WO2008035540A1 - Apparatus with electronic device mounted therein and method for suppressing resonance of the apparatus - Google Patents
Apparatus with electronic device mounted therein and method for suppressing resonance of the apparatus Download PDFInfo
- Publication number
- WO2008035540A1 WO2008035540A1 PCT/JP2007/066518 JP2007066518W WO2008035540A1 WO 2008035540 A1 WO2008035540 A1 WO 2008035540A1 JP 2007066518 W JP2007066518 W JP 2007066518W WO 2008035540 A1 WO2008035540 A1 WO 2008035540A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic device
- resonance
- heat dissipation
- heat sink
- frequency
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a technique for suppressing vibration of a heat sink of an electronic device.
- Electronic devices such as LSIs, which are used in information processing equipment such as personal computers and workstations, perform main storage, control, and computation, and are composed of a single chip, are designed to realize high-speed processing capabilities. Requires a large current. In order to prevent the electronic device from exceeding the allowable temperature due to the heat generated by this large current, heat dissipation means is applied.
- FIG. 1 is a top view of an electronic device-equipped device having a heat dissipating means in an example for explaining the present invention
- FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG.
- the printed circuit board 1 is equipped with an electronic device 2 with large heat generation such as LSI, and the upper part of the electronic device 2 is used to dissipate the heat generated by the operation of the electronic device 2.
- Heat sink 3 is installed!
- the clock signal When the electronic device 2 operates with a clock signal, the clock signal has a frequency component of a fundamental wave and an integral multiple of the harmonic, and the clock signal harmonic propagates to the printed circuit board 1 and the heat sink 3 as noise. To do. Clock signal harmonic noise propagated from the electronic device 2 to the heat sink 3 by electrostatic coupling is radiated from the heat sink 3.
- FIG. 3 shows a perspective view of the heat sink 3.
- the planar shape of the heat radiating plate 3 is a rectangular shape
- the dimension of one side is a
- the dimension of the other side is b.
- Figure 4 shows a side view of the heat sink in the dimension a direction.
- the voltage waveform is maximum V0 at both ends of the heat sink, as shown by the solid line.
- the maximum current waveform is 10 at the center of the heat sink as shown by the broken line. This state is called resonance due to half-wavelength.
- clock signal harmonic noise is radiated through the heat sink 3 if the fundamental frequency of the clock signal or 1/2 wavelength length of the harmonic frequency matches the dimension a of the heat sink 3, Resonance at the matched frequency increases the radiation noise level.
- the dimension a on one side of the heat radiating plate 3 is defined as a half wave of the signal frequency or its harmonic frequency. It has been proposed to set a dimension that does not coincide with the length (see, for example, JP-A-2000-156578).
- the size of the heat sink may not be set to an appropriate length only for the purpose of changing the resonance frequency. For example, to reduce the resonance frequency of the heat sink, the dimension a may be increased. However, increasing the heat sink dimension increases the mounting area, which may exceed the allowable dimensions for electronic device-equipped equipment. To increase the resonance frequency of the heat sink, the dimension a can be shortened. However, if the heat sink is shortened, the heat dissipation efficiency of the heat sink decreases and the heat generated by the electronic device may not be sufficiently dissipated.
- the subject of this invention is solving the problem regarding the thermal radiation means mentioned above.
- the purpose of the present invention is one of the following: (1) Do not change the dimensions of the heat dissipation means; (2) Do not sacrifice the heat dissipation characteristics; (3) Do not ground the heat dissipation means; This is to reduce the level of high-frequency noise radiated from the heat dissipation means by avoiding resonance with the clock signal (or its harmonics).
- an electronic device that operates by a clock signal, a heat dissipation member connected to the electronic device, and a resonance suppression member formed of a dielectric material attached to the heat dissipation member are provided.
- Electronic device-equipped equipment is provided.
- a plurality of electronic devices operated by a clock signal, a heat radiation member commonly connected to the plurality of electronic devices, and a heat radiation member There is provided an electronic device mounting device including a resonance suppressing member formed of a mounted dielectric material.
- an electronic device to which a clock signal is transmitted and a heat dissipation member connected to the electronic device are prepared, and the frequency of the clock signal or
- a resonance suppression method for an electronic device-equipped device comprising: mounting a resonance suppression member including a dielectric material on a heat dissipation member so as to avoid resonance at a harmonic frequency.
