WO2008029852A1 - Dispositif optique, appareil d'exposition et procédé de fabrication du dispositif - Google Patents

Dispositif optique, appareil d'exposition et procédé de fabrication du dispositif Download PDF

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Publication number
WO2008029852A1
WO2008029852A1 PCT/JP2007/067324 JP2007067324W WO2008029852A1 WO 2008029852 A1 WO2008029852 A1 WO 2008029852A1 JP 2007067324 W JP2007067324 W JP 2007067324W WO 2008029852 A1 WO2008029852 A1 WO 2008029852A1
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WO
WIPO (PCT)
Prior art keywords
gas
space
optical element
optical device
substrate
Prior art date
Application number
PCT/JP2007/067324
Other languages
English (en)
Japanese (ja)
Inventor
Takaya Okada
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2008533188A priority Critical patent/JP5182093B2/ja
Publication of WO2008029852A1 publication Critical patent/WO2008029852A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/14—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation
    • G02B13/143—Optical objectives specially designed for the purposes specified below for use with infrared or ultraviolet radiation for use with ultraviolet radiation
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/12—Fluid-filled or evacuated lenses

Definitions

  • the present invention relates to an optical apparatus, an exposure apparatus, and a device manufacturing method.
  • Patent Document 1 discloses an example of a technique related to a holding member that holds an optical element of a projection optical system in an immersion exposure apparatus.
  • Patent Document 1 International Publication No. 2005/054955 Pamphlet
  • An object of the present invention is to provide an optical device that can satisfactorily hold an optical element. It is another object of the present invention to provide an exposure apparatus that can satisfactorily expose a substrate through an optical element, and a device manufacturing method using the exposure apparatus. Means for solving the problem
  • the present invention adopts the following configuration associated with each drawing shown in the embodiment.
  • the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.
  • the holding member (3A) having the facing surface (31) facing the first surface (11) of the optical element (2A), and the facing surface (31) and the first surface (11) are joined.
  • An optical device (1) is provided.
  • the optical element can be satisfactorily held.
  • the exposure apparatus (the exposure apparatus that exposes the substrate (P) in EU includes the optical apparatus (1) of the above-described aspect), and the optical apparatus (1) Exposure light (exposure apparatus (EX) for irradiating EU) is provided on a substrate (P) through an element.
  • Exposure light Exposure apparatus (EX) for irradiating EU
  • the substrate can be exposed satisfactorily through the optical element.
  • a device can be manufactured using an exposure apparatus that can satisfactorily expose the substrate.
  • the optical element can be favorably held. Further, according to the present invention, the substrate can be satisfactorily exposed through the optical element. Further, according to the present invention, a device having a desired performance can be manufactured.
  • FIG. 1 is a schematic configuration diagram showing an optical device according to a first embodiment.
  • FIG. 2 is an enlarged cross-sectional view of a part of FIG.
  • FIG. 3 is a cross-sectional view taken along line AA in FIG.
  • FIG. 4 is an enlarged view of a part of FIG.
  • FIG. 5 is a perspective view of a part of FIG.
  • FIG. 6 is a perspective view of a part of an optical device according to a second embodiment.
  • FIG. 7 is a perspective view of a part of an optical device according to a third embodiment.
  • FIG. 8 is an enlarged cross-sectional view of a part of an optical device according to a fourth embodiment.
  • FIG. 9 is an enlarged cross-sectional view of a part of an optical device according to a fifth embodiment.
  • FIG. 10 is a perspective view of a part of an optical device according to a sixth embodiment.
  • FIG. 11 is an enlarged cross-sectional view of a part of an optical device according to a seventh embodiment.
  • FIG. 12 is a partial perspective view of an optical device according to a seventh embodiment.
  • FIG. 13 is an enlarged cross-sectional view of a part of an optical device according to an eighth embodiment.
  • FIG. 14 is an enlarged cross-sectional view of a part of an optical device according to a ninth embodiment.
  • FIG. 15 is an enlarged cross-sectional view of a part of an optical device according to a tenth embodiment.
  • FIG. 16 is an enlarged cross-sectional view of a part of an optical device according to an eleventh embodiment.
