WO2008045184A1 - Revêtements exempts de polymère pour dispositifs médicaux formés par dépôt électrolytique de plasma - Google Patents

Revêtements exempts de polymère pour dispositifs médicaux formés par dépôt électrolytique de plasma Download PDF

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WO2008045184A1
WO2008045184A1 PCT/US2007/020124 US2007020124W WO2008045184A1 WO 2008045184 A1 WO2008045184 A1 WO 2008045184A1 US 2007020124 W US2007020124 W US 2007020124W WO 2008045184 A1 WO2008045184 A1 WO 2008045184A1
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plasma electrolytic
medical device
electrolytic deposition
agent
coating
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PCT/US2007/020124
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Liliana Atanasoka
Jan Weber
Robert Warner
Steve R. Larsen
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Boston Scientific Limited
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Priority to EP07838346A priority Critical patent/EP2084310A1/fr
Publication of WO2008045184A1 publication Critical patent/WO2008045184A1/fr

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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00Coating not provided for in groups C23C2/00 - C23C24/00
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C23C28/042Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material including a refractory ceramic layer, e.g. refractory metal oxides, ZrO2, rare earth oxides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C23C28/3455Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02Anodisation
    • C25D11/026Anodisation with spark discharge

Definitions

  • the Held of the present invention is coatings for medical devices, such as stents.
  • Medical devices such as catheters, guide wires and stents arc often made with materials that can cause undesirable complications such as bacterial infection, blood clots, and tissue trauma caused by device insertion.
  • a coating on the medical device can alleviate these challenges without altering the device's bulk material properties. Certain coatings confer a variety of desired properties, such as lubricity, biocompatibility, and antimicrobial action to medical device surfaces. Other coatings can be used to release drugs or make implanted devices more visible to imaging systems. While there are a number of commercially available coating technologies, most use polymers, organic solvents and/or UV curing in the process.
  • medical devices such as stents are implantable devices used to maintain the diameter of a vessel after the vessel has been opened or a blockage removed.
  • a stent may be placed in a coronary artery after an angioplasty procedure is performed. Stenting is a growing field of treatment and research in medicine, and various types of stents have found use in a wide range of treatments.
  • implanted stents In many applications, it is desirable for implanted stents to become covered in endothelial cells as early as possible after implantation of the stent. This may be particularly true with respect to arterial stenting, and especially coronary arterial stenting. Implanted stents that have not re-endothelialized (i.e., become covered to some degree with endothelial cells) are associated with adverse clinical events such as stent thrombosis. After a stent is implanted it may take several weeks for endothelial cells to propagate from healthy areas within the vessel to the region of the implanted stent and cover the stent.
  • Stents may be covered with various therapeutic agents to aid acceptance of the stent or to serve other therapeutic goals.
  • stents may be covered with drugs that act to inhibit restenosis (re-blocking) of a vessel.
  • the use of drug-eluting stents has greatly reduced the chance of restenosis.
  • the present invention is directed to various methods for making polymer-free coatings for stents and other medical devices using a plasma electrolytic deposition (PED) process.
  • the plasma electrolytic deposition can include plasma electrolytic oxidation (PEO) processes (also known as micro-arc oxidation (MAO), plasma-arc oxidation (PAO) or anodic spark oxidation), as well as plasma electrolytic saturation (PES) processes.
  • PEO plasma electrolytic oxidation
  • MAO micro-arc oxidation
  • PAO plasma-arc oxidation
  • PES plasma electrolytic saturation
  • a process is provided for applying a coating onto a medical device using plasma electrolytic deposition, where the coating provides controlled drug release.
  • Certain embodiments of the invention relate to methods for the application of a polymer-free drug-eluting coating onto a medical device using plasma electrolytic deposition, comprising: (i) applying an optional metal precoating onto the medical device (e.g., the metal precoating can comprise any suitable metal, such as biodegradable iron or magnesium, as wellas non-degradable titanium, or oxides or combinations thereof); (ii) placing the medical device into an electrolyte solution comprising at least one electrolyte (e.g., an ionic form of a drug may be used in certain embodiments); and (iii) establishing an electric potential under plasma electrolytic deposition conditions between a first electrode and the medical device to form a coating.
