WO2008133139A1 - ダミー基板及びそれを用いた成膜装置の始動方法、成膜条件の維持・変更方法並びに停止方法 - Google Patents
ダミー基板及びそれを用いた成膜装置の始動方法、成膜条件の維持・変更方法並びに停止方法 Download PDFInfo
- Publication number
- WO2008133139A1 WO2008133139A1 PCT/JP2008/057423 JP2008057423W WO2008133139A1 WO 2008133139 A1 WO2008133139 A1 WO 2008133139A1 JP 2008057423 W JP2008057423 W JP 2008057423W WO 2008133139 A1 WO2008133139 A1 WO 2008133139A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- dummy substrate
- film forming
- sputtering
- thin film
- compound thin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12361—All metal or with adjacent metals having aperture or cut
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/596,303 US9011654B2 (en) | 2007-04-18 | 2008-04-16 | Dummy substrate, and start method of, retention/modification method of deposition condition, and stop method of deposition apparatus using same |
KR1020097023285A KR101122309B1 (ko) | 2007-04-18 | 2008-04-16 | 더미 기판 및 그것을 사용한 성막 장치의 시동 방법, 성막 조건의 유지?변경 방법 및 정지 방법 |
CN2008800123574A CN101657563B (zh) | 2007-04-18 | 2008-04-16 | 伪基板和使用该伪基板的成膜装置的启动方法、成膜条件的维持或变更方法及停止方法 |
JP2009511823A JP5015241B2 (ja) | 2007-04-18 | 2008-04-16 | ダミー基板及びそれを用いた成膜装置の始動方法、成膜条件の維持・変更方法並びに停止方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-109275 | 2007-04-18 | ||
JP2007109275 | 2007-04-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008133139A1 true WO2008133139A1 (ja) | 2008-11-06 |
Family
ID=39925595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/057423 WO2008133139A1 (ja) | 2007-04-18 | 2008-04-16 | ダミー基板及びそれを用いた成膜装置の始動方法、成膜条件の維持・変更方法並びに停止方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9011654B2 (ja) |
JP (1) | JP5015241B2 (ja) |
KR (1) | KR101122309B1 (ja) |
CN (1) | CN101657563B (ja) |
TW (1) | TWI428461B (ja) |
WO (1) | WO2008133139A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010255052A (ja) * | 2009-04-24 | 2010-11-11 | Ulvac Japan Ltd | スパッタリング方法 |
JP2015189503A (ja) * | 2014-03-28 | 2015-11-02 | 旭化成ケミカルズ株式会社 | ベールの収納方法、ベール収納装置、ベール包装体製造方法、ベール包装体製造装置、及びベール包装体 |
KR20180083259A (ko) | 2017-01-12 | 2018-07-20 | 가부시키가이샤 아루박 | 기판 홀더, 종형 기판 반송 장치 및 기판 처리 장치 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008015982B3 (de) * | 2008-03-27 | 2009-07-30 | Grenzebach Maschinenbau Gmbh | Verfahren und Vorrichtung zur Fixierung und den Weitertransport stoßempfindlicher Platten in Sputter-Beschichtungsanlagen, Computerprogramm zur Durchführung des Verfahrens und maschinenlesbarer Träger hierzu |
TWI564950B (zh) * | 2014-03-06 | 2017-01-01 | 金載鵬 | 基板運送方法 |
CN105900210B (zh) * | 2014-12-15 | 2021-06-01 | 应用材料公司 | 用于纹理化腔室部件的方法和具有纹理化表面的腔室部件 |
CN105083980B (zh) * | 2015-06-10 | 2017-12-01 | 合肥京东方光电科技有限公司 | 溅射设备及其基板承载装置 |
KR102392851B1 (ko) * | 2018-06-15 | 2022-04-29 | 가부시키가이샤 알박 | 진공 처리 장치, 더미 기판 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0570952A (ja) * | 1991-09-18 | 1993-03-23 | Hitachi Ltd | インライン式スパツタ装置およびその運転方法 |
