WO2008035506A1 - Réseau de fibres optiques - Google Patents

Réseau de fibres optiques Download PDF

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Publication number
WO2008035506A1
WO2008035506A1 PCT/JP2007/064593 JP2007064593W WO2008035506A1 WO 2008035506 A1 WO2008035506 A1 WO 2008035506A1 JP 2007064593 W JP2007064593 W JP 2007064593W WO 2008035506 A1 WO2008035506 A1 WO 2008035506A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical fiber
pitch
array
optical
cover
Prior art date
Application number
PCT/JP2007/064593
Other languages
English (en)
Japanese (ja)
Inventor
Yoshiaki Nakano
Noriyoshi Hiroi
Original Assignee
Namiki Seimitsu Houseki Kabushiki Kaisha
The University Of Tokyo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namiki Seimitsu Houseki Kabushiki Kaisha, The University Of Tokyo filed Critical Namiki Seimitsu Houseki Kabushiki Kaisha
Priority to JP2008535284A priority Critical patent/JP5337931B2/ja
Publication of WO2008035506A1 publication Critical patent/WO2008035506A1/fr

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/04—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres
    • G02B6/06—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres the relative position of the fibres being the same at both ends, e.g. for transporting images
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3664—2D cross sectional arrangements of the fibres
    • G02B6/3668—2D cross sectional arrangements of the fibres with conversion in geometry of the cross section
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves

Definitions

  • the present invention relates to an optical fiber array capable of optically coupling an optical element and an optical fiber directly and with low loss.
  • An optical module used in such a communication system is equipped with an array of transmitting elements and receiving elements (hereinafter referred to as a transmitting array or a receiving array), and a light emitting diode is used as the transmitting array.
  • a transmitting array or a receiving array an array of transmitting elements and receiving elements
  • a light emitting diode is used as the transmitting array.
  • Optical devices using a PIN photodiode array have been developed for receiving arrays!
  • the most common optical fiber has a cladding diameter of 125 Hm and a coating diameter of 250 ⁇ m. When these optical fibers are arranged in a row, a pitch of 250 m or more according to the coating diameter is used.
  • Array Tape-type optical fibers (an optical fiber in the form of an array in which a plurality of optical fibers are integrally coated with the core axes arranged in parallel with each other may be used. The fibers are usually arranged according to the coating diameter of each optical fiber, and each optical fiber is arranged at a pitch of 250 m or more.
  • the arrangement pitch of the optical elements such as the transmission array and the reception array is smaller than the arrangement pitch of the optical fiber in the array form. Need to be designed smaller. In such cases, multiple optical fibers must be smaller than 250 ⁇ m to couple the fiber to the transmit and receive arrays. It is required to arrange at the pitch and pitch. Even if the pitch of the coated portions of a plurality of optical fibers is constant, the ends of the optical fibers to be coupled to the transmitting array and the receiving array need to be arranged at a different pitch from the coated portion. Therefore, as shown in FIG.
  • a pitch-convertable optical fiber 103 in which the groove pitch on one end side matches the pitch of the tape-type optical fiber 101 and the groove pitch on the end side matches the pitch of the transmission array is provided.
  • An optical fiber array 100 sandwiched between a pair of substrates 104 and 104 has been devised (see, for example, Patent Documents 1, 2, and 3).
  • Patent Document 1 Japanese Patent Laid-Open No. 05-188236 (page 2-3, Fig. 1)
  • Patent Document 2 Japanese Patent Laid-Open No. 10-78514 (Page 3-4, Fig. 1)
  • Patent Document 3 Japanese Unexamined Patent Publication No. 2005-148616 (Page 6-13, Fig. 1)
  • the present invention has been made in view of such a problem, and an object of the present invention is to prevent the position accuracy of the end portion of the optical fiber from being lowered by the stress applied to the optical fiber, and to It is an object of the present invention to provide a pitch-convertable optical fiber array that can be easily converted into an array pitch of optical elements to arrange each optical fiber.
  • An optical fiber array according to claim 1 of the present invention is
  • M optical fibers arranged at a constant pitch P1 (m: not including 0! /, Natural number) and m or more grooves on the surface are parallel to the pitch P beam! /, Pitch P2.
  • the optical fiber the pitch P1 is gradually narrowed toward the end, the end of the optical fiber is arranged in a line at the pitch P2 narrower than the pitch P1, Ends of the optical fibers arranged in a line at the pitch P2 are arranged in the grooves of each of the grooved substrates, and are sandwiched between the grooved substrate and the cover, and further, the grooved substrate.
  • a concave portion for collectively storing the end portions of the optical fiber is formed, and both ends of the concave portion are formed so as to gradually expand toward the grooved substrate. It relates to an optical fiber array characterized by the above.
  • the optical fiber comprises:
  • each of the m optical fiber forces having a reduced diameter is arranged in the groove.
  • the optical fiber array of claim 1 of the present invention by installing the cover on the grooved substrate, the optical fibers spread in a crossing manner are inscribed on the outer peripheral surface of each other. Thus, it can be easily converted into the arrangement pitch of the optical elements.
  • optical fiber array of claim 2 in addition to the effect of the optical fiber array of claim 1, by using the etched optical fiber having a reduced diameter, characteristics can be obtained. A uniform optical fiber array can be realized.
  • FIG. 1 is a plan view showing an optical fiber array according to the present invention.
  • FIG. 2 A plan view of the optical fiber array of FIG. 1 excluding a ring and a cover for explanation.
  • FIG. 3 is a plan view showing a guide substrate which is one of the components of the optical fiber array of FIGS. 1 and 2.
  • FIG. 4 Partial enlarged view of the optical fiber used in the optical fiber array.
  • FIG. 5 is an enlarged partial sectional view taken along line AA in FIG.
  • FIG. 6 is a partial plan view of an optical fiber array schematically showing an end portion of an optical fiber.
  • Fig. 7 BB enlarged partial cross-sectional view of Fig. 6.
  • FIG. 11 Plan view excerpting only LD array chip and optical fiber from Fig. 10c
  • the optical fiber array 1 of the present embodiment includes a multi-core optical fiber tape 2 and a substrate 3 provided with a guide (hereinafter referred to as a guide substrate 3).
  • a guide substrate 3 a guide
  • a holder 11 that holds the plate 3 is provided.
  • the optical fiber array 1 is optically coupled to a laser diode (LD) array chip 4 which is an example of an optical element of a transmission array.
  • LD laser diode