  • an optional metal precoating onto the medical device
  • the metal precoating can comprise any suitable metal, such as biodegradable iron or magnesium, as wellas non-degradable titanium, or oxides or combinations thereof
  • placing the medical device into an electrolyte solution comprising at least one electrolyte (
  • the first electrode may be either a cathode or an anode, depending on the process conditions.
  • the at least one electrolyte can be any chemical compound that ionizes when dissolved to produce an electrically conductive medium.
  • Appropriate plasma electrolytic deposition conditions are used in order to sustain deposition of the coating from the electrolyte solution onto the surface of the medical device to form a polymer-free coating.
  • the plasma electrolytic deposition conditions may be easily adjusted to permit control over the physical properties of the coating, e.g., thickness, porosity, etc.
  • the medical device to be coated may be made from any conventional material.
  • common materials could be selected from the group consisting of: iron, magnesium, magnesium composite, magnesium oxide, MP35N, niobium, zirconium, nitinol, tantalum, titanium, tungsten, stainless steel, iridium, platinum, suitable polymers, and mixtures thereof.
  • the medical device Prior to subjecting the medical device to plasma electrolytic deposition conditions, the medical device can be First precoated with a suitable metal in certain embodiments.
  • This precoating preferably comprises a soft metal, for example, selected from magnesium, titanium, aluminum, biodegradable iron, as well as oxides or combinations thereof. If a soft metal or a valve metal is not used, an appropriate metal can be selected, which will provide good coating fracture integrity.
  • the metal precoating may be applied by a hybrid, duplex, or multiplex coating process.
  • the precoating may be applied by a conventional technique such as, but not limited to, a method selected from the group consisting of plating, sputtering, anodization electrodeposition, solvothermal treatment, pulsed laser deposition (PLD) and variations or combinations thereof.
  • the precoating may also be applied to selected portions, for example by means of PLD or by sputtering using a mask, such that that different parts of the stent can be coated with different metal compositions.
  • the coating formed on the medical device may be macroporous, microporous or nanoporous, as well as biodegradable.
  • a drug or other bioactive compound may be incorporated into the polymer-free coating. In such cases, the drug or bioactive compound will be released from the coating over time.
  • ionic drugs that may be incorporated into the coating using plasma electrolytic deposition include dexamethasone sodium phosphate, paclitaxel and/or methyl pyridinium mesylate.
  • the plasma electrolytic deposition process may be used to easily incorporate additional agents into the coating, either with or without a drug or therapeutic agent.
  • the electrolyte solution can also comprise additional ionic compounds selected from the group consisting of corrosion resistance compounds or growth modifiers, for example.
  • additional ions may be selected from the group consisting of polyoxometalate, ruthenate, ferrate, chromatc, molibdate, silicate, iridate, palatinate, cations for nitriding, cations for carbo-nitriding, and combinations thereof.
  • the plasma electrolytic deposition conditions can be conveniently adjusted in order to alter the surface morphology and other properties of the coating. Selection of reaction condition parameters can be easily tailored to permit the facile adjustment of coating properties.
  • the plasma electrolytic deposition conditions may be carried out using a suitable regime such as pulsed DC or pulsed AC. For example, voltages of about - 100 to 600 V and current densities of 0.5-30 A/dm 2 may be used. In certain embodiments, the plasma electrolytic deposition conditions could be carried out at a cell voltage of 240-600 V, a current density of 0.5-5 A/dm 2 , and a processing time of 5-60 minutes.
  • an unbalanced AC is used, there will usually be higher local discharge intensities, which facilitates obtaining high temperature crystal phases, such as anatase or rutile.
  • a positive voltage regime of up to 500 V could be used, and a negative regime down to - 100 V, whereas the current densities may go up to about 30A/dm 2
  • an AC PEO in the range of 10-100 Hz may be used, and processing times of up to 2 minutes.
