WO2008038383A1

WO2008038383A1 - Inspection equipment and inspection method

Info

Publication number: WO2008038383A1
Application number: PCT/JP2006/319357
Authority: WO
Inventors: Yoshikazu Sakaguchi; Koji Namiki
Original assignee: Pioneer Corporation; Pioneer Fa Corporation
Priority date: 2006-09-28
Filing date: 2006-09-28
Publication date: 2008-04-03
Also published as: CN101278181A; CN101278181B; JPWO2008038383A1; JP4588788B2

Abstract

Inspection equipment for inspecting a relatively large quantity of inspection objects, i.e. packages for piezoelectric element, in a short time by correctly performing airtight inspection to a small package for piezoelectric element to shorten the inspection time as compared that required for general inspection equipment and making the inspection equipment relatively compact. The inspection equipment (1) performs airtight inspection to an electronic component (a package for piezoelectric element) (2) wherein a piezoelectric element is sealed airtightly. The inspection equipment comprises a section (1401)(a pressurization chamber (140), a pressurizing unit (146)) for pressurizing the periphery of the package (2) for piezoelectric element under a state where the package (2) is placed in the freely opening/closing pressurization chamber (140), a section (145) for measuring the impedance of the package (2) placed in the pressurizing section (1401), and a control section (17) for calculating a variation amount from the impedance measured at the measuring section (145) when a pressure is applied and not applied, and judging poor airtightness of the electronic component by comparing the variation with a set value.

Description

Specification

Inspection device and inspection method

Technical field

[0001] The present invention relates to an inspection apparatus and an inspection method.

Background art

[0002] An electronic component in which a piezoelectric element such as a crystal resonator is hermetically sealed has, for example, a case in which the piezoelectric element is sealed and the package has poor airtightness, that is, a leak occurs. In this case, the electrical characteristics of the piezoelectric element are affected and the reliability is lowered. For this reason, in general, an electronic component is manufactured by hermetically sealing a piezoelectric element, and then an airtightness inspection, so-called leak inspection, is performed.

As a method for leak inspection, various inspection methods such as a bubble leak test method, a differential pressure type air leak test method, and an impedance measurement method by pressure change are known, for example.

[0004] The measurement method of the bubble leak test method includes, for example, immersing a piezoelectric element package in which a piezoelectric element to be inspected is hermetically sealed in a fluorine-based inert liquid heated to about 120 ° C by a heater or the like. Then, the inside of the knocker is expanded to visually inspect the bubbles from the leak (leak) inside the knocker.

[0005] The differential pressure type air leak test method measures the pressure fluctuation due to leakage (leakage) by placing a package for the piezoelectric element to be inspected in a sealed capsule and enclosing a certain amount of compressed air. Compared with a master package, specifically a reference package that does not leak, the pressure difference is measured by a differential pressure sensor to perform an airtight inspection of the piezoelectric element package (for example, Patent Documents 1 and 2). reference).

[0006] The impedance measurement method based on pressure changes is based on measuring the package for a piezoelectric element to be inspected in an air atmosphere and a vacuum atmosphere, and determining whether the impedance changes due to the pressure difference at that time. Detect (see, for example, Patent Document 3).

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2000-121486

Patent Document 2: Japanese Patent Publication No. 7-104224 Patent Document 3: Japanese Patent Laid-Open No. 11-51802

Disclosure of the invention

Problems to be solved by the invention

However, in the inspection method using the bubble leak test method, since the package for the piezoelectric element to be inspected is inspected by immersing it in a fluorine-based inert liquid, it requires a relatively long inspection time. There are problems such as low reliability of visual inspection of bubbles.

[0009] Furthermore, in the inspection method of the differential pressure type air leak test method described in Patent Documents 1 and 2, for example, since the package size force for the piezoelectric element becomes small, the package capacity also becomes small. The difference cannot be measured accurately, and there are problems such as the volume of the chamber and the leak of the chamber itself greatly affecting the inspection.

[0010] For example, in the measurement method described in Patent Document 3, it is necessary to prepare an evacuation apparatus for creating a vacuum state during measurement. In addition, this method has problems such as that it takes a long time to reach the specified degree of vacuum, so that the inspection time is relatively long, the vacuum apparatus is relatively large, and a relatively large installation space is required.

In addition, an inspection apparatus capable of inspecting a relatively large amount of packages for piezoelectric elements to be inspected with high efficiency and in a short time is desired!

[0012] The present invention is directed to addressing such a problem as an example. That is, accurate airtight inspection of small packages for piezoelectric elements, shortening the inspection time compared with general inspection devices, making inspection devices relatively small, and relatively large amounts of piezoelectric objects to be inspected It is an object of the present invention to inspect a device package in a short time. Means for solving the problem

[0013] In the present invention, one of the objects is to solve the above-mentioned problems!

The invention according to claim 1 is an inspection device that performs an airtight inspection of an electronic component in which a piezoelectric element is hermetically sealed, and the electronic component is installed in a pressure chamber that can be freely opened and closed. A pressurizing unit that pressurizes the periphery of the sensor, a measuring unit that measures the impedance of the electronic component installed in the pressurizing unit, and an impedance force change amount during non-pressurization and pressurization measured by the measurement unit And a determination unit that compares the amount of change with a set value to determine that the airtightness of the electronic component is poor. [0014] The invention of claim 11 is an inspection method for performing an airtight inspection of an electronic component in which a piezoelectric element is hermetically sealed, and the electronic component is installed in a pressurizable chamber that can be opened and closed. A step of pressurizing the periphery of the electronic component, a step of measuring the impedance of the electronic component installed in the pressurizing chamber, and calculating a measured amount of change in the impedance force during non-pressurization and pressurization. Comparing the amount of change with a set value and determining that the airtightness of the electronic component is poor.

Brief Description of Drawings

FIG. 1 is an overall configuration diagram for explaining an inspection apparatus according to a first embodiment of the present invention.

2 is a perspective view of the entire inspection apparatus 1 shown in FIG.

FIG. 3 is a diagram for explaining a piezoelectric element package 2 to be inspected according to the present invention. (A) is a plan view through the cover 23 of the piezoelectric element package 2, and (B) is a cross-sectional view taken along the line AA of the piezoelectric element package 2 shown in (A).

4 is a top view for explaining a holding part 131 formed on the index table 13 shown in FIG. 1. FIG.

FIG. 5 is a view for explaining holding part 131 and lid part 141 shown in FIG. 1.

FIG. 6 is a top view for explaining a holding part 131 according to another embodiment.

FIG. 7 is a view for explaining a holding part 131 and a lid part 141 according to another embodiment.

FIG. 8 is a flowchart for explaining the overall operation of the inspection apparatus 1 shown in FIG.

FIG. 9 is a flowchart for explaining the operation related to the pressurized leak inspection process of the inspection apparatus 1 shown in FIG. 1.

FIG. 10 is a diagram showing a change amount of a CI value of a piezoelectric element during pressurization.

FIG. 11 is a diagram showing the change amount R of the CI value when leakage occurs in the piezoelectric element package during pressurization and when there is no leakage.

