JP2000208861A - Manufacturing method and equipment of semiconductor laser device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an equipment which is capable of automating processes where an optical pickup semiconductor laser device is assembled and checked. SOLUTION: A process where a semiconductor laser chip and a photodetector are built in a package mounted on a lead frame and fed to a feed section; and another process where a package is transferred to an automation unit from the feed section, a hologram device is built in the package, and the package is checked; are provided. The automation unit is equipped with a light- current characteristics check section 4, a resin application section 5, a hologram device transfer section 6, a hologram device aligning section 7, a resin application section 8, a resin setting section 9, and a mounting check section 10. These sections are arranged in regular order on a turn table. By this setup, in the manufacture of an optical pickup semiconductor laser device, very precise assembly and check operations can be automatically carried out, so that automation of the manufacturing process of a semiconductor laser device can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a semiconductor laser device for an optical pickup comprising a semiconductor laser, a light receiving element and a hologram element, and a glass plate having a semiconductor laser, a light receiving element and an optical diffraction grating. And a method of manufacturing a semiconductor laser device for an optical pickup.

[0002]

2. Description of the Related Art A semiconductor laser device for an optical pickup comprising a semiconductor laser, a light receiving element and a hologram element,
The process of assembling a semiconductor laser device for an optical pickup composed of a semiconductor laser, a light receiving element, and a glass substrate having a diffraction grating has a plurality of processes, and requires high-precision assembly and high-precision inspection. There is a process. Conventionally, there is no automated device having these multiple steps, and assembly has been performed using a manual device or a jig.

[0003]

However, in the above-mentioned conventional manufacturing apparatus and jigs, there is a limit to the number that can be manufactured while maintaining high cost while maintaining high-precision assembly and high-precision inspection. There was a problem with conversion. As described above, there is little need for automation in terms of mass production quantity, and automation has not been performed for reasons of capital investment in automatic equipment.

Accordingly, an object of the present invention is to solve the above-mentioned problems and to provide a method and an apparatus for manufacturing a semiconductor laser device which realizes mass production of the semiconductor laser device.

[0005]

In order to achieve the above object, a method of manufacturing a semiconductor laser device according to the first aspect of the present invention comprises assembling a semiconductor laser chip and a light receiving element into a package mounted on a lead frame. And feeding the package from the supply unit to the automation unit, assembling the hologram element to the package, and inspecting the package.

As described above, the semiconductor laser chip and the light receiving element are assembled into a package mounted on a lead frame and supplied to a supply section. The package is transported from the supply section to an automation unit, and the hologram element is assembled into the package and inspected. Therefore, in a semiconductor laser device for an optical pickup including a semiconductor laser, a light receiving element, and a hologram element, a plurality of highly accurate assembling and inspection can be automatically performed. Therefore, automation of the manufacturing process of the semiconductor laser device can be realized.

According to a second aspect of the present invention, there is provided a method of manufacturing a semiconductor laser device according to the first aspect, wherein the semiconductor laser device is supplied to the supply unit in individual package units. In this way, since the individual units are supplied to the supply unit, the devices determined to be defective in the automation unit can be discharged, and only non-defective products flow, so that no loss occurs in the next step.

According to a third aspect of the present invention, there is provided a method of manufacturing a semiconductor laser device, comprising: assembling a semiconductor laser chip and a light receiving element into a package mounted on a lead frame and supplying the package to a supply unit; The automation unit includes a resin application step of applying a resin to a joint between the package and the hologram element. As described above, since the automation unit includes the resin application step of applying the resin to the joint between the package and the hologram element, the automation of the resin application step can be realized very efficiently.

According to a fourth aspect of the present invention, there is provided a method of manufacturing a semiconductor laser device, comprising: assembling a semiconductor laser chip, a light receiving element, and a hologram element into a package mounted on a lead frame and supplying the package to a supply section; The automation unit includes a mounting inspection step of performing a characteristic inspection in a mounted state. As described above, since the automation unit includes the mounting inspection process for performing the characteristic inspection in the mounted state, the automation of the mounting inspection process can be realized very efficiently.

According to a fifth aspect of the present invention, there is provided a method of manufacturing a semiconductor laser device, comprising: assembling a semiconductor laser chip and a light receiving element into a package mounted on a lead frame and supplying the package to a supply unit; Transporting, assembling a glass plate having an optical diffraction grating into the package, and inspecting the glass plate.