- the present invention extends the electrical dimension of the heat sink by changing the resonance frequency of the heat sink by attaching a dielectric material resonance suppression member to the heat sink. Do not make the effective dimensions of the heat sink not excessively large, or small enough to impair the heat dissipation characteristics, to match the half-wavelength of the clock signal frequency propagating in the electronic device or its harmonic frequency. Can be. Therefore, according to the present invention, it is possible to avoid resonance of the heat sink at the clock signal frequency of the electronic device or its harmonic frequency, and the clock signal propagated from the electronic device to the heat sink and radiated from the heat sink. High harmonic noise can be suppressed.
- FIG. 1 is a top view of a device equipped with an electronic device in the related art.
- FIG. 2 is a cross-sectional view of an electronic device-equipped device in related technology.
- FIG. 3 is a perspective view of a heat sink in related technology.
- FIG. 4 Side view of dimensions a of heat sink in related technology.
- FIG. 5 is a top view of the electronic device-equipped device according to the first embodiment of the present invention.
- FIG. 6 is a cross-sectional view of the electronic device-equipped device according to the first embodiment of the present invention.
- FIG. 7 is a side view of the heat sink according to the first embodiment of the present invention in the dimension a direction.
- FIG. 8 is a resonance characteristic diagram with and without dielectric strips of the heat sink according to the first embodiment of the present invention.
- FIG. 9 is a resonance characteristic diagram with and without dielectric strips of the heat sink according to the first embodiment of the present invention.
- FIG. 10 Coincidence with the occupation ratio of the dielectric strip to the heat sink according to the first embodiment of the present invention.
- the graph which shows the relationship with a vibration frequency fluctuation rate.
- FIG. 11 is a top view of an electronic device-equipped device according to a second embodiment of the present invention.
- FIG. 12 is a cross-sectional view of an electronic device-equipped device according to a second embodiment of the present invention.
- FIG. 13 is a top view of an electronic device-equipped device according to a third embodiment of the present invention.
- FIG. 14 is a cross-sectional view of an electronic device mounting apparatus according to a third embodiment of the present invention.
- FIG. 5 is a top view of the electronic device mounting apparatus according to the first embodiment of the present invention
- FIG. 6 is a cross-sectional view taken along the line AA ′ of FIG.
- electronic device 2 is mounted on printed circuit board 1.
- a heat sink 3 is installed in the electronic device 2, and dielectric strips 4 and 5 made of a dielectric material are attached to both ends of the heat sink 3 on the electronic device 2 side.
- the dielectric strips 4 and 5 may contain a metal body as long as the relative permittivity is larger than 1.
- the size of one side of the heat sink 3 is a, and the size of the other side is b.
- the planar shape of the dielectric strips 4 and 5 is a rectangle, but may be another shape such as an ellipse. Further, in this embodiment, the end portions of the dielectric strips 4 and 5 are mounted so that the end portions of the heat radiating plate are aligned with the one end and the other end in the longitudinal direction, respectively. .
- the mounting position of the dielectric strips 4 and 5 is an area excluding the central portion of the heat sink, for example, the central portion when the heat sink is divided into three by a straight line parallel to the short side. It is desirable that the area is excluded.
- FIG. 7 shows a side view in the dimension a direction of the heat sink on which the dielectric strips 4 and 5 are mounted.
- the half-wave of the harmonic frequency of the clock signal and the dimension a of the heat sink 3 match, but the electrical dimensions of the heat sink 3 are determined by the dielectric strips 4 and 5 attached to both ends of the heat sink 3.
- Fig. 8 shows the resonance characteristics of the heat sink depending on the presence or absence of a dielectric strip having a relative dielectric constant of about 10 attached to both ends of the heat sink.
- the dimensions of the heat sink and dielectric strip used are 150mm x 6 Omm and 10mm x 60mm.
- the measurement was performed by placing a high-frequency signal source at the position of the electronic device and observing the received radio wave intensity at antennas arranged at a predetermined distance.
- the horizontal axis represents the frequency of the high-frequency signal source
- the vertical axis represents the signal intensity observed by the antenna.
- the reference value (OdB) on the vertical axis is the received radio wave intensity when there is no heat sink! /.
- the solid line shows the resonance characteristics of the heat sink when no dielectric strip is attached!
- the resonance frequency is the position of the maximum resonance level of the solid line, indicating approximately 920 MHz.
- the broken line shows the resonance characteristics when dielectric material is attached to both ends of the heat sink.
- the position of the maximum resonance level indicated by the broken line indicates about 890 MHz, indicating that the resonance frequency has dropped from 920 MHz to 890 MHz (variation rate of about 4%). It turns out that the resonant frequency of a heat sink falls by mounting
- Fig. 9 shows the resonance characteristics when a dielectric strip longer than the size of the dielectric strip mounted on the heat sink of Fig. 8 is mounted.