  • FIG. 17 is an enlarged cross-sectional view of a part of an optical device according to a twelfth embodiment.
  • FIG. 18 is a schematic block diagram that shows an exposure apparatus according to a thirteenth embodiment.
  • FIG. 19 is an enlarged cross-sectional view of a part of FIG.
  • FIG. 20 is a flowchart showing an example of a microdevice manufacturing process.
  • an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system.
  • the predetermined direction in the horizontal plane is the X-axis direction
  • the direction orthogonal to the X-axis direction in the horizontal plane is the Y-axis direction
  • the direction orthogonal to each of the X-axis direction and the Y-axis direction is the Z-axis direction.
  • the rotation (tilt) directions around the X, Y, and Z axes are the ⁇ X, ⁇ Y, and ⁇ ⁇ ⁇ ⁇ directions, respectively.
  • FIG. 1 is a schematic configuration diagram showing an optical device 1 according to the first embodiment.
  • an optical device 1 includes a plurality of optical elements 2A to 2E, holding members 3A to 3E for holding the plurality of optical elements 2A to 2E, and an internal space 4, and includes a plurality of optical elements 2A.
  • ⁇ 2E is held in the internal space 4 via holding members 3A-3E.
  • the optical device 1 can project an image of the object plane Os onto the image plane Is.
  • the optical axis AX of the plurality of optical elements 2A to 2E of the optical device 1 is parallel to the Z axis.
  • Each of the object plane Os and the image plane Is is parallel to the XY plane.
  • the object plane Os is arranged on the + Z side of the optical device 1 in the drawing, and the image plane Is is arranged on the Z side.
  • the optical element 2 A closest to the image plane Is of the optical device 1 is an internal space 4 of the lens barrel 5 and an external space different from the internal space 4 Arranged at the boundary with 6.
  • the optical element 2A disposed at the boundary between the internal space 4 and the external space 6 of the lens barrel 5 is appropriately used as the terminal optical element 2A, Called.
  • the inner space 4 of the lens barrel 5 is filled with gas.
  • the outer space 6 of the lens barrel 5 includes an immersion space LS filled with liquid LQ.
  • the immersion space LS is formed in the vicinity of the terminal optical element 2A on the image plane Is side of the optical device 1.
  • the optical device 1 can project the image of the first object B1 arranged on the object plane Os onto the second object B2 arranged on the image plane Is via the liquid LQ in the immersion space LS.
  • the immersion space LS is formed between the terminal optical element 2A and the second object B2 disposed on the image plane Is.
  • the optical device 1 of the present embodiment includes an air supply port 61 formed in the lens barrel 5, and a first gas supply device 60 that supplies gas to the internal space 4 via the air supply port 61 and the air supply pipe 61P. And.
  • the first gas supply device 60 supplies dry inert gas to the internal space 4.
  • the first gas supply device 60 is chemically purified and delivers nitrogen gas having a concentration of approximately 100%. Note that the gas supplied to the internal space 4
  • the active gas may be helium or a mixed gas of nitrogen and helium.
  • the first gas supply device 60 may supply dry air (dry air) to the internal space 4.
  • FIG. 2 is a side sectional view showing the vicinity of the terminal optical element 2A disposed at the boundary between the internal space 4 and the external space 6 of the lens barrel 5 and the holding member 3A for holding the terminal optical element 2A.
  • 3 is a cross-sectional view taken along line AA in FIG. 4 is an enlarged view of a part of FIG. 2
  • FIG. 5 is a perspective view of a part of FIG.
  • the terminal optical element 2A includes an incident surface 7 on which light from the object surface Os is incident, and an exit surface 8 that emits light incident from the incident surface 7.
  • the outer peripheral surface 9 connecting the outer periphery of the incident surface 7 and the outer periphery of the exit surface 8 is provided.
  • the incident surface 7 is disposed in the internal space 4 so as to face the object surface Os.
  • the exit surface 8 is disposed in the external space 6 so as to face the image surface Is. At least a part of the outer peripheral surface 9 is disposed in the external space 6.