FIG. 12 is a graph showing the change over time in the amount of change in CI value when a piezoelectric element package in which leakage occurs is pressurized to 0.1 lMPa to 0.5 MPa.

FIG. 13 is a diagram showing the amount of change in CI value by a conventional vacuum measurement method for a plurality of packages 2 for piezoelectric elements.

FIG. 14 shows a plurality of piezoelectric element packages 2 shown in FIG. 13 according to the present invention. It is a figure which shows the variation | change_quantity of CI value by the pressurization leak measuring method of a.

FIG. 15 is an overall configuration diagram for explaining an inspection apparatus 1A according to a second embodiment of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION

[0016] The invention according to an embodiment of the present invention is an inspection device that performs an airtight inspection of an electronic component in which a piezoelectric element is hermetically sealed, and the electronic component is installed in an openable and closable pressurizing chamber. A pressure unit that pressurizes the periphery of the electronic component in a state; a measurement unit that measures the impedance of the electronic component installed in the pressurization unit; and a non-pressurized and a pressurized state measured by the measurement unit The impedance of the electronic component also includes a determination unit that calculates a change amount, compares the change amount with a set value, and determines that the airtightness of the electronic component is poor.

[0017] In the inspection apparatus having the above-described configuration, the electronic component is pressurized around the electronic component while the electronic component is installed in a pressurizing chamber that can be opened and closed by the pressurizing unit, and the electric component installed in the pressurizing unit is measured by the measuring unit. The impedance of the child component is measured, and the discriminating unit calculates the amount of change in the impedance force during non-pressurization and pressurization measured by the measurement unit. Is determined to be defective.

For example, the discriminating unit determines the impedance based on the measured impedance value at the time of non-pressurization measured by the measuring unit, specifically, the atmospheric pressure (1 atmospheric pressure) and the measured impedance value when the electronic component is pressurized. The amount of change is calculated, and if the amount of change in impedance is greater than or equal to the set value within the pressurization time, it is determined that the leak is poor and the amount of change in impedance is less than the set value. It is determined that the airtightness is good, assuming that the standard airtightness is secured.

Hereinafter, an inspection apparatus according to an embodiment of the present invention will be described with reference to the drawings.

[0019] [First embodiment]

FIG. 1 is an overall configuration diagram for explaining an inspection apparatus according to a first embodiment of the present invention. FIG. 1 is a top view of the inspection apparatus 1. FIG. 2 is a perspective view of the entire inspection apparatus 1 shown in FIG.

The inspection apparatus 1 performs an airtight inspection of an electronic component in which, for example, a piezoelectric element is hermetically sealed as an object to be inspected. The electronic component according to the present embodiment is, for example, a surface mount electronic component. In detail, the piezoelectric element package 2 has a piezoelectric element hermetically sealed. For example, a piezoelectric element package 2 in which a piezoelectric element such as a crystal resonator is hermetically sealed has an electrical characteristic in which the impedance of the piezoelectric element changes depending on the pressure inside the package. The inspection apparatus 1 according to this embodiment measures the impedance of the piezoelectric element by pressurizing the piezoelectric element package in which the piezoelectric element is hermetically sealed, and the impedance for the piezoelectric element is changed when the pressure is not applied and when the pressure is applied. It is determined that the airtightness is poor.

As shown in FIGS. 1 and 2, for example, the inspection apparatus 1 according to the present embodiment includes an alignment supply unit 11, a conveyance supply unit 12, an index table 13, a pressure leak inspection unit 14, a conveyance unit 15 (pick-up unit). A second place portion 15A), a storage portion 16, and a control portion 17. The control unit 17 is connected to each component via a signal line such as a data line or an optical fiber, and controls each component in an integrated manner.

For example, the alignment supply unit 11, the conveyance supply unit 12, the index table 13, the pressure leak detection unit 14, the conveyance unit 15, the storage unit 16, and the like are placed on the base 10.

[0022] The alignment supply unit 11 and the conveyance supply unit 12 correspond to an embodiment of the transfer unit according to the present invention. The index table 13 corresponds to an embodiment of the index table according to the present invention. The pressurized leak inspection unit 14 corresponds to an embodiment of the pressurized leak inspection unit according to the present invention. The transport unit 15 corresponds to an embodiment of the transport unit according to the present invention. The control unit 17 corresponds to an embodiment of the control unit according to the present invention.

The alignment supply unit 11 accommodates, for example, a plurality of piezoelectric element packages 2 that are electronic components to be inspected, and distinguishes and aligns the front and back of the piezoelectric element package 2. The alignment supply unit 11 includes a parts feeder unit 111 placed on the base 10 as shown in FIGS. The parts feeder unit 111 includes, for example, a bowl feeder (container) 111A and a linear feeder 111B. The bowl feeder 111 (accommodating section) 111A accommodates, for example, a plurality of piezoelectric element packages 2, and after the front and back surfaces and polarity of the piezoelectric element package 2 are discriminated by a drive mechanism, they are aligned. Output to linear feeder 111B. The linear feeder 111B conveys the piezoelectric element package 2 aligned by the bowl feeder (container) 111A to the end of the linear feeder 111B.

FIG. 3 is a diagram for explaining a piezoelectric element package 2 to be inspected according to the present invention. It is. Specifically, Fig. 3 (A) is a plan view through the cover 23 of the piezoelectric element package 2, and Fig. 3 (B) is an A—A line of the piezoelectric element package 2 shown in Fig. 3 (A). FIG.

[0025] The piezoelectric element package 2 includes, for example, as shown in FIGS. 3A and 3B, a piezoelectric element 21, a conductive adhesive 213, a case internal electrode 214, a case 22, a case cover 23, and a brazing material. 24, and external electrode 25. The sealed space 26 sealed by the case 22 and the case cover 23 is defined in a vacuum state, for example. Alternatively, an inert gas 27 may be sealed in the sealed space 26. The pressure of the inert gas 27 in the sealed space 26 is set to a specified pressure such as atmospheric pressure. The pressure in the package is appropriately set according to the characteristics of the piezoelectric element package 2.

As the piezoelectric element 21 according to the present embodiment, for example, a piezoelectric vibrator device such as a crystal vibrator can be adopted. In addition, the piezoelectric element 21 according to the present embodiment has a characteristic that the impedance changes according to a change in pressure inside the package.

The piezoelectric element 21 includes a crystal piece 210 and excitation electrodes 211 and 212 as shown in FIGS. 3 (A) and 3 (B), for example. As shown in FIGS. 3 (A) and 3 (B), excitation electrodes 211 and 212 are formed on both surfaces of the crystal piece 210, and the ends of the excitation electrodes 211 and 212 are connected to the conductive adhesive 21. 3 is supported and fixed to the case internal electrode 214. The excitation electrodes 211 and 212 are electrically connected to the external electrode 25 via the conductive adhesive 213 and the case internal electrode 214. Further, both ends or one ends of the crystal piece 210 are supported by the support base 22A of the case 22 by the conductive adhesive 213, and are specifically supported so as not to suppress vibration.

