WO2009004858A1 - 浮上搬送装置 - Google Patents

浮上搬送装置 Download PDF

Info

Publication number
WO2009004858A1
WO2009004858A1 PCT/JP2008/058624 JP2008058624W WO2009004858A1 WO 2009004858 A1 WO2009004858 A1 WO 2009004858A1 JP 2008058624 W JP2008058624 W JP 2008058624W WO 2009004858 A1 WO2009004858 A1 WO 2009004858A1
Authority
WO
WIPO (PCT)
Prior art keywords
fluid
levitation
transportation device
chamber
fluid supply
Prior art date
Application number
PCT/JP2008/058624
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Kensuke Hirata
Fumio Hasegawa
Kai Tanaka
Original Assignee
Ihi Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ihi Corporation filed Critical Ihi Corporation
Priority to CN200880021730A priority Critical patent/CN101715421A/zh
Priority to KR1020107000545A priority patent/KR101135000B1/ko
Publication of WO2009004858A1 publication Critical patent/WO2009004858A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G51/00—Conveying articles through pipes or tubes by fluid flow or pressure; Conveying articles over a flat surface, e.g. the base of a trough, by jets located in the surface
    • B65G51/02—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases
    • B65G51/03—Directly conveying the articles, e.g. slips, sheets, stockings, containers or workpieces, by flowing gases over a flat surface or in troughs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Fluid Mechanics (AREA)
  • Mechanical Engineering (AREA)
  • Control Of Vehicles With Linear Motors And Vehicles That Are Magnetically Levitated (AREA)
PCT/JP2008/058624 2007-06-29 2008-05-09 浮上搬送装置 WO2009004858A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200880021730A CN101715421A (zh) 2007-06-29 2008-05-09 悬浮输送装置
KR1020107000545A KR101135000B1 (ko) 2007-06-29 2008-05-09 부상 반송 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007173446A JP2009012877A (ja) 2007-06-29 2007-06-29 浮上搬送装置
JP2007-173446 2007-06-29

Publications (1)

Publication Number Publication Date
WO2009004858A1 true WO2009004858A1 (ja) 2009-01-08

Family

ID=40225915

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058624 WO2009004858A1 (ja) 2007-06-29 2008-05-09 浮上搬送装置

Country Status (5)

Country Link
JP (1) JP2009012877A (enrdf_load_stackoverflow)
KR (2) KR20120042990A (enrdf_load_stackoverflow)
CN (1) CN101715421A (enrdf_load_stackoverflow)
TW (2) TW200914350A (enrdf_load_stackoverflow)
WO (1) WO2009004858A1 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210971A (ja) * 2010-03-30 2011-10-20 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5495065B2 (ja) * 2010-12-06 2014-05-21 株式会社ダイフク 板状体搬送装置
JP5582021B2 (ja) * 2010-12-22 2014-09-03 村田機械株式会社 物品搬送装置
CN102923480A (zh) * 2011-08-12 2013-02-13 大银微系统股份有限公司 气浮平台的管路整合构造
CN102616567B (zh) * 2012-03-23 2014-02-05 深圳市华星光电技术有限公司 玻璃基板的取出装置
CN106938785B (zh) * 2017-02-28 2022-07-19 江苏科技大学 一种具有形变检测功能的玻璃基板气浮装置及检测方法
CN114476681A (zh) * 2022-03-09 2022-05-13 河北泰晶新材料科技有限公司 一种物料输送系统、物料输送方法及存储介质

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001097532A (ja) * 1999-09-28 2001-04-10 Tosho Inc 散薬供給装置
JP2006182563A (ja) * 2004-12-01 2006-07-13 Ishikawajima Harima Heavy Ind Co Ltd 浮上装置および搬送装置
JP2007088201A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62112339A (ja) * 1985-11-12 1987-05-23 Nippon Telegr & Teleph Corp <Ntt> 半導体基板のロツト編成装置
JPWO2004088742A1 (ja) * 2003-03-28 2006-07-06 平田機工株式会社 基板搬送システム
TW200502070A (en) * 2003-07-04 2005-01-16 Rorze Corp Carrying apparatus and carrying control method for sheet-like objects
JP2005075496A (ja) * 2003-08-28 2005-03-24 Murata Mach Ltd 浮上搬送装置
CN100507778C (zh) * 2005-01-19 2009-07-01 三菱电机株式会社 定位装置及定位方法
TWI301119B (en) * 2005-10-26 2008-09-21 Ind Tech Res Inst Substrate transportation apparatus
TW200800773A (en) * 2005-11-14 2008-01-01 Ishikawajima Harima Heavy Ind Floating device and carrying device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001097532A (ja) * 1999-09-28 2001-04-10 Tosho Inc 散薬供給装置
JP2006182563A (ja) * 2004-12-01 2006-07-13 Ishikawajima Harima Heavy Ind Co Ltd 浮上装置および搬送装置
JP2007088201A (ja) * 2005-09-22 2007-04-05 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011210971A (ja) * 2010-03-30 2011-10-20 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
TWI375650B (enrdf_load_stackoverflow) 2012-11-01
TW200914350A (en) 2009-04-01
KR20120042990A (ko) 2012-05-03
TW201242877A (en) 2012-11-01
KR101135000B1 (ko) 2012-04-09
TWI399331B (zh) 2013-06-21
JP2009012877A (ja) 2009-01-22
KR20100018611A (ko) 2010-02-17
CN101715421A (zh) 2010-05-26

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