As described above, the semiconductor laser chip and the light receiving element are assembled into a package mounted on a lead frame and supplied to the supply section, and the package is transported from the supply section to the automation unit, and the package has an optical diffraction grating. Since the glass plate is assembled and inspected, a plurality of highly accurate assembling and inspection can be automatically performed in a semiconductor laser device for an optical pickup including a semiconductor laser, a light receiving element, and a glass plate having a diffraction grating. Therefore, automation of the manufacturing process of the semiconductor laser device can be realized.

According to a sixth aspect of the present invention, in the method of manufacturing a semiconductor laser device according to the fifth aspect, the semiconductor laser device is supplied to the supply unit in units of individual packages. In this way, since the individual units are supplied to the supply unit, the devices determined to be defective in the automation unit can be discharged, and only non-defective products flow, so that no loss occurs in the next step.

According to a seventh aspect of the present invention, there is provided a method of manufacturing a semiconductor laser device, comprising: mounting a hologram element on a semiconductor laser device having a package in which a semiconductor laser chip and a light receiving element are bonded; and mounting inspection using a simple pickup optical system. The process includes a process of aligning the optical axis of the hologram element while performing the process, bonding and sealing with a resin, and a process of performing a mounting inspection using an actual pickup optical system.

As described above, the hologram element is mounted on the semiconductor laser device having the package in which the semiconductor laser chip and the light receiving element are bonded, and the optical axis of the hologram element is aligned while performing the mounting inspection using the simple pickup optical system. Since bonding and sealing are performed using a resin and mounting inspection using an actual pickup optical system is performed, a plurality of high-precision assembling and inspection can be automatically performed. In this case, the automation of the manufacturing process of the semiconductor laser device capable of aligning the optical axis of the semiconductor laser chip, the light receiving element, and the hologram element can be realized.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor laser device, comprising: measuring a polarization ratio of a semiconductor laser device having a package in which a semiconductor laser chip and a light receiving element are bonded; A step of mounting a glass plate having, a step of bonding the package and the glass plate with a resin, a step of measuring the spread angle of the laser light, a step of measuring the position of the light emitting point of the laser light with respect to the package, and the characteristics of the laser wave. Inspecting.

As described above, the polarization ratio of a semiconductor laser device having a package in which a semiconductor laser chip and a light receiving element are bonded is measured, a glass plate having an optical diffraction grating is mounted on the semiconductor laser device, and the package and the glass plate are mounted. By bonding with resin, measuring the spread angle of the laser light, measuring the position of the light emitting point of the laser light with respect to the package, and inspecting the characteristics of the laser wave, multiple high-precision assembly and inspection can be performed automatically. . In this case, it is possible to automate the manufacturing process of the semiconductor laser device capable of measuring and inspecting the polarization ratio of the semiconductor laser device, the spread angle of the laser light, the position of the light emitting point of the laser light, and the characteristics of the laser wave.

According to a ninth aspect of the present invention, there is provided an apparatus for manufacturing a semiconductor laser device, comprising: a supply section for supplying a semiconductor laser chip and a light receiving element to a package mounted on a lead frame; a transport section for transporting the package; A rotatable turntable on which the package conveyed is mounted, and a plurality of assembling and inspection steps performed by rotating the turntable one pitch at a time on the turntable to perform a hologram element or optical diffraction. An automatic unit for assembling a glass plate having a lattice into a package.

As described above, the supply unit that supplies the semiconductor laser chip and the light receiving element to the package mounted on the lead frame and supplies the package, the transport unit that transports the package, and the package transported by the transport unit are placed. A rotatable turntable, and a plurality of assembling and inspection steps performed by rotating the turntable one pitch at a time on the turntable to assemble a hologram element or a glass plate having an optical diffraction grating into a package. Since an automation unit is provided, it is possible to realize automation of a manufacturing process of a semiconductor laser device for an optical pickup composed of a semiconductor laser, a light receiving element, and a hologram element or a semiconductor laser, a light receiving element, and a glass plate having an optical diffraction grating,
A new product that has never existed can be provided.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a block diagram of a semiconductor laser device manufacturing apparatus for accurately assembling and inspecting a hologram element on a lead frame to which a semiconductor laser chip and a light receiving element are bonded according to a first embodiment of the present invention. 2 (a) is a perspective view of a lead frame according to the embodiment of the present invention, (b) is an enlarged view of a plastic package unit portion of the lead frame, and FIG. 3 (a) is an ultraviolet curing type according to the embodiment of the present invention. FIG. 4B is a process diagram of applying an adhesive, FIG. 4B is a process diagram of placing the hologram element on a plastic package, FIG. 4C is a process diagram of applying an ultraviolet-curing adhesive to a joint between the plastic package and the hologram device, and FIG. FIG. 4 is a process chart for performing positioning of the hologram element according to the embodiment of the present invention.