The piezoelectric element 21 may have various shapes, characteristics, functions, and the like that are not limited to those described above.

[0028] The case 22 is formed of various materials such as ceramic and resin, and as shown in FIGS. 3 (A) and 3 (B), a support base 22A is formed, and the piezoelectric element 21 is placed on the support base 22A. It is provided.

[0029] The case cover 23 is formed in a substantially plate shape from various materials such as metal, ceramics, glass, and resin, and is hermetically bonded and sealed to the case 22 via a brazing material (adhesive) 24. It is.

The brazing material (adhesive) 24 is provided between the case 22 and the case cover 23. For the brazing material 24, various brazing materials such as alloys such as Ag—Cu and Au—Sn, solder, and glass can be employed. The brazing material 24 is not limited to the above-mentioned form, but it may be hermetically sealed with Ni as a brazing material, such as parallel seam welding.

[0031] The external electrode 25 is formed, for example, on at least the bottom or side of the piezoelectric element package 2, and is electrically connected to the excitation electrodes 211 and 212.

In the piezoelectric element 21 in the piezoelectric element package 2 having the above-described configuration, when the pressure inside the package changes due to, for example, leakage, the impedance of the piezoelectric element 21 changes due to the pressure change.

As shown in FIGS. 1 and 2, the transport supply unit 12 transfers the piezoelectric element package 2 to a holding unit (work holder) 131 formed on the index table 13, for example, under the control of the control unit 17. Included. Specifically, the transport supply unit 12 includes a pick and place unit 12A. The pick-and-place unit 12A is a transport port bot that includes a plurality of heads 12B that can adsorb and detach the piezoelectric element package 2, for example, and that the heads 12B can move along the XZ-axis direction. The pick and place unit 12A according to the present embodiment has an eight-unit head 12B, and each head 12B is provided with a vacuum sensor.

The pick-and-place unit 12A having the above-described configuration attracts the piezoelectric element package 2 from the linear feeder 111B of the part feeder unit 111 by the head 12B, and the head 12B is mounted on the index table 13 and held. The piezoelectric element package 2 is moved onto the part 131 to be detached, and the piezoelectric element package 2 is transferred to the holding part 131.

The index table 13 is formed in a circular shape, for example, and has a holding part 131 on the upper surface side. The holding portion 131 constitutes a part of the pressurizing chamber 140 and can accommodate and hold one or a plurality of piezoelectric element packages 2. As shown in FIGS. 1 and 2, in the index table 13 according to the present embodiment, a plurality of holding portions 131 are formed at equal intervals along the circumferential direction. Specifically, as shown in FIGS. 1 and 2, four holding portions 131 are arranged on the index table 13 along the circumferential direction. The index table 13 is formed to be rotatable along the circumferential direction. For example, index tape A rotation drive unit 135 having a drive motor and a rotation mechanism is formed in the cylinder 13. The control unit 17 controls the rotation driving unit 135 to rotate the index table 13 along the circumferential direction at a specified timing.

In addition, as shown in FIG. 1, around the index table 13, a conveyance supply unit (transfer unit) 12, a pressure leak inspection unit 14, and a conveyance unit 15 are sequentially arranged at specified intervals along the circumferential direction. It is arranged.

[0036] The index table 13 according to the present embodiment includes, for example, a workpiece (electronic component) input stage, a pressure leak inspection stage, a non-defective / defective product classification stage, and an empty check stage at a specified interval along the circumferential direction. It rotates in order.

FIG. 4 is a top view for explaining the holding part 131 formed in the index table 13 shown in FIG. FIG. 5 is a view for explaining the holding part 131 and the lid part 141 shown in FIG. FIG. 6 is a top view for explaining a holding part 131 according to another embodiment. FIG. 7 is a view for explaining a holding part 131 and a lid part 141 according to another embodiment.

As shown in FIGS. 4 and 5, the holding part 131 has a work holding pocket 132 and a packing 133 provided around the work holding pocket 132.

The workpiece holding pocket 132 is formed in, for example, a rectangular shape and a concave shape, and positioning is possible by accommodating the piezoelectric element package 2 therein. In the holding part 131 according to the present embodiment, a plurality of workpiece holding pockets 132, for example, eight workpiece holding pockets 132 as shown in FIG. 4, are formed in series at regular intervals. The holding portion 131 is not limited to the above-described form, and the work holding pockets 132 may be formed in a plurality of rows, for example, two rows, three rows or more.

As shown in FIG. 5, the lid 141 forms a part of the pressurizing chamber 14 and can hermetically seal the holding part 131 formed on the index table 13. That is, the pressurizing chamber 140 corresponds to a sealed space formed by the holding part 131 and the lid part 141. For example, as shown in FIGS. 1 and 5, the lid 141 is provided with a driving unit 149 that drives the lid 141 to move in a specified direction, for example, the vertical direction. The control unit 17 can control the driving unit 149 to seal the holding unit 131 with the lid unit 141. Further, as shown in FIGS. 6 and 7, for example, the holding portion 131 may have a configuration in which a plurality of work pockets 132 are formed in a relatively large recess.

[0040] Further, the terminal part 142 that can be electrically connected to the electrode part 25 of the piezoelectric element package 2 in which the one end part 142A is connected to the measuring part 141 and the other end part 142B is held by the holding part 131, It is formed on one of the holding part 131 and the lid part 141. The terminal portion 142 according to the present embodiment is formed at a position corresponding to the work holding pocket 132 in the lid portion 141 as shown in FIG.

[0041] In addition, formed in the holding portion 131 or the lid portion 141 constituting a part of the pressurizing chamber 140 capable of flowing a gas of a specified pressure from the pressurizing device 146 into the pressurizing chamber 140 !, The In the present embodiment, for example, as shown in FIG. 5, the air passage 134 is formed inside the rectangular holding portion 131 along the longitudinal direction with the force on one end portion of the holding portion 131 directed toward the other end portion. ing. Further, as shown in FIG. 5, a through hole 1341 is formed between the air passage 134 and the work holding pocket 132. The air passage 134 is not limited to the above-described form. For example, the formation position and shape of the inlet 134A of the air passage 134 may be appropriately set as long as the gas of the specified pressure from the pressurizing device 146 can flow in.For example, the bottom surface portion and the side surface portion of the holding portion 131 The upper surface portion and the like may be set as appropriate. Further, a vent hole that communicates with the vent path 134 and penetrates the index table 13 in the vertical direction may be provided. In other words, the gas force of the specified pressure from the pressurizing device 146 may flow into the pressurizing chamber 140 through the vent and the vent passage.

Further, as described above, the pressurizing chamber 140 corresponds to a state in which the holding part 131 having the above configuration is hermetically sealed by the lid part 141. That is, the pressurizing chamber 140 is formed to be openable and closable. The pressurizing chamber 140 in which the piezoelectric element package 2 is accommodated can be pressurized by flowing a gas such as an inert gas from the pressurizing device 146 through the air passage 134 and the through hole portion 1341. The pressurizing device 146 and the pressurizing chamber 140 correspond to the pressurizing unit 1401.

