WO2009073596A3 - Formulations for cleaning memory device structures - Google Patents

Formulations for cleaning memory device structures Download PDF

Info

Publication number
WO2009073596A3
WO2009073596A3 PCT/US2008/085111 US2008085111W WO2009073596A3 WO 2009073596 A3 WO2009073596 A3 WO 2009073596A3 US 2008085111 W US2008085111 W US 2008085111W WO 2009073596 A3 WO2009073596 A3 WO 2009073596A3
Authority
WO
WIPO (PCT)
Prior art keywords
formulations
memory device
device structures
cleaning memory
protective coating
Prior art date
Application number
PCT/US2008/085111
Other languages
French (fr)
Other versions
WO2009073596A2 (en
Inventor
Jun Liu
Peng Zhang
Original Assignee
Advanced Technology Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Technology Materials, Inc. filed Critical Advanced Technology Materials, Inc.
Publication of WO2009073596A2 publication Critical patent/WO2009073596A2/en
Publication of WO2009073596A3 publication Critical patent/WO2009073596A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions
    • C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
    • C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/423—Stripping or agents therefor using liquids only containing mineral acids or salts thereof, containing mineral oxidizing substances, e.g. peroxy compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/422—Stripping or agents therefor using liquids only
    • G03F7/425—Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

Abstract

A removal composition and process for removing polymeric protective coating(s) from a microelectronic device having said coatings thereon. The removal composition removes the polymeric protective coating(s) from the device in a single step without substantially removing underlying layers.
PCT/US2008/085111 2007-11-30 2008-12-01 Formulations for cleaning memory device structures WO2009073596A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US99126207P 2007-11-30 2007-11-30
US60/991,262 2007-11-30

Publications (2)

Publication Number Publication Date
WO2009073596A2 WO2009073596A2 (en) 2009-06-11
WO2009073596A3 true WO2009073596A3 (en) 2009-08-27

Family

ID=40718472

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/085111 WO2009073596A2 (en) 2007-11-30 2008-12-01 Formulations for cleaning memory device structures

Country Status (2)

Country Link
TW (1) TW200934865A (en)
WO (1) WO2009073596A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI548738B (en) 2010-07-16 2016-09-11 安堤格里斯公司 Aqueous cleaner for the removal of post-etch residues
KR20130099948A (en) 2010-08-20 2013-09-06 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 Sustainable process for reclaiming precious metals and base metals from e-waste
CN103154321B (en) 2010-10-06 2015-11-25 安格斯公司 The composition of selective etch metal nitride and method
WO2012174518A2 (en) * 2011-06-16 2012-12-20 Advanced Technology Materials, Inc. Compositions and methods for selectively etching silicon nitride
JP5933950B2 (en) 2011-09-30 2016-06-15 アドバンスド テクノロジー マテリアルズ，インコーポレイテッド Etching solution for copper or copper alloy
SG10201605172RA (en) 2011-12-28 2016-08-30 Entegris Inc Compositions and methods for selectively etching titanium nitride
WO2014089196A1 (en) 2012-12-05 2014-06-12 Advanced Technology Materials, Inc. Compositions for cleaning iii-v semiconductor materials and methods of using same
US9102901B2 (en) 2012-12-20 2015-08-11 Rohm And Haas Electronic Materials Llc Methods and compositions for removal of metal hardmasks
US10472567B2 (en) 2013-03-04 2019-11-12 Entegris, Inc. Compositions and methods for selectively etching titanium nitride
SG10201708364XA (en) 2013-06-06 2017-11-29 Entegris Inc Compositions and methods for selectively etching titanium nitride
CN112442374A (en) 2013-07-31 2021-03-05 恩特格里斯公司 Aqueous formulations with Cu/W compatibility for removal of metal hardmask and post-etch residues
CN105492576B (en) 2013-08-30 2019-01-04 恩特格里斯公司 The composition and method of selective etch titanium nitride
US10340150B2 (en) 2013-12-16 2019-07-02 Entegris, Inc. Ni:NiGe:Ge selective etch formulations and method of using same
TWI662379B (en) 2013-12-20 2019-06-11 美商恩特葛瑞斯股份有限公司 Use of non-oxidizing strong acids for the removal of ion-implanted resist
US10475658B2 (en) 2013-12-31 2019-11-12 Entegris, Inc. Formulations to selectively etch silicon and germanium
WO2015116818A1 (en) 2014-01-29 2015-08-06 Advanced Technology Materials, Inc. Post chemical mechanical polishing formulations and method of use
US11127587B2 (en) 2014-02-05 2021-09-21 Entegris, Inc. Non-amine post-CMP compositions and method of use
KR20230061777A (en) * 2021-10-29 2023-05-09 한국과학기술연구원 MXene with excellent mechanical strength and Fast and high-yielding anhydrous synthesis method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6703319B1 (en) * 1999-06-17 2004-03-09 Micron Technology, Inc. Compositions and methods for removing etch residue
WO2006110645A2 (en) * 2005-04-11 2006-10-19 Advanced Technology Materials, Inc. Fluoride liquid cleaners with polar and non-polar solvent mixtures for cleaning low-k-containing microelectronic devices
US20060240181A1 (en) * 2004-01-16 2006-10-26 Chenghong Li Spin-on protective coatings for wet-etch processing of microelectronic substrates

