WO2009011023A1 - 配線基板及びその製造方法 - Google Patents
配線基板及びその製造方法 Download PDFInfo
- Publication number
- WO2009011023A1 WO2009011023A1 PCT/JP2007/064021 JP2007064021W WO2009011023A1 WO 2009011023 A1 WO2009011023 A1 WO 2009011023A1 JP 2007064021 W JP2007064021 W JP 2007064021W WO 2009011023 A1 WO2009011023 A1 WO 2009011023A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- wiring board
- manufacturing
- groove portion
- base
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1536—Temporarily stacked PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
配線基板19は、第1基板1と、第1基板1より実装面積が小さい第2基板2と、第1基板1と第2基板2との間に設けられているベース基板3と、を積層して構成され、外周の少なくとも一部の厚みが、中央部よりも薄く形成される。ベース基板3は、無機フィラー配合樹脂を含んで構成される。第1基板1及び前記第2基板2は、可撓性樹脂を含んで構成される。第1基板1と第2基板2とにはヴィア44が設けられている。第1基板1と第2基板2との間には層間溝部11が設けられている。層間溝部11には気体等が充填されている。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009523463A JP4834157B2 (ja) | 2007-07-13 | 2007-07-13 | 配線基板及びその製造方法 |
CN200780100601A CN101803482A (zh) | 2007-07-13 | 2007-07-13 | 布线基板及其制造方法 |
PCT/JP2007/064021 WO2009011023A1 (ja) | 2007-07-13 | 2007-07-13 | 配線基板及びその製造方法 |
EP07790801A EP2173146A1 (en) | 2007-07-13 | 2007-07-13 | Wiring board and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2007/064021 WO2009011023A1 (ja) | 2007-07-13 | 2007-07-13 | 配線基板及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009011023A1 true WO2009011023A1 (ja) | 2009-01-22 |
Family
ID=40259372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/064021 WO2009011023A1 (ja) | 2007-07-13 | 2007-07-13 | 配線基板及びその製造方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2173146A1 (ja) |
JP (1) | JP4834157B2 (ja) |
CN (1) | CN101803482A (ja) |
WO (1) | WO2009011023A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104584701B (zh) * | 2012-06-22 | 2018-11-13 | 株式会社尼康 | 基板、拍摄单元及拍摄装置 |
CN108882562B (zh) * | 2017-05-10 | 2020-11-10 | 欣兴电子股份有限公司 | 线路板单元与其制作方法 |
CN113194619B (zh) * | 2021-04-09 | 2022-08-26 | 东莞市多普光电设备有限公司 | 一种印刷电路板的生产工艺 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05152693A (ja) | 1991-11-30 | 1993-06-18 | Nitto Denko Corp | 補強部付フレキシブルプリント基板およびその製法 |
JPH1174651A (ja) * | 1997-03-13 | 1999-03-16 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JPH11172457A (ja) * | 1997-12-05 | 1999-06-29 | Ibiden Co Ltd | 無電解めっき用接着剤および多層プリント配線板 |
JP2000013019A (ja) * | 1998-06-23 | 2000-01-14 | Sharp Corp | ビルトアップ多層プリント配線板およびその製造方法 |
JP2002064271A (ja) * | 2000-06-09 | 2002-02-28 | Matsushita Electric Ind Co Ltd | 複合配線基板及びその製造方法 |
JP2005079402A (ja) * | 2003-09-01 | 2005-03-24 | Fujikura Ltd | 回路基板およびその製造方法 |
JP2005236205A (ja) * | 2004-02-23 | 2005-09-02 | Sharp Corp | 多層プリント配線板の製造方法及び多層プリント配線板 |
JP2005268505A (ja) * | 2004-03-18 | 2005-09-29 | Fujikura Ltd | 多層配線板およびその製造方法 |
JP2005336287A (ja) * | 2004-05-26 | 2005-12-08 | Matsushita Electric Works Ltd | フレキシブルプリント配線板用熱硬化性接着シート、その製造方法及びそれを用いた多層フレキシブルプリント配線板並びにフレックスリジッドプリント配線板 |
JP2006032830A (ja) | 2004-07-21 | 2006-02-02 | Fujikura Ltd | 部分ビルドアップ配線板の製造方法 |
JP2006114741A (ja) * | 2004-10-15 | 2006-04-27 | Ibiden Co Ltd | 多層コア基板及びその製造方法 |
JP2006202891A (ja) * | 2005-01-19 | 2006-08-03 | Fujikura Ltd | リジッドフレックスプリント配線板の製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004266238A (ja) * | 2003-01-09 | 2004-09-24 | Sony Chem Corp | 複合配線板、基板素片 |
JP2005064357A (ja) * | 2003-08-19 | 2005-03-10 | Fujikura Ltd | 多層配線板およびその製造方法 |
-
2007
- 2007-07-13 EP EP07790801A patent/EP2173146A1/en not_active Withdrawn
- 2007-07-13 CN CN200780100601A patent/CN101803482A/zh active Pending
- 2007-07-13 JP JP2009523463A patent/JP4834157B2/ja not_active Expired - Fee Related
- 2007-07-13 WO PCT/JP2007/064021 patent/WO2009011023A1/ja active Application Filing
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05152693A (ja) | 1991-11-30 | 1993-06-18 | Nitto Denko Corp | 補強部付フレキシブルプリント基板およびその製法 |
JPH1174651A (ja) * | 1997-03-13 | 1999-03-16 | Ibiden Co Ltd | プリント配線板及びその製造方法 |
JPH11172457A (ja) * | 1997-12-05 | 1999-06-29 | Ibiden Co Ltd | 無電解めっき用接着剤および多層プリント配線板 |
JP2000013019A (ja) * | 1998-06-23 | 2000-01-14 | Sharp Corp | ビルトアップ多層プリント配線板およびその製造方法 |
JP2002064271A (ja) * | 2000-06-09 | 2002-02-28 | Matsushita Electric Ind Co Ltd | 複合配線基板及びその製造方法 |
JP2005079402A (ja) * | 2003-09-01 | 2005-03-24 | Fujikura Ltd | 回路基板およびその製造方法 |
JP2005236205A (ja) * | 2004-02-23 | 2005-09-02 | Sharp Corp | 多層プリント配線板の製造方法及び多層プリント配線板 |
JP2005268505A (ja) * | 2004-03-18 | 2005-09-29 | Fujikura Ltd | 多層配線板およびその製造方法 |
JP2005336287A (ja) * | 2004-05-26 | 2005-12-08 | Matsushita Electric Works Ltd | フレキシブルプリント配線板用熱硬化性接着シート、その製造方法及びそれを用いた多層フレキシブルプリント配線板並びにフレックスリジッドプリント配線板 |
JP2006032830A (ja) | 2004-07-21 | 2006-02-02 | Fujikura Ltd | 部分ビルドアップ配線板の製造方法 |
JP2006114741A (ja) * | 2004-10-15 | 2006-04-27 | Ibiden Co Ltd | 多層コア基板及びその製造方法 |
JP2006202891A (ja) * | 2005-01-19 | 2006-08-03 | Fujikura Ltd | リジッドフレックスプリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4834157B2 (ja) | 2011-12-14 |
EP2173146A1 (en) | 2010-04-07 |
CN101803482A (zh) | 2010-08-11 |
JPWO2009011023A1 (ja) | 2010-09-09 |
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