  • the internal space 4 of the lens barrel 5 is filled with gas, and the incident surface 7 of the final optical element 2A disposed in the internal space 4 is in contact with the gas.
  • the external space 6 of the lens barrel 5 includes an immersion space LS filled with the liquid LQ, and the emission surface 8 disposed in the external space 6 is in contact with the liquid LQ. Note that Figure 2 does not show liquid LQ.
  • the entrance surface 7 of the terminal optical element 2A is a convex curved surface that swells toward the object plane Os, and the exit surface 8 of the terminal optical element 2A is substantially parallel to the XY plane. It is a plane.
  • the outer peripheral surface 9 of the last optical element 2A is disposed so as to surround the exit surface 8 and the inclined surface 9S inclined to the entrance surface 9 side with respect to the exit surface 8, and the inclined surface 9S, and is substantially flat with the XY plane.
  • the plane 9F facing the Z side In the following description, of the outer peripheral surface 9 of the last optical element 2A, a plane 9F facing the Z side that is substantially parallel to the XY plane is appropriately referred to as a flange surface 9F.
  • the optical device 1 includes a holding member 3A having a facing surface 31 facing the first surface 11 of the flange surface 9F, and the holding member 3A facing.
  • a gas flow is generated between the joint 40 that joins the surface 31 and the first surface 11 and the second surface 12 on the outer space 6 side of the flange surface 9F with respect to the first surface 11, and And a gas seal mechanism 20 that suppresses the gas in the external space 6 from being brought to the joint 40.
  • the first surface 11 is set to at least a part of the outer edge region (first region) of the flange surface 9F, and the second surface 12 is more external than the first surface 11.
  • the second surface 12 is set on the flange surface 9F so as to surround the immersion space LS and the injection surface 8 arranged in the external space 6, and the first surface 11 is an external surface including the immersion space LS and the injection surface 8. It is set at a position farther from the second surface 12 with respect to the space 6.
  • the holding member 3A has a facing surface 31 that faces the first surface 11 of the flange surface 9F of the terminal optical element 2A.
  • the holding member 3A is disposed so as to face the flange surface 9F of the last optical element 2A, and has an upper surface 30 facing the + Z side substantially parallel to the XY plane.
  • the facing surface 31 is set as a part of the upper surface 30.
  • the upper surface 30 of the holding member 3A facing the flange surface 9F of the terminal optical element 2A is formed in an annular shape so as to surround the immersion space LS and the exit surface 8 disposed in the external space 6.
  • the facing surface 31 is set to at least a part of the outer edge region of the upper surface 30 so as to face the first surface 11 of the flange surface 9F.
  • the flange surface 9F of the terminal optical element 2A and the upper surface 30 of the holding member 3A are separated by a predetermined distance!
  • the facing surface 31 is a surface on which the joint portion 40 is formed and includes the joint portion 40.
  • the first surface 11 is a surface on which the joint portion 40 is formed and is a surface including the joint portion 40.
  • each of the first surface 11 of the terminal optical element 2A and the facing surface 31 of the holding member 3A that are joined via the joint portion 40 has an optical axis AX It is set in each of a plurality of predetermined areas in the surrounding rotation direction.
  • the joint portion 40 (region where the adhesive is disposed) is set in a plurality of islands in the rotation direction around the optical axis AX.
  • the terminal optical element 2A is made of, for example, quartz (silica).
  • the terminal optical element 2A is a single crystal material of a fluoride compound such as calcium fluoride (fluorite), barium fluoride, strontium fluoride, lithium fluoride, and sodium fluoride. It may be formed. Further, the optical elements 2B to 2E can be formed of the above-described materials.
  • the holding member 3A is formed of a material having the same or similar linear expansion coefficient as that of the optical element 2A, for example, an inorganic material such as ceramics or glass, or a metal.
  • the holding member 3A may contain boron or may be formed of glass.
  • an adhesive for joining the first surface 11 of the terminal optical element 2A and the facing surface 31 of the holding member 3A for example, a metal as disclosed in International Publication No. 2005/054955 pamphlet, What contains inorganic materials, such as ceramics and glass, can be used.
  • the adhesive that bonds the first surface 11 and the opposing surface 31 may include an organic material such as an epoxy resin.
