WO2008090768A1 - 感光性樹脂組成物、及びこれを用いたパターン形成方法 - Google Patents
感光性樹脂組成物、及びこれを用いたパターン形成方法 Download PDFInfo
- Publication number
- WO2008090768A1 WO2008090768A1 PCT/JP2008/050234 JP2008050234W WO2008090768A1 WO 2008090768 A1 WO2008090768 A1 WO 2008090768A1 JP 2008050234 W JP2008050234 W JP 2008050234W WO 2008090768 A1 WO2008090768 A1 WO 2008090768A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- photosensitive resin
- same
- pattern
- forming pattern
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
安全性が高く、塗膜の均一性に優れ、硬化樹脂パターンの硬化密度を向上することができ、さらに高膜厚、高アスペクト比の微細なレジストパターンを形成できる高感度、高解像性の感光性樹脂組成物を提供する。
特定の構造を有するオニウムフッ素化アルキルフルオロリン酸塩系のカチオン重合開始剤に加えて、特定の溶剤又は特定の増感剤を必須成分として含有する感光性樹脂組成物によれば、塗膜の均一性に優れ、硬化樹脂パターンの硬化密度を向上することができ、さらに高膜厚、高アスペクト比の微細なレジストパターンを形成できる高感度、高解像性の感光性樹脂組成物を提供できる。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/449,060 US8288078B2 (en) | 2007-01-24 | 2008-01-11 | Photosensitive resin composition, and pattern formation method using the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007013798A JP5020645B2 (ja) | 2007-01-24 | 2007-01-24 | 感光性樹脂組成物、及びこれを用いたパターン形成方法 |
JP2007-013798 | 2007-01-24 | ||
JP2007-013799 | 2007-01-24 | ||
JP2007013799A JP5020646B2 (ja) | 2007-01-24 | 2007-01-24 | 感光性樹脂組成物、及びこれを用いたパターン形成方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008090768A1 true WO2008090768A1 (ja) | 2008-07-31 |
Family
ID=39644343
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/050234 WO2008090768A1 (ja) | 2007-01-24 | 2008-01-11 | 感光性樹脂組成物、及びこれを用いたパターン形成方法 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8288078B2 (ja) |
WO (1) | WO2008090768A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008310089A (ja) * | 2007-06-15 | 2008-12-25 | Tokyo Ohka Kogyo Co Ltd | 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法 |
JP2012056915A (ja) * | 2010-09-13 | 2012-03-22 | San Apro Kk | フッ素化アルキルリン酸スルホニウム塩、酸発生剤及び硬化性組成物 |
CN114262404A (zh) * | 2020-09-16 | 2022-04-01 | 宁波南大光电材料有限公司 | 光敏树脂及应用该光敏树脂的光刻胶组合物 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007094396A1 (ja) * | 2006-02-16 | 2007-08-23 | Tokyo Ohka Kogyo Co., Ltd. | 感光性樹脂組成物およびこれを用いたパターン形成方法 |
US8702819B2 (en) | 2008-09-10 | 2014-04-22 | Poet Research, Inc. | Oil composition and method of recovering the same |
JP5837574B2 (ja) | 2010-05-03 | 2015-12-24 | クリーティービー マイクロテック, インク.Creatv Microtech, Inc. | 高分子マイクロフィルタおよびその製造方法 |
EP4101517A1 (en) | 2011-11-21 | 2022-12-14 | Creatv Microtech, Inc. | Polymer microfiltration devices, methods of manufacturing the same and the uses of the microfiltration devices |
US20170176856A1 (en) | 2015-12-21 | 2017-06-22 | Az Electronic Materials (Luxembourg) S.A.R.L. | Negative-working photoresist compositions for laser ablation and use thereof |
JP7029112B2 (ja) * | 2016-09-16 | 2022-03-03 | 日産化学株式会社 | 保護膜形成組成物 |
Citations (5)
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JP2005055865A (ja) * | 2003-07-24 | 2005-03-03 | Tokyo Ohka Kogyo Co Ltd | 感光性樹脂組成物および該組成物を用いたパターン形成方法 |
WO2005116038A1 (ja) * | 2004-05-28 | 2005-12-08 | San-Apro Limited | 新規なオニウムおよび遷移金属錯体のフッ素化アルキルフルオロリン酸塩 |
JP2006227544A (ja) * | 2005-01-21 | 2006-08-31 | Tokyo Ohka Kogyo Co Ltd | 精密微細空間の天板部形成用感光性積層フィルムおよび精密微細空間の形成方法 |
WO2007094396A1 (ja) * | 2006-02-16 | 2007-08-23 | Tokyo Ohka Kogyo Co., Ltd. | 感光性樹脂組成物およびこれを用いたパターン形成方法 |
WO2007119391A1 (ja) * | 2006-03-22 | 2007-10-25 | San-Apro Limited | 感活性エネルギー線ネガ型フォトレジスト組成物およびその硬化物 |
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US7153909B2 (en) * | 1994-11-17 | 2006-12-26 | Dow Global Technologies Inc. | High density ethylene homopolymers and blend compositions |
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JPH1097068A (ja) | 1996-09-20 | 1998-04-14 | Nippon Kayaku Co Ltd | 樹脂組成物、永久レジスト樹脂組成物及びこれらの硬化物 |
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-
2008
- 2008-01-11 US US12/449,060 patent/US8288078B2/en active Active
- 2008-01-11 WO PCT/JP2008/050234 patent/WO2008090768A1/ja active Application Filing
Patent Citations (5)
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JP2005055865A (ja) * | 2003-07-24 | 2005-03-03 | Tokyo Ohka Kogyo Co Ltd | 感光性樹脂組成物および該組成物を用いたパターン形成方法 |
WO2005116038A1 (ja) * | 2004-05-28 | 2005-12-08 | San-Apro Limited | 新規なオニウムおよび遷移金属錯体のフッ素化アルキルフルオロリン酸塩 |
JP2006227544A (ja) * | 2005-01-21 | 2006-08-31 | Tokyo Ohka Kogyo Co Ltd | 精密微細空間の天板部形成用感光性積層フィルムおよび精密微細空間の形成方法 |
WO2007094396A1 (ja) * | 2006-02-16 | 2007-08-23 | Tokyo Ohka Kogyo Co., Ltd. | 感光性樹脂組成物およびこれを用いたパターン形成方法 |
WO2007119391A1 (ja) * | 2006-03-22 | 2007-10-25 | San-Apro Limited | 感活性エネルギー線ネガ型フォトレジスト組成物およびその硬化物 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008310089A (ja) * | 2007-06-15 | 2008-12-25 | Tokyo Ohka Kogyo Co Ltd | 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法 |
JP2012056915A (ja) * | 2010-09-13 | 2012-03-22 | San Apro Kk | フッ素化アルキルリン酸スルホニウム塩、酸発生剤及び硬化性組成物 |
CN114262404A (zh) * | 2020-09-16 | 2022-04-01 | 宁波南大光电材料有限公司 | 光敏树脂及应用该光敏树脂的光刻胶组合物 |
CN114262404B (zh) * | 2020-09-16 | 2023-06-30 | 宁波南大光电材料有限公司 | 光敏树脂及应用该光敏树脂的光刻胶组合物 |
Also Published As
Publication number | Publication date |
---|---|
US20100068649A1 (en) | 2010-03-18 |
US8288078B2 (en) | 2012-10-16 |
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