WO2008098272A1 - Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte - Google Patents

Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte Download PDF

Info

Publication number
WO2008098272A1
WO2008098272A1 PCT/AT2008/000030 AT2008000030W WO2008098272A1 WO 2008098272 A1 WO2008098272 A1 WO 2008098272A1 AT 2008000030 W AT2008000030 W AT 2008000030W WO 2008098272 A1 WO2008098272 A1 WO 2008098272A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
rigid
region
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/AT2008/000030
Other languages
German (de)
English (en)
French (fr)
Other versions
WO2008098272A8 (de
Inventor
Johannes Stahr
Markus Leitgeb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&S Austria Technologie und Systemtechnik AG
Original Assignee
AT&S Austria Technologie und Systemtechnik AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&S Austria Technologie und Systemtechnik AG filed Critical AT&S Austria Technologie und Systemtechnik AG
Priority to KR1020097017101A priority Critical patent/KR20090109109A/ko
Priority to CN2008800117111A priority patent/CN101658082B/zh
Priority to JP2009549743A priority patent/JP5327545B2/ja
Priority to EP08700296.0A priority patent/EP2119330B1/de
Priority to US12/449,608 priority patent/US8500938B2/en
Publication of WO2008098272A1 publication Critical patent/WO2008098272A1/de
Publication of WO2008098272A8 publication Critical patent/WO2008098272A8/de
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly

Definitions

  • the present invention relates to a method for producing a rigid-flexible printed circuit board, wherein at least one rigid region of a printed circuit board is connected via a layer of non-conductive material or a dielectric layer to at least one flexible region of the printed circuit board, wherein after connecting the at least one rigid and flexible region of the printed circuit board is cut through the rigid region of the printed circuit board and a connection is made between the mutually separate, rigid partial regions of the printed circuit board via the flexible region connected thereto.
  • the invention further relates to a rigid-flexible printed circuit board, wherein at least one rigid region of a printed circuit board is connected via a layer of non-conductive material or a dielectric layer with at least one flexible region of the printed circuit board, wherein after connecting the at least one rigid and flexible region of the printed circuit board, the rigid region of the printed circuit board can be severed and a connection between the separate, rigid partial regions can be produced via the flexible region connected thereto.
  • connection points of active components to components of a printed circuit board
  • reduction in the size simultaneously providing a reduction in the distance between such connection points is.
  • HDI high density interconnects
  • the present invention aims to develop both a method of the type mentioned above and a printed circuit board of the type mentioned in that rigid-flexible printed circuit boards for highly complex electronic components can be produced in a simplified process, moreover aimed at In contrast to known embodiments, layers of non-conductive material or dielectric layers are formed thinner between individual, rigid and flexible regions of the printed circuit board. Furthermore, the aim is to improve the processing or processing in further steps, for example, by increased registration accuracy.
  • a method of the type initially mentioned is essentially characterized in that the connection between the at least one rigid region of the printed circuit board and the at least one flexible region of the printed circuit board is made before the rigid region is cut through a bond.
  • an adhesive for producing a connection between at least one rigid and at least one flexible region of the printed circuit board according to the invention makes it possible to find the way with thinner layer thicknesses for the non-conductive material or the dielectric layer, so that in the Sense of further miniaturization and reduction of the total thickness of the present invention, rigid-flexible circuit board further advantages can be achieved.
  • the adhesive for producing the bond between the at least one rigid and the at least one flexible portion of the rigid-flexible printed circuit board to be produced according to the invention it is proposed according to a preferred embodiment that the bonding between the rigid and flexible region the printed circuit board is made over a printable adhesive.
  • a printable adhesive can be applied correspondingly accurately and with a desired low layer thickness on the subsequently to be connected to a flexible region of the circuit board, rigid area.
  • the Layer thickness of the bond with less than 50 microns, especially less than 40 microns, is selected.
  • a single- or multi-component adhesive is used, which is thermally crosslinking curable.
  • the adhesive is selected based on epoxides, polyimides, phenolic resins or mixtures thereof, optionally in combination with curing systems based on hydroxyl, thiol or amino functional crosslinking groups.
  • the inorganic / inorganic adhesive be / or organic fillers is provided, as corresponds to a further preferred embodiment of the method according to the invention.
  • the adhesive be applied by screen printing, stencil printing, spread coating, roll coating or spin coating.
  • Such printing methods are known per se and can, in particular taking into account the material properties of the adhesive used to form the bond according to the invention as well as the achievable layer thicknesses and / or shaping of the connecting layer of a non-conductive material or dielectric between the rigid region of the circuit board and be selected according to the flexible area of the circuit board.
  • the adhesive be selectively in the region of the subsequent separation of the rigid Area of the circuit board to form the separate, rigid portions is applied.
  • an adhesive layer is applied which is subjected to complete curing, after which a further adhesive layer adjoins the partially applied and fully cured adhesive layer the rigid region of the circuit board is applied, which is subsequently only partially cured, and that after the partial hardening of the second or adjacent adhesive layer, the rigid region of the circuit board with the flexible region of the circuit board with the interposition of the adhesive layer by a subsequent, complete curing the second adhesive layer is connected.
  • the applied in the subsequent separation in a first step adhesive layer is completely cured, a connection with the thus to be connected, flexible area of the circuit board is avoided so that in the subsequent step of severing the rigid portion of the circuit board without excessively accurate setting
  • the depth of a severing the immediately connected to the removed portion of the rigid portion of the circuit board, applied in a first step and completely cured adhesive layer is removed
  • it must be ensured for the subsequent transection only ensure that the cutting tool reliably completely rigid Area of ladder plate severed, with a correspondingly accurate adjustment of the cutting or cutting depth matched to the thickness of the adhesive layer beyond not mandatory.
  • a rigid-flexible printed circuit board of the type mentioned above is essentially characterized in that a connection between the at least one rigid portion of the printed circuit board and the at least one flexible region of the printed circuit board is formed by at least one adhesive layer.
  • connection by providing an adhesive layer for connection between at least one rigid area of the printed circuit board and a flexible area of the printed circuit board with a lower layer thickness, it is possible to make use of the connection, wherein, moreover, a registering accuracy can be achieved by providing an adhesive bond and further Sequence with simplified process steps, for example to form the severing of the rigid area of the circuit board to form a bend under the mediation of the flexible area of the circuit board as well as to provide appropriate connections between individual, conductive layers of the circuit board, possibly also between the flexible and the rigid area the same can be found.