  • the tape-type optical fiber 2 is a general type single-mode optical fiber in which a clad 2a having a refractive index lower than the refractive index of the core 2e is surrounded around the core 2e (see FIG. 5). Consists of. Strip the coating 2b from the starting end of the tape-type optical fiber 2 (arrow s side in Figs. 1 and 2) toward the end (arrow t side in Figs. 1 and 2) by a predetermined amount, and As shown in FIG. 4, the end portion of the clad 2a portion from which the coating 2b has been removed is reduced in diameter toward the end in a direction parallel to the axis c of the core. As a means for reducing the diameter, etching or the like is used. By making the core 2e an unetched portion, the core diameter is kept as it is, and only the cladding diameter is etched to reduce the diameter.
  • the cladding diameter of the reduced optical fiber portion 2c is 30 m.
  • the guide substrate 3 is made of silicon (Si), plastic, or photosensitive glass.
  • a guide 3b composed of 3c is formed.
  • Each groove 3a is formed in parallel at a constant pitch P1 on one end side (arrow s side) of the guide substrate 3, and as the pitch P1 advances toward the end side (arrow t side) opposite to the one end side, the pitch P1 becomes It is formed so as to be gradually narrowed.
  • the eight grooves 3a are integrally formed into one groove 3c.
  • each optical fiber 3 ⁇ 4f3 ⁇ 4 is inserted into each groove 3a and groove 3c of the guide substrate 3 as shown in FIG. 2, and in this state, the rings 7, 7 as shown in FIG. Cover each optical fiber 3 ⁇ 4f3 ⁇ 4 firmly.
  • the 8 optical fibers are fixed by pouring and fixing the adhesive.
  • An optical fiber in the form of an array is formed.
  • each groove 3a is formed such that the pitch P1 gradually decreases as it advances toward the end side (arrow t side) of the guide substrate 3. Therefore, each optical fiber 2 inserted into the groove 3a is arranged at a pitch P1 on the one end side (arrow s side), and the pitch P1 gradually increases toward the end (arrow t side) of the optical fiber 2f.
  • the interaxial distance (pitch) of the core at each end of the optical fiber portion 2c on the end side gradually increases as the LD array chip 4 is approached. It will be narrower than. Then, as shown in FIG. 9, the end portions of the optical fibers 2f are converged and arranged in a line at a pitch P2 narrower than the pitch P1, thereby forming a converging portion 2d.
  • the curved shape of the guide 3b is determined in consideration of the transmission loss that occurs when the optical fiber 2f is bent. In the present embodiment, the curved shape of the guide 3b is determined so that the propagation loss force of each optical fiber 2f is less than 1.3 dB.
  • Fig. 5 shows an enlarged view of the cross section taken along line AA in Fig. 1.
  • grooves 9 having a number m or more of optical fins 3 ⁇ 4f are formed in parallel at a pitch P2 narrower than the pitch P1, and each optical fiber 2f has one groove 9 and a cover 10 It is arranged in each groove 9 so as to be held down from above and below by the surface of the substrate (see FIG. 5).
  • m optical fiber portions 2c having a reduced diameter 2c force S are arranged in each groove 9.
  • a concave portion 10a is formed on the surface of the cover 10 facing the grooved substrate 8, and when the cover 10 is disposed on the surface of the grooved substrate 8, the converging portion 2d, which is the end of the optical fiber 2f, is bundled. And store. Since the cross-sectional shape of each groove 9 is V-shaped as shown in FIG. 5, each optical fiber 2f of the converging part 2d is sandwiched between the grooved substrate 8 and the cover 10 to Three points are supported by three contact points H1 to H3 between the groove 9 and the concave surface 10a.
  • a cover 10 is attached so as to cover the groove 9 to be stored in the optical fiber 3 ⁇ 4f3 ⁇ 4, and the converging portion 2d is sandwiched between the cover 10 and the substrate 8 with the groove. Both ends 10b, 10b of the recess 10a are formed in a tapered shape so as to gradually expand toward the grooved substrate 8! /.
  • the adhesive (14 lead wires in FIG. 5) is provided with a gap between the groove 9 and the optical fiber 2f and a groove.
  • the substrate 8 with groove and the cover 10 are fixed.
  • the end portions of the optical fibers 2f are polished together with the grooved substrate 8 and the cover 10, so that the lengths of the end portions of the optical fiber layers f are made uniform.
  • only the end portions of the optical fiber 2f may be polished flat so that the lengths of the respective end portions of the m optical fine layers f are evenly aligned.
  • the tapered surface 12 to reduce the width of the end portions of the substrate 8 with the groove 10 and the cover 10 the polishing portion can be reduced and the polishing process can be simplified.
  • the adhesive 14 contains spherical beads 13 as an additive. By stiffening the beads 13, the gap between the grooved substrate 8 and the cover 10 is kept constant to prevent the cover 10 from tilting, and the amount of adhesive used is reduced by the content of the additive. As the amount of use decreases, excessive wear during polishing of the adhesive 14 having a lower hardness than the grooved substrate 8, the cover 10, and the optical fiber 2f is prevented.
  • the beads 13 have a size smaller than the diameter of the optical fino 2f. By limiting to such a diameter, the gap between the grooved substrate 8 and the cover 10 can be minimized, and the amount of the adhesive 14 used can be reduced, thereby preventing excessive wear during polishing. It becomes possible.
  • a preferred material for the beads 13 is a transparent glassy material or a ceramic material. By using a transparent material, when a photo-curing adhesive is used for the adhesive 14, it is possible to cure and bond without degrading the photo-curing performance of the adhesive 14.
  • a rod-like or elliptical filler (filler) such as carbon fiber or glass fiber may be used.