[0043] During the pressurization measurement, the impedance of the piezoelectric element 21 in the piezoelectric element package 2 is measured by pressurizing the periphery of the piezoelectric element package 2 in a state where the holding part 131 is hermetically sealed by the lid part 141. Is done. At the time of non-pressurization measurement, the cover part 141 is attached to the holding part 131, and a state where no gas flows in, that is, an atmospheric pressure state where no pressure is applied is obtained. The pressure leak inspection unit 14 includes a lid 141 that can hermetically seal the holding unit 131, a terminal 142, a measurement unit 145 (crystal impedance: CI value measurement unit), and a pressure device 146. Description of the above-described configuration is omitted.

The measuring unit 145 measures the impedance of the piezoelectric element 21 of the piezoelectric element package 2. For example, when a crystal resonator is adopted as the piezoelectric element 21 of the piezoelectric element package 2, the measurement unit 145 measures the crystal impedance of the crystal resonator. In addition, the measuring unit 145 according to the present embodiment measures the impedance of the piezoelectric element package 2 installed in the pressing unit.

In addition, the measurement unit 145 applies an oscillation signal such as a low frequency of 10 MHz to 40 MHz and a high frequency of 40 MHz to 60 MHz to the piezoelectric element 21 of the piezoelectric element package 2 by, for example, an oscillation circuit, and causes the piezoelectric element 21 to oscillate. Then, the impedance of the piezoelectric element 21 is measured.

Then, measurement unit 145 outputs a signal indicating the measurement result to control unit 17. Based on the signal output from the measurement unit 145, the control unit 17 calculates the amount of change in impedance force between the non-pressurization and the pressurization measured by the measurement unit 145, and compares the change amount with a set value. Thus, it is determined that the airtightness of the piezoelectric element package 2 is poor. The function of the control unit 17 corresponds to the determination unit 171. In other words, the discriminating unit 171 calculates the amount of change in impedance force between the non-pressurized state and the pressurized state measured by the measuring unit 145, and compares the amount of change with the set value. Determine that there is.

The measurement unit 145 is not limited to the above-described embodiment, and may measure various characteristics such as impedance and frequency characteristics of the piezoelectric element by other measurement methods, for example.

[0047] The pressurizing device 146 supplies an inert gas such as compressed air or compressed nitrogen (N) at a specified pressure.

2

It is a device to do. As the pressure source, for example, compressed air, compressed nitrogen, or a compressed tank in which an inert gas is stored, a pump, or the like piped at the manufacturing site can be employed. Further, under the control of the control unit 17, the surroundings of the piezoelectric element package 2 are pressurized in a state where the piezoelectric element package 2 is installed in the pressurizing chamber 140.

The transfer unit 15 takes out the piezoelectric element package 2 from the holding unit 131 formed on the index table 13, for example, and places the piezoelectric element package at a position according to the determination result of the determination unit 171. Transport knock 2.

As shown in FIGS. 1 and 2, the transport unit 15 includes a pick and place unit 15A. The pick-and-place unit 15A is, for example, a transport robot that includes a plurality of heads that can adsorb and detach the piezoelectric element package 2, and the heads can move along the XZ-axis direction. The pick-and-place unit 15A according to the present embodiment has an eight-unit head, and each head is provided with a vacuum sensor.

The pick-and-place unit 15A having the above configuration attracts the piezoelectric element package 2 on the holding unit 131 by the head and moves the head onto the housing unit 16 to detach the piezoelectric element cage 2. Thus, the piezoelectric element package 2 is transported to a position corresponding to the determination result of the determination unit 171.

As shown in FIG. 1, the storage unit 16 includes a storage box 1601 that stores the piezoelectric element package 2. The storage box 161 is disposed on a moving device that can move along a specified direction, for example, the Y-axis direction, and can move in the specified direction, for example, under the control of the controller 17.

The storage box 161 according to the present embodiment includes, for example, a plurality of boxes, and specifically includes a non-defective product box 161A and an NG (defective product) box 161B as shown in FIG. The non-defective box 161A and the NG box 161B are arranged at predetermined positions. For example, the non-defective box 161A and the NG box 161B may be moved and arranged at a specified position under the control of the control unit 17.

[0051] The non-defective product box 161A accommodates, for example, the piezoelectric element package 2 that is determined to be non-defective without leak being detected by the pressure leak test. In addition, the non-defective box 161 A may contain, for example, the piezoelectric element package 2 that has passed other inspections other than the pressurized leak inspection and has been determined to be non-defective.

In the NG box 161B, for example, the piezoelectric element package 2 that has been determined to be a defective product by detecting a leak by pressure leak inspection is housed. In the NG box 161B, for example, the piezoelectric element package 2 that has been determined to be defective by other inspections may be accommodated. [0052] For example, the control unit 17 controls the pick and place unit 15A, and adsorbs a good piezoelectric element package 2 on the holding unit 131 according to the determination result of the determination unit 171 to block the pick and place. The piezoelectric element package 2 is moved to the non-defective box 161 A to be attached to and removed from the non-defective box 161A, and is stored in the non-defective box 161A. The package 2 is adsorbed, the head is moved onto the NG (defective product) box 161B, and the piezoelectric element package 2 is detached and accommodated in the NG box 161B.

The control unit 17 controls the entire inspection apparatus, for example. Specifically, for example, the control unit 17 implements functions according to the present invention, such as a determination unit and various control functions, by executing a program 172 stored in a memory or the like. Further, the control unit 17 uses, for example, a computer having an input device such as a keyboard and a mouse, a memory, a display device, an output device, a CPU (Central Process Unit), a hard disk drive (HDD), an external storage device, and the like. Thus, the functions according to the present invention may be realized.

In addition, the control unit 17 calculates the amount of change in the impedance force measured by the measurement unit 145 during non-pressurization and during pressurization, and compares the variation with a set value to obtain a package for a piezoelectric element. The function of the determination unit 171 is realized by determining that the airtightness of 2 is poor.

The determination unit 171 may determine that the airtightness of the piezoelectric element package 2 is poor based on, for example, the time change amount (slope) of the impedance change amount, which is not limited to the above embodiment. That is, the determination unit 171 determines that the airtightness is poor when the time change amount (slope) of the impedance change amount is equal to or larger than the set value, and determines that the airtightness is good when the impedance change amount is smaller than the set value. .

Further, the control unit 17 controls the rotation of the index table 13 along the circumferential direction at a predetermined timing, and at least a transfer unit (alignment supply) arranged at a predetermined interval along the circumferential direction of the index table. Unit 11, conveyance supply unit 12), pressure leak inspection unit 14, and conveyance unit 15 are processed in parallel.

Detailed functions and operations of the control unit 17 will be described later.

