TW201130029A - Methods and devices for enhancing chemical mechanical polishing processes - Google Patents

Methods and devices for enhancing chemical mechanical polishing processes

Info

Publication number
TW201130029A
TW201130029A TW99146262A TW99146262A TW201130029A TW 201130029 A TW201130029 A TW 201130029A TW 99146262 A TW99146262 A TW 99146262A TW 99146262 A TW99146262 A TW 99146262A TW 201130029 A TW201130029 A TW 201130029A
Authority
TW
Taiwan
Prior art keywords
vibrating
contact interface
wafer
cmp pad
cmp
Prior art date
Application number
TW99146262A
Other languages
Chinese (zh)
Inventor
jian-min Song
Original Assignee
jian-min Song
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/651,289 external-priority patent/US20100173567A1/en
Application filed by jian-min Song filed Critical jian-min Song
Publication of TW201130029A publication Critical patent/TW201130029A/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The present invention discloses methods and systems for increasing polishing performance of a CMP process. In one aspect, for example, a method of increasing polishing performance of a CMP process includes vibrating a contact interface between a CMP pad and a wafer during a CMP process, such that oscillations between the CMP pad and the wafer occurs in a direction substantially parallel to a working surface of the CMP pad. In one specific aspect, vibrating the contact interface includes vibrating the contact interface in a direction substantially parallel to the contact interface. The vibrating can include vibrating the CMP pad, vibrating the wafer, or vibrating the CMP pad and the wafer. Such vibrations can allow the contact pressure at the contact interface to be decreased as compared to a contact interface that is not vibrated to minimize damage to the CMP pad or the wafer.
TW99146262A 2009-12-31 2010-12-28 Methods and devices for enhancing chemical mechanical polishing processes TW201130029A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/651,289 US20100173567A1 (en) 2006-02-06 2009-12-31 Methods and Devices for Enhancing Chemical Mechanical Polishing Processes

Publications (1)

Publication Number Publication Date
TW201130029A true TW201130029A (en) 2011-09-01

Family

ID=44566122

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99146262A TW201130029A (en) 2009-12-31 2010-12-28 Methods and devices for enhancing chemical mechanical polishing processes

Country Status (2)

Country Link
CN (1) CN102179732A (en)
TW (1) TW201130029A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107363649A (en) * 2017-08-08 2017-11-21 北京交通大学 A kind of electrostriction ultrasonic vibration burnishing device
CN112059897B (en) * 2020-08-03 2022-04-12 北京烁科精微电子装备有限公司 Polishing device
CN114851057A (en) * 2021-02-04 2022-08-05 中国科学院微电子研究所 Wafer polishing device and polishing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5245790A (en) * 1992-02-14 1993-09-21 Lsi Logic Corporation Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers
JP3466374B2 (en) * 1995-04-26 2003-11-10 富士通株式会社 Polishing apparatus and polishing method
TW320591B (en) * 1995-04-26 1997-11-21 Fujitsu Ltd
JPH11291167A (en) * 1998-04-07 1999-10-26 Nikon Corp Polishing device and polishing method
JP2000218514A (en) * 1999-02-02 2000-08-08 Nikon Corp Polisher and polishing method
US6913528B2 (en) * 2001-03-19 2005-07-05 Speedfam-Ipec Corporation Low amplitude, high speed polisher and method

Also Published As

Publication number Publication date
CN102179732A (en) 2011-09-14

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