  • additional coatings may be optionally applied using techniques such as, but not limited to: nitriding, sputter deposition, electrophoresis, anodization, electrodeposition, solvothermal treatment, and/or hydrothermal treatment, to form one or more multiple films over the medical device.
  • the invention also relates to coatings as well as medical devices and stents that are coated using this process.
  • the invention relates generally to the application of plasma electrolytic deposition to fabricate a polymer-free coating for a medical device such as a stent.
  • the coating produced may be an inorganic, microporous or nanoporous coating that comprises a biologically active agent or drug capable of controlled drug delivery.
  • Plasma electrolytic deposition methods typically involve the application of different electrical potentials between the medical device and a counter-electrode, which produces an electrical discharge (e.g., a spark or arc plasma micro-discharge) at or near the medical device surface. See A. L. Yerokhin et al., "Plasma Electrolysis for Surface Engineering," Surface and Coatings Technology, 122:73-93 ( 1999).
  • Plasma electrolytic deposition includes plasma electrolytic oxidation processes such as micro-arc oxidation (MAO) also known as plasma-arc oxidation (PAO) or plasma electrolytic oxidation (PGO), as well as the plasma electrolytic saturation (PHS) process including plasma electrolytic nitriding (PEN), plasma electrolytic carburizing (PHC) or plasma electrolytic bonding (PEB).
  • MAO micro-arc oxidation
  • PGO plasma-arc oxidation
  • PHS plasma electrolytic saturation
  • PEN plasma electrolytic nitriding
  • PHC plasma electrolytic carburizing
  • PEB plasma electrolytic bonding
  • spark or arc plasma micro discharges in an aqueous solution are used to ionize gaseous media from the solution such that complex compounds are synthesized on the metal surfaces through the plasma-chemical interactions. Both anode and cathode processes may be used in the present invention.
  • PES is a technology involved with heating surface discharges in liquid electrolytic plasma.
  • the diffusion of electrolyte into the surface of the electrode can be achieved to saturate the surface with various alloying elements. Both diffusion of elements to the substrate in a saturation process, as well as diffusion outward to the surface in a depletion process have been reported, which are facilitated by the heated surface as well as the plasma envelope around the substrate.
  • the saturation of the surface of the medical device is usually accomplished using electrolyte solutions of simple inorganic acids, suitable salts of the desired ionic species, and certain organic compounds.
  • the ionic species for the coating or saturation of the surface will be negatively charged so that they can be drawn into the vapor envelope.
  • Micro-arc oxidation is a variation of traditional electrochemical methods, and has been used for the incorporation of a compact ceramic coating onto a metal (e.g., Al, Ti, Mg, Hf, etc.) or alloy surface.
  • the MAO process combines electrochemical oxidation with a high voltage spark treatment, resulting in a coating formed on the surface. See, e.g., Song et al., Biomaterials, 25:3341 (2005); Ishizawa and Ogino, J. Biomed Material Research,29: 1071 ( 1995): Li el al., Biomaterials, 25:2867(2004); Zhang et al, J.
  • the plasma electrolytic deposition techniques combine traditional electrochemical oxidation with a high voltage spark treatment.
  • the plasma electrolytic deposition process had not been generally applicable for conventional medical device materials, such as iron, nitinol, MP35N or stainless steel.
  • a polymer-free coating may be applied using plasma electrolytic deposition techniques to a wide variety of medical devices, including those made from conventional materials.
  • the surface of the medical device to be treated may be cleaned and/or degreased prior to applying the coating.
  • the surface of the medical device can be polished with an abrasive paper (such as alumina waterproof abrasive paper, for example), then wiping with a suitable solvent, e.g., acetone, ethyl alcohol and/or distilled water.
  • a suitable solvent e.g., acetone, ethyl alcohol and/or distilled water.
  • the medical device will simply be rinsed with distilled water and allowed to air dry.
  • the surface of the medical device may optionally be covered with a metal (metal oxide or any ceramics) pre-coating layer if desired.
