WO2008108463A1 - 研磨具及び研磨装置 - Google Patents

研磨具及び研磨装置 Download PDF

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Publication number
WO2008108463A1
WO2008108463A1 PCT/JP2008/054181 JP2008054181W WO2008108463A1 WO 2008108463 A1 WO2008108463 A1 WO 2008108463A1 JP 2008054181 W JP2008054181 W JP 2008054181W WO 2008108463 A1 WO2008108463 A1 WO 2008108463A1
Authority
WO
WIPO (PCT)
Prior art keywords
annular
grind stone
polishing
air phase
rotating shaft
Prior art date
Application number
PCT/JP2008/054181
Other languages
English (en)
French (fr)
Inventor
Kazumasa Ohnishi
Original Assignee
Kazumasa Ohnishi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kazumasa Ohnishi filed Critical Kazumasa Ohnishi
Priority to JP2009502631A priority Critical patent/JPWO2008108463A1/ja
Priority to US12/530,041 priority patent/US20100087125A1/en
Priority to CN200880014504A priority patent/CN101674919A/zh
Publication of WO2008108463A1 publication Critical patent/WO2008108463A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/16—Bushings; Mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/16—Bushings; Mountings

Abstract

　研磨対象物（１１）の支持テーブル（１２）；支持テーブルの上方に垂直に配置された回転軸（１３ａ）；そして回転軸に接続されている、環状超音波振動子（３１ａ、３１ｂ）を固定した砥石保持部材（３２）と、砥石保持部材の周縁部の下端に備えられた環状の砥石（３３）とを含む研磨具（４０）から構成され、前記の砥石保持部材の環状超音波振動子の固定位置と回転軸との接続位置との間の位置に、環状に配置した非連続の空気相を含む環状空気相含有帯域を多重に形成してなる環状空気相含有領域（３６）が設けられていて、この環状空気相含有領域により、環状超音波振動子から発生される超音波振動が砥石保持部材の環状空気相含有領域よりも回転軸との接続位置の側の領域に直線的に伝達されないようにされていることを特徴とする研磨装置（１０）は、超音波振動子から発生される超音波振動を砥石に効率良く付与することができるため、研磨対象物を高い精度で研磨することができる。
PCT/JP2008/054181 2007-03-07 2008-03-07 研磨具及び研磨装置 WO2008108463A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009502631A JPWO2008108463A1 (ja) 2007-03-07 2008-03-07 研磨具及び研磨装置
US12/530,041 US20100087125A1 (en) 2007-03-07 2008-03-07 Polishing tool and polishing device
CN200880014504A CN101674919A (zh) 2007-03-07 2008-03-07 研磨工具及研磨装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007098874 2007-03-07
JP2007-098874 2007-03-07
JP2007137186 2007-04-23
JP2007-137186 2007-04-23

Publications (1)

Publication Number Publication Date
WO2008108463A1 true WO2008108463A1 (ja) 2008-09-12

Family

ID=39738328

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/054181 WO2008108463A1 (ja) 2007-03-07 2008-03-07 研磨具及び研磨装置

Country Status (4)

Country Link
US (1) US20100087125A1 (ja)
JP (1) JPWO2008108463A1 (ja)
CN (1) CN101674919A (ja)
WO (1) WO2008108463A1 (ja)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010058252A (ja) * 2008-09-08 2010-03-18 Disco Abrasive Syst Ltd 研削ホイール
JP2010194649A (ja) * 2009-02-24 2010-09-09 Disco Abrasive Syst Ltd 研削ホイール
JP2010201604A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd 研削ホイール
JP2010201603A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd 研削ホイール
JP2011056588A (ja) * 2009-09-07 2011-03-24 Disco Abrasive Syst Ltd 研削ホイール
JP2012121118A (ja) * 2010-12-10 2012-06-28 Disco Corp 研削装置
JP2012125850A (ja) * 2010-12-13 2012-07-05 Disco Corp 研削ホイール
JP2013184256A (ja) * 2012-03-08 2013-09-19 Disco Corp 研磨定盤およびラッピング装置
KR20180031574A (ko) * 2016-09-20 2018-03-28 가부시기가이샤 디스코 연삭 휠 및 연삭 장치
JP2019025628A (ja) * 2017-08-03 2019-02-21 株式会社キラ・コーポレーション 超音波振動加工装置