  • the LD array chip 4 is a chip having m active layers 4a having the same number m as the number of tape optical fibers 2, and each active layer 4a has a narrow pitch P beam. ! /, Arranged at pitch P 2.
  • the specific value of pitch P2 is 30 m.
  • each optical fiber 2f inserted into each groove 3a and groove 3c of the guide substrate 3 is released from the guide 3b at the front end of the groove 3c. As shown in Fig. 7, the optical fiber is spread or some optical fibers cross each other. It cannot be arranged in a shape.
  • both ends 10b of the recess 10a are formed in a tapered shape, as shown in FIG. 8, as the cover 10 is pressed against the grooved substrate 8, the end of the optical fiber 2f is changed to both ends.
  • the cover 10 By sliding along the taper surface of 10b, it moves to the center of the recess 10a, and IJ is arranged inside and pushed out the optical fiber 2f3 ⁇ 4.
  • the extruded optical fiber 2f moves to the adjacent groove 9.
  • all the optical fins 3 ⁇ 4f3 ⁇ 4S are arrayed in the grooves 9 in an array while being inscribed at the outer periphery of each.
  • the guide substrate 3 and the grooved substrate 8 are mounted on the holder 11 provided inside the package 5 that houses the LD array chip 4, and the converging part 2 d becomes the LD array.
  • the holder 11 provided inside the package 5 that houses the LD array chip 4, and the converging part 2 d becomes the LD array.
  • a tape-type optical fiber 2 is extended outside the package 5. Further, a protective resin (not shown) is filled in the frame of the package 5 and sealed. In FIG. 10, for convenience of explanation, the ring 7 and the cover 10 are not shown. 1S Provided when the optical fiber array 1 is actually stored in the package 5.
  • FIG. 11 is a plan view showing only the LD array chip 4 and the optical fiber 2f extracted from the configuration shown in FIG. As shown in FIG. 11, the output power of the LD array chip 4 is directly coupled to the optical fiber 2f, and the pitch of the optical fiber 2f is gradually changed from the pitch P2 to the pitch P1. In the optical fiber 2f itself, the pitch conversion from the LD array chip 4 to the tape-type optical fiber 2 is performed.
  • the optical fiber 2f is bent to form a converging portion 2d at the same pitch P2 as the pitch P2 of the active layer 4a of the LD array chip 4,
  • the LD array chip 4 and the tape-type optical fiber 2 having different pitches can be directly optically coupled.
  • the pitch of the converging part 2d can be reduced by arranging it at a high density up to 30 m, the same as the pitch P2. Therefore, the space occupied by the optical fiber array 1 inside the package 5 is reduced.
  • each optical fin 3 ⁇ 4f in each groove 9 play at the end of the optical fi no 3 ⁇ 4f can be reduced.
  • the area of each LD array chip 4 is reduced, and a large number of semiconductor wafers can be produced.
  • the yield of the LD array chip 4 is also improved, so that the cost can be greatly reduced.
  • the unit area of the LD array chip 4 is reduced, the distance between the LDs is reduced, and the characteristics of the LD are easily aligned, thereby achieving high efficiency.
  • the force pitch P2 described with the pitch P2 of the converging part 2d as 30 m is not limited to this dimension.
  • the optimum P2 can be determined from the viewpoint of changing the pitch P2 associated with the LD array chip change and suppressing crosstalk.
  • the cross-sectional shape of the groove 9 is not limited to the V shape as long as it is a shape that can be firmly supported by the optical fiber 2f.
  • the groove 9 may be changed to a concave shape.
  • the LD array chip is taken as an example of the optical element, but the optical element is not limited to the LD array chip, and includes an optical element such as a light receiving element 'light emitting element' or AWG.
  • the focusing section 2d may be aligned so that the focusing section 2d faces the waveguide section.
  • the AWG can also be reduced.
  • optical fiber array of the present invention in the wiring part of an optical communication system or inside a chip package, it is possible to increase the amount of propagation data, reduce the coupling loss, and reduce the size of the optical coupling part.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un réseau de fibres optiques à pas changeable, qui empêche la dégradation de la précision du positionnement de parties d'extrémité de fibres optiques en appliquant une contrainte aux fibres optiques, et qui forme facilement un réseau avec les fibres optiques individuelles en convertissant les parties d'extrémité de fibres optiques au pas de réseau des éléments optiques. Le réseau de fibres optiques est constitué pour comprendre un nombre m (m : un nombre naturel ne comprenant pas 0) de fibres optiques disposées en réseau à un pas constant (P1), un substrat rainuré ayant un nombre m ou davantage de rainures formées dans sa face en parallèle et à un pas (P2) plus étroit que le pas (P1), et une enveloppe. Le pas (P1) s'est progressivement rétréci vers les parties d'extrémité des fibres optiques, et ces fibres optiques sont disposées à leurs parties d'extrémité dans une rangée et au pas (P2) plus étroit que le pas (P1). Les parties d'extrémité des fibres optiques sont disposées en réseau dans les rainures individuelles du substrat rainuré et serrées par le substrat rainuré et l'enveloppe. De plus, une cavité pour recevoir les parties d'extrémité des fibres optiques toutes ensemble est formée dans la face de l'enveloppe qui fait face au substrat rainuré, et ces extrémités sont formées pour s'étendre progressivement vers le substrat rainuré.
PCT/JP2007/064593 2006-09-22 2007-07-25 Réseau de fibres optiques WO2008035506A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008535284A JP5337931B2 (ja) 2006-09-22 2007-07-25 光ファイバアレイ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-256768 2006-09-22
JP2006256768 2006-09-22