  • a completely hardened adhesive layer is provided, to which a partially cured, second adhesive layer adjoins, which adjoins with the the rigid region of the circuit board fixable, flexible region of the circuit board is connectable.
  • FIG. 1 shows a schematic section through an embodiment of a rigid part of an inventively produced, rigid-flexible circuit board.
  • 2 shows a schematic section through an embodiment of a flexible region of a rigid-flexible printed circuit board to be produced according to the invention;
  • 3 shows individual method steps of the method according to the invention for producing a rigid-flexible printed circuit board according to the invention, wherein in FIG. 3a an application of an adhesive layer in the region of a subsequent severing of the rigid area of the printed circuit board is indicated;
  • FIG. 3b shows the formation of milling edges in the region of the subsequent severing of the rigid region;
  • FIG. Figure 3c shows the application of a second layer of adhesive adjacent to the first layer of adhesive in the area of subsequent severing of the rigid area of the circuit board;
  • FIG. 3d shows the connection of the rigid area of the printed circuit board to the flexible area of the printed circuit board; and FIG. 3e shows the severing of the rigid region of the printed circuit board to form a bending point after the connection between the rigid region and the flexible region of the rigid-flexible printed circuit board produced according to the invention has been made.
  • FIG. 1 shows a schematic representation of a rigid region 1 of a rigid-flexible printed circuit board to be produced subsequently, wherein the rigid region 1 is of multilayer design.
  • Hiebei copper layers 2 are each separated by a prepreg layer 3 and a core 4 from each other. Connections between individual copper layers 2 are indicated by microvia 5 or through openings 6.
  • FIG. 2 shows a schematic section through a flexible region 7 of a rigid-flexible printed circuit board to be produced, with a copper layer 9 and solder masks 10 and 11 being indicated in addition to a flexible laminate layer 8.
  • a first adhesive layer 13 is selectively applied on the rigid region of the rigid-flexible printed circuit board which is again designated 1 in a region of a subsequent severing thereof, as can be seen in particular from FIG. which is subsequently fully cured .
  • milling edges 14 takes place in the region of the subsequently produced severing of the rigid region 1 of the printed circuit board, the milling edges not only the adhesive layer 13 but also adjacent thereto Penetrate layers of the rigid area 1 of the printed circuit board.
  • a second adhesive layer 15 is then applied to the rigid region 1 of the printed circuit board in essentially the same layer thickness as the adhesive layer 13, in contrast to the complete curing of the adhesive layer 13, the adhesive layer 15 is only partially cured.
  • the rigid region 1 of the printed circuit board is connected to the flexible region 7 of the printed circuit board by the intermediary of the adhesive layer 15, this being carried out by likewise complete curing of the adhesive layer 15.
  • solder masks 19 on the rigid subregions 17 and 18, but also, for example, a plated-through connection between the conductive copper layer 9 of the flexible portion 7 of the manufactured, rigid-flexible Printed circuit board and a first copper layer 2 of the rigid portions 17 and 18, as indicated at 20.
  • an identical adhesive is used, for example, for the adhesive layers 13 and 15, a subsequent connection to the flexible region 7 of the printed circuit board to be fixed thereto being avoided by premature, complete curing of the adhesive layer 13.
  • a substantially identical adhesive for the adhesive layers 13 and 15 and a different pre-treatment before fixing the flexible region 7 of the printed circuit board can of course also be a use of different adhesives for the preparation of the adhesive layers 13 and 15 are provided, wherein a subsequent, simple formation of a cut 16 in the rigid portion 1 of the circuit board is to be taken to ensure that as in the embodiment shown in FIG. 3 a weaker and reasonably completely lacking adherence to the flexible region 7 in the subsequent determination for easier removal of the Adhesive in the region of the cut 16 to be produced is achievable.
  • the adhesive layers 13 and 15 may in this case be applied, in particular depending on the adhesive material used, for example by screen printing, stencil printing, spread coating, roll coating or spin coating in a correspondingly desired, small thickness and with the required accuracy for subsequent registration or alignment ,
  • the extents can be found with a correspondingly low layer thickness, in particular less than 50 ⁇ m, particularly preferably less than 40 ⁇ m.
  • the process can be found with simple methods for applying the adhesive layer or adhesive layers, wherein such adhesive layers can also be applied with corresponding precision and high precision, so that additional processing steps, for example punching steps for preparing corresponding sheet-like films according to the State of the art, omitted can.
  • additional processing steps for example punching steps for preparing corresponding sheet-like films according to the State of the art, omitted can.
  • FIG. 1 The embodiment of a multilayer, rigid printed circuit board illustrated in FIG. 1 represents a simplified example of such a printed circuit board for illustration purposes, of course a larger number or plurality of, in particular, conductive layers 2 as well as microvias 5 corresponding to the desired complexity the component to be used can be used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
PCT/AT2008/000030 2007-02-16 2008-01-30 Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte Ceased WO2008098272A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020097017101A KR20090109109A (ko) 2007-02-16 2008-01-30 플렉시-리지드 인쇄회로판의 제조 방법 및 플렉시-리지드 인쇄회로판
CN2008800117111A CN101658082B (zh) 2007-02-16 2008-01-30 制造刚挠性印刷电路板的方法和刚挠性印刷电路板
JP2009549743A JP5327545B2 (ja) 2007-02-16 2008-01-30 フレキ−リジッドプリント回路基板を製造する方法、およびフレキ−リジッドプリント回路基板
EP08700296.0A EP2119330B1 (de) 2007-02-16 2008-01-30 Verfahren zum herstellen einer starr-flexiblen leiterplatte
US12/449,608 US8500938B2 (en) 2007-02-16 2008-01-30 Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
AT0009907U AT10029U1 (de) 2007-02-16 2007-02-16 Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte
ATGM99/2007 2007-02-16

