WO2008078498A1 - 排水処理システム及び排水処理方法 - Google Patents

排水処理システム及び排水処理方法 Download PDF

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Publication number
WO2008078498A1
WO2008078498A1 PCT/JP2007/072958 JP2007072958W WO2008078498A1 WO 2008078498 A1 WO2008078498 A1 WO 2008078498A1 JP 2007072958 W JP2007072958 W JP 2007072958W WO 2008078498 A1 WO2008078498 A1 WO 2008078498A1
Authority
WO
WIPO (PCT)
Prior art keywords
wastewater
wastewater treatment
raw
filter membrane
tank
Prior art date
Application number
PCT/JP2007/072958
Other languages
English (en)
French (fr)
Inventor
Shinichi Kosaka
Original Assignee
Ngk Insulators, Ltd.
Ngk Filtech, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ngk Insulators, Ltd., Ngk Filtech, Ltd. filed Critical Ngk Insulators, Ltd.
Priority to CN2007800481847A priority Critical patent/CN101573298B/zh
Priority to JP2008551005A priority patent/JP5563765B2/ja
Publication of WO2008078498A1 publication Critical patent/WO2008078498A1/ja
Priority to US12/477,380 priority patent/US7922915B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
    • B01D61/14—Ultrafiltration; Microfiltration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/12—Devices for exhausting mist of oil or coolant; Devices for collecting or recovering materials resulting from grinding or polishing, e.g. of precious metals, precious stones, diamonds or the like
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/44—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis
    • C02F1/444—Treatment of water, waste water, or sewage by dialysis, osmosis or reverse osmosis by ultrafiltration or microfiltration
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/66—Treatment of water, waste water, or sewage by neutralisation; pH adjustment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D2311/00—Details relating to membrane separation process operations and control
    • B01D2311/18—Details relating to membrane separation process operations and control pH control
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
    • C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/06—Controlling or monitoring parameters in water treatment pH

Abstract

　シリコン加工排水に炭酸ガスを注入して被処理排水を得る炭酸ガス注入手段３と、排水タンク２と、被処理排水を濾過する濾過膜１１と、被処理排水を濾過膜１１に送液する送液ポンプ９と、排水タンク２中の被処理排水の量が基準量を下回った場合に、濃縮水、又は濃縮水と濾過水を排水タンク２に送液するとともに、被処理排水のｐＨを４．０～６．５に調整して濾過膜１１に送液することが可能な循環送液制御手段３０と、を備えた排水処理システム２０である。
PCT/JP2007/072958 2006-12-25 2007-11-28 排水処理システム及び排水処理方法 WO2008078498A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2007800481847A CN101573298B (zh) 2006-12-25 2007-11-28 废水处理系统和废水处理方法
JP2008551005A JP5563765B2 (ja) 2006-12-25 2007-11-28 排水処理システム及び排水処理方法
US12/477,380 US7922915B2 (en) 2006-12-25 2009-06-03 Wastewater treatment system and method of wastewater treatment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-348049 2006-12-25
JP2006348049 2006-12-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/477,380 Continuation US7922915B2 (en) 2006-12-25 2009-06-03 Wastewater treatment system and method of wastewater treatment

Publications (1)

Publication Number Publication Date
WO2008078498A1 true WO2008078498A1 (ja) 2008-07-03

Family

ID=39562291

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/072958 WO2008078498A1 (ja) 2006-12-25 2007-11-28 排水処理システム及び排水処理方法

Country Status (5)

Country Link
US (1) US7922915B2 (ja)
JP (1) JP5563765B2 (ja)
CN (1) CN101573298B (ja)
MY (1) MY146285A (ja)
WO (1) WO2008078498A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013119050A (ja) * 2011-12-06 2013-06-17 Disco Corp 廃液処理装置

