WO2009038177A1 - 硬化性樹脂組成物およびその用途 - Google Patents

硬化性樹脂組成物およびその用途 Download PDF

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Publication number
WO2009038177A1
WO2009038177A1 PCT/JP2008/066985 JP2008066985W WO2009038177A1 WO 2009038177 A1 WO2009038177 A1 WO 2009038177A1 JP 2008066985 W JP2008066985 W JP 2008066985W WO 2009038177 A1 WO2009038177 A1 WO 2009038177A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
curable resin
porous silica
particles
primary particles
Prior art date
Application number
PCT/JP2008/066985
Other languages
English (en)
French (fr)
Inventor
Yosuke Fujito
Makoto Fujimura
Tadahiro Omi
Akinobu Teramoto
Original Assignee
Tohoku University
Zeon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tohoku University, Zeon Corporation filed Critical Tohoku University
Priority to JP2009533200A priority Critical patent/JPWO2009038177A1/ja
Publication of WO2009038177A1 publication Critical patent/WO2009038177A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

 本発明は、高周波数領域で使用される多層回路基板の電気絶縁層を形成した場合に、比誘電率の低い電気絶縁層を形成しうる硬化性樹脂組成物を提供することを目的としている。  本発明の硬化性樹脂組成物は、脂環式オレフィン重合体、硬化剤、及び多孔質シリカ凝集粒子を含む硬化性樹脂組成物であり、該多孔質シリカ凝集粒子が、１ｎｍ以上の格子面間隔（ｄ）に対応する回折角（２θ／°）の範囲に１つ以上の回折線を有するＸ線回折パターンを示す多孔質シリカ球状一次粒子を、これらの多孔質シリカ球状一次粒子間に空隙層を形成するように集合してなる多孔質シリカ凝集粒子であることを特徴としている。
PCT/JP2008/066985 2007-09-19 2008-09-19 硬化性樹脂組成物およびその用途 WO2009038177A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009533200A JPWO2009038177A1 (ja) 2007-09-19 2008-09-19 硬化性樹脂組成物およびその用途

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007241835 2007-09-19
JP2007-241835 2007-09-19

Publications (1)

Publication Number Publication Date
WO2009038177A1 true WO2009038177A1 (ja) 2009-03-26

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JP (1) JPWO2009038177A1 (ja)
WO (1) WO2009038177A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012077194A (ja) * 2010-09-30 2012-04-19 Nippon Zeon Co Ltd 変性シリカ分散液及びその製造方法、並びに絶縁材料用樹脂組成物
WO2013047726A1 (ja) * 2011-09-30 2013-04-04 日本ゼオン株式会社 絶縁性接着フィルム、プリプレグ、積層体、硬化物、及び複合体
JP2013077704A (ja) * 2011-09-30 2013-04-25 Nippon Zeon Co Ltd 絶縁性接着フィルム、プリプレグ、積層体、硬化物、及び複合体
JP5624184B1 (ja) * 2013-06-28 2014-11-12 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
WO2017159816A1 (ja) * 2016-03-18 2017-09-21 日東電工株式会社 絶縁樹脂材料、それを用いた金属層付絶縁樹脂材料および配線基板
JP2017171898A (ja) * 2016-03-18 2017-09-28 日東電工株式会社 絶縁樹脂材料、それを用いた金属層付絶縁樹脂材料および配線基板
WO2020004225A1 (ja) * 2018-06-26 2020-01-02 京セラ株式会社 有機基板、金属張積層板および配線基板
JP2020045385A (ja) * 2018-09-14 2020-03-26 旭化成株式会社 樹脂組成物、積層体、及び硬化膜
TWI732082B (zh) * 2016-12-26 2021-07-01 日商東麗股份有限公司 感光性樹脂組成物
EP3882927A4 (en) * 2018-11-15 2022-07-06 Kyocera Corporation ORGANIC INSULATION, METAL CLAD LAMINATE AND WIRING PLATE

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998015595A1 (fr) * 1996-10-09 1998-04-16 Nippon Zeon Co., Ltd. Composition a base d'un polymere de norbornene
JP2000319012A (ja) * 1999-04-30 2000-11-21 Mizusawa Ind Chem Ltd 球状シリカゲル系粒子及びその製法
WO2001004213A1 (fr) * 1999-06-30 2001-01-18 Nippon Zeon Co., Ltd. Composition durcissable, article associe et produit stratifie
JP2001139777A (ja) * 1999-11-10 2001-05-22 Jsr Corp 熱硬化性樹脂組成物およびその硬化物
WO2002098974A1 (fr) * 2001-06-01 2002-12-12 Zeon Corporation Composition de resine, preimpregne, et produit en couches
JP2004323752A (ja) * 2003-04-25 2004-11-18 Matsushita Electric Ind Co Ltd 乾燥ゲルを含む成形体およびその製造方法
JP2005213122A (ja) * 2004-01-30 2005-08-11 Sumitomo Osaka Cement Co Ltd 多孔質微粒子の製造方法
JP2006077172A (ja) * 2004-09-10 2006-03-23 Sumitomo Bakelite Co Ltd 絶縁性樹脂組成物、その製造方法及び電子部品

