WO2009057444A1 - 回路基板及び表示装置 - Google Patents
回路基板及び表示装置 Download PDFInfo
- Publication number
- WO2009057444A1 WO2009057444A1 PCT/JP2008/068591 JP2008068591W WO2009057444A1 WO 2009057444 A1 WO2009057444 A1 WO 2009057444A1 JP 2008068591 W JP2008068591 W JP 2008068591W WO 2009057444 A1 WO2009057444 A1 WO 2009057444A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- interlayer insulating
- insulating films
- display device
- circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200880106147.1A CN101796619B (zh) | 2007-11-02 | 2008-10-14 | 电路基板和显示装置 |
US12/679,510 US8692251B2 (en) | 2007-11-02 | 2008-10-14 | Circuit board and display device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-286363 | 2007-11-02 | ||
JP2007286363 | 2007-11-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009057444A1 true WO2009057444A1 (ja) | 2009-05-07 |
Family
ID=40590836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/068591 WO2009057444A1 (ja) | 2007-11-02 | 2008-10-14 | 回路基板及び表示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8692251B2 (ja) |
CN (1) | CN101796619B (ja) |
WO (1) | WO2009057444A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130029040A (ko) | 2010-03-04 | 2013-03-21 | 제온 코포레이션 | 반도체 소자 기판의 제조 방법 |
US20150108478A1 (en) * | 2009-10-21 | 2015-04-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method for the same |
WO2018147048A1 (ja) * | 2017-02-13 | 2018-08-16 | ソニー株式会社 | 表示装置、電子機器、および表示装置の製造方法 |
JP2021061410A (ja) * | 2010-08-06 | 2021-04-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI540710B (zh) * | 2012-06-22 | 2016-07-01 | Sony Corp | A semiconductor device, a method for manufacturing a semiconductor device, and an electronic device |
CN107527925B (zh) | 2017-08-25 | 2019-11-05 | 京东方科技集团股份有限公司 | 显示基板及其制造方法、显示面板、显示装置 |
CN115128873B (zh) * | 2021-03-29 | 2023-12-05 | 株式会社日本显示器 | 显示装置及显示装置的阵列基板 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08316310A (ja) * | 1995-05-15 | 1996-11-29 | Sony Corp | 半導体装置の製造方法 |
JPH1048660A (ja) * | 1996-08-06 | 1998-02-20 | Toshiba Corp | 液晶表示装置 |
JP2000284722A (ja) * | 1999-01-29 | 2000-10-13 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2004177892A (ja) * | 2002-11-29 | 2004-06-24 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
JP2004221559A (ja) * | 2002-12-25 | 2004-08-05 | Semiconductor Energy Lab Co Ltd | 半導体装置及び表示装置 |
JP2005072573A (ja) * | 2003-08-05 | 2005-03-17 | Semiconductor Energy Lab Co Ltd | 配線基板及びその作製方法、並びに半導体装置及びその作製方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3520396B2 (ja) * | 1997-07-02 | 2004-04-19 | セイコーエプソン株式会社 | アクティブマトリクス基板と表示装置 |
US6593592B1 (en) | 1999-01-29 | 2003-07-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having thin film transistors |
TW200304227A (en) | 2002-03-11 | 2003-09-16 | Sanyo Electric Co | Top gate type thin film transistor |
JP2003338509A (ja) | 2002-03-11 | 2003-11-28 | Sanyo Electric Co Ltd | トップゲート型薄膜トランジスタ |
GB0219771D0 (en) * | 2002-08-24 | 2002-10-02 | Koninkl Philips Electronics Nv | Manufacture of electronic devices comprising thin-film circuit elements |
US7408196B2 (en) | 2002-12-25 | 2008-08-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and display device |
KR100542986B1 (ko) * | 2003-04-29 | 2006-01-20 | 삼성에스디아이 주식회사 | 박막 트랜지스터, 상기 박막 트랜지스터 제조 방법 및 이를 이용한 표시장치 |
US7423343B2 (en) | 2003-08-05 | 2008-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
JP5040222B2 (ja) * | 2005-12-13 | 2012-10-03 | ソニー株式会社 | 表示装置 |
JP5090658B2 (ja) * | 2006-04-06 | 2012-12-05 | 三菱電機株式会社 | 薄膜トランジスタ、及びその製造方法、並びにアクティブマトリクス型表示装置 |
JP4967631B2 (ja) * | 2006-12-07 | 2012-07-04 | 三菱電機株式会社 | 表示装置 |
-
2008
- 2008-10-14 CN CN200880106147.1A patent/CN101796619B/zh active Active
- 2008-10-14 WO PCT/JP2008/068591 patent/WO2009057444A1/ja active Application Filing
- 2008-10-14 US US12/679,510 patent/US8692251B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08316310A (ja) * | 1995-05-15 | 1996-11-29 | Sony Corp | 半導体装置の製造方法 |
JPH1048660A (ja) * | 1996-08-06 | 1998-02-20 | Toshiba Corp | 液晶表示装置 |
JP2000284722A (ja) * | 1999-01-29 | 2000-10-13 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
JP2004177892A (ja) * | 2002-11-29 | 2004-06-24 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
JP2004221559A (ja) * | 2002-12-25 | 2004-08-05 | Semiconductor Energy Lab Co Ltd | 半導体装置及び表示装置 |
JP2005072573A (ja) * | 2003-08-05 | 2005-03-17 | Semiconductor Energy Lab Co Ltd | 配線基板及びその作製方法、並びに半導体装置及びその作製方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150108478A1 (en) * | 2009-10-21 | 2015-04-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method for the same |
US10079307B2 (en) * | 2009-10-21 | 2018-09-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method for the same |
KR20130029040A (ko) | 2010-03-04 | 2013-03-21 | 제온 코포레이션 | 반도체 소자 기판의 제조 방법 |
JP2021061410A (ja) * | 2010-08-06 | 2021-04-15 | 株式会社半導体エネルギー研究所 | 半導体装置 |
WO2018147048A1 (ja) * | 2017-02-13 | 2018-08-16 | ソニー株式会社 | 表示装置、電子機器、および表示装置の製造方法 |
US11038140B2 (en) | 2017-02-13 | 2021-06-15 | Sony Corporation | Display device, electronic device, and method of producing display device |
Also Published As
Publication number | Publication date |
---|---|
CN101796619A (zh) | 2010-08-04 |
US8692251B2 (en) | 2014-04-08 |
CN101796619B (zh) | 2013-03-06 |
US20100193793A1 (en) | 2010-08-05 |
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