WO2008108264A1 - 半導体装置およびその製造方法ならびに磁気メモリ素子 - Google Patents

半導体装置およびその製造方法ならびに磁気メモリ素子 Download PDF

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Publication number
WO2008108264A1
WO2008108264A1 PCT/JP2008/053496 JP2008053496W WO2008108264A1 WO 2008108264 A1 WO2008108264 A1 WO 2008108264A1 JP 2008053496 W JP2008053496 W JP 2008053496W WO 2008108264 A1 WO2008108264 A1 WO 2008108264A1
Authority
WO
WIPO (PCT)
Prior art keywords
tmr
mram
magnetic memory
semiconductor device
manufacturing
Prior art date
Application number
PCT/JP2008/053496
Other languages
English (en)
French (fr)
Inventor
Tsuyoshi Koga
Shuichi Ueno
Hideto Hidaka
Tomoya Kawagoe
Original Assignee
Renesas Technology Corp.
Grandis, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp., Grandis, Inc. filed Critical Renesas Technology Corp.
Publication of WO2008108264A1 publication Critical patent/WO2008108264A1/ja

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1659Cell access
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/165Auxiliary circuits
    • G11C11/1675Writing or programming circuits or methods
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B61/00Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
    • H10B61/20Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors
    • H10B61/22Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices comprising components having three or more electrodes, e.g. transistors of the field-effect transistor [FET] type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/10Magnetoresistive devices

Abstract

 半導体装置は、フリー層MFを含む磁気トンネル接合TMRを有し、TMRの近傍に流れる電流が発生する磁場によって、フリー層MFの磁化方向が制御される標準MRAMと、フリー層MFを含むTMRを有し、TMRに供給されるスピン注入電流により、フリー層MFの磁化方向が制御されるSTT-MRAMとを備え、標準MRAMおよびSTT-MRAMが同一基板上に搭載される。  こうした構成により、種類の異なる磁気メモリ素子の個々の特性を有効に活用でき、素子特性が多様な磁気メモリ素子を実現できる。
PCT/JP2008/053496 2007-03-02 2008-02-28 半導体装置およびその製造方法ならびに磁気メモリ素子 WO2008108264A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-052952 2007-03-02
JP2007052952A JP2008218649A (ja) 2007-03-02 2007-03-02 半導体装置およびその製造方法ならびに磁気メモリ素子

Publications (1)

Publication Number Publication Date
WO2008108264A1 true WO2008108264A1 (ja) 2008-09-12

Family

ID=39738147

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/053496 WO2008108264A1 (ja) 2007-03-02 2008-02-28 半導体装置およびその製造方法ならびに磁気メモリ素子

Country Status (3)

Country Link
JP (1) JP2008218649A (ja)
TW (1) TW200845442A (ja)
WO (1) WO2008108264A1 (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010039458A1 (en) * 2008-09-23 2010-04-08 Qualcomm Incorporated Low power electronic system using non-volatile magnetic memory
CN102623483A (zh) * 2011-01-27 2012-08-01 瑞萨电子株式会社 半导体器件
JP2014112691A (ja) * 2013-12-26 2014-06-19 Renesas Electronics Corp 半導体装置の製造方法
TWI451411B (zh) * 2008-09-30 2014-09-01 Micron Technology Inc 用於自旋力矩轉移磁性隨機存取記憶體或其他自旋電子應用之自旋電流產生器
US10446211B2 (en) 2017-09-20 2019-10-15 Toshiba Memory Corporation Semiconductor storage device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5488833B2 (ja) * 2008-03-07 2014-05-14 日本電気株式会社 Mram混載システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004023062A (ja) * 2002-06-20 2004-01-22 Nec Electronics Corp 半導体装置とその製造方法
JP2005101123A (ja) * 2003-09-24 2005-04-14 Sony Corp 磁気記憶装置、磁気記憶装置の書き込み方法および磁気記憶装置の製造方法
JP2005277147A (ja) * 2004-03-25 2005-10-06 Tohoku Univ 磁気記録素子の記録方法及び磁気記録素子アレイ
JP2006080287A (ja) * 2004-09-09 2006-03-23 Toshiba Corp 磁気ランダムアクセスメモリ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004023062A (ja) * 2002-06-20 2004-01-22 Nec Electronics Corp 半導体装置とその製造方法
JP2005101123A (ja) * 2003-09-24 2005-04-14 Sony Corp 磁気記憶装置、磁気記憶装置の書き込み方法および磁気記憶装置の製造方法
JP2005277147A (ja) * 2004-03-25 2005-10-06 Tohoku Univ 磁気記録素子の記録方法及び磁気記録素子アレイ
JP2006080287A (ja) * 2004-09-09 2006-03-23 Toshiba Corp 磁気ランダムアクセスメモリ

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010039458A1 (en) * 2008-09-23 2010-04-08 Qualcomm Incorporated Low power electronic system using non-volatile magnetic memory
US8719610B2 (en) 2008-09-23 2014-05-06 Qualcomm Incorporated Low power electronic system architecture using non-volatile magnetic memory
TWI451411B (zh) * 2008-09-30 2014-09-01 Micron Technology Inc 用於自旋力矩轉移磁性隨機存取記憶體或其他自旋電子應用之自旋電流產生器
US8885398B2 (en) 2008-09-30 2014-11-11 Micron Technology, Inc. Spin current generator for STT-MRAM or other spintronics applications
CN102623483A (zh) * 2011-01-27 2012-08-01 瑞萨电子株式会社 半导体器件
CN102623483B (zh) * 2011-01-27 2016-06-01 瑞萨电子株式会社 半导体器件
JP2014112691A (ja) * 2013-12-26 2014-06-19 Renesas Electronics Corp 半導体装置の製造方法
US10446211B2 (en) 2017-09-20 2019-10-15 Toshiba Memory Corporation Semiconductor storage device

Also Published As

Publication number Publication date
TW200845442A (en) 2008-11-16
JP2008218649A (ja) 2008-09-18

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