  • the metal precoating may be applied by conventional methods such as plating, sputtering, vapor deposition (i.e., chemical, physical, plasma enhanced physical, or thermal spraying, etc.), or combinations thereof.
  • the material for the precoating should be one that is suitable for subsequent plasma electrolytic deposition.
  • the so-called soft or valve metals may be used in certain preferred embodiments.
  • metals such as aluminum, titanium, magnesium, zirconium and hafium can be used as a precoating on the medical device prior to the plasma electrolytic deposition treatment.
  • the precoating metal may comprise, for example, oxides and/or composites thereof, e.g., AUOs-SiO 2 , AhO 3 -MgO, Al 2 O 3 -CaO, and others.
  • the polymer-free coating may be applied to the medical device under plasma electrolytic deposition conditions.
  • the medical device could be patterned or treated in order to provide a masked or template-based synthesis of the plasma electrolytic deposition coating.
  • certain areas of the medical device are masked in order to apply different types of coalings or different drugs to specific regions on the surface of the medical device. See. e.g., Lee, W. et al., Angevv. Chem. Int. Ed., 44:6050-6054 (2005); Datta, M. et al., Electrochimica Acta, 45:2535-2558 (2000) and Volkcl, B.
  • the plasma electrolytic deposition process is carried out in an electrolyte solution connected to a power supply.
  • the setup will be very similar in configuration to a conventional anodic oxidation or electroplating process, but one notable difference is that the applied electrode potential in the plasma electrolytic deposition process will be much higher. See, e.g., Meletis, E.I., et al.. Surface and Coatings Technology, 150:246-256 (2002).
  • the plasma electrolytic deposition process involves electrolysis by applying an electrical potential between the medical device to be coated and the counter-electrode, as well as the production of an electrical discharge in close proximity to the medical device surface.
  • One of the benefits of plasma electrolytic deposition is that environmentally friendly solutions may be used.
  • the electrolyte preferably uses distilled water as the solvent.
  • Plasma electrolytic deposition is normally carried out in an electrolyser with a high power electric source.
  • the electrolyser can be a water-cooled bath placed on a dielectric base and confined in a grounded steel frame, which an insulated current supply.
  • the medical device to be coated is attached to the current supply and typically either immersed in the electrolyte or dripped with electrolyte, e.g., as shown in Figure Ib of Meletis, E.I., et al., Surface and Coatings Technology, 150:246-256 (2002).
  • the medical device can be connected to the positive terminal (anode) and a nonreactive metal, such as stainless steel, is connected to the negative terminal (cathode). Both the anode and the cathode are immersed into the electrolyte solution, and the voltage applied across them. A suitable voltage can be applied and the power supply can be adjusted as necessary for the optimal current and amplitudes of the anode and cathode voltages.
  • either DC or AC sources may be applied, including DC sources, pulsed DC sources, unbalanced AC sources (i.e., alternating current with different amplitudes to the positive and negative components), heteropolar pulsed current, and combinations thereof.
  • DC sources including DC sources, pulsed DC sources, unbalanced AC sources (i.e., alternating current with different amplitudes to the positive and negative components), heteropolar pulsed current, and combinations thereof.
  • Each of these electric sources may be optimized to achieve the desired coating and/or surface characteristics.
  • the parameters will vary depending on the composition of the electrolyte solution and medical device, etc., but can be estimated using standard calculations as set forth, for example, in A.L. Yerokhin et al., "Kinetic Aspects of Aluminum Titanate Layer Formation on Titanium Alloys by Plasma Electrolytic Oxidation," Applied Surface Science, 200: 172- 184(2002).
  • Current density is often set within the range of 0.01 to 0.3 A/cm 2 , which usually provides an acceptable coating
  • the final coating on the medical device should be optimized in terms of chemical composition, surface roughness, surface energy and porosity, etc. to provide good cell adhesion and cell proliferation.
  • the drug release profile will be controlled by a number of factors in addition to porosity, including wetting and surface energy. Increased wetting and surface energy improves a material's adhesion characteristics, thereby allowing improved release characteristics.