Publications (2)

Publication Number Publication Date
WO2008098272A1 true WO2008098272A1 (de) 2008-08-21
WO2008098272A8 WO2008098272A8 (de) 2008-11-27

Family

ID=39367422

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/AT2008/000030 Ceased WO2008098272A1 (de) 2007-02-16 2008-01-30 Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte

Country Status (7)

Country Link
US (1) US8500938B2 (https=)
EP (1) EP2119330B1 (https=)
JP (1) JP5327545B2 (https=)
KR (1) KR20090109109A (https=)
CN (1) CN101658082B (https=)
AT (1) AT10029U1 (https=)
WO (1) WO2008098272A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010078611A1 (de) 2009-01-09 2010-07-15 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum herstellen eines leiterplattenelements

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010007704A1 (ja) * 2008-07-16 2012-01-05 イビデン株式会社 フレックスリジッド配線板及び電子デバイス
DE102010045536B4 (de) * 2010-09-15 2012-06-21 Trw Automotive Electronics & Components Gmbh Elektrodynamischer Aktor
AT12737U1 (de) * 2010-09-17 2012-10-15 Austria Tech & System Tech Verfahren zum herstellen einer aus mehreren leiterplattenbereichen bestehenden leiterplatte sowie leiterplatte
US20120325524A1 (en) * 2011-06-23 2012-12-27 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
CN103096647B (zh) * 2011-10-31 2016-01-13 健鼎（无锡）电子有限公司 弯折式印刷电路板的制造方法
CN102802361B (zh) * 2012-08-27 2014-12-10 皆利士多层线路版(中山)有限公司 半挠性印刷线路板的制作方法
TWI477212B (zh) * 2013-01-24 2015-03-11 Unimicron Technology Corp 軟硬複合線路板及其製造方法
CN103987207B (zh) * 2013-02-07 2017-03-01 欣兴电子股份有限公司 软硬复合线路板及其制造方法
WO2014207822A1 (ja) * 2013-06-25 2014-12-31 株式会社メイコー プリント配線基板
TWI501713B (zh) * 2013-08-26 2015-09-21 Unimicron Technology Corp 軟硬板模組以及軟硬板模組的製造方法
CN104582325B (zh) * 2013-10-12 2018-03-27 鹏鼎控股(深圳)股份有限公司 刚挠结合板及其制作方法、电路板模组
CN103578804B (zh) * 2013-11-01 2015-11-18 电子科技大学 一种刚挠结合印制电路板的制备方法
CN105282995B (zh) * 2014-06-24 2018-04-06 健鼎（无锡）电子有限公司 移除部分的多层线路结构的方法
US9997442B1 (en) 2016-12-14 2018-06-12 Advanced Semiconductor Engineering, Inc. Semiconductor device and method of manufacturing the same
KR102327991B1 (ko) * 2016-12-16 2021-11-18 삼성디스플레이 주식회사 디스플레이 장치의 제조방법
CN108243568A (zh) * 2016-12-27 2018-07-03 健鼎（无锡）电子有限公司 可挠性电路板的制作方法
CN206602182U (zh) * 2017-04-06 2017-10-31 京东方科技集团股份有限公司 一种天线结构及通讯设备
CN107328536B (zh) * 2017-08-16 2023-07-25 拓旷(上海)光电科技有限公司 测试机械
US10420208B2 (en) * 2017-09-06 2019-09-17 Microsoft Technology Licensing, Llc Metal layering construction in flex/rigid-flex printed circuits
US11690170B2 (en) 2017-11-03 2023-06-27 ZF Active Safety and Electronic US LLC Driver assist system
US20200053887A1 (en) 2018-08-09 2020-02-13 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Mechanically Robust Component Carrier With Rigid and Flexible Portions
CN209572202U (zh) 2018-10-31 2019-11-01 奥特斯(中国)有限公司 半柔性部件承载件
KR102268389B1 (ko) * 2019-09-11 2021-06-23 삼성전기주식회사 인쇄회로기판 및 이를 포함하는 안테나 모듈
CN112582386B (zh) * 2019-09-27 2022-05-27 珠海格力电器股份有限公司 功率模块及其制备方法、电器设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4003344C1 (https=) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
JPH1022645A (ja) 1996-07-08 1998-01-23 Nippon Avionics Co Ltd キャビティ付きプリント配線板の製造方法
DE20221121U1 (de) 2002-09-19 2005-03-24 Ruwel Ag Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich
DE20221189U1 (de) 2002-09-19 2005-05-19 Ruwel Ag Leiterplatte mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4931134A (en) * 1989-08-15 1990-06-05 Parlex Corporation Method of using laser routing to form a rigid/flex circuit board
US5004639A (en) * 1990-01-23 1991-04-02 Sheldahl, Inc. Rigid flex printed circuit configuration
DE4003345C1 (https=) * 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
JP3209772B2 (ja) * 1991-07-08 2001-09-17 株式会社フジクラ リジッドフレックス配線板の製造方法
JP3310037B2 (ja) * 1993-01-05 2002-07-29 株式会社東芝 プリント配線板の製造方法
JPH06252552A (ja) * 1993-02-26 1994-09-09 Hitachi Chem Co Ltd 配線板の製造法
JPH10173342A (ja) * 1996-12-13 1998-06-26 Toshiba Chem Corp 多層フレックスリジッド配線板及びその製造方法
JP2003332742A (ja) * 2002-05-16 2003-11-21 Kyocera Chemical Corp 多層フレックスリジッド配線板およびその製造方法
DE10243637B4 (de) * 2002-09-19 2007-04-26 Ruwel Ag Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten
DE10349963A1 (de) * 2003-10-24 2005-06-02 Leonhard Kurz Gmbh & Co. Kg Verfahren zur Herstellung einer Folie