As shown in FIG.
Has a plurality of plastic packages 13, a laser chip 14 and a light receiving element chip 15 are bonded, and connected by bonding wires. As shown in FIG. 1, a lead frame 12 is supplied to a lead frame supply section 1, and is transported one by one to a turntable 3 by a lead frame transport section 2. On the turntable 3,
The respective steps for assembling the semiconductor laser device are arranged in order, and all the steps are assembled by rotating the turntable 3 by one pitch. In this case, the light-current characteristic inspection unit 4, the resin application unit 5, the hologram element transfer unit 7, the hologram element positioning unit 7, the resin application unit 8, the resin curing unit 9, and the mounting inspection unit 10 are provided on the turntable 3. Automation units are located. By these steps on the turntable 3, the hologram element 17 is assembled to the package 13 and inspected as shown in FIG.

Hereinafter, each of the assembling steps will be described in order.

First, in the light-current characteristic inspection section 4,
Measure the operating current of the laser and measure the characteristics of the laser wave. Next, in the resin application section 5, as shown in FIG. 3A, an ultraviolet curable adhesive 16 is applied on the plastic package 13, and in the hologram element transfer section 6,
As shown in FIG. 3B, the hologram element 17 is placed on the adhesive applied portion. At this time, by performing the drying in an atmosphere of a dry inert gas such as nitrogen gas, oxygen and moisture in the space around the laser chip 14 and the light receiving element chip 15 surrounded by the plastic package 13 and the hologram element 17 can be removed. It is possible to prevent oxidation of the chip 14 and the light receiving element chip 15 and to prevent dew condensation inside the hologram element 17.

Next, in the hologram element positioning section 7, the optical axes of the laser chip 14, the light receiving element chip 15, and the hologram element 17 bonded on the lead frame 12 are aligned. That is, as shown in FIG. 4, the plastic package 13 is fixed in the hologram element positioning unit 7, the hologram element 17 is chucked by the claws 19 attached to the XY-θ stage 18, and the laser chip 14 emits light. The emitted laser light is transmitted through a collimator lens 20 and a collimator lens 21.
, Is reflected by the mirror 22, is reflected again by the collimator lens 21 and the collimator lens 20, passes through the hologram element 17, and passes through the hologram element 17.
5 on the light receiving element.

Next, the hologram element 17 is moved while observing the signal from the light receiving element, the position of the hologram element 17 is stopped at the position where the optical axis is aligned, and the hologram element 17 is adhered and fixed to the plastic package 13 by irradiating ultraviolet rays. I do. Next, the nail 19 is opened and the plastic package 13 is opened.
Release the regulations. Next, in the resin application section 8, FIG.
As shown in (c), an ultraviolet-curing adhesive 23 is applied to the joint between the hologram element 17 and the plastic package 13 adhered and fixed by the hologram positioning unit 7 and cured by irradiating ultraviolet rays in the resin curing unit 9. And
It increases airtightness and strength. Next, in the mounting inspection unit 10 to which the actual pickup optical system unit is attached, a characteristic inspection is performed in a mounted state, and a good product and a defective product are determined. Next, the lead frame is transported by the lead frame transport unit 2 and stored in the lead frame storage unit 11.

As described above, according to this embodiment,
By arranging the plurality of high-precision assembly / inspection process automation units on the turntable 3, automation of the semiconductor laser device manufacturing process can be realized. In this embodiment, an ultraviolet curable adhesive is used as the adhesive, but a thermosetting adhesive or the like may be used. Each of the assembling steps arranged on the turntable 3 can select whether or not to use it. For example, in this embodiment, there are two hologram alignment units 7, but it is possible to manufacture using only one hologram alignment unit 7 or to perform only the mounting inspection unit 10.

A second embodiment of the present invention will be described with reference to FIG.

