WO2009011307A1 - 試料の表面形状の測定方法及び装置 - Google Patents

試料の表面形状の測定方法及び装置 Download PDF

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Publication number
WO2009011307A1
WO2009011307A1 PCT/JP2008/062581 JP2008062581W WO2009011307A1 WO 2009011307 A1 WO2009011307 A1 WO 2009011307A1 JP 2008062581 W JP2008062581 W JP 2008062581W WO 2009011307 A1 WO2009011307 A1 WO 2009011307A1
Authority
WO
WIPO (PCT)
Prior art keywords
probe
sample
surface profile
measuring surface
detection
Prior art date
Application number
PCT/JP2008/062581
Other languages
English (en)
French (fr)
Inventor
Naoki Mizutani
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to CN200880104312XA priority Critical patent/CN101784862B/zh
Priority to KR1020107003159A priority patent/KR101278763B1/ko
Priority to US12/668,705 priority patent/US8474147B2/en
Priority to EP08778096A priority patent/EP2172736A4/en
Publication of WO2009011307A1 publication Critical patent/WO2009011307A1/ja

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0011—Arrangements for eliminating or compensation of measuring errors due to temperature or weight
    • G01B5/0016—Arrangements for eliminating or compensation of measuring errors due to temperature or weight due to weight
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/28—Measuring arrangements characterised by the use of mechanical techniques for measuring roughness or irregularity of surfaces

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • A Measuring Device Byusing Mechanical Method (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

　試料には強い力をかけずに探針のとびを抑制できる試料の表面形状の測定方法及び装置を提供する。 センサによる被測定表面上における探針の垂直方向の変位の検出と、探針の変位の検出に基いた探針の速度及び加速度の算出と、及び探針の速度及び加速度の少なくとも一方のリアルタイムでのモニターによる探針のとびの検出と、探針の針圧発生装置への電流制御とから成る制御操作を短時間で行い、探針が空中にあるときにだけ探針にかける針圧を増大し、探針が試料に再び触れる前に探針の針圧を元の状態に戻す。
PCT/JP2008/062581 2007-07-13 2008-07-11 試料の表面形状の測定方法及び装置 WO2009011307A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880104312XA CN101784862B (zh) 2007-07-13 2008-07-11 试样的表面形状的测定方法及装置
KR1020107003159A KR101278763B1 (ko) 2007-07-13 2008-07-11 표본의 표면 프로파일 측정을 위한 방법 및 장치
US12/668,705 US8474147B2 (en) 2007-07-13 2008-07-11 Method and apparatus for measuring surface profile of sample
EP08778096A EP2172736A4 (en) 2007-07-13 2008-07-11 METHOD FOR MEASURING SURFACE PROFILE OF SAMPLE AND APPARATUS FOR MEASURING SAMPLE SURFACE PROFILE

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007184390A JP5173292B2 (ja) 2007-07-13 2007-07-13 試料の表面形状の測定方法
JP2007-184390 2007-07-13

Publications (1)

Publication Number Publication Date
WO2009011307A1 true WO2009011307A1 (ja) 2009-01-22

Family

ID=40259640

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062581 WO2009011307A1 (ja) 2007-07-13 2008-07-11 試料の表面形状の測定方法及び装置

Country Status (7)