- the dimensions of the heat sink and dielectric strip used are 150mm x 60mm and 50mm x 60mm, respectively.
- the heat sink resonance frequency when the dielectric strip is not attached is about 920 MHz.
- the resonance frequency is approximately 740 MHz (variation rate is approximately 20%).
- the resonance frequency can be further lowered by increasing the dimension of the dielectric strip.
- FIG. 10 is a graph showing the relationship between the occupancy ratio of the dielectric strip attached to the heat sink with respect to the heat sink size and the resonance frequency fluctuation rate of the heat sink.
- the resonance frequency variation rate can be increased as the area ratio of the dielectric strip attached to the heat sink increases. Therefore, it is possible to change the resonance frequency to an appropriate value by selecting the size of the dielectric strip.
- the resonance frequency can be changed to an appropriate value. Even if the thickness of the piece is increased, the fluctuation rate of the resonance frequency can be increased. Also, using a dielectric strip with a higher dielectric constant, the fluctuation rate of the resonance frequency Can raise the power S.
- the method for suppressing resonance of an electronic device mounted device includes any one of an area occupancy ratio of a dielectric strip attached to the heat sink to the heat sink, a thickness of the dielectric strip, and a dielectric constant of the dielectric strip. High frequency noise emitted through the heat sink so that the resonance frequency does not match the frequency of the clock signal in the electronic device or its harmonics. The level is reduced.
- FIG. 11 is a top view of an electronic device mounting apparatus on which a plurality of electronic devices according to the second embodiment of the present invention are mounted
- FIG. 12 is a cross-sectional view taken along the line AA ′ of FIG.
- a plurality of electronic devices 2 are mounted on the printed circuit board 1.
- the heat sink 3 is installed in the electronic device 2, and the dielectric strips 4 and 5 are attached to both ends of the heat sink 3 on the electronic device 2 side.
- FIG. 7 A side view in the dimension a direction of the heat sink on which the dielectric strips 4 and 5 of this embodiment are mounted is shown in FIG. 7 as in the case of the first embodiment.
- the half-wave of the clock signal harmonic noise frequency and the heat sink 3 dimension a match, but the dielectric strips 4 and 5 attached to both ends of the heat sink 3
- the target dimensions are each extended by dimension c to become dimension a '.
- FIG. 13 is a top view of an electronic device mounting device in which the dielectric strip according to the third embodiment of the present invention is mounted only on one end of the heat sink, and FIG. 'Is a cross-sectional view taken along the line.
- the electronic device 2 is mounted on the printed circuit board 1.
- a heat sink 3 is installed in the electronic device 2, and a dielectric strip 4 is attached to one end of the heat sink 3 on the electronic device 2 side.
- the half wavelength of the clock signal harmonic noise frequency and the size of the heat sink 3 are the same.
- the dielectric strip attached to one end of the heat sink 3 is The dimensional dimension is extended.
- the electrical dimensions of the heat sink installed on the upper part of the electronic device can be made not to match the half wavelength of the clock signal harmonic noise frequency.
- the area occupancy of the dielectric strip attached to the heat sink with respect to the heat sink, the thickness of the dielectric strip, the dielectric of the dielectric strip Select one or more of them and change the resonance frequency so that the resonance frequency of the heat sink does not match the frequency of the clock signal in the electronic device or its harmonics It is something that can be done.
