WO2008152783A1 - スピーカシステム - Google Patents

スピーカシステム Download PDF

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Publication number
WO2008152783A1
WO2008152783A1 PCT/JP2008/001414 JP2008001414W WO2008152783A1 WO 2008152783 A1 WO2008152783 A1 WO 2008152783A1 JP 2008001414 W JP2008001414 W JP 2008001414W WO 2008152783 A1 WO2008152783 A1 WO 2008152783A1
Authority
WO
WIPO (PCT)
Prior art keywords
cabinet
speaker system
opening formed
gas
enlarging
Prior art date
Application number
PCT/JP2008/001414
Other languages
English (en)
French (fr)
Inventor
Shuji Saiki
Toshiyuki Matsumura
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to EP08764011.6A priority Critical patent/EP2154906B1/en
Priority to JP2009519149A priority patent/JP5075199B2/ja
Priority to US12/598,317 priority patent/US8565463B2/en
Publication of WO2008152783A1 publication Critical patent/WO2008152783A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2819—Enclosures comprising vibrating or resonating arrangements of the bass reflex type for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/283—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm
    • H04R1/2834—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2838—Enclosures comprising vibrating or resonating arrangements of the bandpass type
    • H04R1/2842—Enclosures comprising vibrating or resonating arrangements of the bandpass type for loudspeaker transducers

Landscapes

  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Drying Of Gases (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)

Abstract

　本発明に係るスピーカシステムは、キャビネットと、キャビネットに形成された開口部に取り付けられたスピーカユニットと、キャビネット内部に配置され、キャビネット内部の気体を物理吸着してキャビネット内部の容積を等価的に拡大させる気体吸着体と、キャビネットに形成された開口部に取り付けられ、直流電圧が印加されることによってキャビネット内部の湿気を外部に放出する除湿素子とを備える。
PCT/JP2008/001414 2007-06-12 2008-06-04 スピーカシステム WO2008152783A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08764011.6A EP2154906B1 (en) 2007-06-12 2008-06-04 Speaker system
JP2009519149A JP5075199B2 (ja) 2007-06-12 2008-06-04 スピーカシステム
US12/598,317 US8565463B2 (en) 2007-06-12 2008-06-04 Loudspeaker system

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007155700 2007-06-12
JP2007-155700 2007-06-12

Publications (1)

Publication Number Publication Date
WO2008152783A1 true WO2008152783A1 (ja) 2008-12-18

Family

ID=40129398

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/001414 WO2008152783A1 (ja) 2007-06-12 2008-06-04 スピーカシステム

Country Status (4)

Country Link
US (1) US8565463B2 (ja)
EP (1) EP2154906B1 (ja)
JP (1) JP5075199B2 (ja)
WO (1) WO2008152783A1 (ja)