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998015595A1 (fr) * 1996-10-09 1998-04-16 Nippon Zeon Co., Ltd. Composition a base d'un polymere de norbornene
JP2000319012A (ja) * 1999-04-30 2000-11-21 Mizusawa Ind Chem Ltd 球状シリカゲル系粒子及びその製法
WO2001004213A1 (fr) * 1999-06-30 2001-01-18 Nippon Zeon Co., Ltd. Composition durcissable, article associe et produit stratifie
JP2001139777A (ja) * 1999-11-10 2001-05-22 Jsr Corp 熱硬化性樹脂組成物およびその硬化物
WO2002098974A1 (fr) * 2001-06-01 2002-12-12 Zeon Corporation Composition de resine, preimpregne, et produit en couches
JP2004323752A (ja) * 2003-04-25 2004-11-18 Matsushita Electric Ind Co Ltd 乾燥ゲルを含む成形体およびその製造方法
JP2005213122A (ja) * 2004-01-30 2005-08-11 Sumitomo Osaka Cement Co Ltd 多孔質微粒子の製造方法
JP2006077172A (ja) * 2004-09-10 2006-03-23 Sumitomo Bakelite Co Ltd 絶縁性樹脂組成物、その製造方法及び電子部品

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012077194A (ja) * 2010-09-30 2012-04-19 Nippon Zeon Co Ltd 変性シリカ分散液及びその製造方法、並びに絶縁材料用樹脂組成物
WO2013047726A1 (ja) * 2011-09-30 2013-04-04 日本ゼオン株式会社 絶縁性接着フィルム、プリプレグ、積層体、硬化物、及び複合体
JP2013077704A (ja) * 2011-09-30 2013-04-25 Nippon Zeon Co Ltd 絶縁性接着フィルム、プリプレグ、積層体、硬化物、及び複合体
US9453145B2 (en) 2011-09-30 2016-09-27 Zeon Corporation Insulating adhesive film, prepreg, laminate, cured article, and composite article
US9822226B2 (en) 2013-06-28 2017-11-21 Taiyo Ink Mfg. Co., Ltd. Dry film and printed wiring board
JP5624184B1 (ja) * 2013-06-28 2014-11-12 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
JP2015010179A (ja) * 2013-06-28 2015-01-19 太陽インキ製造株式会社 ドライフィルムおよびプリント配線板
KR101618025B1 (ko) 2013-06-28 2016-05-03 다이요 잉키 세이조 가부시키가이샤 드라이 필름 및 프린트 배선판
KR102375660B1 (ko) * 2016-03-18 2022-03-16 닛토덴코 가부시키가이샤 절연 수지 재료, 그것을 이용한 금속층 구비 절연 수지 재료 및 배선 기판
WO2017159816A1 (ja) * 2016-03-18 2017-09-21 日東電工株式会社 絶縁樹脂材料、それを用いた金属層付絶縁樹脂材料および配線基板
KR20180126473A (ko) * 2016-03-18 2018-11-27 닛토덴코 가부시키가이샤 절연 수지 재료, 그것을 이용한 금속층 구비 절연 수지 재료 및 배선 기판
US10388425B2 (en) 2016-03-18 2019-08-20 Nitto Denko Corporation Insulating resin material, metal layer-equipped insulating resin material using same, and wiring substrate
JP7134594B2 (ja) 2016-03-18 2022-09-12 日東電工株式会社 絶縁樹脂材料、それを用いた金属層付絶縁樹脂材料および配線基板
JP2017171898A (ja) * 2016-03-18 2017-09-28 日東電工株式会社 絶縁樹脂材料、それを用いた金属層付絶縁樹脂材料および配線基板
JP2021061406A (ja) * 2016-03-18 2021-04-15 日東電工株式会社 絶縁樹脂材料、それを用いた金属層付絶縁樹脂材料および配線基板
TWI732082B (zh) * 2016-12-26 2021-07-01 日商東麗股份有限公司 感光性樹脂組成物
CN112334544A (zh) * 2018-06-26 2021-02-05 京瓷株式会社 有机基板、覆金属层叠板及布线基板
JPWO2020004225A1 (ja) * 2018-06-26 2021-07-08 京セラ株式会社 有機基板、金属張積層板および配線基板
WO2020004225A1 (ja) * 2018-06-26 2020-01-02 京セラ株式会社 有機基板、金属張積層板および配線基板
US11661495B2 (en) 2018-06-26 2023-05-30 Kyocera Corporation Organic board, metal-clad laminate, and wiring board
JP2020045385A (ja) * 2018-09-14 2020-03-26 旭化成株式会社 樹脂組成物、積層体、及び硬化膜
JP7222638B2 (ja) 2018-09-14 2023-02-15 旭化成株式会社 樹脂組成物、積層体、及び硬化膜
EP3882927A4 (en) * 2018-11-15 2022-07-06 Kyocera Corporation ORGANIC INSULATION, METAL CLAD LAMINATE AND WIRING PLATE
US11879049B2 (en) 2018-11-15 2024-01-23 Kyocera Corporation Organic insulating body, metal-clad laminate, and wiring board

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