FIG. 5 is a configuration diagram of an apparatus for manufacturing a semiconductor laser device according to a second embodiment of the present invention. In the first embodiment, the package form (conveyance form) of the semiconductor laser device is a lead frame unit, but in the second embodiment, it is an individual package unit. As shown in FIG.
This manufacturing apparatus includes a first turntable 27 and a second turntable 30. On the first turntable 27, the light-current characteristic inspection unit 4 and the defective discharge unit 2
8 automation units, and on the second turntable 30, the resin coating unit 5, the hologram element transfer unit 6, the hologram element positioning unit 7, and the automation unit of the defective discharge unit 31 are arranged. In FIG. 5, reference numeral 24 denotes a device supply unit, 25 denotes a device storage unit, 26 denotes a device transport unit, and 29 denotes a device transfer unit.

Next, each step of the apparatus for manufacturing a semiconductor laser device having the above configuration will be described. Device supply unit 24
The semiconductor laser device in the form of an individual package is cut into a tray and set in a tray.
It is transported to the first turntable 27. Next, the first turntable 27 is rotated by one pitch, and the process of the light-current characteristic inspection unit 4 described in the first embodiment is performed.

Next, a defective discharge unit 28 is provided at a position where the first turntable 27 is rotated by one pitch, and the device determined to be defective by the light-current characteristic inspection unit 4 is discharged from the first turntable 27. Next, only the devices determined to be non-defective by the light-current characteristic inspection unit 4 are mounted on the second turntable 30 by the device transfer unit 29. On the second turntable 30, the resin coating section 5, the hologram element transfer section 6, and the hologram element positioning section 7 described in the first embodiment are arranged, and the respective steps are assembled. The device determined to be defective by the hologram element positioning unit 7 is discharged to the defective discharge unit 31.
The non-defective device in the hologram element alignment unit 7 is transferred to the first turntable 27 by the device transfer unit 29.
And stored in the device storage unit 25 by the device transport unit 26.

As described above, according to this embodiment, as in the first embodiment, it is possible to automate the manufacture of a plurality of highly accurate assembling and inspection processes of a semiconductor laser device. Also, a feature of this embodiment is that, since the transport mode of the device is an individual package unit, the device determined to be defective by the light-current characteristic inspection unit 4 can be discharged by the defective discharge unit 28, and the second turntable can be discharged. On the top 30, there is no loss in the next process because only good products flow. Also, the hologram element positioning unit 7
Since the device determined to be defective in is discharged to the defective discharge unit 31, only a non-defective product can be stored in the device storage unit 25, and no production loss occurs in the next process apparatus.
There is no need to provide a new function for determining good or defective products. In addition, it is possible to select whether or not to use each process, and to select a setting for preventing defective discharge. In this embodiment, it is needless to say that a thermosetting adhesive or the like can be used instead of the ultraviolet curing adhesive.

A third embodiment of the present invention will be described with reference to FIG.

FIG. 6 is a configuration diagram of an apparatus for manufacturing a semiconductor laser device according to a third embodiment of the present invention. In the third embodiment, the automation unit includes only a resin applying step of applying a resin to a joint between the package and the hologram element. As shown in FIG. 6, the manufacturing apparatus includes a transfer arm 35 and a turntable 36. An automation unit for the resin application unit 8 is arranged around the transfer arm 35, and an automation unit for the resin curing unit 37 is arranged on the turntable 36. In FIG. 6, 32 is a device supply unit, 33 and 38 are device transport units, and 39 is a device storage unit.

Next, each step of the apparatus for manufacturing a semiconductor laser device having the above configuration will be described. The device assembled by the semiconductor laser device manufacturing apparatus described in the second embodiment is set in the device supply unit 32 by a tray,
The packages are placed on the loading stage 34 one by one by the device transport unit 33. Next, the device on the loading stage 34 is sorted by the transfer arm 35 to four resin coating sections 8 arranged around the transfer arm 35. Next, in the resin application section 8, an ultraviolet curable adhesive 23 is applied as shown in FIG.
5 put on the turntable 36. In addition, there are four resin application sections 8, and each resin application section can individually select whether or not to use it. For example, it is possible to move the device using only three locations. Next, the turntable 36 is rotated, and the ultraviolet ray is irradiated by the resin curing section 37 to cure the ultraviolet curing adhesive 23, and is stored in the tray of the device storage section 39 by the device transport section 38.

As described above, according to this embodiment, a dedicated machine having only a resin coating unit is provided, and the automation of the resin coating process can be realized very efficiently. In addition, although four resin application parts 8 are arrange | positioned, this number is not restricted to this. Also in this embodiment, it is possible to use a thermosetting adhesive or the like instead of the ultraviolet curable adhesive.