  • the drug release will need to be optimized to give a desired profile for a particular bioactive agent and coating system. See, e.g., Zhang, Y.M.
  • the properties of the coating made by the plasma electrolytic deposition technique(s) may be tailored by easily adjusting the process conditions such as, but not limited to: the applied current densities, concentration and constituents of the electrolyte, processing time, current and voltage. See, e.g., Guo, H.F., et al., Applied Surface Science, 246:229-238 (2005); Ishizawa, H., Journal of Biomedical Materials Research, 35: 199-206 (1997); Li, L.-H.
  • the electrolyte solution will contain the desired ions in solution. ⁇ variety of ions may be incorporated into the coating, as desired to confer beneficial properties.
  • an ionic drug is present to be incorporated into the polymer-free coating.
  • additional components may confer desirable properties such as corrosion resistance and control of drug release, better tribological properties (resistant to friction and wear), increased growth rates, or other functional requirements.
  • ions such as polyoxometalate, ruthenate, ferrate, chromatc, molibdate, or silicate may be used. Such ions may be incorporated in the electrolyte solution with the ionic drug.
  • ions such as polyoxometalate, ruthenate, ferrate, chromate, molibdate, silicate, iridate, palatinate, cations for nitriding, cations for carbo-nitriding, etc. may be used to impart corrosion resistance and control.
  • the electrolyte solution is preferably maintained at a temperature less than the boiling point of the solvent used.
  • a temperature range of about 40°C-80°C for an aqueous system may be conveniently used.
  • the temperature can be maintained greater than about 80 0 C.
  • the plasma electrolytic deposition conditions are then carried out at a temperature of less than about 200 0 C, otherwise it is possible to raise the temperature greater than about 200 0 C.
  • the temperature may be automatically controlled by an external source.
  • a heat exchanger or refrigeration equipment may be used in order to regulate the temperature in certain embodiments.
  • the electrolyte solution is conveniently kept within a pH of about 6-12, preferably about 12- 13.
  • any suitable pH may be used. See, e.g., Yong Han, et al., "Structure and in vitro Bioactivity of Titania- Based Films by Micro-Arc Oxidation," Surface and Coatings Technology. 168:249-258 (2003).
  • the breakdown voltage typically about 240V to about 440V
  • the ignition time typically about 40-300 seconds
  • the resulting plasmas appear as sparks moving across the surface, which induce the evolution of the plasmas, where over time the sparks become microarcs, and then arcs.
  • the plasmas in turn oxidize the surface. Also, local conditions of heat and pressure sinter and anneal the coating.
  • the micro-arc plasmas may be conveniently monitored using optical emission spectroscopy.
  • the electric field applied must be greater than the dielectric breakdown field for the oxide. It is important to maintain a sufficient current in order to have good control of the process. Over time, the resistance of the sample surface increases over time due to the growing coating layer, and the current may drop.
  • the coating is typically from about 1 to about 50 microns thick. For example, the thickness is preferably from about 1 to about 10 microns, and more preferably from about 2 to about 5 microns.
  • the process may be monitored using optical emission spectroscopy to determine the dominant species present in the arcs. After the reaction is completed, the medical device may be washed with distilled water and dried.
  • the plasma electrolytic deposition process is performed in an electrolyte solution, it offers the opportunity of easily incorporating various functional ions into the surface layer, by controlling the composition and concentration of the electrolyte.
  • the coating properties' such as thickness, porosity, roughness, etc. can be precisely controlled by the plasma electrolytic deposition process parameters of voltage, current, DC, AC, pulse parameters, number of steps, time, electrolyte concentration, pH, and temperature. For example, rapid cooling will result in a complex mixture of amorphous material and nanocrystalline phases. On the other hand, prolonged reaction times may lead to a decrease in porosity.
  • the plasma processing could be performed on a tube from which the medical device is cut to provide a porous layer on the outside of this tube as described herein.
  • the stent pattern can be cut using an ablating laser, such as a femto second laser.
  • the process does not give additional debris and hardly any heat generation, so that any drug included in the porous coating is not affected.
