリング装置及び電子デバイスの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7785449B2 (ja) |
EP (1) | EP2204469A4 (ja) |
JP (2) | JP4314318B2 (ja) |
CN (1) | CN101595240B (ja) |
WO (1) | WO2009057715A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110024290A1 (en) * | 2009-07-30 | 2011-02-03 | Hon Hai Precision Industry Co., Ltd. | Magnetic device and magnetron sputtering device using the same |
JP2012186057A (ja) * | 2011-03-07 | 2012-09-27 | Kobe Steel Ltd | プラズマ源及びこのプラズマ源を備えた成膜装置 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009060539A1 (ja) * | 2007-11-09 | 2009-05-14 | Canon Anelva Corporation | インライン型ウェハ搬送装置 |
JP4551490B2 (ja) * | 2008-08-18 | 2010-09-29 | キヤノンアネルバ株式会社 | 磁石ユニットおよびマグネトロンスパッタリング装置 |
EP2159304A1 (en) * | 2008-08-27 | 2010-03-03 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Apparatus and method for atomic layer deposition |
JP5390330B2 (ja) * | 2008-10-16 | 2014-01-15 | キヤノンアネルバ株式会社 | 基板処理装置およびそのクリーニング方法 |
JP2010106349A (ja) * | 2008-10-31 | 2010-05-13 | Canon Anelva Corp | スパッタ装置、薄膜形成装置及び磁気記録媒体の製造方法 |
JP5336151B2 (ja) * | 2008-10-31 | 2013-11-06 | キヤノンアネルバ株式会社 | 薄膜形成装置及び磁気記録媒体の製造方法 |
CN101842512A (zh) * | 2008-12-24 | 2010-09-22 | 佳能安内华股份有限公司 | 溅射设备和成膜方法 |
WO2010073330A1 (ja) | 2008-12-25 | 2010-07-01 | キヤノンアネルバ株式会社 | スパッタリング装置 |
US8776542B2 (en) * | 2009-12-25 | 2014-07-15 | Canon Anelva Corporation | Cooling system |
TWI456082B (zh) * | 2010-03-26 | 2014-10-11 | Univ Nat Sun Yat Sen | 磁控式電漿濺鍍機 |
JP5873276B2 (ja) | 2010-12-27 | 2016-03-01 | キヤノンアネルバ株式会社 | 磁石ユニットおよびマグネトロンスパッタリング装置 |
KR20140109427A (ko) | 2012-01-30 | 2014-09-15 | 미쓰비시덴키 가부시키가이샤 | 자기회로 |
CN104357803B (zh) * | 2014-11-20 | 2017-02-22 | 昆山国显光电有限公司 | 磁控溅射磁铁系统及其控制方法和磁控溅射装置 |
JP6313250B2 (ja) * | 2015-03-11 | 2018-04-18 | 東芝メモリ株式会社 | 半導体製造装置 |
US11073912B2 (en) * | 2016-07-07 | 2021-07-27 | Sekisui Polymatech Co., Ltd. | Magnetic deformable member |
CN112272858A (zh) * | 2018-06-08 | 2021-01-26 | 科诺西斯泰克有限责任公司 | 用于通过阴极溅射技术来沉积材料的机器 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59137965U (ja) * | 1983-03-03 | 1984-09-14 | 日本真空技術株式会社 | マグネトロン型スパツタカソ−ド |
JPH0375369A (ja) | 1989-08-18 | 1991-03-29 | Fuji Photo Film Co Ltd | スパッタリング装置 |
JPH0375368A (ja) * | 1989-08-18 | 1991-03-29 | Fuji Photo Film Co Ltd | スパッタリング装置 |
JPH05148639A (ja) * | 1991-11-22 | 1993-06-15 | Anelva Corp | マグネトロンカソード電極 |
JPH09118980A (ja) | 1995-10-24 | 1997-05-06 | Fujitsu Ltd | スパッタリング装置用のマグネトロンユニット及びスパッタリング装置 |
JPH1025572A (ja) * | 1996-07-11 | 1998-01-27 | Hitachi Ltd | マグネトロンスパッタ装置 |
JP2000212739A (ja) * | 1999-01-27 | 2000-08-02 | Sharp Corp | マグネトロンスパッタ装置 |
JP2007131895A (ja) * | 2005-11-09 | 2007-05-31 | Ulvac Japan Ltd | マグネトロンスパッタ電極及びマグネトロンスパッタ電極を備えたスパッタリング装置 |
JP2007283438A (ja) | 2006-04-17 | 2007-11-01 | Ntt Electornics Corp | ブラスト加工方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59137965A (ja) | 1983-01-28 | 1984-08-08 | Canon Inc | 像形成装置 |
JPH0726202A (ja) | 1993-07-14 | 1995-01-27 | Dainippon Ink & Chem Inc | 水性塗料用樹脂組成物 |
US5980707A (en) * | 1998-12-18 | 1999-11-09 | Sierra Applied Sciences, Inc. | Apparatus and method for a magnetron cathode with moving magnet assembly |
DE60105856T2 (de) * | 2001-03-27 | 2005-10-20 | Fundación Tekniker | Bogenverdampfer mit intensiver magnetführung für grossflächige targets |
US8778144B2 (en) * | 2004-09-28 | 2014-07-15 | Oerlikon Advanced Technologies Ag | Method for manufacturing magnetron coated substrates and magnetron sputter source |
EP1710829A1 (de) * | 2005-04-05 | 2006-10-11 | Applied Films GmbH & Co. KG | Magnetanordnung für ein Planar-Magnetron |
US20070051616A1 (en) * | 2005-09-07 | 2007-03-08 | Le Hienminh H | Multizone magnetron assembly |
-
2008
- 2008-10-30 CN CN2008800028071A patent/CN101595240B/zh active Active
- 2008-10-30 EP EP08843409A patent/EP2204469A4/en not_active Withdrawn
- 2008-10-30 WO PCT/JP2008/069799 patent/WO2009057715A1/ja active Application Filing
- 2008-10-30 JP JP2009506456A patent/JP4314318B2/ja active Active
-
2009
- 2009-05-14 JP JP2009117227A patent/JP2009174061A/ja not_active Withdrawn
- 2009-06-03 US US12/477,510 patent/US7785449B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59137965U (ja) * | 1983-03-03 | 1984-09-14 | 日本真空技術株式会社 | マグネトロン型スパツタカソ−ド |
