WO2009031336A1 - 半導体素子 - Google Patents

半導体素子 Download PDF

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Publication number
WO2009031336A1
WO2009031336A1 PCT/JP2008/057152 JP2008057152W WO2009031336A1 WO 2009031336 A1 WO2009031336 A1 WO 2009031336A1 JP 2008057152 W JP2008057152 W JP 2008057152W WO 2009031336 A1 WO2009031336 A1 WO 2009031336A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor element
electric current
current path
carbon
electrodes
Prior art date
Application number
PCT/JP2008/057152
Other languages
English (en)
French (fr)
Inventor
Hideaki Numata
Kazuki Ihara
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to US12/676,563 priority Critical patent/US8253124B2/en
Priority to JP2009531147A priority patent/JP4737474B2/ja
Publication of WO2009031336A1 publication Critical patent/WO2009031336A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/22—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using ferroelectric elements
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009—RRAM elements whose operation depends upon chemical change
    • G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/02—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change
    • G11C13/025—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using elements whose operation depends upon chemical change using fullerenes, e.g. C60, or nanotubes, e.g. carbon or silicon nanotubes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/82—Electrodes
    • H10K10/84—Ohmic electrodes, e.g. source or drain electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221—Carbon nanotubes
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/30—Resistive cell, memory material aspects
    • G11C2213/35—Material including carbon, e.g. graphite, grapheme
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2213/00—Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70—Resistive array aspects
    • G11C2213/73—Array where access device function, e.g. diode function, being merged with memorizing function of memory element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Materials Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Mathematical Physics (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Pressure Sensors (AREA)
  • Semiconductor Memories (AREA)

Abstract

　電流通路として複数のカーボンナノチューブを用いた半導体素子で、電極コンタクト部の接触抵抗を低減し、電気特性に優れた半導体素子を提供する。 　複数のカーボンナノチューブ（１８）で構成された電流通路（１６）を有し、前記電流通路と接続された２つ以上の電極（１４、１５）を有し、前記電極のうち少なくとも１つ以上の電極が、金属とマルチウォール型のカーボンナノチューブ、グラッシーカーボン、グラファイト粒子などのＳＰ２混成軌道を有する炭素材料（１７）の混合物で構成されることを特徴とする半導体素子。
PCT/JP2008/057152 2007-09-07 2008-04-11 半導体素子 WO2009031336A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/676,563 US8253124B2 (en) 2007-09-07 2008-04-11 Semiconductor element
JP2009531147A JP4737474B2 (ja) 2007-09-07 2008-04-11 半導体素子

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-232645 2007-09-07
JP2007232645 2007-09-07

Publications (1)

Publication Number Publication Date
WO2009031336A1 true WO2009031336A1 (ja) 2009-03-12

Family

ID=40428660

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057152 WO2009031336A1 (ja) 2007-09-07 2008-04-11 半導体素子

Country Status (3)

Country Link
US (1) US8253124B2 (ja)
JP (1) JP4737474B2 (ja)
WO (1) WO2009031336A1 (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010123646A (ja) * 2008-11-18 2010-06-03 Toshiba Corp 電気素子、スイッチング素子、メモリ素子、スイッチング方法及びメモリ方法
JP2012060010A (ja) * 2010-09-10 2012-03-22 Fujitsu Ltd 半導体装置及びその製造方法
JP2013033899A (ja) * 2011-07-29 2013-02-14 Qinghua Univ ショットキーダイオード及びその製造方法
US8716691B2 (en) 2010-07-14 2014-05-06 Kabushiki Kaisha Toshiba Nonvolatile memory device and method for manufacturing the same
KR20160145793A (ko) * 2014-04-24 2016-12-20 유니버시티 오브 플로리다 리서치 파운데이션, 인크. 고전력 전자기기를 위한 조정 가능한 배리어 트랜지스터
WO2017090559A1 (ja) * 2015-11-25 2017-06-01 東レ株式会社 強誘電体記憶素子、その製造方法、ならびにそれを用いたメモリセルおよびそれを用いた無線通信装置
JP2018117121A (ja) * 2017-01-20 2018-07-26 ツィンファ ユニバーシティ 薄膜トランジスタ
JP2018117119A (ja) * 2017-01-20 2018-07-26 ツィンファ ユニバーシティ ショットキーダイオード、ショットキーダイオードアレイ及びショットキーダイオードの製造方法
JP2018117120A (ja) * 2017-01-20 2018-07-26 ツィンファ ユニバーシティ 薄膜トランジスタ
CN108336150A (zh) * 2017-01-20 2018-07-27 清华大学 肖特基二极管、肖特基二极管阵列及肖特基二极管的制备方法
JP2020511778A (ja) * 2017-02-16 2020-04-16 マイクロン テクノロジー，インク． 活性化境界キルトアーキテクチャのメモリ
US10896725B2 (en) 2017-02-16 2021-01-19 Micron Technology, Inc. Efficient utilization of memory die area