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US9430998B2 (en) * 2010-06-01 2016-08-30 Nokia Technologies Oy Radio apparatus comprising an agglomeration of acoustically adsorbing members
EP2424270B1 (en) * 2010-08-23 2014-05-21 Knowles Electronics Asia PTE. Ltd. Loudspeaker system with improved sound
JP2012156649A (ja) * 2011-01-24 2012-08-16 Roland Corp 低音増強処理装置、楽器用スピーカ装置、および音響効果装置
EP2495991A1 (en) 2011-03-04 2012-09-05 Knowles Electronics Asia PTE. Ltd. Packaging of acoustic volume increasing materials for loudspeaker devices
JP6171177B2 (ja) * 2012-04-04 2017-08-02 パナソニックＩｐマネジメント株式会社 発音体とそれを用いた音響再生装置、移動体装置
US8687836B2 (en) 2012-08-31 2014-04-01 Bose Corporation Loudspeaker system
US8794373B1 (en) 2013-03-15 2014-08-05 Bose Corporation Three-dimensional air-adsorbing structure
DE102013210696A1 (de) * 2013-06-07 2014-12-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Akustisches System mit einem Gehäuse mit adsorbierendem Pulver
US9247341B2 (en) * 2014-02-26 2016-01-26 Htc Corporation Speaker module
US9706294B2 (en) * 2015-03-18 2017-07-11 Infineon Technologies Ag System and method for an acoustic transducer and environmental sensor package
US9906198B2 (en) 2015-03-20 2018-02-27 Nokia Technologies Oy Narrowing audio filter transition band
CN204498363U (zh) * 2015-04-13 2015-07-22 歌尔声学股份有限公司 吸音组件及设有该吸音组件的扬声器模组
US10349167B2 (en) 2015-05-18 2019-07-09 Apple Inc. Audio speaker with back volume containing adsorptive material
US10341750B2 (en) * 2015-06-15 2019-07-02 Logitech Europe S.A. Pressure equalization audio speaker design
GB2540160B (en) 2015-07-07 2019-08-28 Nanoscape Ag Improved material for rapid gas sorption in loudspeakers
US9615165B2 (en) * 2015-08-07 2017-04-04 Sound Solutions International Co., Ltd. Loudspeaker device having foam insert to improve gas distribution in sound adsorber material
US10244308B2 (en) 2015-08-27 2019-03-26 Apple Inc. Audio speaker having a rigid adsorptive insert
KR101736994B1 (ko) * 2015-11-26 2017-05-17 현대자동차주식회사 차량에 탑재된 스피커의 그릴 제어 방법 및 장치
TWI590667B (zh) * 2016-05-13 2017-07-01 宏碁股份有限公司 具有全音域及低音加強的揚聲裝置及電子裝置
KR101788111B1 (ko) 2016-06-09 2017-10-20 주식회사 이엠텍 다공성 물질을 구비하는 마이크로스피커 인클로져
JP6986365B2 (ja) * 2016-08-23 2021-12-22 アルパイン株式会社 車載用スピーカシステム
CN106231511A (zh) * 2016-08-31 2016-12-14 歌尔股份有限公司 扬声器模组
CN106210999A (zh) * 2016-08-31 2016-12-07 歌尔股份有限公司 扬声器模组
CN106162468A (zh) * 2016-08-31 2016-11-23 歌尔股份有限公司 扬声器模组
CN106231515A (zh) * 2016-09-06 2016-12-14 歌尔股份有限公司 扬声器模组
US10667038B2 (en) 2016-12-07 2020-05-26 Apple Inc. MEMS mircophone with increased back volume
KR102397715B1 (ko) 2016-12-09 2022-05-13 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 섬유 마이크로폰
US10271129B2 (en) * 2017-03-20 2019-04-23 Bose Corporation Acoustic device having an electro-acoustic transducer mounted to a passive radiator diaphragm
CN108632720B (zh) * 2017-03-23 2024-01-09 深圳纽斯声学系统有限公司 一种单腔体三明治式汽车低音炮
US10542347B2 (en) * 2017-06-03 2020-01-21 Don Petracek Speaker cabinet to effectively amplify the full and natural sound of an acoustic guitar
US10728638B2 (en) * 2017-11-13 2020-07-28 Apple Inc. Micro speaker assembly having a manual pump
CN207869382U (zh) * 2018-01-30 2018-09-14 瑞声科技(新加坡)有限公司 扬声器箱
US11368787B1 (en) * 2018-08-17 2022-06-21 Sound Edge LLC Speaker systems including forward and backward facing passive radiators
CN109874094A (zh) * 2018-12-18 2019-06-11 歌尔股份有限公司 声学装置及电子设备
CN111343546B (zh) * 2018-12-19 2023-01-20 歌尔股份有限公司 声学装置及电子设备
KR102564872B1 (ko) * 2019-04-08 2023-08-08 현대자동차주식회사 위상반전 구조를 갖는 패시브 라디에이터 진동 스피커
KR102610761B1 (ko) * 2019-06-04 2023-12-07 현대자동차주식회사 차량의 사운드 장치
CN110337048A (zh) * 2019-07-08 2019-10-15 珠海格力电器股份有限公司 音箱的装配方法、音箱和空调器
CN110475185B (zh) * 2019-08-13 2021-05-25 海能达通信股份有限公司 声学辐射组件以及发声设备
TWI754998B (zh) * 2020-07-22 2022-02-11 台灣立訊精密有限公司 聲學塊材的製作方法及聲學裝置
JP7413962B2 (ja) * 2020-09-23 2024-01-16 マツダ株式会社 車両のスピーカ配設構造
US11849297B2 (en) * 2021-12-13 2023-12-19 Bose Corporation Balanced acoustic device with passive radiators

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JP2000107550A (ja) * 1998-10-06 2000-04-18 Mitsubishi Electric Corp 湿度調整素子、湿度調整装置および湿度調整ケース
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WO2005099300A1 (ja) * 2004-03-31 2005-10-20 Matsushita Electric Industrial Co., Ltd. スピーカ装置
WO2005101896A1 (ja) * 2004-04-13 2005-10-27 Matsushita Electric Industrial Co., Ltd. スピーカ装置
JP2006501737A (ja) * 2002-10-02 2006-01-12 ジーピー・アコースティクス・（ユーケイ・）リミテッド 拡声器用のエンクロージャにおける湿分制御の方法及び装置

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JP2006501737A (ja) * 2002-10-02 2006-01-12 ジーピー・アコースティクス・（ユーケイ・）リミテッド 拡声器用のエンクロージャにおける湿分制御の方法及び装置
JP2004343318A (ja) * 2003-05-14 2004-12-02 Mitsubishi Electric Corp マイクロホン装置
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Also Published As

Publication number Publication date
US8565463B2 (en) 2013-10-22
JP5075199B2 (ja) 2012-11-14
US20100135516A1 (en) 2010-06-03
JPWO2008152783A1 (ja) 2010-08-26
EP2154906B1 (en) 2017-08-09
EP2154906A1 (en) 2010-02-17
EP2154906A4 (en) 2014-07-30

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