WO2009030494A3 - Halterungsvorrichtung für scheibenartige substrate wie solarzellenwafer - Google Patents

Halterungsvorrichtung für scheibenartige substrate wie solarzellenwafer Download PDF

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Publication number
WO2009030494A3
WO2009030494A3 PCT/EP2008/007321 EP2008007321W WO2009030494A3 WO 2009030494 A3 WO2009030494 A3 WO 2009030494A3 EP 2008007321 W EP2008007321 W EP 2008007321W WO 2009030494 A3 WO2009030494 A3 WO 2009030494A3
Authority
WO
WIPO (PCT)
Prior art keywords
comb
outer contour
support surface
mounting
solar wafer
Prior art date
Application number
PCT/EP2008/007321
Other languages
English (en)
French (fr)
Other versions
WO2009030494A2 (de
Inventor
Stefan Jonas
Lutz Redmann
Original Assignee
Jonas & Redmann Automationstechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jonas & Redmann Automationstechnik Gmbh filed Critical Jonas & Redmann Automationstechnik Gmbh
Priority to CN2008801113103A priority Critical patent/CN101821845B/zh
Priority to CA2697732A priority patent/CA2697732A1/en
Priority to JP2010522268A priority patent/JP2010537440A/ja
Priority to EP08801903A priority patent/EP2188833A2/de
Priority to US12/674,837 priority patent/US8307997B2/en
Publication of WO2009030494A2 publication Critical patent/WO2009030494A2/de
Publication of WO2009030494A3 publication Critical patent/WO2009030494A3/de

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • H01L31/1876—Particular processes or apparatus for batch treatment of the devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Die Erfindung betrifft eine Halterungsvorrichtung für Solarzellenwafer (2), mit mindestens einem kammartigen Halter (1) mit einem langgestreckten Steg (3), an dem über dessen Längserstreckung hin eine Vielzahl in gleichem Abstand zueinander angeordneter Kammelemente (4) vorgesehen ist, wobei zwischen den jeweils einander zugewandten Flächen benachbarter Kammelemente (4) mindestens eine Ausnehmung (5 bzw 6) gebildet, die eine Anlagefläche (7) und eine Führungsfläche (8) für den in der Ausnehmung (5 bzw 6) aufzunehmenden Solarzellenwafer (2) aufweist. Zur sicheren Aufnahme und Halterung des Solarzellenwafers in der Halterungsvorrichtung ist zwischen den jeweils benachbarten Kammelementen (4) des langgestreckten Stegs (3) des mindestens einen kammartigen Halters (1) ein Halterungsspalt (9), dessen Umrißkontur (us) die Anlagefläche (7) und die Führungsfläche (8) aufweist, mit beliebiger Breite (bH) von zwei zueinander versetzten Ausnehmungen (5 und 6) gebildet ist, deren Tiefe (t1) bzw (t2) jeweils kleiner ist als die Gesamttiefe (tges) jedes Kammelementes (4) ist, wobei die Tiefe (t1) und die Tiefe (t2) zusammen jeweils die Gesamttiefe (tges) jedes Kammelementes (4) bilden und die Umrißkontur (uA1 oder uA2) der Ausnehmungen (5 bzw 6) stegseitig eine Auskehlung (10) mit einem geneigten stegseitigen Flächenabschnitt (11) aufweist, der in einer Ebene (12) liegt, die zur Ebene (13) der Anlagefläche (7) der Umrißkontur (us) des Halterungsspaltes (9) geneigt verläuft derart, daß bei Ineingriffkommen der Unterkante (21) des Solarzellenwafers (2) mit dem geneigten Flachenabschnitt (11) der Auskehlung (10) der Umrißkontur (uA1 oder uA2) auf diesem Schwerkraft bedingt in eine vorbestimmte Position gleitend zu versetzen ist, in der der Solarzellenwafer (2) bei Drehung des kammartige Halters (1) um einen vorbestimmten spitzen Winkel (φ) zur Lotrechten auf die Anlagefläche (7) der Umrißkontur (us) des Halterungsspaltes (9) mit seiner letzterer zugewandten Fläche (13) an der Anlagefläche (7) plan in Anlage zu bringen ist und in der zugleich ein Toleranzspiel (14) zwischen der der Anlagefläche (7) abgewandten Fläche (22) des Solarzellenwafers (2) und der zur Anlagefläche (7) parallel verlaufenden Führungsflache (8) der Umrißkontur (us) des Halterungsspaltes (9) gegeben ist.
PCT/EP2008/007321 2007-08-31 2008-08-30 Halterungsvorrichtung für scheibenartige substrate wie solarzellenwafer WO2009030494A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008801113103A CN101821845B (zh) 2007-08-31 2008-08-30 用于盘形基片的夹持装置及其制造方法
CA2697732A CA2697732A1 (en) 2007-08-31 2008-08-30 Mounting device for disk-shaped substrates such as solar wafers
JP2010522268A JP2010537440A (ja) 2007-08-31 2008-08-30 ソーラーウエハ等のディスク形基板のためのマウントディバイス
EP08801903A EP2188833A2 (de) 2007-08-31 2008-08-30 Halterungsvorrichtung für scheibenartige substrate wie solarzellenwafer
US12/674,837 US8307997B2 (en) 2007-08-31 2008-08-30 Mounting device for disk-shaped substrates such as solar wafers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202007012384U DE202007012384U1 (de) 2007-08-31 2007-08-31 Kammartiger Halter einer Halterungsvorrichtung für scheibenartige Substrate wie Solarzellenwafer
DE202007012.384.1 2007-08-31

