WO2008139763A1 - 光通信モジュールとその製造方法及び光送受信装置 - Google Patents

光通信モジュールとその製造方法及び光送受信装置 Download PDF

Info

Publication number
WO2008139763A1
WO2008139763A1 PCT/JP2008/053036 JP2008053036W WO2008139763A1 WO 2008139763 A1 WO2008139763 A1 WO 2008139763A1 JP 2008053036 W JP2008053036 W JP 2008053036W WO 2008139763 A1 WO2008139763 A1 WO 2008139763A1
Authority
WO
WIPO (PCT)
Prior art keywords
communications module
optical communications
light emitting
manufacturing
photo acceptance
Prior art date
Application number
PCT/JP2008/053036
Other languages
English (en)
French (fr)
Inventor
Yoshihiro Terada
Masakazu Ohashi
Koji Azegami
Kentaro Ichii
Original Assignee
Fujikura Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007127810A external-priority patent/JP2008010837A/ja
Application filed by Fujikura Ltd. filed Critical Fujikura Ltd.
Priority to EP08711810.5A priority Critical patent/EP2151900B1/en
Priority to JP2008544699A priority patent/JPWO2008139763A1/ja
Priority to CN2008800154727A priority patent/CN101682167B/zh
Publication of WO2008139763A1 publication Critical patent/WO2008139763A1/ja
Priority to US12/618,626 priority patent/US8113724B2/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02251—Out-coupling of light using optical fibres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

Abstract

（１）サブマウント基板の側面に発光素子、受光素子を実装し、該サブマウント基板をプリント基板上に、発光素子及び受光素子の発光及び受光方向がプリント基板に平行となるように実装する工程；（２）光導波路を位置合わせする工程；（３）光導波路端部及び発光素子又は受光素子を含むサブマウント基板部分に樹脂液を滴下し、さらに該樹脂液を硬化させる工程；の各工程を順に行って光通信モジュールを作製する光通信モジュールの製造方法。本発明に拠れば、薄型化、小型化でき、かつ低コストな光通信モジュールが提供可能である。
PCT/JP2008/053036 2007-05-14 2008-02-22 光通信モジュールとその製造方法及び光送受信装置 WO2008139763A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08711810.5A EP2151900B1 (en) 2007-05-14 2008-02-22 Optical communications module, process for manufacturing the same, and optical transmitter and receiver apparatus
JP2008544699A JPWO2008139763A1 (ja) 2007-05-14 2008-02-22 光通信モジュールとその製造方法及び光送受信装置
CN2008800154727A CN101682167B (zh) 2007-05-14 2008-02-22 光通信模块及其制造方法及光收发装置
US12/618,626 US8113724B2 (en) 2007-05-14 2009-11-13 Optical communication module, manufacturing method therefor, and optical transceiver

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-127810 2007-05-14
JP2007127810A JP2008010837A (ja) 2006-05-29 2007-05-14 光通信モジュールとその製造方法及び光送受信装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/618,626 Continuation US8113724B2 (en) 2007-05-14 2009-11-13 Optical communication module, manufacturing method therefor, and optical transceiver

Publications (1)

Publication Number Publication Date
WO2008139763A1 true WO2008139763A1 (ja) 2008-11-20

Family

ID=40001986

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053036 WO2008139763A1 (ja) 2007-05-14 2008-02-22 光通信モジュールとその製造方法及び光送受信装置

Country Status (5)

