WO2009013941A1 - 基板吸着装置及びその製造方法 - Google Patents

基板吸着装置及びその製造方法 Download PDF

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Publication number
WO2009013941A1
WO2009013941A1 PCT/JP2008/060341 JP2008060341W WO2009013941A1 WO 2009013941 A1 WO2009013941 A1 WO 2009013941A1 JP 2008060341 W JP2008060341 W JP 2008060341W WO 2009013941 A1 WO2009013941 A1 WO 2009013941A1
Authority
WO
WIPO (PCT)
Prior art keywords
dielectric layer
vacuum suction
downmost
suction apparatus
substrate suction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/060341
Other languages
English (en)
French (fr)
Inventor
Yoshiaki Tatsumi
Kinya Miyashita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Creative Technology Corp
Original Assignee
Creative Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Technology Corp filed Critical Creative Technology Corp
Priority to KR1020107000505A priority Critical patent/KR101384504B1/ko
Priority to US12/669,856 priority patent/US8469342B2/en
Priority to JP2009524417A priority patent/JP5094863B2/ja
Publication of WO2009013941A1 publication Critical patent/WO2009013941A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

　真空吸着機構と静電吸着機構とを備え、真空吸着力の均一性を高めて、被加工物の平坦性を向上させた基板吸着装置及びその製造方法を提供する。 基板吸着装置（１）は、基盤（２）と誘電体（３）と静電吸着機構（４）と真空吸着機構（５）とを備える。具体的には、誘電体（３）を最下位誘電体層（３１）と中間誘電体層（３２）と最上位誘電体層（３３）とで構成し、静電吸着機構（４）を吸着電極（４１，４２）と直流電源とで構成した。真空吸着機構（５）は、溝（５１）及び吸気通路（５２）と、多孔質の誘電体（３）と多孔質の吸着電極（４１，４２）とで構成した。そして、最下位誘電体層（３１）と中間誘電体層（３２）と最上位誘電体層（３３）とをセラミック粒子の溶射で形成し、吸着電極（４１，４２）をタングステン粒子の溶射で形成した。また、最下位誘電体層（３１）の平均孔径及び気孔率を最も大きく設定し、最上位誘電体層（３３）の平均孔径及び気孔率を最も小さく設定した。
PCT/JP2008/060341 2007-07-23 2008-06-05 基板吸着装置及びその製造方法 Ceased WO2009013941A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107000505A KR101384504B1 (ko) 2007-07-23 2008-06-05 기판 흡착 장치 및 그 제조 방법
US12/669,856 US8469342B2 (en) 2007-07-23 2008-06-05 Substrate suction apparatus and method for manufacturing the same
JP2009524417A JP5094863B2 (ja) 2007-07-23 2008-06-05 基板吸着装置及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-190601 2007-07-23
JP2007190601 2007-07-23

Publications (1)

Publication Number Publication Date
WO2009013941A1 true WO2009013941A1 (ja) 2009-01-29

Family

ID=40281200

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060341 Ceased WO2009013941A1 (ja) 2007-07-23 2008-06-05 基板吸着装置及びその製造方法

Country Status (5)

Country Link
US (1) US8469342B2 (ja)
JP (1) JP5094863B2 (ja)
KR (1) KR101384504B1 (ja)
TW (1) TWI433260B (ja)
WO (1) WO2009013941A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010267746A (ja) * 2009-05-13 2010-11-25 Nikon Corp 半導体処理装置
JP2010278052A (ja) * 2009-05-26 2010-12-09 Disco Abrasive Syst Ltd 切削装置のチャックテーブル
JP2014501440A (ja) * 2010-12-14 2014-01-20 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウェハを保持しマウントするための保持装置
WO2015029575A1 (ja) * 2013-08-26 2015-03-05 京セラ株式会社 試料保持具
JP2019012757A (ja) * 2017-06-29 2019-01-24 日本特殊陶業株式会社 真空吸着部材
JP2022011991A (ja) * 2020-06-30 2022-01-17 京セラ株式会社 静電チャック
JP2022176701A (ja) * 2021-05-17 2022-11-30 日本特殊陶業株式会社 保持装置
JP2024058161A (ja) * 2022-10-14 2024-04-25 日本特殊陶業株式会社 サセプタ

