WO2008136454A1 - アダマンタン誘導体、その製造方法、該アダマンタン誘導体を含む樹脂組成物及びその用途 - Google Patents

アダマンタン誘導体、その製造方法、該アダマンタン誘導体を含む樹脂組成物及びその用途 Download PDF

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Publication number
WO2008136454A1
WO2008136454A1 PCT/JP2008/058178 JP2008058178W WO2008136454A1 WO 2008136454 A1 WO2008136454 A1 WO 2008136454A1 JP 2008058178 W JP2008058178 W JP 2008058178W WO 2008136454 A1 WO2008136454 A1 WO 2008136454A1
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WO
WIPO (PCT)
Prior art keywords
adamantane derivative
group
resin composition
integer
producing
Prior art date
Application number
PCT/JP2008/058178
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English (en)
French (fr)
Inventor
Yasunari Okada
Hidetoshi Ono
Katsuki Ito
Original Assignee
Idemitsu Kosan Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co., Ltd. filed Critical Idemitsu Kosan Co., Ltd.
Priority to US12/598,041 priority Critical patent/US8022151B2/en
Priority to CN200880014270A priority patent/CN101675090A/zh
Publication of WO2008136454A1 publication Critical patent/WO2008136454A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/12—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms
    • C07D303/16—Compounds containing oxirane rings with hydrocarbon radicals, substituted by singly or doubly bound oxygen atoms by esterified hydroxyl radicals
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
    • C07D303/02—Compounds containing oxirane rings
    • C07D303/04—Compounds containing oxirane rings containing only hydrogen and carbon atoms in addition to the ring oxygen atoms
    • C07D303/06—Compounds containing oxirane rings containing only hydrogen and carbon atoms in addition to the ring oxygen atoms in which the oxirane rings are condensed with a carbocyclic ring system having three or more relevant rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Compounds (AREA)

Abstract

　本発明は、透明性、耐光性等の光学特性、耐熱性等の耐久性、誘電率等の電機特性に優れた硬化物を与える、下記一般式（Ｉ）で表されるアダマンタン誘導体、その製造方法、該アダマンタン誘導体とエポキシ樹脂硬化剤とを含む樹脂組成物及びそれを用いた光半導体用封止剤である。 （式中、Ｙは、炭化水素基、水酸基、カルボキシル基、及び２つのＹが一緒になって形成された＝Ｏから選ばれる基を示す。Ｚは、環状エーテル基であり、ｎは０以上の整数、ｐは２～４の整数、ｑは０～１４の整数であり、２≦ｐ＋ｑ≦１６である。）
PCT/JP2008/058178 2007-05-01 2008-04-28 アダマンタン誘導体、その製造方法、該アダマンタン誘導体を含む樹脂組成物及びその用途 WO2008136454A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US12/598,041 US8022151B2 (en) 2007-05-01 2008-04-28 Adamantane derivative, method for producing the same, resin composition containing the adamantane derivative and use thereof
CN200880014270A CN101675090A (zh) 2007-05-01 2008-04-28 金刚烷衍生物、其制造方法、含该金刚烷衍生物的树脂组合物及其用途

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-120998 2007-05-01
JP2007120998A JP2008274159A (ja) 2007-05-01 2007-05-01 アダマンタン誘導体、その製造方法、該アダマンタン誘導体を含む樹脂組成物及びその用途

Publications (1)

Publication Number Publication Date
WO2008136454A1 true WO2008136454A1 (ja) 2008-11-13

Family

ID=39943561

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/058178 WO2008136454A1 (ja) 2007-05-01 2008-04-28 アダマンタン誘導体、その製造方法、該アダマンタン誘導体を含む樹脂組成物及びその用途

Country Status (6)