FIG. 8 is a flowchart for explaining the overall operation of the inspection apparatus 1 shown in FIG. The operation of the inspection apparatus 1 will be described with reference to FIG. The control unit 17 of the inspection apparatus 1 The process of transferring the piezoelectric element package 2 as a sub-part to the holding part 131 of the index table 13, the pressure leak inspection process, the classification process based on the result of the pressure leak inspection process, etc. are performed in parallel. It is not limited to this form.

[0057] As shown in FIGS. 3 (A) and 3 (B), with the piezoelectric element 21 placed in the case 22, the case cover 23 is hermetically sealed through the brazing filler metal 24 for the piezoelectric element. Make package 2. Next, the inspection device 1 inspects the piezoelectric element package 2.

[0058] In step S1, the control unit 17 of the inspection apparatus 1 first, as shown in FIGS. 1 and 2, the piezoelectric element package 2 to be inspected is the bowl feeder (container) 111A of the parts feeder unit 111. In this state, the parts feeder 111 is controlled to determine the front and back sides and polarity of the piezoelectric element package 2 by the drive mechanism, and then aligned, and the piezoelectric element package 2 is aligned to the linear feeder 111B. .

Next, the control unit 17 controls the conveyance supply unit 12 to transfer the piezoelectric element package 2 from the parts feeder unit 111 to the index table 13 on the holding unit 131 by the pick and place unit 12A. Perform the process described. Specifically, as shown in FIG. 4, the pick and place unit 12A places the piezoelectric element package 2 in each of the plurality of work holding pockets 132 formed in the holding unit 131. At this time, the pick-and-place part 12A is placed such that the external electrode 25 of the piezoelectric element package 2 is on the upper side, for example.

[0059] In step S3, the control unit 17 controls the rotation driving unit 135 to rotate the index table 13 along the circumferential direction at a specified timing. Specifically, as shown in FIG. 1, the control unit 17 rotates the holding unit 131 of the index table 13 from the transfer position to the arrangement position of the pressure leak inspection unit 14. In the present embodiment, the index table 13 rotates 90 degrees.

Next, the control unit 17 controls the driving unit 149 to move the lid 141 downward, and the holding unit 131 is hermetically sealed by the lid 141.

The control unit 17 performs pressure leak measurement of the piezoelectric element package 2 in the pressurizing chamber 140, and determines the airtightness of the piezoelectric element package 2 based on the measurement result. Details will be described later.

[0061] In step S5, the control unit 17 controls the drive unit 149, for example, after measuring the pressure leak. Then, the lid 141 is moved upward. Next, the control unit 17 controls the rotation driving unit 135 to rotate the index table 13 along the circumferential direction at a specified timing. Specifically, as shown in FIG. 1, the control unit 17 rotates the holding unit 131 of the index table 13 from the caloric pressure leak measurement position to the arrangement position of the pick and place unit 15A of the transport unit 15. In this embodiment, the index table 13 is rotated 90 degrees.

Next, as shown in FIGS. 1 and 2, the control unit 17 controls the pick-and-place unit 15 A of the transport unit 15 to take out the piezoelectric element package 2 on the holding unit 131 and determine the determination unit 171. The piezoelectric element package 2 is transported through the accommodating portion 16 to a position corresponding to the discrimination result. For example, the control unit 17 controls the pick-and-place unit 15A to transfer the piezoelectric element package 2 determined to be a non-defective product to the non-defective product box 161A, and to determine that the piezoelectric element package 2 is determined to be defective. Is transferred to NG box 161 B.

[0063] Next, in step S7, the control unit 17 controls the rotation driving unit 135 to rotate the index table 13 by a specified angle along the circumferential direction at a specified timing. Specifically, the control unit 17 rotates the index table 13 by 90 degrees. At that time, the control unit 17 images the holding unit 131 by, for example, an imaging unit (not shown), and based on the imaging result, the work holding pocket 132 internal force piezoelectric element package 2 of the holding unit 131 is removed and becomes empty. It is determined whether or not it is not. For example, when the control unit 17 determines that the piezoelectric element package 2 remains in the workpiece holding pocket 132 of the holding unit 131, for example, the controller 17 drives the pressurizing device 146 to compress the piezoelectric material from the workpiece holding pocket 132 by compressed gas. Precise processing such as processing to remove the device package 2 is performed.

Next, the control unit 17 controls the rotation driving unit 135 to rotate the index table 13 by a specified angle along the circumferential direction at a specified timing, and returns to the process of step S1.

That is, as described above, the control unit 17 controls the rotation of the index table 13 along the circumferential direction at a prescribed timing, and is disposed at a prescribed interval along at least the circumferential direction of the index table 13. The transfer unit (conveyance supply unit 12), the pressure leak inspection unit 14, and the conveyance unit 15 are processed in parallel.

FIG. 9 is a flowchart for explaining the operation related to the pressurized leak inspection process of the inspection apparatus 1 shown in FIG. The operation of the inspection apparatus 1 will be described with reference to FIG. In Step Sl l, the piezoelectric element package 2 is installed in the pressurizing chamber 140 that can be opened and closed. Specifically, as described above, the control unit 17 performs a process of transferring the piezoelectric element package 2 onto the holding unit 131 provided in the index table 13 by the pick and place unit 12A. At this time, the pick-and-place unit 12A is placed such that the external electrode 25 of the piezoelectric element package 2 is on the upper side, for example.

In step S 13, the control unit 17 drives the drive unit 149 to seal the holding unit 131 with the lid unit 141. That is, the piezoelectric element package 2 is installed in the pressurizing chamber 140 as described above. In this non-pressurized state, the control unit 17 also connects the impedance of the piezoelectric element 21 (crystal impedance: CI value) via the terminal part 142 electrically connected to the electrode part 25 of the piezoelectric element package 2. Is measured by the measuring unit 145, and the measurement result by the measuring unit 145 is stored in a memory or the like. The CI value at the time of non-pressurization (atmospheric pressure (1 atm)) may be used as the reference value according to the present invention.

In step S15, the control unit 17 performs a process of pressurizing the periphery of the piezoelectric element package 2 in a state where the piezoelectric element package 2 is installed in the pressurizing chamber 140. Specifically, the control unit 17 drives the pressurizing device 146 to apply a gas such as an inert gas having a predetermined pressure into the pressurizing chamber 140 through the air passage 134, so that the piezoelectric element package 2. Pressurize around.

[0068] In step S17, the control unit 17 pressurizes the periphery of the piezoelectric element package 2 via the terminal part 14 2 electrically connected to the electrode part 25 of the piezoelectric element package 2. Then, the impedance (CI value) of the piezoelectric element 21 is measured by the measuring unit 145, and the measurement result by the measuring unit 145 is stored in a memory or the like.

[0069] In step S19, the control unit 17 calculates the measured amount of change in the impedance force during non-pressurization and during pressurization, compares the amount of change with the set value, and then compares the piezoelectric element package 2 with the set value. It is determined whether the airtightness is poor.

