KR101155361B1 - 전자 부품용 접착제, 반도체 칩의 적층 방법 및 반도체 장치 - Google Patents

전자 부품용 접착제, 반도체 칩의 적층 방법 및 반도체 장치 Download PDF

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Publication number
KR101155361B1
KR101155361B1 KR1020097026044A KR20097026044A KR101155361B1 KR 101155361 B1 KR101155361 B1 KR 101155361B1 KR 1020097026044 A KR1020097026044 A KR 1020097026044A KR 20097026044 A KR20097026044 A KR 20097026044A KR 101155361 B1 KR101155361 B1 KR 101155361B1
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South Korea
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adhesive
semiconductor chip
electronic component
electronic components
preferable
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KR1020097026044A
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English (en)
Korean (ko)
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KR20100018562A (ko
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히데아키 이시자와
아키노부 하야카와
고헤이 다케다
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세키스이가가쿠 고교가부시키가이샤
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Publication of KR20100018562A publication Critical patent/KR20100018562A/ko
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Die Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
KR1020097026044A 2007-07-25 2008-07-22 전자 부품용 접착제, 반도체 칩의 적층 방법 및 반도체 장치 KR101155361B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2007-193758 2007-07-25
JP2007193758 2007-07-25
JP2008053249 2008-03-04
JPJP-P-2008-053249 2008-03-04
PCT/JP2008/063124 WO2009014115A1 (ja) 2007-07-25 2008-07-22 電子部品用接着剤、半導体チップの積層方法及び半導体装置

Publications (2)

Publication Number Publication Date
KR20100018562A KR20100018562A (ko) 2010-02-17
KR101155361B1 true KR101155361B1 (ko) 2012-06-19

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JP (1) JP4339927B2 (ja)
KR (1) KR101155361B1 (ja)
CN (1) CN101755329B (ja)
TW (1) TWI411049B (ja)
WO (1) WO2009014115A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101456397B1 (ko) 2011-03-09 2014-10-31 세키스이가가쿠 고교가부시키가이샤 전자 부품용 접착제 및 반도체 칩 실장체의 제조 방법

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010219162A (ja) * 2009-03-13 2010-09-30 Sekisui Chem Co Ltd 半導体チップ接合用接着剤
JP5694671B2 (ja) * 2010-02-16 2015-04-01 公立大学法人首都大学東京 金属被覆粒子の製造方法
JP5680330B2 (ja) * 2010-04-23 2015-03-04 株式会社東芝 半導体装置の製造方法
JP5676954B2 (ja) * 2010-07-27 2015-02-25 京セラ株式会社 サーマルヘッドおよびこれを備えるサーマルプリンタ
JP5912249B2 (ja) * 2010-12-28 2016-04-27 日揮触媒化成株式会社 半導体装置実装用ペ−スト
US8937380B1 (en) * 2013-08-30 2015-01-20 Infineon Technologies Austria Ag Die edge protection for pressure sensor packages
KR101651649B1 (ko) * 2016-01-22 2016-08-29 주식회사 일렉켐스 전기 또는 전자 부품 접속용 도전성 접착 조성물
CN108352243B (zh) * 2016-03-30 2020-12-04 积水化学工业株式会社 电感器用粘接剂及电感器

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