Country Link
US (1) US8022151B2 (ja)
JP (1) JP2008274159A (ja)
KR (1) KR20100015791A (ja)
CN (1) CN101675090A (ja)
TW (1) TW200909423A (ja)
WO (1) WO2008136454A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5134233B2 (ja) * 2006-11-29 2013-01-30 出光興産株式会社 アダマンタン誘導体、その製造方法及びアダマンタン誘導体を含む樹脂組成物
JP5849963B2 (ja) * 2010-11-15 2016-02-03 日産化学工業株式会社 多官能エポキシ化合物
JP5867749B2 (ja) * 2011-03-23 2016-02-24 日産化学工業株式会社 多官能エポキシ化合物
JP5935584B2 (ja) * 2012-08-07 2016-06-15 三菱瓦斯化学株式会社 アダマンタンカルボン酸グリシジルエステル化合物の製造方法
JP2015017076A (ja) * 2013-07-12 2015-01-29 三菱瓦斯化学株式会社 高透明アダマンタンカルボン酸グリシジルエステル化合物
CN117186361B (zh) * 2023-08-08 2024-05-17 广东炎墨方案科技有限公司 一种金刚烷改性的高耐热光固化阻焊油墨及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003321530A (ja) * 2002-05-01 2003-11-14 Jsr Corp 含脂環共重合体、その製造方法、及び光学用樹脂
WO2007010784A1 (ja) * 2005-07-15 2007-01-25 Idemitsu Kosan Co., Ltd. 含フッ素アダマンタン誘導体、それを含有する樹脂組成物及びその樹脂組成物を用いた光学電子部材
WO2007026828A1 (ja) * 2005-09-01 2007-03-08 Idemitsu Kosan Co., Ltd. アダマンタン誘導体、それを含有する樹脂組成物及びそれを用いた光学電子部材
WO2007094173A1 (ja) * 2006-02-17 2007-08-23 Idemitsu Kosan Co., Ltd. アダマンタン誘導体、それを含有する組成物及びその組成物を用いた光学電子部材

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JP2881969B2 (ja) 1990-06-05 1999-04-12 富士通株式会社 放射線感光レジストとパターン形成方法
JP2774229B2 (ja) 1993-04-27 1998-07-09 帝人化成株式会社 光学用成形品
JP3331121B2 (ja) 1996-05-17 2002-10-07 カネボウ株式会社 ポリエステル重合体およびその成形体
JP4003551B2 (ja) 2001-06-25 2007-11-07 三菱化学株式会社 脂環式エポキシ化合物および脂環式エポキシ樹脂組成物ならびに発光ダイオード用封止材
JP2005146253A (ja) 2003-06-20 2005-06-09 Tokuyama Corp 硬化性多環式化合物、及びその製造方法
JP2007070407A (ja) 2005-09-05 2007-03-22 Idemitsu Kosan Co Ltd アダマンタン誘導体、エポキシ樹脂及びそれらを含む樹脂組成物を用いた光学電子部材

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* Cited by examiner, † Cited by third party
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JP2003321530A (ja) * 2002-05-01 2003-11-14 Jsr Corp 含脂環共重合体、その製造方法、及び光学用樹脂
WO2007010784A1 (ja) * 2005-07-15 2007-01-25 Idemitsu Kosan Co., Ltd. 含フッ素アダマンタン誘導体、それを含有する樹脂組成物及びその樹脂組成物を用いた光学電子部材
WO2007026828A1 (ja) * 2005-09-01 2007-03-08 Idemitsu Kosan Co., Ltd. アダマンタン誘導体、それを含有する樹脂組成物及びそれを用いた光学電子部材
WO2007094173A1 (ja) * 2006-02-17 2007-08-23 Idemitsu Kosan Co., Ltd. アダマンタン誘導体、それを含有する組成物及びその組成物を用いた光学電子部材

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Also Published As

Publication number Publication date
KR20100015791A (ko) 2010-02-12
US20100093947A1 (en) 2010-04-15
US8022151B2 (en) 2011-09-20
JP2008274159A (ja) 2008-11-13
CN101675090A (zh) 2010-03-17
TW200909423A (en) 2009-03-01

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