  • the adhesive may include a UV curable resin material that is cured by irradiation with ultraviolet light.
  • the first surface 11 and the facing surface 31 may be bonded with a metal solder containing indium or the like.
  • the holding member 3A and the terminal optical element 2A are bonded using an adhesive, an increase in size and complexity of a mechanism for holding the terminal optical element 2A is suppressed. ing.
  • the gas seal mechanism 20 can generate a gas flow with the second surface 12 of the last optical element 2A.
  • the gas seal mechanism 20 has a facing surface 32 that is arranged with a predetermined distance from the second surface 12 of the last optical element 2A.
  • the gas seal mechanism 20 is provided on the holding member 3A that holds the terminal optical element 2A.
  • the opposing surface 32 of the gas seal mechanism 20 is formed on the holding member 3A.
  • the opposed surface 32 of the gas seal mechanism 20 is set as a part of the upper surface 30 of the holding member 3A.
  • the upper surface 30 of the holding member 3A has a facing surface 31 that faces the first surface 11 of the terminal optical element 2A and a facing surface that faces the second surface 12 of the terminal optical element 2A. Includes 32 each.
  • the facing surface 31 is set to at least a part of the outer edge region of the upper surface 30, and the facing surface 32 is closer to the external space 6 side than the facing surface 31 (the optical axis side of the terminal optical element 2A). Is set to at least a part of the inner edge region.
  • the upper surface 30 is set so as to surround the immersion space LS and the injection surface 8 arranged in the external space 6.
  • the facing surface 31 is set at a position farther than the facing surface 32 with respect to the external space 6 including the immersion space LS and the exit surface 8! /.
  • the gas seal mechanism 20 is a second surface formed on the flange surface 9F.
  • a flow of gas can be generated between 12 and the opposing surface 32 that is arranged with a predetermined distance from the second surface 12.
  • an interval (gap) between the second surface 12 and the facing surface 32 is set to 1 ⁇ m to 100 ⁇ m, for example.
  • the gas seal mechanism 20 includes a gas supply port 21 formed in the facing surface 32 and a second gas supply device 22 that supplies gas to the gas supply port 21. ing.
  • the second gas supply device 22 and the gas supply port 21 are connected via a supply channel 23 formed inside the supply pipe 23P and the holding member 3A.
  • the second gas supply device 22 can supply the dried gas to the gas supply port 21.
  • the gas seal mechanism 20 supplies the gas sent from the second gas supply device 22 to the gap between the second surface 12 and the facing surface 32 through the gas supply port 21.
  • the gas seal mechanism 20 supplies a dry inert gas from the gas supply port 21.
  • the second gas supply device 22 sends out nitrogen gas that is chemically purified and has a concentration of approximately 100%.
  • the gas seal mechanism 20 supplies dry nitrogen gas from the gas supply port 21.
  • the gas (inert gas) supplied from the gas supply port 21 may be helium, carbon dioxide (CO 2), argon (Ar),
  • Krypton (Cr), a mixed gas of them and nitrogen, or a mixed gas of nitrogen and helium may be used.
  • the gas seal mechanism 20 may supply dry air (dry air) from the gas supply port 21.
  • the gas supplied into the lens barrel 5 may be reused.
  • the gas supplied from the gas scenery mechanism 20 via the gas supply port 21 may be the same as the gas supplied from the first gas supply device 60 to the internal space 4.
  • the gas supply port 21 is formed on the facing surface 32, and is formed on the external space 6 side with respect to the joint portion 40 formed on the facing surface 31. Yes. In other words, the gas supply port 21 is disposed between the outer space 6 and the joint 40, and is formed closer to the outer space 6 than the joint 40. As shown in FIG. 3, in the present embodiment, a plurality of gas supply ports 21 are formed on the facing surface 32 so as to correspond to each of the plurality of joints 40 formed in an island shape. Yes. In other words, each of the plurality of gas supply ports 21 is disposed at a position close to each of the plurality of joints 40. Each of the plurality of gas supply ports 21 is disposed on the outer space 6 side with respect to the joint portion 40.