FIG. 10 is a diagram showing the amount of change in the CI value of the piezoelectric element during pressurization. The horizontal axis shows pressure P (unit: kPa), and the vertical axis shows the amount of change in CI value (unit: Ω). The reference value of CI value corresponds to the CI value at atmospheric pressure (1 atm), for example. FIG. 11 is a diagram showing the change amount R of the CI value when leakage occurs in the piezoelectric element package during pressurization and when there is no leakage. Horizontal axis is pressurized The time T (unit: second) is shown, and the vertical axis shows the CI value change amount R (unit: Ω).

FIG. 12 is a diagram showing the change over time in the amount of change in the CI value when the piezoelectric element package in which leakage occurs is pressurized to 0.1 MPa to 0.5 MPa. The vertical axis is the amount of change R (unit: Ω) of the CI value at the time of leak, and the horizontal axis is the pressurization time T (unit: seconds). The piezoelectric elements used in Figs. 10 to 12 are quartz resonators with a frequency of 26. OMHz.

For example, as shown in FIG. 10, the piezoelectric element 21 has a characteristic that the amount of change in the CI value increases according to the pressure applied to the piezoelectric element package 2.

As a characteristic of the piezoelectric element package 2 according to the present embodiment, as shown in FIG. 11, for example, when leakage occurs in the piezoelectric element package 2, compared with the non-pressurized state, Since the internal pressure of the piezoelectric element package 2 at the time of measuring the pressure increases, the CI value of the piezoelectric element 21 during pressurization changes compared to the CI value of the piezoelectric element 21 during non-pressurization. The amount of change is relatively large. On the other hand, when there is no leak, the airtightness in the piezoelectric element package 2 is maintained, so that the pressure in the piezoelectric element package 2 during pressurization does not change or changes in pressure compared to when no pressure is applied. Since the amount is relatively small, the change amount R of the CI value of the piezoelectric element 21 is zero, or the change amount R of the CI value is relatively small and smaller than the specified value.

In detail, as shown in FIG. 11, the characteristics of the piezoelectric element package 2 include leakage of the piezoelectric element package 2 during pressurization. The amount of change R with the CI value at the time becomes greater than the set value (eg 2 Ω), for example, the amount of change RNG of the CI value RNG (when 0.2 MPa is applied) is about Ω Ω. On the other hand, if there is no leak, the airtightness in the piezoelectric element package 2 is maintained, so that the pressure in the piezoelectric element package 2 during pressurization does not change compared to when no pressure is applied. Or, since the pressure change amount is relatively small, the CI value change amount RG of the piezoelectric element 21 is zero, or the CI value change amount RG is relatively small and smaller than the set value.

Specifically, as shown in FIG. 11, the determination unit 171 calculates an impedance change amount R at the time of non-pressure mouth pressure and pressurization measured by the measurement unit 145, and calculates the change amount R as Compared with the preset set value Rth (step S19), there is no leakage when the impedance change amount R is smaller than the set value Rth, for example, depending on the result of the comparison (step S21). Package (electronic component) 2 has good airtightness, and the piezoelectric element package 2 is determined to be good (step S23), and the piezoelectric element package 2 determined to be non-defective is classified and accommodated. Housed in part 16 (step S25).

The control unit 17 performs classification according to the result of the determination unit 171 and, in detail, performs a process of storing the piezoelectric element package 2 determined to be non-defective in the non-defective box 161 A of the storage unit 16. (Step S25).

On the other hand, in step S19, as shown in FIG. 11, the determination unit 171 calculates the impedance change amount R between the non-pressurization and the pressurization measured by the measurement unit 145, and the change As a result of comparing the amount R with the preset value Rth, for example, there is a leak when the impedance change amount is greater than or equal to the set value Rth (step S27), and the airtightness of the piezoelectric element package (electronic component) 2 is It is determined that it is defective (step S29). The control unit 17 performs classification according to the result of the discriminating unit 1701, and in detail, performs processing for accommodating the piezoelectric element package 2 that is discriminated as a defective product in the defective product box 161B of the storage unit 16 ( Step S25).

In addition, as described above, the control unit 17 calculates the change amount R from the non-pressurization impedance and the pressurization impedance measured by the measurement unit, and compares the change amount with a set value. Since it is determined that the package 2 for the piezoelectric element is defective in airtightness, as shown in FIG. With Ω, it is possible to determine whether the airtightness is good in about 1 to 3 seconds.

As shown in FIG. 12, the greater the pressurization pressure, the greater the fluctuation amount of the CI value at the time of leakage of the piezoelectric element package 2, and the shorter the time for determining the airtightness. For details, as shown in Fig. 12, when the pressurization time is 5 seconds, when the pressure is 0. IMPa, the CI value fluctuation amount R force 2 Ω, pressure 0.2 MPa, 5 Ω, pressure 0.3 MPa In this case, it is 8.72 Ω, 13.5 Ω when the pressure is 0.4 MPa, and 19.5 Ω when the pressure is 0.5 MPa. In other words, since the amount of fluctuation of the CI value increases as the caloric pressure increases, the defect of the piezoelectric element package 2 can be determined with high accuracy. In addition, the larger the pressurizing pressure, the more accurately the defect of the piezoelectric element package 2 can be determined in a short time.

[0080] The pressure applied to the piezoelectric element package 2 is preferably, for example, a value of 0.2 MPa to 0.5 MPa. This pressure of 0.2 MPa to 0.5 MPa is used to manufacture the piezoelectric element package 2. It can be easily prepared by using compressed air or compressed nitrogen or a pressure tank or a pressurizing device that are generally piped in the field. In addition, as described above, it is possible to determine whether the piezoelectric element package 2 is airtight or not with high accuracy even when the compressed air is set at a pressure of 0.2 to 0.5 MPa or set time.

Further, the pressurizing pressure is not limited to the above-described embodiment, and may be, for example, a pressure of 0.5 MPa or more. In this case, the present invention can be easily implemented by preparing a structure of a pressurizing device, a cylinder, and a pressurizing leak inspection unit 14 for relatively high pressure.

[0081] [Comparison of conventional vacuum measurement method and pressurized leak measurement method according to the present invention]

In order to confirm the effect according to the present invention, the inventor of the present application uses the conventional vacuum measurement method and the pressure leak measurement method according to the present invention to determine the amount of change in the CI value for a plurality of packages 2 for piezoelectric elements. Measurements were made for comparison.

FIG. 13 is a diagram showing the amount of change in CI value by the conventional vacuum measurement method for a plurality of piezoelectric element packages 2. In detail, in FIG. 13, the vertical axis represents the CI value change amount R (unit: Ω), and the horizontal axis represents the evacuation time (unit: second). FIG. 14 is a diagram showing the amount of change in the CI value of the plurality of piezoelectric element packages 2 shown in FIG. 13 by the 0.2 MPa pressurized leak measurement method according to the present invention. The vertical axis shows the amount of change in CI value R (unit: Ω), and the horizontal axis shows the evacuation time (unit: seconds). In FIGS. 13 and 14, for example, the measured values of each of the two packages for the piezoelectric element 2 are distinguished by line types such as a solid line, a broken line, and a two-dot chain line. The piezoelectric elements used in Figs. 13 and 14 are quartz resonators with a frequency of 26. OMHz.

