WO2009030494A2 - Halterungsvorrichtung für scheibenartige substrate wie solarzellenwafer - Google Patents
Halterungsvorrichtung für scheibenartige substrate wie solarzellenwafer Download PDFInfo
- Publication number
- WO2009030494A2 WO2009030494A2 PCT/EP2008/007321 EP2008007321W WO2009030494A2 WO 2009030494 A2 WO2009030494 A2 WO 2009030494A2 EP 2008007321 W EP2008007321 W EP 2008007321W WO 2009030494 A2 WO2009030494 A2 WO 2009030494A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- comb
- holder
- solar cell
- web
- cell wafer
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 9
- 235000012431 wafers Nutrition 0.000 title abstract description 58
- 230000001154 acute effect Effects 0.000 claims abstract description 15
- 230000005484 gravity Effects 0.000 claims abstract description 4
- 238000003754 machining Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000003068 static effect Effects 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920002457 flexible plastic Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the invention relates to a Garrungsvor ⁇ chtung for disc-like substrates such as solar cell wafer, with at least one comb-like holder with an elongated web on which over its longitudinal extent (X-axis) towards a plurality of equidistantly spaced comb elements is provided, each perpendicular to the longitudinal extent of the web (Z-axis) protrude over an equal height and each corresponding to the width of the elongated web perpendicular (Y-axis) to the plane formed by the X and Z axis have an identical total depth t, wherein between the respective facing each other
- At least one recess for the supported solar cell wafer is formed with a Um ⁇ ßkontur whose central axis extends in the direction of the Z-axis and a contact surface and a Fuhrungsflache, which are arranged both to each other and parallel to the central axis of the recess for the in the recess has held to be received solar cell wafer
- a Garrungsvor ⁇ chtung in the form of a Ubertragungsusion having a plurality each at the same distance to each other located recesses in the form of Ubertragungs ⁇ llen, in each of which a In the totallysrandabschmtt each Ubertragungs ⁇ lle a Wegnlochformiger cavity is provided which can hold only a chip component Since the radial length of the cavity is shorter than the long side of the chip component, A portion of the chip component contained in the cavity protrudes from the peripheral surface side of the transmission disk.
- a step in the lower surface between the cavity and the transmission portion is smaller than the width of the short side of the transmission disk Chip Component This controls the movement of successive chip components toward the outer diameter of the transfer disk
- the invention is based on the object for disk-like substrates such as solar cell wafers Halterungsvor ⁇ chtung with at least one comb-like holder available, each with any narrow to be produced support gap between each adjacent comb elements for a secure recording and holding each to be supported solar cell wafer both a defined side of a comb element, as well as in a defined height in the comb-like holder in a technically simple and economical way to make is also allow the inventive mounting device a backlash-free fixation of her salaried solar cell wafer
- Supporting gap has to be included in the solar cell wafer, with in the direction of the X-axis arbitrary width of two mutually offset in the direction of the X-axis recesses, which have an outline contour U 1 and u, and whose depth t ( or t 7 is smaller than the total depth t ges j E ach comb member, said depth t 1 and t 2, the depth j J in each case the
- Investment plan is to bring into abutment and in the same time there is a tolerance match between the surface of the solar cell wafer facing away from the contact surface and the guide surface of the outline contour u s of the support gap parallel to the contact surface.