Country Link
US (1) US8113724B2 (ja)
EP (1) EP2151900B1 (ja)
JP (1) JPWO2008139763A1 (ja)
CN (2) CN102109646B (ja)
WO (1) WO2008139763A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011135978A1 (ja) * 2010-04-28 2013-07-18 学校法人慶應義塾 カーボンナノチューブ発光素子、光源及びフォトカプラ
WO2015087971A1 (ja) * 2013-12-13 2015-06-18 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101688245B1 (ko) 2009-02-20 2016-12-20 세키스이가가쿠 고교가부시키가이샤 Ｇｉ 형 광섬유 및 그 제조 방법
WO2010140604A1 (ja) 2009-06-05 2010-12-09 先端フォトニクス株式会社 サブマウント、これを備えた光モジュール、及びサブマウントの製造方法
EP2523029B1 (en) * 2010-01-06 2017-02-15 Fujikura Ltd. Optical coupling structure and optical transreceiver module
US8957956B2 (en) 2010-06-09 2015-02-17 Honeywell International Inc. Method and system for iris image capture
US8876327B2 (en) 2010-10-20 2014-11-04 Pioneer Corporation Laser light source module and method of manufacturing laser light source module
JP5840411B2 (ja) * 2011-08-05 2016-01-06 日本メクトロン株式会社 光電気混載可撓性プリント配線板及びその受発光素子実装方法
CN102385125A (zh) * 2011-10-28 2012-03-21 江苏奥雷光电有限公司 多通道小封装收发器及组装方法
US8976833B2 (en) * 2013-03-12 2015-03-10 Taiwan Semiconductor Manufacturing Company, Ltd. Light coupling device and methods of forming same
US20160011386A1 (en) * 2013-03-27 2016-01-14 Ccs Technology, Inc. Optoelectronic device and method of assembling an optoelectronic device
JP2015105978A (ja) * 2013-11-28 2015-06-08 富士通株式会社 光ファイバ、及び光ファイバの製造方法
US10073226B2 (en) 2014-05-15 2018-09-11 Imec Vzw Method for coupling an optical fiber to an optical or optoelectronic component
US10677995B2 (en) 2014-10-23 2020-06-09 Hewlett Packard Enterprise Development Lp Optical fiber interface for optical device package
WO2016064426A1 (en) 2014-10-24 2016-04-28 Hewlett Packard Enterprise Development Lp Optical interconnect device
WO2016122490A1 (en) 2015-01-28 2016-08-04 Hewlett Packard Enterprise Development Lp Laser-written optical routing systems and method
US10326252B2 (en) 2015-05-06 2019-06-18 Microsoft Technology Licensing, Llc Beam projection for fast axis expansion
CN106571871A (zh) * 2015-10-13 2017-04-19 华为技术有限公司 一种光通信模块，及载板
US11303355B2 (en) 2018-05-30 2022-04-12 Apple Inc. Optical structures in directional free-space optical communication systems for portable electronic devices
US10700780B2 (en) * 2018-05-30 2020-06-30 Apple Inc. Systems and methods for adjusting movable lenses in directional free-space optical communication systems for portable electronic devices
US11105973B2 (en) 2019-01-11 2021-08-31 Schott Corporation Optically enhanced high resolution image guides
US11722759B2 (en) * 2019-03-20 2023-08-08 Ticona Llc Actuator assembly for a camera module
US11549799B2 (en) 2019-07-01 2023-01-10 Apple Inc. Self-mixing interference device for sensing applications
US11672448B2 (en) 2020-01-10 2023-06-13 Vioptix, Inc. Probe tip for medical device
CN113126217B (zh) * 2020-01-16 2022-11-11 华为技术有限公司 一种光发端器件、光发端器件的制备方法及光通信设备

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05333251A (ja) * 1992-06-04 1993-12-17 Fujitsu Ltd 光アレイモジュール及び光アレイリンク
WO2000008729A1 (en) * 1998-08-05 2000-02-17 Seiko Epson Corporation Optical module and method of manufacture thereof
JP2001249245A (ja) * 2000-03-06 2001-09-14 Hitachi Cable Ltd 光導波路と光ファイバとの接続方法及び光モジュール
JP2005159265A (ja) * 2003-10-31 2005-06-16 Sharp Corp 光学素子の封止構造体および光結合器ならびに光学素子の封止方法
JP2005172989A (ja) * 2003-12-09 2005-06-30 Fujikura Ltd 光コネクタおよびその製造方法
JP2006030463A (ja) * 2004-07-14 2006-02-02 Fuji Xerox Co Ltd 光モジュール、光信号伝送装置、及び、光伝送装置
JP2006337550A (ja) * 2005-05-31 2006-12-14 Sony Corp 光結合器
WO2007111236A1 (ja) 2006-03-24 2007-10-04 Ibiden Co., Ltd. 光電気配線板、光通信用デバイス及び光通信用デバイスの製造方法

