WO2009028215A1 - 金属板チップ抵抗器の製造方法及び製造装置 - Google Patents

金属板チップ抵抗器の製造方法及び製造装置 Download PDF

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Publication number
WO2009028215A1
WO2009028215A1 PCT/JP2008/050170 JP2008050170W WO2009028215A1 WO 2009028215 A1 WO2009028215 A1 WO 2009028215A1 JP 2008050170 W JP2008050170 W JP 2008050170W WO 2009028215 A1 WO2009028215 A1 WO 2009028215A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal plate
resistance
chip resistor
product
production device
Prior art date
Application number
PCT/JP2008/050170
Other languages
English (en)
French (fr)
Inventor
Tatsuki Hirano
Kazuo Tanaka
Original Assignee
Kamaya Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kamaya Electric Co., Ltd. filed Critical Kamaya Electric Co., Ltd.
Priority to CN2008800003407A priority Critical patent/CN101542643B/zh
Priority to JP2008548898A priority patent/JP4264463B2/ja
Priority to US12/294,563 priority patent/US20100236054A1/en
Publication of WO2009028215A1 publication Critical patent/WO2009028215A1/ja
Priority to US13/196,078 priority patent/US8590141B2/en
Priority to US14/074,858 priority patent/US8973253B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/245—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by mechanical means, e.g. sand blasting, cutting, ultrasonic treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49004—Electrical device making including measuring or testing of device or component part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53022—Means to assemble or disassemble with means to test work or product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

　本発明は、簡易な工程により、比較的低い抵抗値を有する金属板チップ抵抗器を高精度、且つ高い歩留まりで製造可能とする製造方法及び製造装置を提供することことを目的とする。この目的は、帯状中間加工品１４を短辺方向に切断してチップ状加工品１６ａを形成する切断金型２１と、チップ状加工品１６ａの抵抗値を測定する抵抗値測定器２２と、抵抗値測定器２２により測定した抵抗値を用いて演算し、所望の抵抗値を備えたチップ状加工品が得られるように帯状中間加工品１４の短辺方向の切断幅を算出する演算手段を有する制御部２３と、演算手段により得られた切断幅で帯状中間加工品１４が短辺方向に切断されるべく調整する切断幅調整手段２６，２７とを備える金属板チップ抵抗器の製造装置１０により達成される。
PCT/JP2008/050170 2007-08-30 2008-01-10 金属板チップ抵抗器の製造方法及び製造装置 WO2009028215A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN2008800003407A CN101542643B (zh) 2007-08-30 2008-01-10 金属板芯片电阻器的制造方法以及制造装置
JP2008548898A JP4264463B2 (ja) 2007-08-30 2008-01-10 金属板チップ抵抗器の製造方法及び製造装置
US12/294,563 US20100236054A1 (en) 2007-08-30 2008-01-10 Method and apparatus for manufacturing metal plate chip resistors
US13/196,078 US8590141B2 (en) 2007-08-30 2011-08-02 Method and apparatus for manufacturing metal plate chip resistors
US14/074,858 US8973253B2 (en) 2007-08-30 2013-11-08 Method and apparatus for manufacturing metal plate chip resistors

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-223746 2007-08-30
JP2007223746 2007-08-30

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/294,563 A-371-Of-International US20100236054A1 (en) 2007-08-30 2008-01-10 Method and apparatus for manufacturing metal plate chip resistors
US13/196,078 Continuation US8590141B2 (en) 2007-08-30 2011-08-02 Method and apparatus for manufacturing metal plate chip resistors

Publications (1)

Publication Number Publication Date
WO2009028215A1 true WO2009028215A1 (ja) 2009-03-05

Family

ID=40386947

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/050170 WO2009028215A1 (ja) 2007-08-30 2008-01-10 金属板チップ抵抗器の製造方法及び製造装置

Country Status (6)