A fourth embodiment of the present invention will be described with reference to FIG.

FIG. 7 is a configuration diagram of an apparatus for manufacturing a semiconductor laser device according to a fourth embodiment of the present invention. In the fourth embodiment, only the mounting inspection step is performed in which the automation unit performs a characteristic inspection in a mounted state. As shown in FIG. 7, the manufacturing apparatus includes a transfer arm 35, around which an automation unit of the mounting inspection unit 10 is arranged.
Other configurations are the same as those of the third embodiment.

Next, each step of the apparatus for manufacturing a semiconductor laser device having the above configuration will be described. The semiconductor laser device, which has been subjected to the resin coating process by the semiconductor laser device manufacturing apparatus described in the third embodiment, is set in the device supply section 32 by a tray. The device transport unit 33 places the devices set in the device supply unit 32 on the input stage 34 one by one. Next, the transfer arm 35 sorts the devices on the loading stage 34 to the mounting inspection units 10 arranged at four locations around the transfer arm 35. As described in the first embodiment, the mounting inspection unit 10 performs a characteristic inspection in a mounted state using a real pickup optical system unit, and determines a non-defective product or a defective product.
Although there are four mounting inspection units 10, each mounting inspection unit can individually select whether or not to use it. Next, the device determined as defective by the mounting inspection unit 10 by the transfer arm 35 is discharged to the defective discharge unit 36, and the device determined to be non-defective is taken out by the take-out stage 3.
7 Next, the device on the take-out stage 37 is stored in the tray of the device storage section 39 by the device transport section 38.

As described above, according to this embodiment,
This is a dedicated machine having only the mounting inspection unit, and can realize automation of the mounting inspection process very efficiently.
Although four mounting inspection units 10 are arranged, the number is not limited to this.

A fifth embodiment of the present invention will be described with reference to FIG.

FIG. 8 is a configuration diagram of a semiconductor laser device manufacturing apparatus according to a fifth embodiment of the present invention, and FIG. 9A is a diagram showing a glass plate having an optical diffraction grating according to the embodiment of the present invention in a plastic package. Process diagram for loading, (b)
FIG. 4 is a process diagram of applying a resin to a joint portion between the glass plate and the plastic package.

The lead frame supply section 1, lead frame transport section 2, turntable 3, and lead frame storage section 11 of FIG. 8 are the same mechanism as the semiconductor laser device manufacturing apparatus of the first embodiment. The lead frame 12 has a plurality of plastic packages 13 and the laser chip 1
4 and the light receiving element chip 15 are bonded, and are connected by bonding wires (FIG. 2). As shown in FIG. 8, the lead frame 12 is supplied to the lead frame supply unit 1 and transported one by one to the turntable 3 by the lead frame transport unit 2. On the turntable 3,
The respective steps for assembling the semiconductor laser device are arranged in order, and all the steps are assembled by rotating the turntable 3 by one pitch. In this case, the polarization ratio measuring unit 40, the resin coating unit 5, the glass transfer unit 41, the FFP measuring unit (vertical) 42, the FFP measuring unit (horizontal) 43, the light emitting point accuracy measuring unit 44, the resin An automation unit of the application unit 45, the resin curing unit 9, and the laser wave characteristic inspection unit 46 is provided. As shown in FIG. 9, a glass plate 49 having an optical diffraction grating is mounted on the package 13 and inspected by these steps on the turntable 3.

Hereinafter, each of the assembling steps will be described in order.

First, the polarization ratio is measured in the polarization ratio measuring section 40. Next, in the resin application section 5, as in the first embodiment, an ultraviolet curable adhesive 16 is applied to the plastic package 13 (FIG. 3A). next,
In the glass transfer section 41, as shown in FIG. 9A, a glass plate 49 having an optical diffraction grating is
6 is placed on the plastic package portion to which the adhesive 6 has been applied, and is irradiated with ultraviolet rays to cure the adhesive. When the glass plate is placed, the plastic package 13 and the glass plate 4 are placed in an inert gas atmosphere such as dry nitrogen gas.
9 and the laser chip 14 and the light receiving element chip 15 surrounded by
Since oxygen and moisture in the surrounding space can be removed, the laser chip 14 and the light receiving element chip 15 are prevented from being oxidized and the glass plate 49 is prevented.
It is possible to prevent condensation on the inside. Next, the FFP measuring unit (vertical) 42 and the FFP measuring unit (horizontal) 43 measure the spread angles of the laser light in the vertical and horizontal directions.