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* Cited by examiner, † Cited by third party
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WO2006137453A1 (ja) * 2005-06-21 2006-12-28 Kazumasa Ohnishi 超音波振動を利用する研磨装置
EP2486602B1 (de) * 2009-10-08 2013-01-16 Komax Holding AG Vorrichtung und Verfahren zum Entschichten von Solarmodulen
JP5443960B2 (ja) * 2009-11-27 2014-03-19 有限会社Ｕｗａｖｅ 研磨具
CN101837569A (zh) * 2010-01-12 2010-09-22 武汉万邦激光金刚石工具有限公司 分体式金刚石磨盘快装结构
JP2012169024A (ja) * 2011-02-16 2012-09-06 Showa Denko Kk 磁気記録媒体用ガラス基板の製造方法
JP5394427B2 (ja) * 2011-03-29 2014-01-22 コマツＮｔｃ株式会社 砥石台金、取外し治具、研削盤及び砥石台金の取外し方法
CN102179733A (zh) * 2011-04-11 2011-09-14 辽宁工业大学 圆环形超声抛光振子
WO2014063075A1 (en) * 2012-10-19 2014-04-24 Motion Concepts, LLC Setup platform apparatus for bench and pedestal grinders
CN102909648A (zh) * 2012-11-01 2013-02-06 昆山市大金机械设备厂 自动研磨装置
CN103737471B (zh) * 2013-12-27 2016-07-13 湖南宇晶机器股份有限公司 超薄、易脆性工件的抛光方法及抛光装置
JP2015223691A (ja) * 2014-05-30 2015-12-14 天龍製鋸株式会社 カップホイール
DE102014223544A1 (de) * 2014-11-18 2016-05-19 Sauer Gmbh Spindelvorrichtung und Werkzeugmaschine mit Spindelvorrichtung
JP6475518B2 (ja) * 2015-03-03 2019-02-27 株式会社ディスコ ウエーハの加工方法
CN104889881B (zh) * 2015-05-27 2017-07-18 厦门大学 一种振动复合柔性磨抛工具
CN109202756B (zh) * 2018-11-15 2024-04-02 珠海市世创金刚石工具制造有限公司 错齿金刚石磨轮
CA3054036A1 (en) * 2018-12-28 2020-06-28 Virtual Machines Inc. Method and system for producing abrasive products
CN110125801A (zh) * 2019-05-21 2019-08-16 清博(昆山)自动化科技有限公司 一种数字化调速控制的气动磨抛装置及其工作方法
CN110355621B (zh) * 2019-07-17 2021-03-16 大连理工大学 一种用于超声加工的组合砂轮及其设计方法
CN112276785B (zh) * 2020-10-16 2022-07-05 广州大学 一种双行波作动轴承滚子超声研磨装置
CN112846972B (zh) * 2021-01-11 2022-10-21 烟台鑫硕机械有限公司 一种立式圆台平面磨床砂轮紧固装置
CN112904719B (zh) * 2021-01-15 2022-08-02 哈尔滨工程大学 一种适用于水下机器人位置环形区域跟踪控制方法
CN115383520A (zh) * 2022-08-30 2022-11-25 山东大学 一种滚动轴承滚道内壁微织构加工装置及方法

Citations (6)

* Cited by examiner, † Cited by third party
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JPH05200659A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 超音波研磨装置
JPH09291557A (ja) * 1996-04-24 1997-11-11 Shimizu Corp 地中防振壁
JPH10156706A (ja) * 1996-11-27 1998-06-16 Speedfam Co Ltd 研磨装置及び研磨方法
JP2004293433A (ja) * 2003-03-27 2004-10-21 Toyoda Gosei Co Ltd 吸気装置およびその製造方法
JP2006184079A (ja) * 2004-12-27 2006-07-13 Tohoku Univ 原子間力顕微鏡
WO2006137453A1 (ja) * 2005-06-21 2006-12-28 Kazumasa Ohnishi 超音波振動を利用する研磨装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05200659A (ja) * 1992-01-24 1993-08-10 Olympus Optical Co Ltd 超音波研磨装置
JPH09291557A (ja) * 1996-04-24 1997-11-11 Shimizu Corp 地中防振壁
JPH10156706A (ja) * 1996-11-27 1998-06-16 Speedfam Co Ltd 研磨装置及び研磨方法
JP2004293433A (ja) * 2003-03-27 2004-10-21 Toyoda Gosei Co Ltd 吸気装置およびその製造方法
JP2006184079A (ja) * 2004-12-27 2006-07-13 Tohoku Univ 原子間力顕微鏡
WO2006137453A1 (ja) * 2005-06-21 2006-12-28 Kazumasa Ohnishi 超音波振動を利用する研磨装置

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010058252A (ja) * 2008-09-08 2010-03-18 Disco Abrasive Syst Ltd 研削ホイール
JP2010194649A (ja) * 2009-02-24 2010-09-09 Disco Abrasive Syst Ltd 研削ホイール
JP2010201604A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd 研削ホイール
JP2010201603A (ja) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd 研削ホイール
JP2011056588A (ja) * 2009-09-07 2011-03-24 Disco Abrasive Syst Ltd 研削ホイール
JP2012121118A (ja) * 2010-12-10 2012-06-28 Disco Corp 研削装置
JP2012125850A (ja) * 2010-12-13 2012-07-05 Disco Corp 研削ホイール
JP2013184256A (ja) * 2012-03-08 2013-09-19 Disco Corp 研磨定盤およびラッピング装置
KR20180031574A (ko) * 2016-09-20 2018-03-28 가부시기가이샤 디스코 연삭 휠 및 연삭 장치
KR102260927B1 (ko) * 2016-09-20 2021-06-03 가부시기가이샤 디스코 연삭 휠 및 연삭 장치
JP2019025628A (ja) * 2017-08-03 2019-02-21 株式会社キラ・コーポレーション 超音波振動加工装置
JP6995306B2 (ja) 2017-08-03 2022-01-14 株式会社キラ・コーポレーション 超音波振動加工装置

Also Published As

Publication number Publication date
US20100087125A1 (en) 2010-04-08
JPWO2008108463A1 (ja) 2010-06-17
CN101674919A (zh) 2010-03-17

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