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AU2008283846A1 (en) * 2007-08-07 2009-02-12 Nanocomp Technologies, Inc. Electrically and thermally non-metallic conductive nanostructure-based adapters
CN101582445B (zh) * 2008-05-14 2012-05-16 清华大学 薄膜晶体管
CN101599495B (zh) * 2008-06-04 2013-01-09 清华大学 薄膜晶体管面板
CN101593699B (zh) * 2008-05-30 2010-11-10 清华大学 薄膜晶体管的制备方法
CN101582451A (zh) * 2008-05-16 2009-11-18 清华大学 薄膜晶体管
CN101587839B (zh) * 2008-05-23 2011-12-21 清华大学 薄膜晶体管的制备方法
CN101582450B (zh) * 2008-05-16 2012-03-28 清华大学 薄膜晶体管
CN101582448B (zh) * 2008-05-14 2012-09-19 清华大学 薄膜晶体管
CN101582446B (zh) * 2008-05-14 2011-02-02 鸿富锦精密工业（深圳）有限公司 薄膜晶体管
CN101582382B (zh) * 2008-05-14 2011-03-23 鸿富锦精密工业（深圳）有限公司 薄膜晶体管的制备方法
CN101582449B (zh) * 2008-05-14 2011-12-14 清华大学 薄膜晶体管
US8822970B2 (en) * 2011-02-21 2014-09-02 Korea Advanced Institute Of Science And Technology (Kaist) Phase-change memory device and flexible phase-change memory device insulating nano-dot
EP2697660B1 (en) * 2011-04-15 2019-03-20 Indiana University of Pennsylvania Thermally activated magnetic and resistive aging
KR101963229B1 (ko) * 2011-12-05 2019-03-29 삼성전자주식회사 접을 수 있는 박막 트랜지스터
CN102655146B (zh) * 2012-02-27 2013-06-12 京东方科技集团股份有限公司 阵列基板、阵列基板的制备方法及显示装置
US8873270B2 (en) * 2012-12-14 2014-10-28 Palo Alto Research Center Incorporated Pulse generator and ferroelectric memory circuit
CN103646611B (zh) * 2013-09-04 2015-11-11 京东方科技集团股份有限公司 一种阵列基板、柔性显示器件及阵列基板的制作方法
CN104867980B (zh) * 2014-02-24 2018-04-24 清华大学 薄膜晶体管及其阵列
CN105097428B (zh) * 2014-04-24 2017-12-01 清华大学 碳纳米管复合膜
KR102216543B1 (ko) 2014-06-16 2021-02-17 삼성전자주식회사 그래핀-금속 접합 구조체 및 그 제조방법, 그래핀-금속 접합 구조체를 구비하는 반도체 소자
US9299939B1 (en) 2014-12-09 2016-03-29 International Business Machines Corporation Formation of CMOS device using carbon nanotubes
CN108336151B (zh) 2017-01-20 2020-12-04 清华大学 肖特基二极管、肖特基二极管阵列及肖特基二极管的制备方法
CN108899369B (zh) * 2018-06-27 2020-11-03 东南大学 一种石墨烯沟道碳化硅功率半导体晶体管
US11043497B1 (en) * 2019-12-19 2021-06-22 Micron Technology, Inc. Integrated memory having non-ohmic devices and capacitors
CN113193115B (zh) * 2021-05-19 2023-05-12 电子科技大学 一种悬空碳纳米管场效应晶体管及其制备方法

