WO2009008307A1 - 配線基板の製造方法 - Google Patents

配線基板の製造方法 Download PDF

Info

Publication number
WO2009008307A1
WO2009008307A1 PCT/JP2008/062006 JP2008062006W WO2009008307A1 WO 2009008307 A1 WO2009008307 A1 WO 2009008307A1 JP 2008062006 W JP2008062006 W JP 2008062006W WO 2009008307 A1 WO2009008307 A1 WO 2009008307A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
manufacturing
protective base
base materials
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/062006
Other languages
English (en)
French (fr)
Inventor
Hiroyuki Sugayama
Masahiro Fukuda
Hidehiro Numao
Tatsushi Hirao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Publication of WO2009008307A1 publication Critical patent/WO2009008307A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0228—Cutting, sawing, milling or shearing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

　本発明の目的は、配線基板の厚みの増加を抑えて可撓性を保持するとともに、めっき不良の発生を抑える配線基板の製造方法を提供することである。銅貼り基板３の一方面に保護基材４を貼り付け、貼り付けた保護基材４同士を貼り合わせる。保護基材４同士が貼り合わされた状態でめっきを行い、貼り合わせた部分を切断してそれぞれの配線基板に分離する。
PCT/JP2008/062006 2007-07-12 2008-07-02 配線基板の製造方法 Ceased WO2009008307A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007183471A JP2009021435A (ja) 2007-07-12 2007-07-12 配線基板の製造方法
JP2007-183471 2007-07-12

Publications (1)

Publication Number Publication Date
WO2009008307A1 true WO2009008307A1 (ja) 2009-01-15

Family

ID=40228485

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/062006 Ceased WO2009008307A1 (ja) 2007-07-12 2008-07-02 配線基板の製造方法

Country Status (3)

Country Link
JP (1) JP2009021435A (ja)
TW (1) TW200922423A (ja)
WO (1) WO2009008307A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052262A (zh) * 2011-10-14 2013-04-17 北大方正集团有限公司 一种鸳鸯铜印刷电路板制作方法
CN103796437A (zh) * 2014-01-27 2014-05-14 广州兴森快捷电路科技有限公司 阴阳铜箔电路板的制作方法
CN104254196A (zh) * 2014-09-19 2014-12-31 江西景旺精密电路有限公司 一种非对称铜厚双面铝基板及其加工方法
CN109719404A (zh) * 2019-01-15 2019-05-07 广东科翔电子科技有限公司 一种ic载板激光钻孔的方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247596A (ja) * 1986-04-21 1987-10-28 株式会社日立製作所 多層プリント板の製造方法
JPH11154788A (ja) * 1997-11-20 1999-06-08 Nec Toyama Ltd 多層プリント配線板の製造方法
JPH11333975A (ja) * 1998-05-26 1999-12-07 Ibiden Co Ltd 樹脂付き導体箔およびそれを用いた積層板およびそれらの製造方法
JP2001308548A (ja) * 2000-04-11 2001-11-02 Lg Electronics Inc 多層印刷回路基板及びその製造方法並びに多層印刷回路基板を利用したｂｇａ半導体パッケージ
JP2003324276A (ja) * 2002-04-30 2003-11-14 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2004235323A (ja) * 2003-01-29 2004-08-19 Fujitsu Ltd 配線基板の製造方法
JP2004363536A (ja) * 2003-02-06 2004-12-24 Lg Electron Inc 多層印刷回路基板のインターコネクト方法
JP2005236244A (ja) * 2004-01-19 2005-09-02 Shinko Electric Ind Co Ltd 回路基板の製造方法
JP2006049660A (ja) * 2004-08-06 2006-02-16 Cmk Corp プリント配線板の製造方法
JP2006278774A (ja) * 2005-03-29 2006-10-12 Hitachi Cable Ltd 両面配線基板の製造方法、両面配線基板、およびそのベース基板

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62247596A (ja) * 1986-04-21 1987-10-28 株式会社日立製作所 多層プリント板の製造方法
JPH11154788A (ja) * 1997-11-20 1999-06-08 Nec Toyama Ltd 多層プリント配線板の製造方法
JPH11333975A (ja) * 1998-05-26 1999-12-07 Ibiden Co Ltd 樹脂付き導体箔およびそれを用いた積層板およびそれらの製造方法
JP2001308548A (ja) * 2000-04-11 2001-11-02 Lg Electronics Inc 多層印刷回路基板及びその製造方法並びに多層印刷回路基板を利用したｂｇａ半導体パッケージ
JP2003324276A (ja) * 2002-04-30 2003-11-14 Ngk Spark Plug Co Ltd 配線基板の製造方法
JP2004235323A (ja) * 2003-01-29 2004-08-19 Fujitsu Ltd 配線基板の製造方法
JP2004363536A (ja) * 2003-02-06 2004-12-24 Lg Electron Inc 多層印刷回路基板のインターコネクト方法
JP2005236244A (ja) * 2004-01-19 2005-09-02 Shinko Electric Ind Co Ltd 回路基板の製造方法
JP2006049660A (ja) * 2004-08-06 2006-02-16 Cmk Corp プリント配線板の製造方法
JP2006278774A (ja) * 2005-03-29 2006-10-12 Hitachi Cable Ltd 両面配線基板の製造方法、両面配線基板、およびそのベース基板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103052262A (zh) * 2011-10-14 2013-04-17 北大方正集团有限公司 一种鸳鸯铜印刷电路板制作方法
CN103796437A (zh) * 2014-01-27 2014-05-14 广州兴森快捷电路科技有限公司 阴阳铜箔电路板的制作方法
CN104254196A (zh) * 2014-09-19 2014-12-31 江西景旺精密电路有限公司 一种非对称铜厚双面铝基板及其加工方法
CN109719404A (zh) * 2019-01-15 2019-05-07 广东科翔电子科技有限公司 一种ic载板激光钻孔的方法

Also Published As

Publication number Publication date
JP2009021435A (ja) 2009-01-29
TW200922423A (en) 2009-05-16

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