  • an abluminal coating is achieved, where the inner surface is less rough than with an all-around coating, which could cause pinholes in the balloon delivery system.
  • plasma electrolytic deposition can be used to form polymer-free coatings on various medical devices, including stents.
  • drug-eluting coatings are also provided.
  • the ceramic coating obtained by plasma electrolytic deposition has extremely high adhesion, good hardness properties, high erosion and abrasion wear resistance, and good dielectric properties.
  • the plasma electrolytic deposition produces a thick, well bonded ceramic coating on a variety of reactive light metal alloys and could be used in place of more expensive materials or heavier materials.
  • the surface morphology and phase structure of the final coating may be analyzed using any appropriate technique, such as optical emission spectroscopy (OES), scanning electron microscope (SEM) or X-ray powder diffraction (XRD).
  • OES optical emission spectroscopy
  • SEM scanning electron microscope
  • XRD X-ray powder diffraction
  • the medical device may also contain a radio-opacifying agent within its structure to facilitate viewing the medical device during insertion and at any point while the device is implanted.
  • radio-opacifying agents are bismuth subcarbonate, bismuth oxychloride, bismuth trioxide, barium sulfate, tungsten, and mixtures thereof.
  • the therapeutic agent may be any ionic pharmaceutically acceptable agent such as a non-genetic therapeutic agent, a biomolecule, a small molecule, or cells. Combinations of different drugs may be used on the medical device.
  • exemplary therapeutic agents include anti- thrombogenic agents such heparin, heparin derivatives, prostaglandin (including micellar prostaglandin El), urokinase, and PPACK (dextrophenylalanine proline arginine chloromethylketone); anti-proliferative agents such as enoxaprin, angiopeptin, sirolimus (rapamycin), tacrolimus, everolimus, monoclonal antibodies capable of blocking smooth muscle cell proliferation, hirudin, and acetylsalicylic acid; anti-inflammatory agents such as dcxamethasone, rosiglitazone, prednisolone, corticosterone, budesonide, estrogen, estrodiol, sulfasala
  • biomolecules include peptides, polypeptides and proteins; oligonucleotides; nucleic acids such as double or single stranded DNA (including naked and cDNA), RNA, antisense nucleic acids such as antisense DNA and RNA, small interfering RNA (siRNA), and ribozymes; genes; carbohydrates; angiogenic factors including growth factors; cell cycle inhibitors; and anti-restenosis agents. Nucleic acids may be incorporated into deliver)' systems such as, for example, vectors (including viral vectors), plasmids or liposomes.
  • the therapeutic agent could also be a polymer-drug conjugate, such as paclitaxel-polyglutamate or cvcrolimus polyglutamate, for example.
  • Non-limiting examples of proteins include serca-2 protein, monocyte chemoattractant proteins ("MCP- I) and bone morphogenic proteins ("BMP's”), such as, for example, BMP-2, BMP-3, BMP-4, BMP-5, BMP-6 (Vgr- 1 ), BMP-7 (OP- I ), BMP-8, BMP-9, BMP- I O, BMP- I I , BMP- 12, BMP- 13, BMP- 14, BMP- 15.
  • Preferred BMPS are any of BMP-2, BMP-3, BMP-4, BMP-5, BMP-6, and BMP-7. These BMPs can be provided as homdimers, heterodimers, or combinations thereof, alone or together with other molecules.
  • molecules capable of inducing an upstream or downstream effect of a BMP can be provided.
  • Such molecules include any of the "hedghog" proteins, or the DNA's encoding them.
  • genes include survival genes that protect against cell death, such as anti-apoptotic Bcl-2 family factors and Akt kinase; serca 2 gene; and combinations thereof.
  • Non-limiting examples of angiogenic factors include acidic and basic fibroblast growth factors, vascular endothelial growth factor, epidermal growth factor, transforming growth factor ⁇ and ⁇ , platelet-derived endothelial growth factor, platelet-derived growth factor, tumor necrosis factor ⁇ , hepatocyte growth factor, and insulin like growth factor.