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DE102010038324B4 (de) * 2010-07-23 2012-03-22 Hilti Aktiengesellschaft Vorrichtung zum Positionieren von Schneidpartikeln
US9615428B2 (en) 2011-02-01 2017-04-04 John Joseph King Arrangement for an outdoor light enabling motion detection
US8982531B2 (en) * 2011-10-19 2015-03-17 Sri International Additional force augmented electroadhesion
US9130484B2 (en) 2011-10-19 2015-09-08 Sri International Vacuum augmented electroadhesive device
JP5961064B2 (ja) * 2012-07-31 2016-08-02 三星ダイヤモンド工業株式会社 吸着テーブルの製造方法並びに吸着テーブル
JP6140457B2 (ja) 2013-01-21 2017-05-31 東京エレクトロン株式会社 接着方法、載置台及び基板処理装置
US9226373B2 (en) 2013-10-30 2015-12-29 John Joseph King Programmable light timer and a method of implementing a programmable light timer
WO2016142238A1 (en) * 2015-03-11 2016-09-15 Nv Bekaert Sa Carrier for temporary bonded wafers
JP6533300B2 (ja) * 2015-10-20 2019-06-19 三菱電機株式会社 太陽電池の製造方法および太陽電池製造装置
WO2017123816A1 (en) 2016-01-12 2017-07-20 Grabit, Inc. Methods and systems for electroadhesion-based manipulation in manufacturing
US20180281151A1 (en) * 2017-03-30 2018-10-04 Applied Materials, Inc. Adhesive-less carriers for chemical mechanical polishing
JP7012454B2 (ja) * 2017-04-27 2022-01-28 株式会社岡本工作機械製作所 静電吸着チャックの製造方法並びに半導体装置の製造方法
JP2019075477A (ja) * 2017-10-17 2019-05-16 株式会社ディスコ チャックテーブル機構
CN108176929B (zh) * 2017-12-16 2021-02-09 武汉吉事达科技股份有限公司 水磨石材质吸附平台的制作方法
US11196360B2 (en) * 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
JP7350438B2 (ja) * 2019-09-09 2023-09-26 株式会社ディスコ チャックテーブル及びチャックテーブルの製造方法
CN111244015B (zh) * 2020-01-20 2023-07-21 杭州立昂东芯微电子有限公司 一种晶圆解键合辅助载盘、解键合机及解键合方法
JP7437186B2 (ja) * 2020-02-26 2024-02-22 Ｊｓｗアクティナシステム株式会社 浮上搬送装置、及びレーザ処理装置
JP7630875B2 (ja) * 2020-11-17 2025-02-18 株式会社ディスコ チャックテーブル及びレーザー加工装置
EP4011537A1 (de) * 2020-12-14 2022-06-15 Hilti Aktiengesellschaft Vorrichtung zum positionieren von partikeln und verfahren zum positionieren von partikeln mittels der vorrichtung
JP7797762B2 (ja) * 2021-08-25 2026-01-14 新光電気工業株式会社 基板固定装置
US12463102B2 (en) * 2022-05-11 2025-11-04 Xintec Inc. Semiconductor device structure and method for forming the same
KR102753530B1 (ko) * 2022-05-23 2025-01-10 세메스 주식회사 기판 처리 장치
TWI824714B (zh) * 2022-09-13 2023-12-01 中國砂輪企業股份有限公司 可局部吹氣或吸氣之吸盤及其應用系統
CN120089640B (zh) * 2025-05-07 2025-08-08 深圳市云在上半导体材料有限公司 用于半导体加工的静电吸盘结构

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JPH0267745A (ja) * 1988-09-02 1990-03-07 Canon Inc ウエハ保持方法
JP2001203258A (ja) * 2000-01-21 2001-07-27 Tocalo Co Ltd 静電チャック部材およびその製造方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010267746A (ja) * 2009-05-13 2010-11-25 Nikon Corp 半導体処理装置
JP2010278052A (ja) * 2009-05-26 2010-12-09 Disco Abrasive Syst Ltd 切削装置のチャックテーブル
JP2014501440A (ja) * 2010-12-14 2014-01-20 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウェハを保持しマウントするための保持装置
WO2015029575A1 (ja) * 2013-08-26 2015-03-05 京セラ株式会社 試料保持具
JP2019012757A (ja) * 2017-06-29 2019-01-24 日本特殊陶業株式会社 真空吸着部材
JP2022011991A (ja) * 2020-06-30 2022-01-17 京セラ株式会社 静電チャック
JP7550551B2 (ja) 2020-06-30 2024-09-13 京セラ株式会社 静電チャック
JP2022176701A (ja) * 2021-05-17 2022-11-30 日本特殊陶業株式会社 保持装置
JP7558886B2 (ja) 2021-05-17 2024-10-01 日本特殊陶業株式会社 保持装置
JP2024058161A (ja) * 2022-10-14 2024-04-25 日本特殊陶業株式会社 サセプタ

Also Published As

Publication number Publication date
JP5094863B2 (ja) 2012-12-12
KR20100044776A (ko) 2010-04-30
TWI433260B (zh) 2014-04-01
US8469342B2 (en) 2013-06-25
US20100194012A1 (en) 2010-08-05
KR101384504B1 (ko) 2014-04-14
TW200910512A (en) 2009-03-01
JPWO2009013941A1 (ja) 2010-09-30

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