- the depth t ] and the depth t, the first recess or the second recess between the respective mutually adjacent comb elements are equal and the acute angle ⁇ is in the range of 46 ° to 50 °, depending on the material pairing of the comb-like holder and the solar cell wafer
- the width of the mounting gap is - measured in the direction of the X-axis - equal to the thickness of the solar cell wafer plus the tolerance clearance
- the outline contour u s of the support gap can expand in a funnel-shaped opposite to the direction of introduction of the solar cell wafer in an opening region by - seen in the longitudinal section of the comb-like holder - each of the opening area limiting surfaces of the Fuhrungs simulation and to the contact surface of the outline u s of the support gap are at an acute angle ß or ⁇ in the range of 18 "to 22" or in the range of 13 "to 17" outwardly guided by the Fuhrungsthesis or the contact surface, wherein the opening region of the outline contour U 1 or u "the first or the second recess, which has the web-side groove, is designed stephole-shaped
- the lower long edge of the web of the comb-like holder for perpendicular to the contact surface of the outline u Retaining gap be inclined at an acute angle of 3 °
- each comb-like holder of the Garrungsvor ⁇ chtung by machining a blank the z B consists of a flexible plastic, light metal or an alloy of the latter and having the outer dimensions of the manufacturing comb-like holder, manufactured such that by means of a single Fraswerkmaschines the Fraskontur the comb-like holder first partly from the one longitudinal side of the blank in the direction of the Y-axis to the depth t ( and after subsequent rotation of the partially blanked blank by 180 ° about the Z-axis from the other longitudinal side of the fretting contour in the direction of the Y - axis
- a simultaneous machining of the blank for the production of the comb-like holder from its two longitudinal sides by means of a correspondingly to be positioned Fraswerkmaschinees is also possible
- the comb-like holder according to the invention can also be formed from two components to be produced at the same time, the outline contour of which is in each case the outline contour u of a
- the comb-like holder of the invention In contrast to the conventional production of the fraskontur of a holder for thin parallel substrates, such as silicon wafers, using a Frastechnikmaschinees in one operation, wherein the width of the support gap for each silicon wafer is defined by the thickness of Frastechnikmaschinees, the comb-like holder of the invention
- the frictional contour of the comb-like holder a plan concerns all in the latter to be supported solar cell wafer both on a defined side of the outline contour of the support gap u ⁇ and in a defined height of the latter ensures the comb-like holder of the invention
- Mounting device for disc-shaped substrates such as solar cell wafers is thus technically relatively simple and economical to manufacture with a support gap of any width
- the holding device according to the invention can have a paired arrangement of the comb-like holder, wherein the elongate webs of the two identically formed comb-like holders are arranged spaced apart parallel and in the long profile exactly aligned with each other for receiving the solar cell wafers.
- At least one further comb-like holder can be provided Controlled longitudinally relative to the other comb-like holders so move is that held in the mutually corresponding support columns of the two fixed comb-like holder and the movable comb-like holder solar cell wafer from the respective contact surface Um ⁇ ßkontur the respective corresponding support gap of the two comb-like holder and the Fuhrungsflache the Outline contour of the corresponding support gap of the movable comb-like holder is to be fixed in a play-free position
- the elongate web of each of the two spaced apart and identically formed comb-like holder be einstuckig formed with a latter connecting base, in the upper surface centrally between the two comb-like holders a running in the longitudinal direction guide is provided, in which the elongated web of the displaceable comb-like holder with its lower long edge parallel and guided in the long profile in alignment with the respective elongated web of the two outer comb-like holder slidably guided
- the slidable comb-like holder In the position of the solar cell wafer fixed without play by the comb-like holders, the slidable comb-like holder is appropriately displaced in the longitudinal direction with respect to the other comb-like holders to the plane defined by the abutment surfaces of the respective support gap of the two comb-like holders by a distance is equal to the tolerance game that is given between the flat surfaces of the solar cell wafer facing away from the contact surfaces and the Fuhrungsflache parallel to the contact surfaces of the outline contour u ⁇ of the holding gap of each of the stationary comb-like holder
- the elongated comb-like web of the movable comb-like holder may be formed identically to the elongate web of the stationary comb-like holder.
- the holding gaps of the elongate web of the displaceable comb-like holder may be U-shaped, as seen in longitudinal section
- FIG. 1 is a plan view of a longitudinal side of a comb-like holder of an embodiment of the holding device
- FIG. 2 is a sectional view of a detail shown in FIG. 1 at the left end of the comb-like holder, showing a solar cell wafer in a holding gap.
- FIG. 2 is a sectional view of a detail shown in FIG. 1 at the left end of the comb-like holder, showing a solar cell wafer in a holding gap.
- FIG. 3 is a perspective view of the marked in Figure 1 detail of the comb-like holder, seen in the direction from the left front on the longitudinal side of the comb-like holder,
- Fig. 4 is a perspective view of the marked in Figure 1 detail of the comb-like holder seen from the right on the longitudinal side of the comb-like holder, and
- Fig. 5 is a view of a section perpendicular to the longitudinal direction of another embodiment of the comb-like holder, which is composed of two components, and
- FIG. 6 shows a perspective view of a further embodiment of the holding device with a solar cell wafer in a held position, in which the solar cell wafer is fixed without play
- a first embodiment of the support device for disc-like substrates such as solar cell wafer 2 is to be designed by two identically shaped comb-like holder 1 of the type shown in FIGS. 1 to 4, which are spaced apart parallel to each other and exactly aligned with each other in the long profile.