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WO2008035506A1 true WO2008035506A1 (fr) 2008-03-27

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WO (1) WO2008035506A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11846815B2 (en) 2020-11-16 2023-12-19 Ii-Vi Delaware, Inc. Assembly for transceiver module of fiber-optic communication network

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05264858A (ja) * 1992-03-23 1993-10-15 Kyowa Densen Kk 光ファイバ心線の加工方法
JPH07249798A (ja) * 1994-03-09 1995-09-26 Fujitsu Ltd 光部品固定装置及びその製造方法
WO2002079831A1 (fr) * 2001-03-29 2002-10-10 Ngk Insulators,Ltd. Reseau de fibres optiques et son procede de fabrication
JP2002365465A (ja) * 2001-04-27 2002-12-18 Fitel Usa Corp 光ファイバ・アレイ
JP2005148616A (ja) * 2003-11-19 2005-06-09 Seiko Instruments Inc 光ファイバアレイおよび光デバイスとそれらの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05264858A (ja) * 1992-03-23 1993-10-15 Kyowa Densen Kk 光ファイバ心線の加工方法
JPH07249798A (ja) * 1994-03-09 1995-09-26 Fujitsu Ltd 光部品固定装置及びその製造方法
WO2002079831A1 (fr) * 2001-03-29 2002-10-10 Ngk Insulators,Ltd. Reseau de fibres optiques et son procede de fabrication
JP2002365465A (ja) * 2001-04-27 2002-12-18 Fitel Usa Corp 光ファイバ・アレイ
JP2005148616A (ja) * 2003-11-19 2005-06-09 Seiko Instruments Inc 光ファイバアレイおよび光デバイスとそれらの製造方法

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JP5337931B2 (ja) 2013-11-06
JPWO2008035506A1 (ja) 2010-01-28

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