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6703319B1 (en) * 1999-06-17 2004-03-09 Micron Technology, Inc. Compositions and methods for removing etch residue
US20060240181A1 (en) * 2004-01-16 2006-10-26 Chenghong Li Spin-on protective coatings for wet-etch processing of microelectronic substrates
WO2006110645A2 (en) * 2005-04-11 2006-10-19 Advanced Technology Materials, Inc. Fluoride liquid cleaners with polar and non-polar solvent mixtures for cleaning low-k-containing microelectronic devices

Also Published As

Publication number Publication date
TW200934865A (en) 2009-08-16
WO2009073596A2 (en) 2009-06-11

Similar Documents

Publication Publication Date Title
WO2009073596A3 (en) Formulations for cleaning memory device structures
HK1164543A1 (en) Substrate holding device, exposure apparatus having the same, device manufacturing method
EP1869520A4 (en) Antireflective coating for semiconductor devices and method for the same
EP2220670A4 (en) Method and apparatus for removing contaminants from substrate
ZA200709026B (en) Apparatus and method for coating a substrate
EP2175480A4 (en) Group iii nitride semiconductor substrate and method for cleaning the same
TWI368267B (en) Method and apparatus for cleaning a substrate surface
TWI370510B (en) Substrate processing apparatus
EP2801864B8 (en) Exposure apparatus, exposure method and device manufacturing method
GB2435942B (en) Auto-focusing method and auto-focusing apparatus using the same
TWI367130B (en) Film coating apparatus and film coating method
EP2067068A4 (en) Optical interconnect device and method for manufacturing the same
SG136946A1 (en) Composition and method comprising same for removing residue from a substrate
EP1902460A4 (en) High speed substrate aligner apparatus
WO2008013959A3 (en) Methods and devices for forming nanostructure monolayers and devices including such monolayers
EP1805792A4 (en) Substrate processing apparatus
SG119361A1 (en) Composition for removing photoresist and/or etching residue from a substrate and use thereof
HK1123627A1 (en) Substrate holding device, exposure device, exposure method, and device fabrication method
TWI319893B (en) Nitride semiconductor substrate, method for forming a nitride semiconductor layer and method for separating the nitride semiconductor layer from the substrate
SG118380A1 (en) Composition and method comprising same for removing residue from a substrate
DE502006009104D1 (en) TRANSPORT DEVICE, ESPECIALLY FOR THE TRANSPORT OF SURFACE SUBSTRATES THROUGH A COATING SYSTEM
EP2070107A4 (en) Anti-reflective imaging layer for multiple patterning process
TWI369588B (en) Stage apparatus, method for controlling the same, exposure apparatus, and method for manufacturing device
EP2199861A4 (en) Composition for forming silicon-containing fine pattern and method for forming fine pattern using the same
PL1990204T3 (en) Process and device for coating a surface

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08857892

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08857892

Country of ref document: EP

Kind code of ref document: A2