- the distance between the two comb-like holders may be smaller than the length of the lower edge 21 of the solar cell wafer 2, which is to be supported in mutually corresponding support columns 9 of the webs 3 of the two comb-like holders 1
- the comb-like holder 1 has a web 3, on which over its longitudinal extension in the direction of the X-axis towards a plurality of equally spaced comb elements 4 is provided
- the comb elements 4 project respectively in the direction of Z-axis perpendicular to the longitudinal extent of the web 3 up an equal height and each have according to the width b of the elongated web 3 perpendicular - in the direction of the Y-axis - to the plane formed by the X and Z axis an identical total depth t tot
- first recess 5 with an outline contour u A] and a second recess 6 with a first recess 5
- a support gap 9 of any width b H outline outline u s to form which has a contact surface 7 and a Fuhrungsflache 8 for the
- the abutment surface 7 and the guide surface 8 are arranged both parallel to one another and parallel to the center axis A of the outline contour u as well as the outline contour u v of the first recess 5 and the second recess 5 and 6, respectively, the central axis A in FIG extends substantially in the direction of the Z-axis
- the outline contour u A2 of the second recess 6 has on the web side a groove 10 with an inclined web-side surface portion 1 1, which lies in a plane 12 to the plane 13 of the contact surface 7 of the outline contour
- Angle ⁇ inclined proceeds Depending on the material pairing of the web 3 and the solar cell wafer 2, the angle ⁇ can be chosen and in the range of 46 ° to 50
- the outline contour u of the support gap 9 widens in a funnel shape opposite to the direction of insertion R 1 of the solar cell wafer 2 into the support gap 9 into an opening region 15 of the outline contour u A
- the first recess 5 between the corresponding adjacent comb elements 4 This opening region 15 is - as seen in longitudinal section of the comb-like holder 1 ( Figure 2) - limited by surfaces 16 and 17 of the adjacent comb elements, the guide surface 8 and the contact surface 7 of the outline contour u s of the mounting gap 9 adjacent to the surface 16 and the flat 17 are preferably ß at an acute angle or ⁇ according außwarts to Fuhrungsflache 8 respectively for abutment surface 7 guided, the "or in the range 18 ° to 22 ° in the range of 13 ⁇ to 17
- the opening region of the outline contour u 1 of the second recess 6, which has the web-side groove 10, is designed in the form of a stepped hole
- FIG. 6 shows an embodiment of the holding device with which the solar cell wafer 2 supported by the latter is to be fixed in a play-free position.
- identical comb-like holders 1 are provided in parallel and at a distance, the elongate web 3 of which is below each one-piece with a base part connecting the latter Formed in the upper surface of the base member 24 is centrally between the two stationary comb-like holders 1 extending in the longitudinal direction Fuhrung in which the elongated web 3 of a movable comb-like holder 27 with its lower long edge 18 parallel and controlled in the long profile in alignment with the respective elongate web 3 of the two outer comb-like holder 1 is guided back and forth displaceable, as indicated by the double arrow 26 in Figure 6, the displacement of the movable comb-like holder 27 in the longitudinal direction from a home position in which, for the solar cell wafer 2, the corresponding support gap 9 of the slidable comb-like holder 27 is in alignment with the respective respective support gap 9 of the two outward
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2008801113103A CN101821845B (zh) | 2007-08-31 | 2008-08-30 | 用于盘形基片的夹持装置及其制造方法 |
JP2010522268A JP2010537440A (ja) | 2007-08-31 | 2008-08-30 | ソーラーウエハ等のディスク形基板のためのマウントディバイス |
CA2697732A CA2697732A1 (en) | 2007-08-31 | 2008-08-30 | Mounting device for disk-shaped substrates such as solar wafers |
US12/674,837 US8307997B2 (en) | 2007-08-31 | 2008-08-30 | Mounting device for disk-shaped substrates such as solar wafers |