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1494963A (en) * 1975-03-18 1977-12-14 Telephone Cables Ltd Optical fibre waveguides and their manufacture
US4172106A (en) * 1976-06-24 1979-10-23 Telephone Cables Limited Optical fibre cables and their manufacture
JPS59174541A (ja) * 1983-01-11 1984-10-03 Hitachi Cable Ltd 偏波面保存光フアイバ
US4701016A (en) * 1985-01-31 1987-10-20 American Telephone And Telegraph Company, At&T Bell Laboratories Thixotropic grease composition and cable comprising same
JPH08220368A (ja) 1995-02-13 1996-08-30 Nippon Telegr & Teleph Corp <Ntt> 光半導体装置モジュール
JP3740748B2 (ja) * 1996-06-18 2006-02-01 松下電器産業株式会社 光ファイバモジュール
JP3191729B2 (ja) * 1997-07-03 2001-07-23 日本電気株式会社 光半導体モジュールとその製造方法
US6239427B1 (en) * 1998-01-14 2001-05-29 Sumitomo Electric Industries, Ltd. Optical data link
JP3392748B2 (ja) 1998-03-13 2003-03-31 日本電信電話株式会社 半導体光モジュールの製造方法
US6164837A (en) * 1998-12-30 2000-12-26 Mcdonnell Douglas Corporation Integrated microelectromechanical alignment and locking apparatus and method for fiber optic module manufacturing
US6851869B2 (en) * 2000-08-04 2005-02-08 Cool Options, Inc. Highly thermally conductive electronic connector
WO2002089274A1 (fr) * 2001-04-25 2002-11-07 Sumitomo Electric Industries, Ltd. Dispositif de communication optique
US6878875B2 (en) * 2002-02-14 2005-04-12 Finisar Corporation Small form factor optical transceiver with extended transmission range
US6867368B2 (en) * 2002-02-14 2005-03-15 Finisar Corporation Multi-layer ceramic feedthrough structure in a transmitter optical subassembly
DE10305171B4 (de) * 2003-01-31 2007-11-29 Infineon Technologies Ag Bidirektionales optisches Sende- und Empfangsmodul
JP2004253638A (ja) 2003-02-20 2004-09-09 Matsushita Electric Ind Co Ltd 光部品とその製造方法
JP2004309570A (ja) 2003-04-02 2004-11-04 Seiko Epson Corp 光通信モジュール、光通信装置、及びその製造方法
JP4659422B2 (ja) 2003-10-06 2011-03-30 三井化学株式会社 光導波路の製造方法
JP2005134600A (ja) 2003-10-30 2005-05-26 Fuji Xerox Co Ltd 光素子パッケージ、及び、光結合構造
CN100431181C (zh) * 2003-10-31 2008-11-05 夏普株式会社 光学元件的密封结构体、光耦合器及光学元件的密封方法
JP4170920B2 (ja) 2004-01-14 2008-10-22 株式会社リコー 光学部品の製造方法および光インターコネクションシステムおよび光配線モジュール
JP2005234464A (ja) * 2004-02-23 2005-09-02 Tdk Corp 光トランシーバ及びこれに用いる光モジュール
JP2006011179A (ja) 2004-06-28 2006-01-12 Omron Corp フィルム光導波路の製造方法および製造装置
US7500792B2 (en) * 2004-11-26 2009-03-10 Finisar Corporation Optoelectronic transmitting and/or receiving arrangement
US7224857B2 (en) * 2004-12-20 2007-05-29 Fujitsu Limited Optical-routing boards for opto-electrical systems and methods and apparatuses for manufacturing the same
US7343060B2 (en) * 2005-03-04 2008-03-11 Fuji Xerox Co., Ltd. Light transmission and reception module, sub-mount, and method of manufacturing the sub-mount
JP4788944B2 (ja) 2005-03-18 2011-10-05 株式会社フジクラ 粉末状蛍光体とその製造方法、発光デバイス及び照明装置
US7747116B2 (en) * 2007-09-05 2010-06-29 Kabushiki Kaisha Toshiba Flexible optoelectric interconnect and method for manufacturing same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05333251A (ja) * 1992-06-04 1993-12-17 Fujitsu Ltd 光アレイモジュール及び光アレイリンク
WO2000008729A1 (en) * 1998-08-05 2000-02-17 Seiko Epson Corporation Optical module and method of manufacture thereof
EP1022822A1 (en) 1998-08-05 2000-07-26 Seiko Epson Corporation Optical module and method of manufacture thereof
JP2001249245A (ja) * 2000-03-06 2001-09-14 Hitachi Cable Ltd 光導波路と光ファイバとの接続方法及び光モジュール
JP2005159265A (ja) * 2003-10-31 2005-06-16 Sharp Corp 光学素子の封止構造体および光結合器ならびに光学素子の封止方法
JP2005172989A (ja) * 2003-12-09 2005-06-30 Fujikura Ltd 光コネクタおよびその製造方法
JP2006030463A (ja) * 2004-07-14 2006-02-02 Fuji Xerox Co Ltd 光モジュール、光信号伝送装置、及び、光伝送装置
JP2006337550A (ja) * 2005-05-31 2006-12-14 Sony Corp 光結合器
WO2007111236A1 (ja) 2006-03-24 2007-10-04 Ibiden Co., Ltd. 光電気配線板、光通信用デバイス及び光通信用デバイスの製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2151900A4