JPH11152564A (ja) * | 1997-11-17 | 1999-06-08 | Murata Mfg Co Ltd | プリスパッタ方法および装置 |
JP2003229369A (ja) * | 2002-02-06 | 2003-08-15 | Mitsubishi Heavy Ind Ltd | 真空処理装置におけるプラズマ安定化方法及びダミー基板 |
JP2004111550A (ja) * | 2002-09-17 | 2004-04-08 | Mitsubishi Heavy Ind Ltd | ダミー基板及びこれが固定された真空処理装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08316283A (ja) * | 1995-05-19 | 1996-11-29 | Kobe Steel Ltd | ダミーウエハー |
JPH10265940A (ja) * | 1997-03-28 | 1998-10-06 | Canon Inc | 成膜用メタルマスク及びその製造方法 |
JP2001093262A (ja) * | 1999-09-21 | 2001-04-06 | Internatl Business Mach Corp <Ibm> | ディスクドライブ装置、ディスクドライブ装置の組付け方法およびダミーディスク |
JP3315675B2 (ja) * | 1999-12-15 | 2002-08-19 | 株式会社半導体先端テクノロジーズ | ダミーウェハおよび熱処理方法 |
US6517908B1 (en) * | 2000-01-10 | 2003-02-11 | Nec Electronics, Inc. | Method for making a test wafer from a substrate |
JP3760370B2 (ja) * | 2000-08-18 | 2006-03-29 | 株式会社村田製作所 | インライン式スパッタ装置 |
US6460674B1 (en) * | 2001-03-22 | 2002-10-08 | Borgwarner, Inc. | Clutch face finish and clutch pack utilizing same |
CN100485848C (zh) * | 2003-12-31 | 2009-05-06 | 中芯国际集成电路制造(上海)有限公司 | 穿透式电子显微镜试片的制备方法 |
-
2008
- 2008-04-16 US US12/596,303 patent/US9011654B2/en active Active
- 2008-04-16 JP JP2009511823A patent/JP5015241B2/ja active Active
- 2008-04-16 TW TW097113834A patent/TWI428461B/zh active
- 2008-04-16 WO PCT/JP2008/057423 patent/WO2008133139A1/ja active Application Filing
- 2008-04-16 KR KR1020097023285A patent/KR101122309B1/ko active IP Right Grant
- 2008-04-16 CN CN2008800123574A patent/CN101657563B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0570952A (ja) * | 1991-09-18 | 1993-03-23 | Hitachi Ltd | インライン式スパツタ装置およびその運転方法 |
JPH11152564A (ja) * | 1997-11-17 | 1999-06-08 | Murata Mfg Co Ltd | プリスパッタ方法および装置 |
JP2003229369A (ja) * | 2002-02-06 | 2003-08-15 | Mitsubishi Heavy Ind Ltd | 真空処理装置におけるプラズマ安定化方法及びダミー基板 |
JP2004111550A (ja) * | 2002-09-17 | 2004-04-08 | Mitsubishi Heavy Ind Ltd | ダミー基板及びこれが固定された真空処理装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010255052A (ja) * | 2009-04-24 | 2010-11-11 | Ulvac Japan Ltd | スパッタリング方法 |
JP2015189503A (ja) * | 2014-03-28 | 2015-11-02 | 旭化成ケミカルズ株式会社 | ベールの収納方法、ベール収納装置、ベール包装体製造方法、ベール包装体製造装置、及びベール包装体 |
KR20180083259A (ko) | 2017-01-12 | 2018-07-20 | 가부시키가이샤 아루박 | 기판 홀더, 종형 기판 반송 장치 및 기판 처리 장치 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008133139A1 (ja) | 2010-07-22 |
TWI428461B (zh) | 2014-03-01 |
CN101657563A (zh) | 2010-02-24 |
US9011654B2 (en) | 2015-04-21 |
US20100175990A1 (en) | 2010-07-15 |
TW200909602A (en) | 2009-03-01 |
JP5015241B2 (ja) | 2012-08-29 |
KR101122309B1 (ko) | 2012-03-21 |
CN101657563B (zh) | 2011-09-28 |
KR20090127378A (ko) | 2009-12-10 |
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