EP08801903A EP2188833A2 (de) | 2007-08-31 | 2008-08-30 | Halterungsvorrichtung für scheibenartige substrate wie solarzellenwafer |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202007012.384.1 | 2007-08-31 | ||
DE202007012384U DE202007012384U1 (de) | 2007-08-31 | 2007-08-31 | Kammartiger Halter einer Halterungsvorrichtung für scheibenartige Substrate wie Solarzellenwafer |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009030494A2 true WO2009030494A2 (de) | 2009-03-12 |
WO2009030494A3 WO2009030494A3 (de) | 2009-09-17 |
Family
ID=38721648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2008/007321 WO2009030494A2 (de) | 2007-08-31 | 2008-08-30 | Halterungsvorrichtung für scheibenartige substrate wie solarzellenwafer |
Country Status (10)
Country | Link |
---|---|
US (1) | US8307997B2 (de) |
EP (1) | EP2188833A2 (de) |
JP (1) | JP2010537440A (de) |
KR (1) | KR20100075470A (de) |
CN (1) | CN101821845B (de) |
CA (1) | CA2697732A1 (de) |
DE (1) | DE202007012384U1 (de) |
RU (1) | RU2010112385A (de) |
TW (1) | TW200921824A (de) |
WO (1) | WO2009030494A2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US9153466B2 (en) * | 2012-04-26 | 2015-10-06 | Asm Ip Holding B.V. | Wafer boat |
KR102143884B1 (ko) * | 2013-09-11 | 2020-08-12 | 삼성전자주식회사 | 버퍼 영역을 갖는 웨이퍼 로더 |
US20150104277A1 (en) * | 2013-10-16 | 2015-04-16 | Gt Crystal Systems, Llc | Product cartridge for transporting product |
US9597791B2 (en) * | 2014-01-08 | 2017-03-21 | Ryan Neal | Tool holder |
CN105356824B (zh) * | 2015-11-24 | 2018-05-15 | 常州兆达睿光伏科技有限公司 | 一种高效太阳能板 |
CN109371383A (zh) * | 2018-12-25 | 2019-02-22 | 南京爱通智能科技有限公司 | 一种适用于超大规模原子层沉积设备的载具 |
CN109385622A (zh) * | 2018-12-25 | 2019-02-26 | 南京爱通智能科技有限公司 | 一种适用于超大产量的原子层沉积设备的流道结构 |
DE102019201166A1 (de) * | 2019-01-30 | 2020-07-30 | Siemens Aktiengesellschaft | Werkstückträger zum Halten eines zu beschichtenden Bauteils, Verwendung eines solchen Werkstückträgers sowie Vorrichtung und Verfahren zum Beschichten eines Bauteils |
CN110854237B (zh) * | 2019-11-20 | 2021-04-20 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 便于单齿更换的基于高精度装配的疏齿托架 |
KR20210100798A (ko) * | 2020-02-06 | 2021-08-18 | 삼성디스플레이 주식회사 | 기판용 카세트 |
CN113483571B (zh) * | 2021-06-22 | 2024-07-26 | 中国联合装备集团安阳机械有限公司 | 一种多边形加热炉及其使用方法 |
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DE19906805B4 (de) | 1998-02-18 | 2005-07-07 | Tokyo Electron Ltd. | Vorrichtung und Verfahren zum Transportieren von zu bearbeitenden Substraten |
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- 2008-07-30 TW TW097128731A patent/TW200921824A/zh unknown
- 2008-08-30 KR KR1020107007047A patent/KR20100075470A/ko not_active Application Discontinuation
- 2008-08-30 CN CN2008801113103A patent/CN101821845B/zh not_active Expired - Fee Related
- 2008-08-30 WO PCT/EP2008/007321 patent/WO2009030494A2/de active Application Filing
- 2008-08-30 JP JP2010522268A patent/JP2010537440A/ja not_active Withdrawn
- 2008-08-30 CA CA2697732A patent/CA2697732A1/en not_active Abandoned
- 2008-08-30 RU RU2010112385/28A patent/RU2010112385A/ru unknown
- 2008-08-30 US US12/674,837 patent/US8307997B2/en not_active Expired - Fee Related
- 2008-08-30 EP EP08801903A patent/EP2188833A2/de not_active Withdrawn
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JPH06232239A (ja) | 1993-01-29 | 1994-08-19 | Sony Corp | 薄板部材の移載用リフト |
DE19906805B4 (de) | 1998-02-18 | 2005-07-07 | Tokyo Electron Ltd. | Vorrichtung und Verfahren zum Transportieren von zu bearbeitenden Substraten |
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Also Published As
Publication number | Publication date |
---|---|
US20110114810A1 (en) | 2011-05-19 |
US8307997B2 (en) | 2012-11-13 |
CN101821845A (zh) | 2010-09-01 |
CN101821845B (zh) | 2012-11-14 |
CA2697732A1 (en) | 2009-03-12 |
TW200921824A (en) | 2009-05-16 |
JP2010537440A (ja) | 2010-12-02 |
DE202007012384U1 (de) | 2007-11-22 |
EP2188833A2 (de) | 2010-05-26 |
KR20100075470A (ko) | 2010-07-02 |
RU2010112385A (ru) | 2011-10-10 |
WO2009030494A3 (de) | 2009-09-17 |
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