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008535298A JPWO2008035540A1 (ja) | 2006-09-19 | 2007-08-27 | 電子装置搭載機器とその共振抑制方法 |
US12/441,829 US20090279265A1 (en) | 2006-09-19 | 2007-08-27 | Electronic device mounting apparatus and resonance suppression method thereof |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006252219 | 2006-09-19 | ||
JP2006-252219 | 2006-09-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008035540A1 true WO2008035540A1 (en) | 2008-03-27 |
Family
ID=39200369
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/066518 WO2008035540A1 (en) | 2006-09-19 | 2007-08-27 | Apparatus with electronic device mounted therein and method for suppressing resonance of the apparatus |
Country Status (3)
Country | Link |
---|---|
US (1) | US20090279265A1 (ja) |
JP (1) | JPWO2008035540A1 (ja) |
WO (1) | WO2008035540A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008012209A2 (en) | 2006-07-27 | 2008-01-31 | International Business Machines Corporation | Integrated circuit heat dissipation device |
DE102008019487A1 (de) * | 2008-04-17 | 2009-12-31 | Sew-Eurodrive Gmbh & Co. Kg | Verfahren zum Betreiben eines Antriebs, Kühlkörper und Umrichter, Verfahren zur Identifikation oder Bestimmung der Entwicklungsversion eines Umrichters, Verfahren zum Betreiben einer Anlage |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5821954B2 (ja) * | 2011-06-10 | 2015-11-24 | 日本電気株式会社 | 電子機器、構造体、及び、ヒートシンク |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02101550U (ja) * | 1989-01-26 | 1990-08-13 | ||
JPH02132993U (ja) * | 1989-04-07 | 1990-11-05 | ||
JPH0363990U (ja) * | 1989-10-26 | 1991-06-21 | ||
JPH09139592A (ja) * | 1995-11-15 | 1997-05-27 | Nec Corp | 電子装置の放熱構造 |
JP2000068427A (ja) * | 1998-08-25 | 2000-03-03 | Sony Corp | ヒートシンク |
JP2000156578A (ja) * | 1998-11-20 | 2000-06-06 | Nec Corp | 電子装置の放熱構造 |
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP2004111727A (ja) * | 2002-09-19 | 2004-04-08 | Teac Corp | ヒートシンク |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4287020B2 (ja) * | 2000-04-05 | 2009-07-01 | Necトーキン株式会社 | 高周波電流抑制型放熱板 |
CN100372106C (zh) * | 2004-07-22 | 2008-02-27 | 鸿富锦精密工业(深圳)有限公司 | 散热器 |
KR100717791B1 (ko) * | 2005-05-25 | 2007-05-11 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
KR100731482B1 (ko) * | 2005-05-31 | 2007-06-21 | 삼성에스디아이 주식회사 | 구동회로기판 및 이를 구비한 평판형 디스플레이 장치 |
JP4809095B2 (ja) * | 2006-03-28 | 2011-11-02 | 富士通株式会社 | ヒートシンク |
KR100839412B1 (ko) * | 2006-11-27 | 2008-06-19 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
US20080170362A1 (en) * | 2007-01-17 | 2008-07-17 | Advanced Digital Broadcast S.A. | Device with support structure for hard disk drive and method for mounting hard disk drive |
-
2007
- 2007-08-27 JP JP2008535298A patent/JPWO2008035540A1/ja not_active Withdrawn
- 2007-08-27 WO PCT/JP2007/066518 patent/WO2008035540A1/ja active Application Filing
- 2007-08-27 US US12/441,829 patent/US20090279265A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02101550U (ja) * | 1989-01-26 | 1990-08-13 | ||
JPH02132993U (ja) * | 1989-04-07 | 1990-11-05 | ||
JPH0363990U (ja) * | 1989-10-26 | 1991-06-21 | ||
JPH09139592A (ja) * | 1995-11-15 | 1997-05-27 | Nec Corp | 電子装置の放熱構造 |
JP2000068427A (ja) * | 1998-08-25 | 2000-03-03 | Sony Corp | ヒートシンク |
JP2000156578A (ja) * | 1998-11-20 | 2000-06-06 | Nec Corp | 電子装置の放熱構造 |
JP2003249611A (ja) * | 2002-02-26 | 2003-09-05 | Fujikura Ltd | フィン付きヒートシンク |
JP2004111727A (ja) * | 2002-09-19 | 2004-04-08 | Teac Corp | ヒートシンク |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008012209A2 (en) | 2006-07-27 | 2008-01-31 | International Business Machines Corporation | Integrated circuit heat dissipation device |
DE102008019487A1 (de) * | 2008-04-17 | 2009-12-31 | Sew-Eurodrive Gmbh & Co. Kg | Verfahren zum Betreiben eines Antriebs, Kühlkörper und Umrichter, Verfahren zur Identifikation oder Bestimmung der Entwicklungsversion eines Umrichters, Verfahren zum Betreiben einer Anlage |
DE102008019487B4 (de) * | 2008-04-17 | 2017-05-11 | Sew-Eurodrive Gmbh & Co Kg | Verfahren zum Betreiben eines Antriebs, Kühlkörper, System von Umrichtern, Verfahren zur Identifikation oder Bestimmung der Entwicklungsversion eines Umrichters durch Modulation der Pulsweitenfrequenz |
Also Published As
Publication number | Publication date |
---|---|
JPWO2008035540A1 (ja) | 2010-01-28 |
US20090279265A1 (en) | 2009-11-12 |
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