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JP2007250904A (ja) * 2006-03-16 2007-09-27 Fujitsu Ltd 電界効果トランジスタ及びその製造方法

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010123646A (ja) * 2008-11-18 2010-06-03 Toshiba Corp 電気素子、スイッチング素子、メモリ素子、スイッチング方法及びメモリ方法
US8716691B2 (en) 2010-07-14 2014-05-06 Kabushiki Kaisha Toshiba Nonvolatile memory device and method for manufacturing the same
JP2012060010A (ja) * 2010-09-10 2012-03-22 Fujitsu Ltd 半導体装置及びその製造方法
JP2013033899A (ja) * 2011-07-29 2013-02-14 Qinghua Univ ショットキーダイオード及びその製造方法
US8809107B2 (en) 2011-07-29 2014-08-19 Tsinghua University Method for making Schottky barrier diode
KR20160145793A (ko) * 2014-04-24 2016-12-20 유니버시티 오브 플로리다 리서치 파운데이션, 인크. 고전력 전자기기를 위한 조정 가능한 배리어 트랜지스터
KR102445520B1 (ko) * 2014-04-24 2022-09-20 유니버시티 오브 플로리다 리서치 파운데이션, 인크. 고전력 전자기기를 위한 조정 가능한 배리어 트랜지스터
JPWO2017090559A1 (ja) * 2015-11-25 2018-09-06 東レ株式会社 強誘電体記憶素子、その製造方法、ならびにそれを用いたメモリセルおよびそれを用いた無線通信装置
WO2017090559A1 (ja) * 2015-11-25 2017-06-01 東レ株式会社 強誘電体記憶素子、その製造方法、ならびにそれを用いたメモリセルおよびそれを用いた無線通信装置
TWI699830B (zh) * 2015-11-25 2020-07-21 日商東麗股份有限公司 強介電體記憶元件、其製造方法、記憶胞及無線通信裝置
US10611868B2 (en) 2015-11-25 2020-04-07 Toray Industries, Inc. Ferroelectric memory element, method for producing same, memory cell using ferroelectric memory element, and radio communication device using ferroelectric memory element
CN108336150A (zh) * 2017-01-20 2018-07-27 清华大学 肖特基二极管、肖特基二极管阵列及肖特基二极管的制备方法
JP2018117120A (ja) * 2017-01-20 2018-07-26 ツィンファ ユニバーシティ 薄膜トランジスタ
JP2018117119A (ja) * 2017-01-20 2018-07-26 ツィンファ ユニバーシティ ショットキーダイオード、ショットキーダイオードアレイ及びショットキーダイオードの製造方法
CN108336150B (zh) * 2017-01-20 2020-09-29 清华大学 肖特基二极管、肖特基二极管阵列及肖特基二极管的制备方法
JP2018117121A (ja) * 2017-01-20 2018-07-26 ツィンファ ユニバーシティ 薄膜トランジスタ
JP2020511778A (ja) * 2017-02-16 2020-04-16 マイクロン テクノロジー，インク． 活性化境界キルトアーキテクチャのメモリ
US10896725B2 (en) 2017-02-16 2021-01-19 Micron Technology, Inc. Efficient utilization of memory die area
US11170850B2 (en) 2017-02-16 2021-11-09 Micron Technology, Inc. Efficient utilization of memory die area
US11355162B2 (en) 2017-02-16 2022-06-07 Micron Technology, Inc. Active boundary quilt architecture memory

Also Published As

Publication number Publication date
JPWO2009031336A1 (ja) 2010-12-09
US8253124B2 (en) 2012-08-28
JP4737474B2 (ja) 2011-08-03
US20100252802A1 (en) 2010-10-07

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