Country Link
US (1) US8474147B2 (ja)
EP (1) EP2172736A4 (ja)
JP (1) JP5173292B2 (ja)
KR (1) KR101278763B1 (ja)
CN (1) CN101784862B (ja)
TW (1) TWI444591B (ja)
WO (1) WO2009011307A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5544137B2 (ja) * 2009-10-01 2014-07-09 株式会社アルバック 触針式段差計による試料の表面形状の測定用の計測制御回路装置
JP5697416B2 (ja) * 2010-11-24 2015-04-08 キヤノン株式会社 接触式形状測定装置
JP2013007669A (ja) * 2011-06-24 2013-01-10 Ulvac Japan Ltd 表面形状測定用触針式段差計における針飛び抑制方法
JP5782863B2 (ja) * 2011-06-24 2015-09-24 株式会社アルバック 表面形状測定用触針式段差計の性能改善方法及び該方法を実施した表面形状測定用触針式段差計
JP2013007666A (ja) * 2011-06-24 2013-01-10 Ulvac Japan Ltd 表面形状測定用触針式段差計及び該段差計における測定精度の改善方法
JP6133678B2 (ja) * 2013-05-01 2017-05-24 株式会社ミツトヨ 表面性状測定装置およびその制御方法
CN103499271A (zh) * 2013-09-29 2014-01-08 无锡乐尔科技有限公司 一种厚度测量装置
CN104297147B (zh) * 2014-09-24 2016-08-24 京东方科技集团股份有限公司 基板划伤程度的检测装置及其检测方法、检测系统
CN105352433A (zh) * 2015-10-23 2016-02-24 武汉理工大学 一种船体典型焊接结构表面裂纹深度及形状测量装置及其方法
JP6229959B2 (ja) * 2016-03-08 2017-11-15 パナソニックＩｐマネジメント株式会社 スタイラス及び測定方法
CN108562222B (zh) * 2018-01-18 2020-05-05 华侨大学 一种海底凹坑深度发育测量装置及使用方法
JP7259198B2 (ja) * 2018-03-23 2023-04-18 株式会社東京精密 表面形状測定装置
KR101944080B1 (ko) * 2018-07-24 2019-01-30 황재은 형상측정기
JP7213059B2 (ja) * 2018-10-24 2023-01-26 株式会社ミツトヨ 表面性状測定装置およびその制御方法
JP7261560B2 (ja) * 2018-10-31 2023-04-20 株式会社ミツトヨ 表面性状測定方法および表面性状測定装置
TWI717106B (zh) * 2019-11-18 2021-01-21 財團法人工業技術研究院 銲接品質檢測系統與方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004340868A (ja) * 2003-05-19 2004-12-02 Canon Inc 接触式プローブの圧力制御の安定化方法
JP2006010469A (ja) * 2004-06-25 2006-01-12 Canon Inc 接触式プローブの跳ね現象の検出方法
JP2006226964A (ja) 2005-02-21 2006-08-31 Ulvac Japan Ltd 試料の表面形状の測定方法及び装置
JP2007051875A (ja) * 2005-08-15 2007-03-01 Ulvac Japan Ltd 表面形状測定用触針式段差計の摩擦力補正方法
JP2007057308A (ja) * 2005-08-23 2007-03-08 Canon Inc 接触式プローブ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4719578A (en) * 1985-12-09 1988-01-12 Mitsubishi Jukogyo Kabushiki Kaisha Profiling control apparatus and control method thereof
JP4944308B2 (ja) * 2001-05-18 2012-05-30 キヤノン株式会社 表面性識別装置とこれを用いた加熱装置及び画像形成装置
US6953930B2 (en) * 2001-08-27 2005-10-11 Nippon Telegraph And Telephone Corporation Conductive transparent probe and probe control apparatus
US20100148813A1 (en) * 2006-07-18 2010-06-17 Multiprobe, Inc. Apparatus and method for combined micro-scale and nano-scale c-v, q-v, and i-v testing of semiconductor materials
JP5544137B2 (ja) * 2009-10-01 2014-07-09 株式会社アルバック 触針式段差計による試料の表面形状の測定用の計測制御回路装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004340868A (ja) * 2003-05-19 2004-12-02 Canon Inc 接触式プローブの圧力制御の安定化方法
JP2006010469A (ja) * 2004-06-25 2006-01-12 Canon Inc 接触式プローブの跳ね現象の検出方法
JP2006226964A (ja) 2005-02-21 2006-08-31 Ulvac Japan Ltd 試料の表面形状の測定方法及び装置
JP2007051875A (ja) * 2005-08-15 2007-03-01 Ulvac Japan Ltd 表面形状測定用触針式段差計の摩擦力補正方法
JP2007057308A (ja) * 2005-08-23 2007-03-08 Canon Inc 接触式プローブ

Also Published As

Publication number Publication date
TW200912251A (en) 2009-03-16
CN101784862A (zh) 2010-07-21
US20100288033A1 (en) 2010-11-18
TWI444591B (zh) 2014-07-11
EP2172736A1 (en) 2010-04-07
CN101784862B (zh) 2012-05-09
KR101278763B1 (ko) 2013-06-28
JP2009020050A (ja) 2009-01-29
KR20100059795A (ko) 2010-06-04
EP2172736A4 (en) 2012-09-19
US8474147B2 (en) 2013-07-02
JP5173292B2 (ja) 2013-04-03

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