WO2009014115A1 - 電子部品用接着剤、半導体チップの積層方法及び半導体装置 - Google Patents

電子部品用接着剤、半導体チップの積層方法及び半導体装置 Download PDF

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Publication number
WO2009014115A1
WO2009014115A1 PCT/JP2008/063124 JP2008063124W WO2009014115A1 WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1 JP 2008063124 W JP2008063124 W JP 2008063124W WO 2009014115 A1 WO2009014115 A1 WO 2009014115A1
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WO
WIPO (PCT)
Prior art keywords
electronic component
adhesive
support member
semiconductor device
stacking method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/063124
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English (en)
French (fr)
Inventor
Hideaki Ishizawa
Akinobu Hayakawa
Kohei Takeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to KR1020097026044A priority Critical patent/KR101155361B1/ko
Priority to CN2008800252999A priority patent/CN101755329B/zh
Priority to JP2008534802A priority patent/JP4339927B2/ja
Publication of WO2009014115A1 publication Critical patent/WO2009014115A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07321—Aligning
    • H10W72/07327—Aligning involving guiding structures, e.g. spacers or supporting members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)

Abstract

本発明は、一の電子部品と、他の電子部品又は支持部材とを平行にかつ正確なギャップ間距離で接合することができる電子部品用接着剤を提供することを目的とする。また、該電子部品用接着剤を用いた半導体チップの積層方法、及び、半導体装置を提供することを目的とする。 本発明は、一の電子部品と他の電子部品又は支持部材とを３０μｍ以下のギャップ間距離で平行に積層するための電子部品用接着剤であって、硬化性化合物、硬化剤及びスペーサ粒子を含有する電子部品用接着剤であり、前記一の電子部品と他の電子部品又は支持部材とを接合する際の温度におけるＥ型粘度計を用いた１０ｒｐｍでの粘度が５０Ｐａ・ｓ以下であり、前記スペーサ粒子は、ＣＶ値が１０％以下であり、平均粒子径が、前記一の電子部品と他の電子部品又は支持部材とのギャップ間距離の４０～７０％である電子部品用接着剤である。 　
PCT/JP2008/063124 2007-07-25 2008-07-22 電子部品用接着剤、半導体チップの積層方法及び半導体装置 Ceased WO2009014115A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097026044A KR101155361B1 (ko) 2007-07-25 2008-07-22 전자 부품용 접착제, 반도체 칩의 적층 방법 및 반도체 장치
CN2008800252999A CN101755329B (zh) 2007-07-25 2008-07-22 电子部件用胶粘剂、半导体芯片的层叠方法及半导体装置
JP2008534802A JP4339927B2 (ja) 2007-07-25 2008-07-22 半導体チップの積層方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-193758 2007-07-25
JP2007193758 2007-07-25
JP2008053249 2008-03-04
JP2008-053249 2008-03-04

Publications (1)

Publication Number Publication Date
WO2009014115A1 true WO2009014115A1 (ja) 2009-01-29

Family

ID=40281366

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/063124 Ceased WO2009014115A1 (ja) 2007-07-25 2008-07-22 電子部品用接着剤、半導体チップの積層方法及び半導体装置

Country Status (5)

Country Link
JP (1) JP4339927B2 (ja)
KR (1) KR101155361B1 (ja)
CN (1) CN101755329B (ja)
TW (1) TWI411049B (ja)
WO (1) WO2009014115A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219162A (ja) * 2009-03-13 2010-09-30 Sekisui Chem Co Ltd 半導体チップ接合用接着剤
JP2011168631A (ja) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd 金属被覆粒子の製造方法
JP2011233599A (ja) * 2010-04-23 2011-11-17 Toshiba Corp 半導体装置の製造方法
JP2012142438A (ja) * 2010-12-28 2012-07-26 Jgc Catalysts & Chemicals Ltd 半導体装置実装用ペ−スト
WO2017170492A1 (ja) * 2016-03-30 2017-10-05 積水化学工業株式会社 インダクタ用接着剤及びインダクタ

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676954B2 (ja) * 2010-07-27 2015-02-25 京セラ株式会社 サーマルヘッドおよびこれを備えるサーマルプリンタ
JP5176000B1 (ja) 2011-03-09 2013-04-03 積水化学工業株式会社 電子部品用接着剤及び半導体チップ実装体の製造方法
US8937380B1 (en) * 2013-08-30 2015-01-20 Infineon Technologies Austria Ag Die edge protection for pressure sensor packages
KR101651649B1 (ko) * 2016-01-22 2016-08-29 주식회사 일렉켐스 전기 또는 전자 부품 접속용 도전성 접착 조성물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2005244188A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用ペースト状接着剤及び半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216973A (ja) * 2004-01-27 2005-08-11 Sekisui Chem Co Ltd 半導体装置
JP2005244188A (ja) * 2004-01-27 2005-09-08 Sekisui Chem Co Ltd 半導体チップ接合用ペースト状接着剤及び半導体装置
JP2007169448A (ja) * 2005-12-21 2007-07-05 Sekisui Chem Co Ltd 熱硬化性樹脂組成物及び半導体装置
WO2008010555A1 (fr) * 2006-07-20 2008-01-24 Sekisui Chemical Co., Ltd. Adhésif pour composants électroniques, procédé de fabrication d'un laminé de puce semi-conductrice, et dispositif semi-conducteur

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219162A (ja) * 2009-03-13 2010-09-30 Sekisui Chem Co Ltd 半導体チップ接合用接着剤
JP2011168631A (ja) * 2010-02-16 2011-09-01 Nippon Shokubai Co Ltd 金属被覆粒子の製造方法
JP2011233599A (ja) * 2010-04-23 2011-11-17 Toshiba Corp 半導体装置の製造方法
JP2012142438A (ja) * 2010-12-28 2012-07-26 Jgc Catalysts & Chemicals Ltd 半導体装置実装用ペ−スト
WO2017170492A1 (ja) * 2016-03-30 2017-10-05 積水化学工業株式会社 インダクタ用接着剤及びインダクタ
JP6232167B1 (ja) * 2016-03-30 2017-11-15 積水化学工業株式会社 インダクタ用接着剤及びインダクタ

Also Published As

Publication number Publication date
CN101755329B (zh) 2011-09-21
JPWO2009014115A1 (ja) 2010-10-07
TWI411049B (zh) 2013-10-01
JP4339927B2 (ja) 2009-10-07
KR20100018562A (ko) 2010-02-17
TW200908166A (en) 2009-02-16
CN101755329A (zh) 2010-06-23
KR101155361B1 (ko) 2012-06-19

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