As shown in FIG. 13, in a general impedance measurement method using reduced pressure, it takes a long time to reach a specified vacuum level, so the inspection time is relatively long. For example, when the impedance change amount R setting value Rth is ± 2 Ω, that is, when the impedance change amount is ± 2 Ω or more, it is determined whether all five packages 2 for piezoelectric elements are good or bad. 10 seconds or more is required. On the other hand, as shown in FIG. 14, in the inspection apparatus 1 according to the present invention, it is possible to determine whether all five packages 2 for piezoelectric elements are good or bad in about 3 seconds or less (in the case of Dalos leak). In the impedance measurement method shown in FIG. 14, the pressurization pressure is 0.2 MPa, and the pass / fail judgment can be made in a shorter time by increasing the pressurization pressure.

More specifically, as shown in FIGS. 13 and 14, the piezoelectric element package 2 having a larger leakage amount is obtained. In a short time, the piezoelectric element package 2 with a large CI value variation R and a small leak amount has a smaller CI value variation R, and therefore the inspection time becomes longer. As shown in FIGS. 13 and 14, in the pressurized leak measurement method according to the present invention, as shown in FIGS. 13 and 14, the piezoelectric element package 2 with a relatively large amount of leakage and a piezoelectric with a relatively small amount of leakage are shown. Both the device package 2 can determine whether the airtightness is good or not in a short time compared to the conventional vacuum measurement method.

[0085] [Second Embodiment]

FIG. 15 is an overall configuration diagram for explaining an inspection apparatus 1A according to the second embodiment of the present invention. Specifically, FIG. 15 is a top view of the inspection apparatus 1A. A description of the same configuration, operation, effects, and the like as in the first embodiment will be omitted.

As shown in FIG. 15, the inspection apparatus 1A according to the present embodiment includes an alignment supply unit 11, a transport supply unit 12, an index table 13, a first inspection unit 50, a first inspection measurement unit 51, and a pressure leak. The inspection unit 14, the second inspection unit 60, the second inspection measurement unit 61, the transport unit 15 (pick and place unit 15 A), the storage unit 16, and the control unit 17 are included. For example, the alignment supply unit 11, the transport supply unit 12, the index table 13, the first inspection unit 50, the pressure leak inspection unit 14, the second inspection unit 60, the transport unit 15, the storage unit 16, etc. are on the base 10. It is placed.

The first inspection unit 50 and the first inspection / measurement unit 51 inspect one of the characteristics of the piezoelectric element package 2 (electronic component) other than the impedance. The second inspection unit 60 and the second inspection / measurement unit 61 inspect one of the characteristics other than the impedance of the characteristic of the piezoelectric element package 2 (electronic component).

For example, the first inspection unit 50, the first inspection measurement unit 51, the second inspection unit 60, and the second inspection measurement unit 62 correspond to an embodiment of the inspection unit.

The control unit 17 causes the transfer unit 12, the inspection unit 50, the pressure leak inspection unit 14, and the transport unit 15 to be processed in parallel, which are arranged at specified intervals along the circumferential direction of the index table 13. More specifically, the control unit 17 according to the present embodiment includes the transfer unit 12, the inspection unit 50, the pressure leak inspection unit 14, and the inspection unit 60 that are arranged at specified intervals along the circumferential direction of the index table 13. The transport unit 15 is processed in parallel.

Further, for example, the first inspection unit 50 and the first inspection / measurement unit 51 inspect one of the characteristics of the piezoelectric element package 2 other than the impedance. For example, the first inspection unit 50, The first inspection / measurement unit 51 inspects the low drive characteristic and frequency characteristic of the piezoelectric element 21. Furthermore, the pressure leak inspection unit 14 and the measurement unit 15 may simultaneously measure impedance and frequency identification. Further, the second inspection unit 60 and the second inspection unit measurement unit 61 measure other characteristics of the piezoelectric element 21 such as capacitance.

For example, the first inspection unit 50 has one end connected to the first inspection measurement unit 51 and the other end connected to the holding unit 131 in order to inspect the low drive characteristics and frequency characteristics of the piezoelectric vibrator. A terminal portion that can be electrically connected to the electrode portion 25 of the held piezoelectric element package 2 is provided. The first inspection / measurement unit 51 measures low drive characteristics and frequency characteristics of the piezoelectric element package 2 connected via the terminal unit, and outputs a signal indicating the measurement result to the control unit 17.

In addition, the second inspection unit 60 has one end connected to the second inspection measurement unit 61 and the other end connected to the holding unit 131 in order to inspect other characteristics of the piezoelectric vibrator, for example, capacitance. A terminal portion that can be electrically connected to the electrode portion 25 of the held piezoelectric element package 2 is provided. The second inspection / measurement unit 61 measures other characteristics, for example, capacitance, of the piezoelectric element package 2 connected via the terminal unit, and outputs a signal indicating the measurement result to the control unit 17.

In the inspection apparatus 1A having the above-described configuration, for example, after the piezoelectric element package 2 is transferred onto the holding unit 131 of the index table 13 by the transport supply unit 12, the first inspection unit 50, the first inspection measurement unit 51 To check the low drive characteristics and frequency characteristics, and then perform the pressure leak inspection by the pressure leak inspection section 14 and then the second inspection section 60 and the second inspection measurement section 61 to check the piezoelectric element package 2 After measuring other characteristics, such as capacitance, it is accommodated in the accommodating part 16 by the conveying part 15.

The control unit 17 performs parallel processing on the various functional units and performs processing for rotating the index table 13 in the circumferential direction at a predetermined angle at a predetermined timing.

Note that the present invention is not limited to the above-described embodiment. The above embodiments may be combined. Further, the piezoelectric element package 2 according to the above embodiment is not limited to the above-described embodiment. For example, an electronic component hermetically sealed with a piezoelectric element such as a crystal resonator.

In addition, the inspection apparatus 1 was performed using a circular index table 13, but this It is not limited to the state.

As described above, the inspection apparatus 1 according to the present invention is an inspection apparatus that performs an airtight inspection of an electronic component (piezoelectric element package) 2 in which piezoelectric elements are hermetically sealed, and is openable and closable. A pressurizing unit 1401 (pressurizing chamber 140, pressurizing device 146) that pressurizes the periphery of the piezoelectric element package 2 in a state where the piezoelectric element package 2 is installed in the pressurizing chamber 1401, and a pressurizing unit (Pressure chamber 140, pressurization device 146) The measurement unit 145 that measures the impedance of the piezoelectric element package 2 installed in the pressure chamber 140, and the impedance force measured by the measurement unit 145 when not pressurized and when pressurized Since the change amount is calculated, and the change amount is compared with a set value to determine that the airtightness of the electronic component is poor, the determination unit 171 is included, so that the inspection time is shortened compared with a general inspection apparatus. be able to.

Further, since it is not necessary to provide a vacuum apparatus as compared with the conventional inspection apparatus, the inspection apparatus 1 can be made relatively small.

In addition, it is possible to accurately inspect a small piezoelectric element package.