Publications (2)

Publication Number Publication Date
WO2009030494A2 WO2009030494A2 (de) 2009-03-12
WO2009030494A3 true WO2009030494A3 (de) 2009-09-17

Family

ID=38721648

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/007321 WO2009030494A2 (de) 2007-08-31 2008-08-30 Halterungsvorrichtung für scheibenartige substrate wie solarzellenwafer

Country Status (10)

Country Link
US (1) US8307997B2 (de)
EP (1) EP2188833A2 (de)
JP (1) JP2010537440A (de)
KR (1) KR20100075470A (de)
CN (1) CN101821845B (de)
CA (1) CA2697732A1 (de)
DE (1) DE202007012384U1 (de)
RU (1) RU2010112385A (de)
TW (1) TW200921824A (de)
WO (1) WO2009030494A2 (de)

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US9153466B2 (en) * 2012-04-26 2015-10-06 Asm Ip Holding B.V. Wafer boat
KR102143884B1 (ko) * 2013-09-11 2020-08-12 삼성전자주식회사 버퍼 영역을 갖는 웨이퍼 로더
US20150104277A1 (en) * 2013-10-16 2015-04-16 Gt Crystal Systems, Llc Product cartridge for transporting product
US9597791B2 (en) * 2014-01-08 2017-03-21 Ryan Neal Tool holder
CN105356824B (zh) * 2015-11-24 2018-05-15 常州兆达睿光伏科技有限公司 一种高效太阳能板
CN109371383A (zh) * 2018-12-25 2019-02-22 南京爱通智能科技有限公司 一种适用于超大规模原子层沉积设备的载具
CN109385622A (zh) * 2018-12-25 2019-02-26 南京爱通智能科技有限公司 一种适用于超大产量的原子层沉积设备的流道结构
DE102019201166A1 (de) * 2019-01-30 2020-07-30 Siemens Aktiengesellschaft Werkstückträger zum Halten eines zu beschichtenden Bauteils, Verwendung eines solchen Werkstückträgers sowie Vorrichtung und Verfahren zum Beschichten eines Bauteils
CN110854237B (zh) * 2019-11-20 2021-04-20 西北电子装备技术研究所(中国电子科技集团公司第二研究所) 便于单齿更换的基于高精度装配的疏齿托架
KR20210100798A (ko) * 2020-02-06 2021-08-18 삼성디스플레이 주식회사 기판용 카세트
CN113483571A (zh) * 2021-06-22 2021-10-08 中国联合装备集团安阳机械有限公司 一种多边形加热炉及其使用方法

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JPH09162266A (ja) * 1995-12-13 1997-06-20 Henmi Keisanjiyaku Kk ウェハ押上げ機構の把持ユニット
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WO2003041880A1 (en) * 2001-11-13 2003-05-22 Fsi International, Inc. Semiconductor wafer cleaning systems and methods

Also Published As

Publication number Publication date
JP2010537440A (ja) 2010-12-02
WO2009030494A2 (de) 2009-03-12
KR20100075470A (ko) 2010-07-02
TW200921824A (en) 2009-05-16
CN101821845B (zh) 2012-11-14
DE202007012384U1 (de) 2007-11-22
CA2697732A1 (en) 2009-03-12
US20110114810A1 (en) 2011-05-19
CN101821845A (zh) 2010-09-01
US8307997B2 (en) 2012-11-13
RU2010112385A (ru) 2011-10-10
EP2188833A2 (de) 2010-05-26

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