JPH0375369A (ja) | 1989-08-18 | 1991-03-29 | Fuji Photo Film Co Ltd | スパッタリング装置 |
JPH0375368A (ja) * | 1989-08-18 | 1991-03-29 | Fuji Photo Film Co Ltd | スパッタリング装置 |
JPH05148639A (ja) * | 1991-11-22 | 1993-06-15 | Anelva Corp | マグネトロンカソード電極 |
JPH09118980A (ja) | 1995-10-24 | 1997-05-06 | Fujitsu Ltd | スパッタリング装置用のマグネトロンユニット及びスパッタリング装置 |
JPH1025572A (ja) * | 1996-07-11 | 1998-01-27 | Hitachi Ltd | マグネトロンスパッタ装置 |
JP2000212739A (ja) * | 1999-01-27 | 2000-08-02 | Sharp Corp | マグネトロンスパッタ装置 |
JP2007131895A (ja) * | 2005-11-09 | 2007-05-31 | Ulvac Japan Ltd | マグネトロンスパッタ電極及びマグネトロンスパッタ電極を備えたスパッタリング装置 |
JP2007283438A (ja) | 2006-04-17 | 2007-11-01 | Ntt Electornics Corp | ブラスト加工方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2204469A4 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110024290A1 (en) * | 2009-07-30 | 2011-02-03 | Hon Hai Precision Industry Co., Ltd. | Magnetic device and magnetron sputtering device using the same |
US8382967B2 (en) * | 2009-07-30 | 2013-02-26 | Hon Hai Precision Industry Co., Ltd. | Magnetic device and magnetron sputtering device using the same |
JP2012186057A (ja) * | 2011-03-07 | 2012-09-27 | Kobe Steel Ltd | プラズマ源及びこのプラズマ源を備えた成膜装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2009057715A1 (ja) | 2011-03-10 |
EP2204469A1 (en) | 2010-07-07 |
JP4314318B2 (ja) | 2009-08-12 |
US20090236219A1 (en) | 2009-09-24 |
CN101595240A (zh) | 2009-12-02 |
JP2009174061A (ja) | 2009-08-06 |
EP2204469A4 (en) | 2012-03-28 |
CN101595240B (zh) | 2012-05-23 |
US7785449B2 (en) | 2010-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2009057715A1 (ja) | マグネトロンユニット、マグネトロンスパッタリング装置及び電子デバイスの製造方法 | |
HK1221775A1 (zh) | 在成形磁場中印刷的可動態改變外觀的光學圖案 | |
WO2007068816A3 (fr) | Noyau magnétique miniature, capteur le comportant et procédé pour le fabriquer | |
WO2010027740A8 (en) | Linear motor with patterned magnet arrays | |
JP2005209997A5 (ja) | ||
TW200637051A (en) | Mask, mask manufacturing method, pattern forming apparatus, and pattern formation method | |
HK1095192A1 (en) | Shift register circuit and drive control apparatus | |
EP1813979A3 (en) | Liquid crystal apparatus and electronic device | |
EP1954112A4 (en) | METHOD FOR PRODUCING A MULTILAYER CONDUCTOR PLATE, CIRCUIT BOARD AND METHOD FOR PRODUCING THE CIRCUIT BOARD | |
WO2007074243A3 (fr) | Dispositif inducteur a bobinages individuels multiples pour foyer de cuisson par induction | |
WO2011095841A3 (en) | Apparatus and method for magnetic field induction portable devices | |
MX2009007544A (es) | Aparato para anuncios que tiene estructura simple a base de imanes para facilidad de modificacion. | |
WO2010089734A3 (en) | Electrical machine | |
WO2006101843A3 (en) | Sputtering devices and methods | |
WO2009054118A1 (ja) | 電磁変換器 | |
WO2012030935A3 (en) | Magnetic blocks with images thereon, systems and methods of making the same | |
TWI319492B (en) | Optical waveguide film and the manufacturing method thereof,and optical/electronic circuit film and electronic machine including that | |
SG152209A1 (en) | Gaming machine | |
WO2008100900A3 (en) | Method and system for a linear actuator with stationary vertical magnets and coils | |
CA2652979A1 (en) | Motion transducer | |
EP2587646A3 (en) | Electric machine with linear mover | |
WO2009133295A3 (fr) | Machine tournante a flux transverse et dispositif de commutation equipe d'une telle machine | |
WO2008149635A1 (ja) | 薄膜作製用スパッタ装置 | |
WO2011019489A3 (en) | Miniature magnetic switch structures | |
TWI350370B (en) | A method and control devices for changing wettability on solid surface by electric or magnetic field |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880002807.1 Country of ref document: CN |
|
ENP | Entry into the national phase |
Ref document number: 2009506456 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2008843409 Country of ref document: EP |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08843409 Country of ref document: EP Kind code of ref document: A1 |
|
NENP | Non-entry into the national phase |
Ref country code: DE |