In addition, the inspection apparatus 1 constitutes a part of the pressurizing chamber 140 and can hold and hold one or a plurality of piezoelectric element packages 2 and one pressurizing chamber 140. And a holding part 131 which can be hermetically sealed, and formed on one of the lid part 141 and the holding part 131, with one end connected to the measuring part 141 and the other end held. The terminal portion 142 that can be electrically connected to the electrode portion 25 of the piezoelectric element package 2 held by the portion 131, and one or both of the lid portion 141 and the holding portion 131, and in the pressurizing chamber 140 Therefore, the openable and closable pressurizing chamber 140 according to the present invention can be configured with a simple configuration. Further, the piezoelectric element package 2 in the pressurizing chamber 140 can be pressurized with a simple configuration.

In addition, in the measurement unit 141, the piezoelectric element package 2 is installed in the pressurizing chamber 140 sealed by the holding unit 131 and the lid unit 141, and a gas having a specified pressure is applied via the air passage 134. The piezoelectric element package 2 (electronic component) applied in the pressure chamber 140 is pressurized and the impedance is passed through the terminal part 142 electrically connected to the electrode part 25 of the piezoelectric element package 2. Therefore, it is possible to easily measure the impedance of the piezoelectric element 21 in the pressurizing chamber 140, and to easily determine whether the piezoelectric element package 2 is airtight. Can be determined.

In addition, in the inspection apparatus 1, a plurality of holding portions 131 are provided at regular intervals along the circumferential direction, the index table 13 that is rotatable along the circumferential direction, and a holding portion formed on the index table 13 131 includes a transfer part 12 for transferring the piezoelectric element package 2 and a lid part 141, and a pressure leak inspection part 14 for measuring the impedance of the piezoelectric element package 2 installed in the pressure part 1401; Then, the piezoelectric element package 2 is taken out from the holding part 131 formed on the index table 13, and transported to a position according to the determination result of the determination part 171 and the index table 13 in the circumferential direction at a specified timing. The transfer unit 12, the pressure leak inspection unit 14, and the transport unit 15 that are arranged at a specified interval along at least the circumferential direction of the index table 13 are processed in parallel. Since having a that control section 17, can be tested relatively large amounts of packages 2 piezoelectric element to be inspected in a short time.

In addition, the pressurized leak inspection unit 14 according to the present invention can inspect a relatively large number of the piezoelectric element packages 2 by inspecting the plurality of piezoelectric element packages 2 held by the holding unit 131 in parallel. Can be processed in time.

[0099] Further, the piezoelectric element has a test unit 50, 60 for inspecting any one of the characteristics of the piezoelectric element package 2 other than the impedance, for example, a low drive characteristic or a frequency characteristic of the piezoelectric element 21. The control unit 17 performs parallel processing on the transfer unit 12, the inspection unit 50, the pressure leak inspection unit 14, and the transport unit 15 that are arranged at a predetermined interval along at least the circumferential direction of the index table 13. The characteristics of the piezoelectric element package 2 other than the pressure leak inspection can be inspected in parallel.

[0100] Further, by using, for example, 0.2 MPa to 0.5 MPa as the pressure by the pressurizing unit 1401, it is possible to easily determine whether the piezoelectric element package 2 is airtight or not with high accuracy. In addition, this pressure can be easily prepared by using compressed air or compressed nitrogen or a pressure tank or a pressurizing device generally piped at the manufacturing site of the piezoelectric element package 2. it can.

Claims

The scope of the claims

[1] An inspection apparatus that performs an airtight inspection of an electronic component in which a piezoelectric element is hermetically sealed, and pressurizes the periphery of the electronic component in a state where the electronic component is installed in an openable / closable pressurizing chamber. Pressure part,

A measuring unit for measuring the impedance of the electronic component installed in the pressurizing unit; and calculating a change amount of the impedance force at the time of non-pressurization and pressurization measured by the measurement unit, and setting the change amount as a set value And a determination unit for determining that the airtightness of the electronic component is poor,

An inspection apparatus comprising:

[2] A holding portion that constitutes a part of the pressurizing chamber and that can accommodate and hold one or a plurality of the electronic components;

A lid that forms a part of the pressurizing chamber and that can hermetically seal the holding portion; and is formed on one of the lid and the holding portion, and has one end connected to the measuring portion; A terminal part that is electrically connectable to the electrode part of the electronic component, the other end part of which is held by the holding part;

An air passage that is formed in one or both of the lid portion and the holding portion, and that can flow a gas of a specified pressure into the pressurizing chamber;

The inspection apparatus according to claim 1, further comprising:

[3] In the measurement unit, the electronic component is installed in the pressurizing chamber sealed by the holding unit and the lid unit, and a gas having a specified pressure enters the pressurizing chamber through the vent. 3. The impedance is measured through the terminal portion electrically connected to the electrode portion of the electronic component in a state where the periphery of the electronic component is applied and pressurized. The inspection device described.

[4] The inspection apparatus according to [2], wherein the holding portions are provided at regular intervals along the circumferential direction, and have an index table that is self-rotating along the circumferential direction.

[5] a transfer unit that transfers the electronic component to the holding unit formed in the index table;

Measure the impedance of the electronic component installed in the pressure unit, including the lid A pressure leak inspection unit,

The holding unit force formed on the index table, taking out the electronic component, and conveying the unit to a position according to the determination result of the determination unit;

The index table is rotationally controlled along a circumferential direction at a prescribed timing, and at least arranged at a prescribed interval along the circumferential direction of the index table, the transfer unit, the pressure leak inspection unit, and the 5. The inspection apparatus according to claim 4, further comprising: a control unit that performs parallel processing on the transport unit.

6. The inspection apparatus according to claim 4, wherein the pressure leak inspection unit inspects the plurality of electronic components of the holding unit in parallel.

[7] It has an inspection part for inspecting any of the characteristics of the electronic component other than the impedance,

The control unit performs parallel processing on the transfer unit, the inspection unit, the pressurized leak inspection unit, and the transport unit, which are arranged at a predetermined interval along at least a circumferential direction of the index table. The inspection device according to claim 5.

8. The inspection apparatus according to claim 7, wherein the inspection unit inspects low drive characteristics or frequency characteristics of the piezoelectric vibrator.

[9] The piezoelectric element includes a crystal resonator,

The inspection apparatus according to claim 1, wherein the measurement unit measures a crystal impedance of the crystal resonator.

[10] The inspection apparatus according to claim 1, wherein the pressure applied by the pressurizing unit is 0.2 MPa to 0.5 MPa.

[11] An inspection method for performing an airtight inspection of an electronic component in which a piezoelectric element is hermetically sealed, the step of pressurizing the periphery of the electronic component in a state where the electronic component is installed in an openable / closable pressurizing chamber When,

A step of measuring the impedance of the electronic component installed in the pressurizing chamber, and calculating a measured amount of change in impedance force at the time of non-pressurization and pressurization, and comparing the amount of change with a set value, Determining that the airtightness of the electronic component is poor; An inspection method characterized by comprising: