WO2008111286A1 - 縦型熱処理用ボートおよび半導体ウエーハの熱処理方法 - Google Patents

縦型熱処理用ボートおよび半導体ウエーハの熱処理方法 Download PDF

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Publication number
WO2008111286A1
WO2008111286A1 PCT/JP2008/000384 JP2008000384W WO2008111286A1 WO 2008111286 A1 WO2008111286 A1 WO 2008111286A1 JP 2008000384 W JP2008000384 W JP 2008000384W WO 2008111286 A1 WO2008111286 A1 WO 2008111286A1
Authority
WO
WIPO (PCT)
Prior art keywords
treating
heat
boat
semiconductor wafer
vertical heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2008/000384
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Takeshi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to KR1020097018865A priority Critical patent/KR101396850B1/ko
Priority to DE112008000667.9T priority patent/DE112008000667B4/de
Priority to US12/449,629 priority patent/US8003918B2/en
Publication of WO2008111286A1 publication Critical patent/WO2008111286A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/127—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by the substrate support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P32/00—Diffusion of dopants within, into or out of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/JP2008/000384 2007-03-12 2008-02-28 縦型熱処理用ボートおよび半導体ウエーハの熱処理方法 Ceased WO2008111286A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097018865A KR101396850B1 (ko) 2007-03-12 2008-02-28 종형 열처리용 보트와, 반도체 웨이퍼의 열처리 방법
DE112008000667.9T DE112008000667B4 (de) 2007-03-12 2008-02-28 Vertikaler Wärmebehandlungsbehälter und Wärmebehandlungsverfahren für Halbleiterwafer
US12/449,629 US8003918B2 (en) 2007-03-12 2008-02-28 Vertical heat treatment boat and heat treatment method for semiconductor wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007061632A JP5061663B2 (ja) 2007-03-12 2007-03-12 縦型熱処理用ボートおよび半導体ウエーハの熱処理方法
JP2007-061632 2007-03-12

Publications (1)

Publication Number Publication Date
WO2008111286A1 true WO2008111286A1 (ja) 2008-09-18

Family

ID=39759230

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000384 Ceased WO2008111286A1 (ja) 2007-03-12 2008-02-28 縦型熱処理用ボートおよび半導体ウエーハの熱処理方法

Country Status (6)

Country Link
US (1) US8003918B2 (https=)
JP (1) JP5061663B2 (https=)
KR (1) KR101396850B1 (https=)
DE (1) DE112008000667B4 (https=)
TW (1) TW200903701A (https=)
WO (1) WO2008111286A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018189870A1 (ja) * 2017-04-13 2018-10-18 株式会社ニコン 情報処理装置、プログラム、作業工程生成装置

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5071217B2 (ja) * 2008-04-17 2012-11-14 信越半導体株式会社 縦型熱処理用ボートおよびそれを用いたシリコンウエーハの熱処理方法
WO2011027823A1 (ja) * 2009-09-02 2011-03-10 本田技研工業株式会社 搬送ラック、金属リングの保持方法及び熱処理方法
US20170110353A1 (en) * 2015-10-20 2017-04-20 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer boat, annealing tool and annealing method
US11521876B2 (en) * 2018-03-07 2022-12-06 Tokyo Electron Limited Horizontal substrate boat
EP4386819A1 (de) 2022-12-15 2024-06-19 Siltronic AG Verfahren zum testen der widerstandsfähigkeit von halbleiterscheiben aus einkristallinem silizium gegen thermisch induzierte versetzungen

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241545A (ja) * 2003-02-05 2004-08-26 Shin Etsu Handotai Co Ltd 縦型熱処理用ボート及び半導体ウエーハの熱処理方法
JP2006128316A (ja) * 2004-10-27 2006-05-18 Shin Etsu Handotai Co Ltd 熱処理用縦型ボートおよび熱処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3328763B2 (ja) * 1995-10-30 2002-09-30 エヌティティエレクトロニクス株式会社 縦型ウエハボートのウエハ支持構造
JP3505934B2 (ja) * 1996-09-10 2004-03-15 東京エレクトロン株式会社 被処理体の支持構造及び熱処理装置
US6077343A (en) * 1998-06-04 2000-06-20 Shin-Etsu Handotai Co., Ltd. Silicon single crystal wafer having few defects wherein nitrogen is doped and a method for producing it
JP3692812B2 (ja) 1998-06-04 2005-09-07 信越半導体株式会社 窒素ドープした低欠陥シリコン単結晶ウエーハおよびその製造方法
JP2000150402A (ja) * 1998-11-09 2000-05-30 Shin Etsu Handotai Co Ltd 基板支持治具
JP2001168175A (ja) * 1999-12-07 2001-06-22 Semiconductor Leading Edge Technologies Inc 熱処理用基板保持具、基板熱処理装置および基板の熱処理方法
JP2002324830A (ja) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp 基板熱処理用保持具、基板熱処理装置、半導体装置の製造方法、基板熱処理用保持具の製造方法及び基板熱処理用保持具の構造決定方法
JP4857517B2 (ja) 2003-11-26 2012-01-18 信越半導体株式会社 アニールウエーハ及びアニールウエーハの製造方法
JP2005203648A (ja) 2004-01-19 2005-07-28 Shin Etsu Handotai Co Ltd シリコンウエーハの熱処理用縦型ボート及び熱処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241545A (ja) * 2003-02-05 2004-08-26 Shin Etsu Handotai Co Ltd 縦型熱処理用ボート及び半導体ウエーハの熱処理方法
JP2006128316A (ja) * 2004-10-27 2006-05-18 Shin Etsu Handotai Co Ltd 熱処理用縦型ボートおよび熱処理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018189870A1 (ja) * 2017-04-13 2018-10-18 株式会社ニコン 情報処理装置、プログラム、作業工程生成装置
JPWO2018189870A1 (ja) * 2017-04-13 2020-02-27 株式会社ニコン 情報処理装置、プログラム、作業工程生成装置、および完成品の作成方法

Also Published As

Publication number Publication date
TW200903701A (en) 2009-01-16
KR101396850B1 (ko) 2014-05-20
KR20100014966A (ko) 2010-02-11
JP2008227056A (ja) 2008-09-25
DE112008000667T5 (de) 2010-01-21
JP5061663B2 (ja) 2012-10-31
US8003918B2 (en) 2011-08-23
DE112008000667B4 (de) 2022-03-17
TWI376011B (https=) 2012-11-01
US20100015817A1 (en) 2010-01-21

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