Country Link
US (3) US20100236054A1 (ja)
JP (1) JP4264463B2 (ja)
KR (1) KR101029484B1 (ja)
CN (1) CN101542643B (ja)
TW (1) TWI431642B (ja)
WO (1) WO2009028215A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095256A1 (ja) * 2009-02-23 2010-08-26 釜屋電機株式会社 金属板低抵抗チップ抵抗器及びその製造方法
JP2012174760A (ja) * 2011-02-18 2012-09-10 Kamaya Denki Kk 金属板低抵抗チップ抵抗器及びその製造方法
JP5373912B2 (ja) * 2009-08-11 2013-12-18 釜屋電機株式会社 低抵抗のチップ形抵抗器とその製造方法
WO2016098556A1 (ja) * 2014-12-15 2016-06-23 株式会社村田製作所 電子部品の製造方法および電子部品

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US20100236054A1 (en) * 2007-08-30 2010-09-23 Kamaya Electric Co., Ltd. Method and apparatus for manufacturing metal plate chip resistors
CN103345996B (zh) * 2013-06-21 2016-12-28 隆科电子(惠阳)有限公司 一种氧化锌避雷器阀片的制备方法
JP6476417B2 (ja) * 2013-08-07 2019-03-06 パナソニックＩｐマネジメント株式会社 抵抗器の製造方法
US9396849B1 (en) 2014-03-10 2016-07-19 Vishay Dale Electronics Llc Resistor and method of manufacture
CN103878585B (zh) * 2014-03-25 2016-04-06 常熟市林芝电热器件有限公司 加热器的ptc发热芯自动装配装置
DE102016000751B4 (de) * 2016-01-25 2019-01-17 Isabellenhütte Heusler Gmbh & Co. Kg Herstellungsverfahren für einen Widerstand und entsprechende Herstellungsanlage
TWI737734B (zh) * 2017-05-23 2021-09-01 德商伊莎貝倫赫特霍斯勒有限兩合公司 電阻器的製造方法及電阻器之製造設備
JP6983093B2 (ja) * 2018-03-27 2021-12-17 日東電工株式会社 抵抗測定装置、フィルム製造装置および導電性フィルムの製造方法
CN109712768B (zh) * 2019-03-27 2019-06-28 常州市伟宏动力技术有限公司 一种车用传感器的自动调阻工作站以及调阻原理
CN114050015B (zh) * 2021-11-19 2023-04-07 彩智电子科技(江西)有限公司 一种可保护物料的贴片电阻生产用长度可调式折条机

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JP2000114009A (ja) * 1998-10-08 2000-04-21 Alpha Electronics Kk 抵抗器、その実装方法および製造方法
JP2000232009A (ja) * 1999-02-12 2000-08-22 Matsushita Electric Ind Co Ltd 抵抗器の製造方法
JP2003115401A (ja) * 2001-10-02 2003-04-18 Koa Corp 低抵抗器及びその製造方法
JP2004063503A (ja) * 2002-07-24 2004-02-26 Rohm Co Ltd チップ抵抗器およびその製造方法
JP2004319787A (ja) * 2003-04-16 2004-11-11 Rohm Co Ltd チップ抵抗器およびその製造方法
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010095256A1 (ja) * 2009-02-23 2010-08-26 釜屋電機株式会社 金属板低抵抗チップ抵抗器及びその製造方法
JP5373912B2 (ja) * 2009-08-11 2013-12-18 釜屋電機株式会社 低抵抗のチップ形抵抗器とその製造方法
JP2012174760A (ja) * 2011-02-18 2012-09-10 Kamaya Denki Kk 金属板低抵抗チップ抵抗器及びその製造方法
WO2016098556A1 (ja) * 2014-12-15 2016-06-23 株式会社村田製作所 電子部品の製造方法および電子部品
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Also Published As

Publication number Publication date
JP4264463B2 (ja) 2009-05-20
KR20090086306A (ko) 2009-08-12
KR101029484B1 (ko) 2011-04-21
US20100236054A1 (en) 2010-09-23
TWI431642B (zh) 2014-03-21
TW200910387A (en) 2009-03-01
US20110283522A1 (en) 2011-11-24
CN101542643A (zh) 2009-09-23
CN101542643B (zh) 2011-09-28
JPWO2009028215A1 (ja) 2010-11-25
US8590141B2 (en) 2013-11-26
US20140059838A1 (en) 2014-03-06
US8973253B2 (en) 2015-03-10

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