WO2008099732A1 - 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法 - Google Patents

硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法 Download PDF

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Publication number
WO2008099732A1
WO2008099732A1 PCT/JP2008/051944 JP2008051944W WO2008099732A1 WO 2008099732 A1 WO2008099732 A1 WO 2008099732A1 JP 2008051944 W JP2008051944 W JP 2008051944W WO 2008099732 A1 WO2008099732 A1 WO 2008099732A1
Authority
WO
WIPO (PCT)
Prior art keywords
composition
film
thermosetting
cured film
film pattern
Prior art date
Application number
PCT/JP2008/051944
Other languages
English (en)
French (fr)
Inventor
Takenori Kakutani
Hidekazu Miyabe
Original Assignee
Taiyo Ink Mfg. Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg. Co., Ltd. filed Critical Taiyo Ink Mfg. Co., Ltd.
Priority to EP08710841A priority Critical patent/EP2116902A4/en
Priority to CN2008800051203A priority patent/CN101611353B/zh
Priority to JP2008558058A priority patent/JP5219846B2/ja
Publication of WO2008099732A1 publication Critical patent/WO2008099732A1/ja
Priority to US12/539,610 priority patent/US20090306243A1/en

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan

Abstract

　主剤と硬化剤を混合した後のポットライフ（可使時間）を長くでき、あるいは一液としての保存安定性に優れたものとするために、硬化皮膜パターン形成用組成物は、熱硬化触媒を含有しないアルカリ現像型の光硬化性・熱硬化性組成物と、窒素含有複素環式化合物からなる熱硬化反応促進用の塩基性硬化触媒の水溶液からなる現像液との組合せからなる。好適には、上記塩基性硬化触媒は、アミジン部位を有する複素環式化合物である。上記光硬化性・熱硬化性組成物の皮膜を活性エネルギー線の照射により選択的に露光した後、未露光部を上記現像液で現像して除去する。この際、上記塩基性硬化触媒が光硬化した塗膜に浸透し、ドーピングされることにより、現像パターニング性に加えて熱硬化性にも優れたものとなる。
PCT/JP2008/051944 2007-02-16 2008-02-06 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法 WO2008099732A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP08710841A EP2116902A4 (en) 2007-02-16 2008-02-06 COMPOSITION FOR MANUFACTURING HARDENED FILM PATTERN AND METHOD FOR MANUFACTURING HARDENED FILM PATTERN USING THE SAME
CN2008800051203A CN101611353B (zh) 2007-02-16 2008-02-06 固化皮膜图案形成用组合物及使用其的固化皮膜图案的制作方法
JP2008558058A JP5219846B2 (ja) 2007-02-16 2008-02-06 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法
US12/539,610 US20090306243A1 (en) 2007-02-16 2009-08-12 Composition for forming cured film pattern and method for producing cured film pattern by using the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-036764 2007-02-16
JP2007036764 2007-02-16

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/539,610 Continuation US20090306243A1 (en) 2007-02-16 2009-08-12 Composition for forming cured film pattern and method for producing cured film pattern by using the same

Publications (1)

Publication Number Publication Date
WO2008099732A1 true WO2008099732A1 (ja) 2008-08-21

Family

ID=39689970

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/051944 WO2008099732A1 (ja) 2007-02-16 2008-02-06 硬化皮膜パターン形成用組成物及びそれを用いた硬化皮膜パターン作製方法

Country Status (7)

Country Link
US (1) US20090306243A1 (ja)
EP (1) EP2116902A4 (ja)
JP (1) JP5219846B2 (ja)
KR (1) KR20100014786A (ja)
CN (1) CN101611353B (ja)
TW (1) TWI414907B (ja)
WO (1) WO2008099732A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014002294A1 (ja) * 2012-06-29 2014-01-03 太陽油墨（蘇州）有限公司 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

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JP5505066B2 (ja) * 2010-04-28 2014-05-28 Ｊｓｒ株式会社 感放射線性樹脂組成物、表示素子の層間絶縁膜、保護膜及びスペーサーならびにそれらの形成方法
CN102375340A (zh) * 2010-08-10 2012-03-14 Jsr株式会社 放射线敏感性树脂组合物、固化膜、固化膜的形成方法、滤色器以及滤色器的形成方法
JP5724681B2 (ja) * 2010-08-10 2015-05-27 Jsr株式会社 感放射線性樹脂組成物、硬化膜、硬化膜の形成方法、カラーフィルタ及びカラーフィルタの形成方法
US9596754B2 (en) * 2011-12-22 2017-03-14 Taiyo Ink Mfg. Co., Ltd. Dry film, printed wiring board using same, method for producing printed wiring board, and flip chip mounting substrate
JP6065845B2 (ja) * 2012-01-31 2017-01-25 三菱瓦斯化学株式会社 プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
US10394126B2 (en) 2015-07-17 2019-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Photolithography process and materials
KR102042300B1 (ko) * 2015-09-24 2019-11-07 주식회사 엘지화학 유기태양전지의 제조방법 및 이를 이용하여 제조된 유기태양전지
WO2018106088A1 (ko) * 2016-12-09 2018-06-14 주식회사 엘지화학 밀봉재 조성물
CN112812013A (zh) * 2020-12-30 2021-05-18 安徽熙泰智能科技有限公司 一种用于引线键合保护胶的化合物及其制备方法和快干型引线键合保护胶

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Publication number Priority date Publication date Assignee Title
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JPWO2014002294A1 (ja) * 2012-06-29 2016-05-30 太陽油墨（蘇州）有限公司 アルカリ現像型感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板

Also Published As

Publication number Publication date
JPWO2008099732A1 (ja) 2010-05-27
US20090306243A1 (en) 2009-12-10
JP5219846B2 (ja) 2013-06-26
TW200848953A (en) 2008-12-16
EP2116902A4 (en) 2011-02-02
KR20100014786A (ko) 2010-02-11
TWI414907B (zh) 2013-11-11
CN101611353B (zh) 2012-04-04
CN101611353A (zh) 2009-12-23
EP2116902A1 (en) 2009-11-11

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