  • a non-limiting example of a cell cycle inhibitor is a cathespin D (CD) inhibitor.
  • Non-limiting examples of anti-restenosis agents include p l 5, p 16, pl8, p l9, p21, p27, p53, p57, Rb, nFkB and E2F decoys, thymidine kinase ("TK”) and combinations thereof and other agents useful for interfering with cell proliferation.
  • Exemplary small molecules include hormones, nucleotides, amino acids, sugars, and lipids and compounds have a molecular weight of less than 10OkD.
  • Exemplary cells include stem cells, progenitor cells, endothelial cells, adult cardiomyocytes, and smooth muscle cells.
  • Cells can be of human origin (autologous or allogenic) or from an animal source (xenogenic), or genetically engineered.
  • Non-limiting examples of cells include side population (SP) cells, lineage negative (Lin ) cells including Lin “ CD34 " , Lin ' CD34 + , Lin " cKit + , mesenchymal stem cells including mesenchymal stem cells with 5-aza, cord blood cells, cardiac or other tissue derived stem cells, whole bone marrow, bone marrow mononuclear cells, endothelial progenitor cells, skeletal myoblasts or satellite cells, muscle derived cells, go cells, endothelial cells, adult cardiomyocytes, Fibroblasts, smooth muscle cells, adult cardiac fibroblasts + 5-aza, genetically modified cells, tissue engineered grafts, MyoD scar fibroblasts, pacing cells, embryonic stem cell clones, embryonic stem cells, fetal or neonatal cells, immunologically masked cells, and teratoma derived cells.
  • SP side population
  • Lin lineage negative
  • Lin lineage negative
  • Lin cKit +
  • any suitable polymer-drug conjugate may also be used.
  • the macromolecules used for the preparation of the conjugate should be selected to be pharmaceutically acceptable, e.g., water-soluble, nontoxic, and nonimmunogenic molecules, with suitable functional groups for attaching the therapeutic agent or drug.
  • suitable polymers include HPMA, PRG, poly(glutamic acid) (PG), and albumin.
  • polymer-drug conjugate includes a biologically acceptable polymer in combination with a therapeutic agent, and includes polymer- protein conjugates as well as polymeric micelles comprising a therapeutic agent.
  • polymer-drug conjugates examples include paclitaxel-polyglutamate conjugates, everolimus-polyglutamate conjugates, doxorubicin-HPMA copolymer conjugates, and polyethylene glycol (PEG)-camptothecin conjugates. See, e.g., Ruth Duncan, "The Dawning Era of Polymer Therapeutics," Nature Reviews: Drug Discovery, 2:347-360 (May 2003) and Rainer Haag and Felix Kratz, "Polymer Therapeutics: Concepts and Applications,' '1 Angew. Chem. Int. Ed, 45: 1 198-1215 (2006).
  • any of the therapeutic agents may be combined to the extent such combination is biologically compatible.

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Abstract

L'invention concerne des procédés pour l'application d'un revêtement exempt de polymère sur un dispositif médical au moyen d'un dépôt électrolytique de plasma. Ledit procédé consistant à : (i) appliquer facultativement un pré-revêtement de métal sur un dispositif médical ; (U) placer le dispositif médical dans une solution d'électrolyte inclusant un électrolyte ; et (Ui) établir un potentiel électrique sous des conditions de dépôt électrolytique de plasma entre une électrode et le dispositif médical, de telle sorte que les conditions de dépôt électrolytique de plasma soient adéquates pour entraîner un dépôt de la solution d'électrolyte sur la surface du dispositif médical et former le revêtement. L'invention concerne également des compositions de revêtement et des dispositifs médicaux revêtus, comme des endoprothèses vasculaires, fabriqués selon ces procédés. Le besoin est, le revêtement exempt de polymère peut être un revêtement d'élution de médicament.
PCT/US2007/020124 2006-10-05 2007-09-18 Revêtements exempts de polymère pour dispositifs médicaux formés par dépôt électrolytique de plasma WO2008045184A1 (fr)

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