WO2008114539A1 - 無接着剤フレキシブルラミネート及びその製造方法 - Google Patents
無接着剤フレキシブルラミネート及びその製造方法 Download PDFInfo
- Publication number
- WO2008114539A1 WO2008114539A1 PCT/JP2008/051646 JP2008051646W WO2008114539A1 WO 2008114539 A1 WO2008114539 A1 WO 2008114539A1 JP 2008051646 W JP2008051646 W JP 2008051646W WO 2008114539 A1 WO2008114539 A1 WO 2008114539A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- flexible laminate
- adhesive
- type flexible
- plasma
- polyimide film
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12472—Microscopic interfacial wave or roughness
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Physical Vapour Deposition (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009505095A JP5043094B2 (ja) | 2007-03-20 | 2008-02-01 | 無接着剤フレキシブルラミネート及びその製造方法 |
US12/525,871 US20100323215A1 (en) | 2007-03-20 | 2008-02-01 | Non-Adhesive-Type Flexible Laminate and Method for Production Thereof |
CN2008800063304A CN101627447B (zh) | 2007-03-20 | 2008-02-01 | 无胶粘剂挠性层压体及其制造方法 |
KR1020097016081A KR101133488B1 (ko) | 2007-03-20 | 2008-02-01 | 무접착제 플렉시블 라미네이트 및 그 제조 방법 |
US13/355,603 US20120135160A1 (en) | 2007-03-20 | 2012-01-23 | Method for Production of Non-Adhesive-Type Flexible Laminate |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-072884 | 2007-03-20 | ||
JP2007072884 | 2007-03-20 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/355,603 Division US20120135160A1 (en) | 2007-03-20 | 2012-01-23 | Method for Production of Non-Adhesive-Type Flexible Laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008114539A1 true WO2008114539A1 (ja) | 2008-09-25 |
Family
ID=39765655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/051646 WO2008114539A1 (ja) | 2007-03-20 | 2008-02-01 | 無接着剤フレキシブルラミネート及びその製造方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US20100323215A1 (ja) |
JP (1) | JP5043094B2 (ja) |
KR (2) | KR101133488B1 (ja) |
CN (1) | CN101627447B (ja) |
TW (1) | TWI473708B (ja) |
WO (1) | WO2008114539A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011102238A1 (ja) * | 2010-02-22 | 2011-08-25 | Jx日鉱日石金属株式会社 | フレキシブルラミネート基板への回路形成方法 |
EP2371535A1 (en) * | 2008-12-26 | 2011-10-05 | JX Nippon Mining & Metals Corporation | Flexible laminate and flexible electronic circuit substrate formed using the same |
WO2012108264A1 (ja) | 2011-02-10 | 2012-08-16 | Jx日鉱日石金属株式会社 | 2層銅張積層材及びその製造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090080978A (ko) * | 2006-11-29 | 2009-07-27 | 닛코 킨조쿠 가부시키가이샤 | 2 층 구리 피복 적층판 |
EP2351876A1 (en) | 2008-11-25 | 2011-08-03 | JX Nippon Mining & Metals Corporation | Copper foil for printed circuit |
WO2010061737A1 (ja) * | 2008-11-25 | 2010-06-03 | 日鉱金属株式会社 | 銅箔又は銅張り積層板の巻取り方法 |
JP2009143234A (ja) | 2008-12-24 | 2009-07-02 | Nippon Mining & Metals Co Ltd | キャリア付金属箔 |
JP5746866B2 (ja) * | 2011-01-05 | 2015-07-08 | Jx日鉱日石金属株式会社 | 銅張積層板及びその製造方法 |
WO2012117850A1 (ja) * | 2011-03-01 | 2012-09-07 | Jx日鉱日石金属株式会社 | 液晶ポリマーフィルムベース銅張積層板及びその製造方法 |
WO2016099163A1 (ko) * | 2014-12-19 | 2016-06-23 | 윤영덕 | 굴삭기를 이용한 굴착 장치 |
CN115348921A (zh) * | 2020-04-03 | 2022-11-15 | 信越聚合物株式会社 | 覆金属层叠板 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997038851A1 (en) * | 1996-04-18 | 1997-10-23 | Gould Electronics Inc. | Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
WO2004050352A1 (ja) * | 2002-12-05 | 2004-06-17 | Kaneka Corporation | 積層体、プリント配線板およびそれらの製造方法 |
JP2004273744A (ja) * | 2003-03-07 | 2004-09-30 | Kanegafuchi Chem Ind Co Ltd | 熱可塑性樹脂材料およびプリント配線板の製造方法 |
WO2006075796A1 (en) * | 2005-01-13 | 2006-07-20 | Fujifilm Corporation | Metal film and formation method of metal film |
