WO2009025070A1 - 試験システムおよびドーターユニット - Google Patents

試験システムおよびドーターユニット Download PDF

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Publication number
WO2009025070A1
WO2009025070A1 PCT/JP2008/002137 JP2008002137W WO2009025070A1 WO 2009025070 A1 WO2009025070 A1 WO 2009025070A1 JP 2008002137 W JP2008002137 W JP 2008002137W WO 2009025070 A1 WO2009025070 A1 WO 2009025070A1
Authority
WO
WIPO (PCT)
Prior art keywords
test
daughter
socket
device under
unit
Prior art date
Application number
PCT/JP2008/002137
Other languages
English (en)
French (fr)
Inventor
Kouji Miyauchi
Toshiyuki Watanabe
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to JP2009528948A priority Critical patent/JPWO2009025070A1/ja
Priority to EP08827732A priority patent/EP2189800A1/en
Priority to CN200880001372.9A priority patent/CN101578528B/zh
Publication of WO2009025070A1 publication Critical patent/WO2009025070A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/18—Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
    • G01R31/2836—Fault-finding or characterising
    • G01R31/2839—Fault-finding or characterising using signal generators, power supplies or circuit analysers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

　被試験デバイスを試験する試験システムであって、被試験デバイスに供給すべき試験信号を発生する試験モジュールを有するテストヘッドと、テストヘッド上に載置され、試験モジュールが発生した試験信号を伝送するパフォーマンスボードと、パフォーマンスボード上に着脱可能に搭載され、パフォーマンスボードから被試験デバイスへと試験信号を伝送するドーターユニットと、を備え、ドーターユニットは、被試験デバイスを搭載するソケットと、ソケットを実装するドーターボードと、ソケットおよびドーターボードを内側に格納し、外部からソケットおよびドーターボードに対するノイズを遮断するドーターユニット側シールドを含む筐体とを有する試験システムを提供する。
PCT/JP2008/002137 2007-08-23 2008-08-06 試験システムおよびドーターユニット WO2009025070A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009528948A JPWO2009025070A1 (ja) 2007-08-23 2008-08-06 試験システムおよびドーターユニット
EP08827732A EP2189800A1 (en) 2007-08-23 2008-08-06 Test system and daughter unit
CN200880001372.9A CN101578528B (zh) 2007-08-23 2008-08-06 测试系统及子单元

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/843,672 US7688077B2 (en) 2007-08-23 2007-08-23 Test system and daughter unit
US11/843,672 2007-08-23

Publications (1)

Publication Number Publication Date
WO2009025070A1 true WO2009025070A1 (ja) 2009-02-26

Family

ID=40377980

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002137 WO2009025070A1 (ja) 2007-08-23 2008-08-06 試験システムおよびドーターユニット

Country Status (7)