Next, the light emitting point accuracy measuring section 44 measures the position of the light emitting point of the laser beam with respect to the plastic package. Next, in the resin application section 45, FIG.
As shown in (b), an ultraviolet curable adhesive 50 is applied around the joint between the plastic package 13 and the glass plate 49. Next, in the resin curing section 9, ultraviolet rays are irradiated to cure the ultraviolet curing adhesive 50. Next, the laser wave characteristic inspection unit 46 measures the operating current of the laser and measures the characteristics of the laser wave. Next, the lead frame is transported by the lead frame transport unit 2 and stored in the lead frame storage unit 11.

As described above, according to this embodiment,
By arranging the plurality of high-precision assembly / inspection process automation units on the turntable 3, automation of the semiconductor laser device manufacturing process can be realized. In this embodiment, it is also possible to use a thermosetting resin or the like instead of an ultraviolet curable adhesive for the adhesive.

A sixth embodiment of the present invention will be described with reference to FIG.

FIG. 10 is a configuration diagram of a semiconductor laser device manufacturing apparatus according to a sixth embodiment of the present invention. Fifth
In this embodiment, the package form (transport form) of the semiconductor laser device is a lead frame unit, but in the sixth embodiment, it is an individual package unit. As shown in FIG. 10, the polarization ratio measuring unit 4
0, an automatic unit of the position accuracy measuring unit 44, the FFP measuring units 42 and 43, and the light-current characteristic inspecting unit 46 are arranged. In FIG. 10, reference numeral 24 denotes a device supply unit;
Denotes a device storage unit, 26 denotes a device transport unit, and 48 denotes a defective discharge unit.

Next, each step of the apparatus for manufacturing a semiconductor laser device having the above configuration will be described. Device supply unit 24
The semiconductor laser device in the form of an individual package is cut into a tray and set in a tray.
Place on turntable 47. Turntable 47 is 6
There are five stop positions, one of which is a loading / unloading position, and five of which are the stop position, the polarization ratio measuring unit 40 and the position accuracy measuring unit 4 used in the fifth embodiment.
4. FFP measuring units 42 and 43, light-current characteristic measuring unit 46
Are arranged, and the turntable is rotated one pitch at a time to inspect all processes. Next, the device determined to be defective in each inspection step by the device transport unit 26 is discharged to the defective discharge unit 48, and the device determined to be non-defective is stored in the device storage unit 25.

As described above, according to this embodiment,
As in the fifth embodiment, the manufacture of a plurality of highly accurate assembling and inspection processes of a semiconductor laser device can be automated. Also, a feature of this embodiment is that, since the transport mode of the device is an individual package unit, the device determined to be defective by the light-current characteristic measuring section 46 can be discharged by the defective discharging section 48 and the device storage section 25 can be discharged. Since only good products can be stored, no loss occurs in the next step. In addition, it is possible to select whether or not to use each process, and to select a setting for preventing defective discharge. In this embodiment, it is also possible to use a thermosetting adhesive or the like instead of the ultraviolet curable adhesive.

[0051]

According to the method of manufacturing a semiconductor laser device according to the first aspect of the present invention, the semiconductor laser chip and the light receiving element are assembled into a package mounted on a lead frame, supplied to the supply section, and supplied. Since the hologram element is assembled to the package after being transported from the section to the automation unit and inspected, a plurality of high-precision assembling and inspection are automatically performed in a semiconductor laser device for an optical pickup including a semiconductor laser, a light receiving element, and a hologram element. be able to. Therefore, automation of the manufacturing process of the semiconductor laser device can be realized.

According to the second aspect, since the supply unit supplies the individual packages, individual devices determined to be defective in the automation unit can be discharged, and only non-defective products flow, so that no loss occurs in the next step.

According to the method of manufacturing a semiconductor laser device according to the third aspect of the present invention, since the automation unit includes a resin coating step of coating a resin on a joint between the package and the hologram element, the resin coating is performed very efficiently. Automation of the process can be realized.

According to the method of manufacturing a semiconductor laser device according to the fourth aspect of the present invention, since the automation unit includes a mounting inspection step for performing a characteristic inspection in a mounted state, the automation of the mounting inspection step can be performed very efficiently. realizable.