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CN101426723B (zh) * 2006-02-24 2011-12-14 Ihi压缩和机器株式会社 硅粒的处理方法和装置
KR100985861B1 (ko) * 2008-09-24 2010-10-08 씨앤지하이테크 주식회사 반도체용 슬러리 공급장치 및 슬러리 공급방법
EP2489641A1 (en) * 2011-02-15 2012-08-22 Ostara Nutrient Recovery Technologies Inc. Methods and apparatus for struvite recovery using upstream CO2 injection
JP2012178418A (ja) * 2011-02-25 2012-09-13 Nomura Micro Sci Co Ltd 研磨剤の回収方法および研磨剤の回収装置
CN102233539A (zh) * 2011-07-05 2011-11-09 大连隆正光饰机制造有限公司 光饰机水循环系统
WO2013091129A1 (en) * 2011-12-19 2013-06-27 General Electric Company Membrane filtration process for industrial process water treatment and recovery
US20180186670A1 (en) * 2015-02-03 2018-07-05 Chelan, Inc. Fluid treatment apparatus and processes
CN109704342A (zh) * 2018-12-26 2019-05-03 山东辰宇稀有材料科技有限公司 一种硅粉废液回收设备
JP2021094674A (ja) * 2019-12-19 2021-06-24 株式会社ディスコ 廃液処理装置及び加工水再生システム

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JPS6261691A (ja) * 1985-09-12 1987-03-18 Japan Organo Co Ltd 濾過膜による濾過方法
JPS6283086A (ja) * 1985-10-07 1987-04-16 Nec Kyushu Ltd 研削排水回収装置
JPH08115892A (ja) * 1994-10-14 1996-05-07 Kurita Water Ind Ltd 研磨剤粒子の回収方法
JPH11156164A (ja) * 1997-11-26 1999-06-15 Mitsubishi Heavy Ind Ltd 酢酸セルロース膜の保管方法及びホウ酸廃液処理装置
JP2001198825A (ja) * 2000-01-14 2001-07-24 Kurita Water Ind Ltd 研磨材の回収装置
JP2002050596A (ja) * 2000-08-02 2002-02-15 Sanyo Electric Co Ltd 半導体結晶物の処理システムおよび半導体ウェハの処理システム
JP2005021805A (ja) * 2003-07-02 2005-01-27 Sumitomo Mitsubishi Silicon Corp 排水処理方法及び排水処理システム

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JPH07316846A (ja) * 1994-05-27 1995-12-05 Asahi Chem Ind Co Ltd ケミカルメカニカルポリッシング液の再生方法
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Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6261691A (ja) * 1985-09-12 1987-03-18 Japan Organo Co Ltd 濾過膜による濾過方法
JPS6283086A (ja) * 1985-10-07 1987-04-16 Nec Kyushu Ltd 研削排水回収装置
JPH08115892A (ja) * 1994-10-14 1996-05-07 Kurita Water Ind Ltd 研磨剤粒子の回収方法
JPH11156164A (ja) * 1997-11-26 1999-06-15 Mitsubishi Heavy Ind Ltd 酢酸セルロース膜の保管方法及びホウ酸廃液処理装置
JP2001198825A (ja) * 2000-01-14 2001-07-24 Kurita Water Ind Ltd 研磨材の回収装置
JP2002050596A (ja) * 2000-08-02 2002-02-15 Sanyo Electric Co Ltd 半導体結晶物の処理システムおよび半導体ウェハの処理システム
JP2005021805A (ja) * 2003-07-02 2005-01-27 Sumitomo Mitsubishi Silicon Corp 排水処理方法及び排水処理システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013119050A (ja) * 2011-12-06 2013-06-17 Disco Corp 廃液処理装置

Also Published As

Publication number Publication date
CN101573298A (zh) 2009-11-04
MY146285A (en) 2012-07-31
JP5563765B2 (ja) 2014-07-30
US20090236292A1 (en) 2009-09-24
CN101573298B (zh) 2012-11-14
US7922915B2 (en) 2011-04-12
JPWO2008078498A1 (ja) 2010-04-22

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