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2011135978A1 (ja) * 2010-04-28 2013-07-18 学校法人慶應義塾 カーボンナノチューブ発光素子、光源及びフォトカプラ
US8895997B2 (en) 2010-04-28 2014-11-25 Keio University Carbon nanotube light emitting device, light source, and photo coupler
JP5747334B2 (ja) * 2010-04-28 2015-07-15 学校法人慶應義塾 カーボンナノチューブ発光素子、光源及びフォトカプラ
WO2015087971A1 (ja) * 2013-12-13 2015-06-18 日立化成株式会社 接着剤組成物及びそれを用いた半導体装置

Also Published As

Publication number Publication date
JPWO2008139763A1 (ja) 2010-07-29
CN102109646A (zh) 2011-06-29
US20100061684A1 (en) 2010-03-11
US8113724B2 (en) 2012-02-14
EP2151900B1 (en) 2016-03-23
CN101682167A (zh) 2010-03-24
EP2151900A1 (en) 2010-02-10
EP2151900A4 (en) 2012-12-12
CN102109646B (zh) 2013-10-23
CN101682167B (zh) 2011-07-20

Similar Documents

Publication Publication Date Title
WO2008139763A1 (ja) 光通信モジュールとその製造方法及び光送受信装置
WO2005104252A8 (en) Semiconductor light emitting devices including flexible film having therein an optical element, and methods of assembling same
EP1921473A4 (en) OPTICAL WAVE CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME, HYBRID OPTOELECTRIC FILM INCLUDING THE WAVE CONDUCTING FILM, AND ELECTRONIC DEVICE
TW200512485A (en) Connecting a component with an embedded optical fiber
TW200704988A (en) Manufacturing of optical waveguides
TW200643834A (en) Passively aligned optical-electrical interface
EP2100908A4 (en) HEAT-CURABLE RESIN COMPOSITION FOR LIGHT REFLECTION, METHOD FOR PRODUCING THE RESIN COMPOSITION AND MOUNTING SUBSTRATE FOR OPTICAL SEMICONDUCTOR ELEMENTS AND OPTICAL SEMICONDUCTOR ELEMENT USING THE RESIN COMPOSITION
TW200710440A (en) Microlens, optical plate, diffusing plate, light guide plate, backlight, projection screen, projection system, electro-optical device, electronic apparatus, and method for manufacturing a microlens
TW200630652A (en) Waveguide comprising an anisotropic diffracting layer
WO2007103836A3 (en) Fiber-coupled optical device mounted on a circuit board
WO2007141664A8 (en) Apparatus, system and method for use in mounting electronic elements
TW200638122A (en) Light system with an attachment structure that is insert molded to a light guide
TW200708770A (en) Optical sheet, backlight unit, electro-optic device, electronic device, method for manufacturing optical sheet, and method for cutting optical sheet
TW200627328A (en) Electro-optical device, method of manufacturing the same, and electronic apparatus
TW200739191A (en) Display device
EP1519206A3 (en) Joined multi functional optical device
TW200736732A (en) Light guide plate and backlight module using the same
WO2008111524A1 (ja) パッケージの製造方法、パッケージ、光モジュール、及び一体成型用金型
WO2008114657A1 (ja) 光伝送路パッケージ、光伝送モジュール、電子機器、および、光伝送モジュールの製造方法
EP2592454A4 (en) OPTICAL MODULE AND MANUFACTURING METHOD THEREFOR
EP2144101A3 (en) Optical semiconductor device and manufacturing method therefor
WO2008090945A1 (ja) 光学シートならびにそれを用いた実装方法および光学モジュール
WO2003098302A3 (en) Optical device receiving substrate and optical device holding carrier
TW200942885A (en) Optoelectric interconnection module
EP2204678A4 (en) Lightwave conductor, optic transmission module, electronic device and method for producing the optical waveguide

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880015472.7

Country of ref document: CN

WWE Wipo information: entry into national phase

Ref document number: 2008544699

Country of ref document: JP

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08711810

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008711810

Country of ref document: EP