According to the method of manufacturing a semiconductor laser device according to the fifth aspect of the present invention, the semiconductor laser chip and the light receiving element are assembled into a package mounted on a lead frame and supplied to a supply section, and the package is supplied from the supply section. Since it is transported to the automation unit and a glass plate having an optical diffraction grating is assembled and inspected in the package, multiple high-precision semiconductor laser devices composed of a semiconductor laser, a light receiving element, and a glass plate having a diffraction grating are used. Automatic assembly and inspection can be performed automatically. Therefore, automation of the manufacturing process of the semiconductor laser device can be realized.

According to the sixth aspect of the present invention, the power is supplied to the supply unit in units of individual packages. In this way, since the individual units are supplied to the supply unit, the devices determined to be defective in the automation unit can be discharged, and only non-defective products flow, so that no loss occurs in the next step.

According to the method of manufacturing a semiconductor laser device of the present invention, a hologram element is mounted on a semiconductor laser device having a package in which a semiconductor laser chip and a light receiving element are bonded, and a simple pickup optical system is used. Since the optical axis of the hologram element is aligned while performing the mounting inspection, and bonded and sealed with resin, and the mounting inspection is performed using the actual pickup optical system, multiple high-precision assembly and inspections are performed automatically. Can be. In this case, the automation of the manufacturing process of the semiconductor laser device capable of aligning the optical axis of the semiconductor laser chip, the light receiving element, and the hologram element can be realized.

According to the method of manufacturing a semiconductor laser device of the present invention, the polarization ratio of the semiconductor laser device having the package in which the semiconductor laser chip and the light receiving element are bonded is measured, and the light is applied to the semiconductor laser device. A glass plate with a diffraction grating is placed, the package and the glass plate are bonded with a resin, the spread angle of the laser light is measured, the position of the light emitting point of the laser light with respect to the package is measured, and the characteristics of the laser wave are inspected. High-precision assembly and inspection can be performed automatically. In this case, it is possible to automate the manufacturing process of the semiconductor laser device capable of measuring and inspecting the polarization ratio of the semiconductor laser device, the spread angle of the laser light, the position of the light emitting point of the laser light, and the characteristics of the laser wave.

According to the semiconductor laser device manufacturing apparatus of the ninth aspect of the present invention, the supply unit for supplying the semiconductor laser chip and the light receiving element by assembling the package mounted on the lead frame, and the transport for transporting the package. Unit, a rotatable turntable on which the package transported by the transport unit is placed, and a hologram that performs a plurality of assembly and inspection processes by rotating the turntable one pitch at a time on the turntable. An automatic unit for assembling a glass plate having an element or a light diffraction grating into a package is provided, so that a light composed of a semiconductor laser, a light receiving element, and a hologram element or a semiconductor laser, a light receiving element, and a glass plate having a light diffraction grating is provided. Automation of the manufacturing process of the semiconductor laser device for pickup can be realized,
A new product that has never existed can be provided.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an apparatus for manufacturing a semiconductor laser device according to a first embodiment of the present invention.

FIG. 2A is a perspective view of a lead frame according to the embodiment of the present invention, and FIG. 2B is an enlarged view of a single plastic package portion of the lead frame.

FIG. 3A is a process diagram of applying an ultraviolet-curable adhesive according to the first to third embodiments of the present invention, FIG. 3B is a process diagram of mounting a hologram element on a plastic package, and FIG. FIG. 4 is a process diagram of applying an ultraviolet curable adhesive to a joint between a plastic package and a hologram element.

FIG. 4 is a process chart for aligning the hologram elements in the first and second embodiments of the present invention.

FIG. 5 is a configuration diagram of an apparatus for manufacturing a semiconductor laser device according to a second embodiment of the present invention.

FIG. 6 is a configuration diagram of an apparatus for manufacturing a semiconductor laser device according to a third embodiment of the present invention.

FIG. 7 is a configuration diagram of a semiconductor laser device manufacturing apparatus according to a fourth embodiment of the present invention.

FIG. 8 is a configuration diagram of an apparatus for manufacturing a semiconductor laser device according to a fifth embodiment of the present invention.

FIG. 9 (a) is a process diagram of mounting a glass plate having an optical diffraction grating in a plastic package according to the fifth and sixth embodiments of the present invention, and FIG. 9 (b) is a view showing a joint between the glass plate and the plastic package. FIG. 3 is a process drawing for applying a resin.

