WO2008114374A1 - 半導体装置及びその製造方法 - Google Patents

半導体装置及びその製造方法 Download PDF

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Publication number
WO2008114374A1
WO2008114374A1 PCT/JP2007/055474 JP2007055474W WO2008114374A1 WO 2008114374 A1 WO2008114374 A1 WO 2008114374A1 JP 2007055474 W JP2007055474 W JP 2007055474W WO 2008114374 A1 WO2008114374 A1 WO 2008114374A1
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WO
WIPO (PCT)
Prior art keywords
semiconductor device
wirings
die pad
relay member
manufacturing same
Prior art date
Application number
PCT/JP2007/055474
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English (en)
French (fr)
Inventor
Takashi Kikuchi
Koichi Kanemoto
Akihiko Iwaya
Original Assignee
Renesas Technology Corp.
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Publication date
Application filed by Renesas Technology Corp. filed Critical Renesas Technology Corp.
Priority to PCT/JP2007/055474 priority Critical patent/WO2008114374A1/ja
Publication of WO2008114374A1 publication Critical patent/WO2008114374A1/ja

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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
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    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
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    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
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    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/0554—External layer
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Abstract

　本発明に係る半導体装置は、ダイパッドやインナーリードを有するリードフレームと、ダイパッド上に搭載され、複数の配線が形成された中継部材と、中継部材上に平置きに搭載され、複数の配線に接続された第１，第２チップと、複数の配線と複数のインナーリードとの間をそれぞれ接続する複数の金属ワイヤと、これらを封止する樹脂とを備える。そして、ダイパッドの外形寸法は、中継部材の外形寸法よりも小さい。これにより、耐リフロー性を向上させ、かつ製造コストを低減することができる。
PCT/JP2007/055474 2007-03-19 2007-03-19 半導体装置及びその製造方法 WO2008114374A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/055474 WO2008114374A1 (ja) 2007-03-19 2007-03-19 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/055474 WO2008114374A1 (ja) 2007-03-19 2007-03-19 半導体装置及びその製造方法

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WO2008114374A1 true WO2008114374A1 (ja) 2008-09-25

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100109148A1 (en) * 2008-10-31 2010-05-06 Renesas Technology Corp. Semiconductor device
JP2021015936A (ja) * 2019-07-16 2021-02-12 Tdk株式会社 電子部品パッケージ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056161A (ja) * 1973-09-14 1975-05-16
JPS59172755A (ja) * 1983-03-22 1984-09-29 Toshiba Corp リ−ドフレ−ム
JPH0316162A (ja) * 1989-03-31 1991-01-24 Hitachi Ltd 半導体装置およびその製造方法
JPH06132444A (ja) * 1992-10-20 1994-05-13 Hitachi Ltd 半導体装置
JPH06216303A (ja) * 1992-03-27 1994-08-05 Hitachi Ltd リードフレーム、その製造方法およびそれを用いた半導体集積回路装置の製造方法
JPH09260575A (ja) * 1996-03-22 1997-10-03 Mitsubishi Electric Corp 半導体装置及びリードフレーム

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5056161A (ja) * 1973-09-14 1975-05-16
JPS59172755A (ja) * 1983-03-22 1984-09-29 Toshiba Corp リ−ドフレ−ム
JPH0316162A (ja) * 1989-03-31 1991-01-24 Hitachi Ltd 半導体装置およびその製造方法
JPH06216303A (ja) * 1992-03-27 1994-08-05 Hitachi Ltd リードフレーム、その製造方法およびそれを用いた半導体集積回路装置の製造方法
JPH06132444A (ja) * 1992-10-20 1994-05-13 Hitachi Ltd 半導体装置
JPH09260575A (ja) * 1996-03-22 1997-10-03 Mitsubishi Electric Corp 半導体装置及びリードフレーム

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100109148A1 (en) * 2008-10-31 2010-05-06 Renesas Technology Corp. Semiconductor device
JP2010109234A (ja) * 2008-10-31 2010-05-13 Renesas Technology Corp 半導体装置
JP2021015936A (ja) * 2019-07-16 2021-02-12 Tdk株式会社 電子部品パッケージ
JP7192688B2 (ja) 2019-07-16 2022-12-20 Tdk株式会社 電子部品パッケージ
US11721618B2 (en) 2019-07-16 2023-08-08 Tdk Corporation Electronic component package

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