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4003344C1 (https=) * 1990-02-05 1991-06-13 Fa. Carl Freudenberg, 6940 Weinheim, De
JPH1022645A (ja) 1996-07-08 1998-01-23 Nippon Avionics Co Ltd キャビティ付きプリント配線板の製造方法
DE20221121U1 (de) 2002-09-19 2005-03-24 Ruwel Ag Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich
DE20221189U1 (de) 2002-09-19 2005-05-19 Ruwel Ag Leiterplatte mit mindestens einem starren Bereich und mindestens einem flexiblen Bereich

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010078611A1 (de) 2009-01-09 2010-07-15 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum herstellen eines leiterplattenelements

Also Published As

Publication number Publication date
KR20090109109A (ko) 2009-10-19
JP2010518649A (ja) 2010-05-27
EP2119330B1 (de) 2017-07-19
US20100025086A1 (en) 2010-02-04
AT10029U1 (de) 2008-07-15
US8500938B2 (en) 2013-08-06
EP2119330A1 (de) 2009-11-18
CN101658082B (zh) 2013-01-02
CN101658082A (zh) 2010-02-24
WO2008098272A8 (de) 2008-11-27
JP5327545B2 (ja) 2013-10-30

Similar Documents

Publication Publication Date Title
EP2119330B1 (de) Verfahren zum herstellen einer starr-flexiblen leiterplatte
EP2342958B1 (de) Verfahren zur integration eines elektronischen bauteils in eine leiterplatte
DE69934674T2 (de) Methode zur herstellung von multifunktionellen mikrowellen-modulen aus fluoropolymer kompositsubstraten
EP2286644B1 (de) Verfahren zur integration wenigstens eines elektronischen bauteils in eine leiterplatte sowie leiterplatte
WO2008098270A1 (de) Verfahren zum herstellen einer starr-flexiblen leiterplatte sowie starr-flexible leiterplatte
EP2119327B1 (de) Verfahren zum entfernen eines teilbereichs einer flächigen materialschicht
EP2818032B1 (de) Verfahren zur herstellung einer leiterplatte und verwendung eines derartigen verfahrens
EP2452546A1 (de) Verfahren zum herstellen einer aus wenigstens zwei leiterplattenbreichen bestehenden leiterplatte sowie leiterplatte
DE4006063A1 (de) Verfahren zur herstellung einer leiterplatte fuer elektronische bausteine
EP2868170B1 (de) Verfahren zum einbetten zumindest eines bauteils in eine leiterplatte
DE112005001414T5 (de) Verfahren zur Herstellung eines Elektronikmoduls
EP0167051A1 (de) Thermostabiles, durch Bestrahlung vernetzbares Polymersystem auf der Basis von Bisphenolen und Epichlorhydrin sowie Verfahren zu seiner Verwendung
DE69605056T2 (de) Lötstopmaske zur herstellung gedruckter schaltungen
EP2018666B1 (de) Verfahren zum festlegen eines elektronischen bauteils auf einer leiterplatte, herstellungverfahren einer trägerlage und einer zwischenlage, sowie system bestehend aus einer leiterplatte und wenigstens einem elektronischen bauteil
DE4206746C1 (en) Manufacture of circuit board with rigid and flexible sections - has flexible sections created by having non-bonding insert of insulation broken away
EP2513957A2 (de) Verfahren zur herstellung einer elektronischen baugruppe und elektronische baugruppe
EP2467003A2 (de) Leiterplatte und Verfahren zur Herstellung von Leiterplatten
WO2018069319A1 (de) Verfahren zur herstellung einer mehrlagigen leiterplatte
DE102021112814A1 (de) Verfahren zur Herstellung einer Leiterplatte und Leiterplatte mit mindestens einem eingebetteten elektronischen Bauteil
DE102020111996A1 (de) Verfahren zur Herstellung einer Leiterplatte und Leiterplatte mit mindestens einem eingebetteten elektronischen Bauteil
DE102016219732A1 (de) Verfahren zur Herstellung einer mehrlagigen Leiterplatte
EP0394678A2 (de) Mehrlagen-Leiterplatten für Feinleiter und Verfahren zu ihrer Herstellung
EP1093909B1 (de) Folienverbund
EP1534050A1 (de) Verfahren zur Herstellung von Leiterplatten und Leiterplatte
DE202025107311U1 (de) Schaltungsträgerverbund aus zumindest zwei aufeinandergeschichteten Schaltungsträgern

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880011711.1

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08700296

Country of ref document: EP

Kind code of ref document: A1

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
ENP Entry into the national phase

Ref document number: 2009549743

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12449608

Country of ref document: US

Ref document number: 1020097017101

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

REEP Request for entry into the european phase

Ref document number: 2008700296

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2008700296

Country of ref document: EP

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)