TW201130029A - Methods and devices for enhancing chemical mechanical polishing processes - Google Patents
Methods and devices for enhancing chemical mechanical polishing processesInfo
- Publication number
- TW201130029A TW201130029A TW99146262A TW99146262A TW201130029A TW 201130029 A TW201130029 A TW 201130029A TW 99146262 A TW99146262 A TW 99146262A TW 99146262 A TW99146262 A TW 99146262A TW 201130029 A TW201130029 A TW 201130029A
- Authority
- TW
- Taiwan
- Prior art keywords
- vibrating
- contact interface
- wafer
- cmp pad
- cmp
- Prior art date
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention discloses methods and systems for increasing polishing performance of a CMP process. In one aspect, for example, a method of increasing polishing performance of a CMP process includes vibrating a contact interface between a CMP pad and a wafer during a CMP process, such that oscillations between the CMP pad and the wafer occurs in a direction substantially parallel to a working surface of the CMP pad. In one specific aspect, vibrating the contact interface includes vibrating the contact interface in a direction substantially parallel to the contact interface. The vibrating can include vibrating the CMP pad, vibrating the wafer, or vibrating the CMP pad and the wafer. Such vibrations can allow the contact pressure at the contact interface to be decreased as compared to a contact interface that is not vibrated to minimize damage to the CMP pad or the wafer.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/651,289 US20100173567A1 (en) | 2006-02-06 | 2009-12-31 | Methods and Devices for Enhancing Chemical Mechanical Polishing Processes |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201130029A true TW201130029A (en) | 2011-09-01 |
Family
ID=44566122
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW99146262A TW201130029A (en) | 2009-12-31 | 2010-12-28 | Methods and devices for enhancing chemical mechanical polishing processes |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN102179732A (en) |
TW (1) | TW201130029A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107363649A (en) * | 2017-08-08 | 2017-11-21 | 北京交通大学 | A kind of electrostriction ultrasonic vibration burnishing device |
CN112059897B (en) * | 2020-08-03 | 2022-04-12 | 北京烁科精微电子装备有限公司 | Polishing device |
CN114851057A (en) * | 2021-02-04 | 2022-08-05 | 中国科学院微电子研究所 | Wafer polishing device and polishing method |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5245790A (en) * | 1992-02-14 | 1993-09-21 | Lsi Logic Corporation | Ultrasonic energy enhanced chemi-mechanical polishing of silicon wafers |
JP3466374B2 (en) * | 1995-04-26 | 2003-11-10 | 富士通株式会社 | Polishing apparatus and polishing method |
TW320591B (en) * | 1995-04-26 | 1997-11-21 | Fujitsu Ltd | |
JPH11291167A (en) * | 1998-04-07 | 1999-10-26 | Nikon Corp | Polishing device and polishing method |
JP2000218514A (en) * | 1999-02-02 | 2000-08-08 | Nikon Corp | Polisher and polishing method |
US6913528B2 (en) * | 2001-03-19 | 2005-07-05 | Speedfam-Ipec Corporation | Low amplitude, high speed polisher and method |
-
2010
- 2010-12-28 TW TW99146262A patent/TW201130029A/en unknown
- 2010-12-29 CN CN2010106110100A patent/CN102179732A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN102179732A (en) | 2011-09-14 |
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