JP2006253185A (ja) * | 2005-03-08 | 2006-09-21 | Toray Ind Inc | ポリイミドフィルム、及びこれを用いた耐熱性樹脂積層フィルム、金属層付き積層フィルム |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5019222A (en) * | 1989-05-02 | 1991-05-28 | Nikko Gould Foil Co., Ltd. | Treatment of copper foil for printed circuits |
US6146480A (en) * | 1999-03-12 | 2000-11-14 | Ga-Tek Inc. | Flexible laminate for flexible circuit |
JP3258308B2 (ja) * | 2000-02-03 | 2002-02-18 | 株式会社日鉱マテリアルズ | レーザー穴開け性に優れた銅箔及びその製造方法 |
US20020182432A1 (en) * | 2000-04-05 | 2002-12-05 | Masaru Sakamoto | Laser hole drilling copper foil |
JP3628585B2 (ja) * | 2000-04-05 | 2005-03-16 | 株式会社日鉱マテリアルズ | 銅張り積層板及び銅張り積層板のレーザーによる穴開け方法 |
JP3768104B2 (ja) * | 2001-01-22 | 2006-04-19 | ソニーケミカル株式会社 | フレキシブルプリント基板 |
CN101024315A (zh) * | 2001-07-06 | 2007-08-29 | 钟渊化学工业株式会社 | 层压体及其制造方法 |
JP4006618B2 (ja) * | 2001-09-26 | 2007-11-14 | 日鉱金属株式会社 | キャリア付銅箔の製法及びキャリア付銅箔を使用したプリント基板 |
JP4298943B2 (ja) * | 2001-10-18 | 2009-07-22 | 日鉱金属株式会社 | 銅箔表面処理剤 |
JP4379854B2 (ja) * | 2001-10-30 | 2009-12-09 | 日鉱金属株式会社 | 表面処理銅箔 |
TW200535259A (en) * | 2004-02-06 | 2005-11-01 | Furukawa Circuit Foil | Treated copper foil and circuit board |
CN100515167C (zh) * | 2004-02-17 | 2009-07-15 | 日矿金属株式会社 | 具有黑化处理表面或层的铜箔 |
KR100701645B1 (ko) * | 2004-08-02 | 2007-03-30 | 도레이새한 주식회사 | 연성회로기판용 적층구조체의 제조방법 |
JP4890546B2 (ja) * | 2006-06-12 | 2012-03-07 | Jx日鉱日石金属株式会社 | 粗化処理面を備えた圧延銅又は銅合金箔及び圧延銅又は銅合金箔の粗化方法 |
-
2008
- 2008-02-01 US US12/525,871 patent/US20100323215A1/en not_active Abandoned
- 2008-02-01 KR KR1020097016081A patent/KR101133488B1/ko active IP Right Grant
- 2008-02-01 CN CN2008800063304A patent/CN101627447B/zh active Active
- 2008-02-01 KR KR1020127001638A patent/KR20120034750A/ko not_active Application Discontinuation
- 2008-02-01 JP JP2009505095A patent/JP5043094B2/ja active Active
- 2008-02-01 WO PCT/JP2008/051646 patent/WO2008114539A1/ja active Application Filing
- 2008-02-05 TW TW97104521A patent/TWI473708B/zh active
-
2012
- 2012-01-23 US US13/355,603 patent/US20120135160A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997038851A1 (en) * | 1996-04-18 | 1997-10-23 | Gould Electronics Inc. | Adhesiveless flexible laminate and process for making adhesiveless flexible laminate |
WO2004050352A1 (ja) * | 2002-12-05 | 2004-06-17 | Kaneka Corporation | 積層体、プリント配線板およびそれらの製造方法 |
JP2004273744A (ja) * | 2003-03-07 | 2004-09-30 | Kanegafuchi Chem Ind Co Ltd | 熱可塑性樹脂材料およびプリント配線板の製造方法 |
WO2006075796A1 (en) * | 2005-01-13 | 2006-07-20 | Fujifilm Corporation | Metal film and formation method of metal film |
JP2006253185A (ja) * | 2005-03-08 | 2006-09-21 | Toray Ind Inc | ポリイミドフィルム、及びこれを用いた耐熱性樹脂積層フィルム、金属層付き積層フィルム |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2371535A1 (en) * | 2008-12-26 | 2011-10-05 | JX Nippon Mining & Metals Corporation | Flexible laminate and flexible electronic circuit substrate formed using the same |
EP2371535A4 (en) * | 2008-12-26 | 2012-05-09 | Jx Nippon Mining & Metals Corp | FLEXIBLE COATING AND A FLEXIBLE SUBSTRATE FOR ELECTRONIC CIRCUITS SHAPED WITH THEIR HELP |
WO2011102238A1 (ja) * | 2010-02-22 | 2011-08-25 | Jx日鉱日石金属株式会社 | フレキシブルラミネート基板への回路形成方法 |
JP5313391B2 (ja) * | 2010-02-22 | 2013-10-09 | Jx日鉱日石金属株式会社 | フレキシブルラミネート基板への回路形成方法 |
WO2012108264A1 (ja) | 2011-02-10 | 2012-08-16 | Jx日鉱日石金属株式会社 | 2層銅張積層材及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP5043094B2 (ja) | 2012-10-10 |
CN101627447A (zh) | 2010-01-13 |
US20100323215A1 (en) | 2010-12-23 |
US20120135160A1 (en) | 2012-05-31 |
JPWO2008114539A1 (ja) | 2010-07-01 |
KR20120034750A (ko) | 2012-04-12 |
TWI473708B (zh) | 2015-02-21 |
KR20090105955A (ko) | 2009-10-07 |
CN101627447B (zh) | 2012-06-13 |
KR101133488B1 (ko) | 2012-04-10 |
TW200900237A (en) | 2009-01-01 |
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