WO2008142923A1 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
WO2008142923A1
WO2008142923A1 PCT/JP2008/057034 JP2008057034W WO2008142923A1 WO 2008142923 A1 WO2008142923 A1 WO 2008142923A1 JP 2008057034 W JP2008057034 W JP 2008057034W WO 2008142923 A1 WO2008142923 A1 WO 2008142923A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate processing
substrate
coating liquid
removing liquid
liquid
Prior art date
Application number
PCT/JP2008/057034
Other languages
English (en)
French (fr)
Inventor
Tomohiro Goto
Masakazu Sanada
Original Assignee
Sokudo Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sokudo Co., Ltd. filed Critical Sokudo Co., Ltd.
Publication of WO2008142923A1 publication Critical patent/WO2008142923A1/ja

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Weting (AREA)

Abstract

　塗布ユニット（ＣＯＶ）は、基板（Ｗ）の上面に塗布された塗布液の液面から光干渉縞（Ｉ）が消失する前に、基板（Ｗ）の回転数を低下させるとともに除去液の供給を開始する。このため、レジストカバー膜（ＣＶＴ）として基板（Ｗ）の上面に徐々に定着しつつも流動性が残る塗布液の周縁部分を、除去液の物理的な浸食により除去することができる。したがって、塗布液の周縁部分を短時間に精度よく除去することができる。また、物理的な浸食作用を利用するため、反射防止膜（ＣＶＢ）やレジスト膜（ＣＶＲ）用の除去液と同一の除去液を使用することができる。
PCT/JP2008/057034 2007-05-21 2008-04-09 基板処理装置および基板処理方法 WO2008142923A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-133878 2007-05-21
JP2007133878A JP2008288488A (ja) 2007-05-21 2007-05-21 基板処理装置および基板処理方法

Publications (1)

Publication Number Publication Date
WO2008142923A1 true WO2008142923A1 (ja) 2008-11-27

Family

ID=40031639

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057034 WO2008142923A1 (ja) 2007-05-21 2008-04-09 基板処理装置および基板処理方法

Country Status (3)

Country Link
JP (1) JP2008288488A (ja)
TW (1) TW200903601A (ja)
WO (1) WO2008142923A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013041129A1 (de) * 2011-09-20 2013-03-28 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zur beschichtung eines trägerwafers
CN109791883A (zh) * 2016-09-16 2019-05-21 株式会社斯库林集团 基板处理方法、基板处理装置
CN109904093A (zh) * 2017-12-11 2019-06-18 株式会社斯库林集团 基板处理方法和基板处理装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105993061A (zh) * 2014-02-13 2016-10-05 三菱电机株式会社 半导体装置的制造方法
JP6363249B2 (ja) * 2017-04-17 2018-07-25 東京エレクトロン株式会社 基板処理方法および基板処理装置
JP2019067894A (ja) * 2017-09-29 2019-04-25 エイブリック株式会社 半導体装置の製造方法
JP7202960B2 (ja) * 2019-04-16 2023-01-12 東京エレクトロン株式会社 塗布膜形成方法及び塗布膜形成装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819350B2 (ja) * 1976-04-08 1983-04-18 富士写真フイルム株式会社 スピンコ−テイング方法
JPH08264412A (ja) * 1995-03-20 1996-10-11 Nittetsu Semiconductor Kk 半導体装置製造工程における塗布液の塗布方法
JPH08281184A (ja) * 1995-04-12 1996-10-29 Tokyo Electron Ltd 処理装置及び処理方法
JP2003324052A (ja) * 2002-04-30 2003-11-14 Tokyo Electron Ltd 塗布膜除去方法および塗布膜形成除去装置
JP2006093409A (ja) * 2004-09-24 2006-04-06 Tokyo Electron Ltd 塗布処理装置及び塗布処理方法
JP2007036121A (ja) * 2005-07-29 2007-02-08 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007134671A (ja) * 2005-10-11 2007-05-31 Tokyo Electron Ltd 基板処理方法及び基板処理装置
JP2007220989A (ja) * 2006-02-17 2007-08-30 Tokyo Electron Ltd 基板処理方法、基板処理装置、その制御プログラム及びコンピュータ読取可能な記憶媒体

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5819350B2 (ja) * 1976-04-08 1983-04-18 富士写真フイルム株式会社 スピンコ−テイング方法
JPH08264412A (ja) * 1995-03-20 1996-10-11 Nittetsu Semiconductor Kk 半導体装置製造工程における塗布液の塗布方法
JPH08281184A (ja) * 1995-04-12 1996-10-29 Tokyo Electron Ltd 処理装置及び処理方法
JP2003324052A (ja) * 2002-04-30 2003-11-14 Tokyo Electron Ltd 塗布膜除去方法および塗布膜形成除去装置
JP2006093409A (ja) * 2004-09-24 2006-04-06 Tokyo Electron Ltd 塗布処理装置及び塗布処理方法
JP2007036121A (ja) * 2005-07-29 2007-02-08 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2007134671A (ja) * 2005-10-11 2007-05-31 Tokyo Electron Ltd 基板処理方法及び基板処理装置
JP2007220989A (ja) * 2006-02-17 2007-08-30 Tokyo Electron Ltd 基板処理方法、基板処理装置、その制御プログラム及びコンピュータ読取可能な記憶媒体

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013041129A1 (de) * 2011-09-20 2013-03-28 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zur beschichtung eines trägerwafers
US20140227440A1 (en) * 2011-09-20 2014-08-14 Ev Group E. Thallner Gmbh Device and method for coating of a carrier wafer
US10497601B2 (en) 2011-09-20 2019-12-03 Ev Group E. Thallner Gmbh Device and method for coating of a carrier wafer
CN109791883A (zh) * 2016-09-16 2019-05-21 株式会社斯库林集团 基板处理方法、基板处理装置
CN109791883B (zh) * 2016-09-16 2023-02-28 株式会社斯库林集团 基板处理方法、基板处理装置
CN109904093A (zh) * 2017-12-11 2019-06-18 株式会社斯库林集团 基板处理方法和基板处理装置
CN109904093B (zh) * 2017-12-11 2023-08-29 株式会社斯库林集团 基板处理方法和基板处理装置

Also Published As

Publication number Publication date
TW200903601A (en) 2009-01-16
JP2008288488A (ja) 2008-11-27

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