Country Link
US (1) US7688077B2 (ja)
EP (1) EP2189800A1 (ja)
JP (1) JPWO2009025070A1 (ja)
KR (1) KR20100035660A (ja)
CN (1) CN101578528B (ja)
TW (1) TWI388835B (ja)
WO (1) WO2009025070A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170019045A (ko) * 2015-08-11 2017-02-21 (주)테크윙 반도체소자 테스트용 핸들러
JP2019191144A (ja) * 2018-04-18 2019-10-31 台湾福雷電子股▲ふん▼有限公司 試験装置およびその操作方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5314634B2 (ja) 2010-05-17 2013-10-16 株式会社アドバンテスト 試験装置、試験方法、およびデバイスインターフェイス
US9213053B2 (en) * 2010-12-02 2015-12-15 Apple Inc. System for field testing wireless devices with reduced multipath interference
US20130014983A1 (en) * 2011-07-14 2013-01-17 Texas Instruments Incorporated Device contactor with integrated rf shield
KR101298158B1 (ko) * 2011-10-18 2013-08-21 가부시키가이샤 어드밴티스트 광 커플러를 가지는 피시험 디바이스를 시험하기 위한 시험 장치, 광 커플러를 가지는 피시험 디바이스를 시험 장치로 시험하기 위한 시험 방법, 및 디바이스 인터페이스
US9588173B2 (en) 2013-12-17 2017-03-07 Keyssa, Inc. Waveguides for capturing close-proximity electromagnetic radiation transmitted by wireless chips during testing on automated test equipment (ATE)
US10826630B2 (en) * 2015-01-30 2020-11-03 Rohde & Schwarz Gmbh & Co. Kg Measuring device, system and method for wirelessly measuring radiation patterns
JP2016170007A (ja) * 2015-03-12 2016-09-23 株式会社東芝 共通テストボード、ｉｐ評価ボード、及び半導体デバイスのテスト方法
TWI557413B (zh) * 2015-06-05 2016-11-11 Hon Tech Inc Test equipment for electronic components testing equipment for anti - noise devices and their application
US9863976B2 (en) 2015-10-09 2018-01-09 Keyssa Systems, Inc. Module test socket for over the air testing of radio frequency integrated circuits
US10897840B2 (en) * 2016-06-13 2021-01-19 Advanced Semiconductor Engineering Korea, Inc. Shield box, shield box assembly and apparatus for testing a semiconductor device
CN108490330A (zh) * 2018-03-30 2018-09-04 上海陆芯电子科技有限公司 一种半导体开关管测试装置
CN110389244A (zh) * 2018-04-17 2019-10-29 罗德施瓦兹两合股份有限公司 测量系统和用于操作测量系统的方法
US10972192B2 (en) * 2018-05-11 2021-04-06 Teradyne, Inc. Handler change kit for a test system
TWI725500B (zh) * 2019-07-31 2021-04-21 和碩聯合科技股份有限公司 扭力測試設備及其待測物定位座
DE102019215126A1 (de) * 2019-10-01 2021-04-01 Neuroloop GmbH Anordnung zur Funktionsüberprüfung eines Meßobjektes
JP7405600B2 (ja) * 2019-12-24 2023-12-26 株式会社アドバンテスト 電子部品ハンドリング装置、電子部品試験装置、及び、ソケット

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07260878A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd テストステーション
JPH10142291A (ja) * 1996-11-13 1998-05-29 Advantest Corp Ｉｃ試験装置
JPH1183934A (ja) * 1997-09-05 1999-03-26 Advantest Corp 半導体試験装置
JP2000121704A (ja) * 1998-10-19 2000-04-28 Advantest Corp Ｉｃ試験装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5475316A (en) * 1993-12-27 1995-12-12 Hypervision, Inc. Transportable image emission microscope
US20020004320A1 (en) * 1995-05-26 2002-01-10 David V. Pedersen Attaratus for socketably receiving interconnection elements of an electronic component
TW440699B (en) * 1998-06-09 2001-06-16 Advantest Corp Test apparatus for electronic parts
EP0965845B1 (en) * 1999-03-19 2001-10-17 Agilent Technologies, Inc. (a Delaware corporation) Test head assembly
US6377062B1 (en) * 2000-03-17 2002-04-23 Credence Systems Corporation Floating interface for integrated circuit test head
US6759842B2 (en) * 2002-04-17 2004-07-06 Eagle Test Systems, Inc. Interface adapter for automatic test systems
SG126909A1 (en) * 2005-05-02 2006-11-29 Daytona Control Co Ltd Temperature control apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07260878A (ja) * 1994-03-18 1995-10-13 Fujitsu Ltd テストステーション
JPH10142291A (ja) * 1996-11-13 1998-05-29 Advantest Corp Ｉｃ試験装置
JPH1183934A (ja) * 1997-09-05 1999-03-26 Advantest Corp 半導体試験装置
JP2000121704A (ja) * 1998-10-19 2000-04-28 Advantest Corp Ｉｃ試験装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170019045A (ko) * 2015-08-11 2017-02-21 (주)테크윙 반도체소자 테스트용 핸들러
KR102312491B1 (ko) 2015-08-11 2021-10-15 (주)테크윙 반도체소자 테스트용 핸들러
JP2019191144A (ja) * 2018-04-18 2019-10-31 台湾福雷電子股▲ふん▼有限公司 試験装置およびその操作方法

Also Published As

Publication number Publication date
EP2189800A1 (en) 2010-05-26
TWI388835B (zh) 2013-03-11
KR20100035660A (ko) 2010-04-05
US20090051366A1 (en) 2009-02-26
CN101578528B (zh) 2013-03-20
US7688077B2 (en) 2010-03-30
JPWO2009025070A1 (ja) 2010-11-18
CN101578528A (zh) 2009-11-11
TW200916783A (en) 2009-04-16

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