FIG. 10 is a configuration diagram of an apparatus for manufacturing a semiconductor laser device according to a sixth embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Lead frame supply part 2 Lead frame conveyance part 3 Turntable 4 Light-current characteristic measurement part 5 Resin coating part 6 Hologram element transfer part 7 Hologram element positioning part 8 Resin coating part 9 Resin hardening part 10 Mounting inspection part 11 Lead Frame accommodating part 12 Lead frame 13 Plastic package 14 Semiconductor laser chip 15 Light receiving element chip 16 Ultraviolet curing adhesive 17 Hologram element 18 XY-θ stage 19 Claw 20 Collimator lens 21 Collimator lens 22 Mirror 23 Ultraviolet curing adhesive 24 Device supply unit 25 Device storage unit 26 Device transport unit 27 First turntable 28 Defective discharge unit 29 Device transfer unit 30 Second turntable 31 Defective discharge unit 32 Device supply unit 33 Device transport unit 34 Input stay 35 Transfer arm 36 Defective discharge unit 37 Removal stage 38 Removal stage 39 Device storage unit 40 Polarization ratio measurement unit 41 Glass transfer unit 42 FFP measurement unit (vertical) 43 FFP measurement unit (horizontal) 44 Light emitting point accuracy measurement unit 45 Resin coating Part 46 light-current characteristic measuring part 47 turntable 48 defective discharge part 49 glass plate 50 ultraviolet curing adhesive

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Isao Hayamizu 1-1, Komachi, Takatsuki-shi, Osaka Matsushita Electronics Co., Ltd. F-term (reference) 4M106 AA04 AA07 AA20 AB10 BA14 CA17 CA70 DH01 5F073 EA19 FA22

Claims (9)

[Claims] 1. A step of assembling a semiconductor laser chip and a light receiving element into a package mounted on a lead frame and supplying the package to a supply unit, transporting the package from the supply unit to an automation unit, and placing the hologram element in the package. A method of manufacturing a semiconductor laser device, comprising: assembling and inspecting. 2. The method for manufacturing a semiconductor laser device according to claim 1, wherein the semiconductor laser device is supplied to the supply unit in individual package units. 3. A method comprising: assembling a semiconductor laser chip and a light receiving element into a package mounted on a lead frame and supplying the package to a supply unit; and transporting the package from the supply unit to an automation unit. The method of manufacturing a semiconductor laser device, wherein the unit comprises a resin application step of applying a resin to a joint between the package and the hologram element. 4. A method comprising: assembling a semiconductor laser chip, a light receiving element, and a hologram element into a package mounted on a lead frame and supplying the package to a supply unit; and transporting the package from the supply unit to an automation unit. A manufacturing method of the semiconductor laser device, wherein the automation unit includes a mounting inspection step of performing a characteristic inspection in a mounted state. 5. A step of assembling a semiconductor laser chip and a light receiving element into a package mounted on a lead frame and supplying the package to a supply unit, and transporting the package from the supply unit to an automation unit and diffracting the light into the package. Assembling and inspecting a glass plate having a lattice. 6. The method for manufacturing a semiconductor laser device according to claim 5, wherein the semiconductor laser device is supplied to the supply unit in individual package units. 7. A step of mounting a hologram element on a semiconductor laser device having a package in which a semiconductor laser chip and a light-receiving element are bonded, and performing optical axis alignment of the hologram element while performing mounting inspection using a simple pickup optical system. Bonding and sealing with resin,
Performing a mounting inspection using an actual pickup optical system. 8. A step of measuring a polarization ratio of a semiconductor laser device having a package in which a semiconductor laser chip and a light receiving element are bonded, a step of mounting a glass plate having an optical diffraction grating on the semiconductor laser device, and a step of mounting the package. Semiconductor laser device including a step of bonding a laser beam to a glass plate with a resin, a step of measuring a spread angle of a laser beam, a step of measuring a position of a light emitting point of the laser beam with respect to a package, and a step of inspecting characteristics of a laser wave Manufacturing method. 9. A supply unit for supplying a semiconductor laser chip and a light receiving element assembled to a package mounted on a lead frame, a transport unit for transporting the package, and a package transported by the transport unit. A turntable that is rotatable and a glass plate having a hologram element or an optical diffraction grating that performs a plurality of assembling and inspection steps by rotating the turntable one pitch at a time on the turntable. An apparatus for manufacturing a semiconductor laser device, comprising: an automation unit to be mounted on a semiconductor laser device.