  • a gas (dry gas) is sent from the second gas supply device 22 of the gas seal mechanism 20, and the gas is supplied to the gas supply port 21.
  • the gas supply port 21 is formed on a facing surface 32 that is arranged at a predetermined distance from the second surface 12 of the last optical element 2A, and the gas supplied from the second gas supply device 22 Supply to the gap between 12 and facing surface 32. Gas is supplied to the gap between the second surface 12 and the facing surface 32 from a gas supply port 21 disposed on the outer space 6 side of the joint 40.
  • Gas is supplied from the gas supply port 21 to the gap between the second surface 12 of the terminal optical element 2A and the facing surface 32 of the holding member 3A, whereby the second surface 12 and the facing surface 32 are In the meantime, a predetermined gas flow is generated.
  • the gas seal mechanism 20 supplies gas from the gas supply port 21 to the gap between the second surface 12 and the facing surface 32. As a result, it is possible to generate a gas flow between the second surface 12 and the facing surface 32 from the joint 40 side to the external space 6 side.
  • the second gas supply device 22 can send a gas having a humidity lower than that of the gas in the external space 6, and the gas seal mechanism 20 is opposed to the second surface 12. In between, the humidity is lower than the gas in the external space 6! / And a gas flow is generated.
  • the gap between the second surface 12 and the facing surface 32 is set to a predetermined value (for example, 1 H 111 to 100 m), and gas is supplied to the gap.
  • the gas seal mechanism 20 can increase the pressure between the second surface 12 and the facing surface 32 at least higher than the pressure (for example, atmospheric pressure) in the external space 6. That is, in the present embodiment, the gas seal mechanism 20 positively pressures the space between the second surface 12 and the opposed surface 32 at least with respect to the adjacent space.
  • the external space 6 includes the immersion space LS, and the gas in the external space 6 may have high humidity. When gas in the external space 6 with high humidity is brought to the joint 40, the joint 40 may deteriorate.
  • the properties of the joint 40 including the adhesive may change.
  • the adhesive when humid gas is brought into the adhesive at the joint 40, for example, the adhesive may swell, the volume of the adhesive may change, or the properties of the adhesive may change.
  • the position of the last optical element 2A may fluctuate or at least one of the entrance surface 7 and the exit surface 8 may be deformed.
  • the bonding strength of the bonding portion 40 is lowered. Then, the optical characteristics of the optical device 1 may change (deteriorate).
  • the gas seal mechanism 20 may generate a predetermined gas flow between the second surface 12 and the facing surface 32, so that the external space 6 may have moisture. A certain gas force can be prevented from being introduced into the joint 40.
  • the gas seal mechanism 20 generates a flow of gas and gas force between the second surface 12 and the opposed surface 32 from the joint 40 side to the external space 6 side. Therefore, it is necessary to use the force S to suppress that the gas in the external space 6 that may be humid is applied to the joint 40 from the external space 6 side.
  • the gas seal mechanism 20 generates a positive pressure between the second surface 12 and the opposing surface 32 by supplying a gas to the gap between the second surface 12 and the opposing surface 32. Therefore, it is possible to suppress the gas in the external space 6 from entering the gap and being brought to the joint 40.
  • the gas seal mechanism 20 supplies a gas having a humidity lower than that of at least the gas in the external space 6 between the second surface 12 and the facing surface 32, and the humidity is reduced. Since the low gas flow is generated, it is possible to prevent the joint 40 from being deteriorated by moisture.
  • the facing surface 31 of the holding member 30 and the first surface 11 of the flange surface 9F are joined by a plurality of separated joints 40 in the rotational direction around the optical axis.
  • the holding member 3 ⁇ and the last optical element 2 ⁇ are joined by a plurality of joints 40, so that a gap 26 communicating the inner space 4 and the outer space 6 is formed between the last optical element 2A and the holding member 3A. 27 is formed.
  • gear 26 is formed between the facing surface 31 and the first surface 11, and the gap 27 is formed between the side surface 9T of the terminal optical element 2A and the inner surface of the holding member 3A facing the side surface 9T. Formed.
  • the entire circumference is provided between the side surface 9T of the terminal optical element 2A and the inner side surface 3T of the holding member 3A.
  • the gap 27 is filled with grease.
  • the supply amount of the gas supplied from the first gas supply device 60 is adjusted instead of filling the gap 27 with a dull.
  • the pressure in the inner space 4 may be higher than the pressure in the outer space 6 (for example, atmospheric pressure).
  • the gas seal mechanism 20 in a state where the gas flow between the internal space 4 and the external space 6 is blocked by grease, the gas seal mechanism 20 generates a predetermined gas flow to generate a joint portion. Deterioration of 40 can be suppressed.
  • the gas flow and the gas flow of the gas seal mechanism 20 Due to the synergistic effect, deterioration of the joint 40 can be suppressed.
  • the holding member 3A and the terminal optical element 2A are bonded using an adhesive, the mechanism for holding the terminal optical element 2A is increased in size and complexity. This has been suppressed. As described above, in the present embodiment, the force S for holding the terminal optical element 2A in a desired state is suppressed while suppressing an increase in size and complexity of the mechanism for holding the terminal optical element 2A.
  • the incident surface 7 has a convex shape so that light incident from the object surface Os side can reach the image surface Is through the liquid LQ satisfactorily.
  • the entire optical device 1 including the terminal optical element 2A may need to be enlarged.
  • the mechanism for holding the terminal optical element 2A is enlarged, The optical device 1 as a whole may be further increased in size.
  • the incident surface 7 (curved surface) becomes large or the terminal optical element 2A is enlarged, the arrangement and structure of the mechanism for holding the terminal optical element 2A may be restricted.
  • the terminal optical element 2A having a curved surface cannot be satisfactorily held and the position of the terminal optical element 2A having the curved surface varies, the optical characteristics of the optical device 1 may greatly vary.
  • the holding member 3A and the last optical element 2A are joined by the joint 40, and deterioration of the joint 40 is suppressed using the gas seal mechanism 20, so that the optical device 1 as a whole
  • the optical characteristics of the optical device 1 can be maintained while suppressing the increase in size and complexity.
  • the external space 6 includes the immersion space LS in order to suppress the gas on the external space 6 side that may be humid from being brought to the joint 40.
  • the force that generates the predetermined gas flow by the gas seal mechanism 20 The immersion space LS is formed in the external space 6! /, Or not! /. In the case where the immersion space LS is formed! /, Na! /,
  • the gas seal mechanism 20 prevents the gas in the outer space 6 from being brought into the joint 40. However, it can be prevented from being deteriorated by the low-purity gas or the gas in the external space 6 flowing into the internal space 4.
  • FIG. 6 is an enlarged perspective view of a part of the optical device 1 according to the second embodiment.
  • the optical device 1 includes a holding member 3A having a facing surface 31 facing the first surface 11 and a facing surface 32 facing the second surface 12 of the terminal optical element 2A.
  • a gas supply port 21 for supplying gas is formed in the facing surface 32.
  • a plurality of gas supply ports 21 are formed on the facing surface 32 so as to correspond to each of the plurality of joints 40. Yes.
  • the gas seal mechanism 20A of the present embodiment has a groove 24 formed in the facing surface 32.
  • the gas supply port 21 is formed inside the groove 24.
  • a plurality of grooves 24 are formed so as to correspond to the gas supply ports 21.
  • the circumferential length of the groove 24 is longer than the circumferential length of the joint 40.
  • the groove 24 is formed in a substantially arc shape in the XY plane, and the gas supply port 21 is formed substantially at the center in the axial direction of the groove 24.
  • a groove 24 and a gas supply port 21 are formed, and a facing surface 32 that faces the second surface 12 is formed with an adhesive portion 40 and is disposed closer to the outer space 6 than the facing surface 31 that faces the first surface 11. Has been.
  • the groove 24 can be formed in the facing surface 32, and the gas supply port 21 can be disposed inside the groove 24.
  • the gas seal mechanism 20A can generate a predetermined gas flow between the second surface 12 on the external space 6 side and the facing surface 32 with respect to the joint portion 40.
  • at least a part of the gas supplied from the gas supply port 21 flows so as to expand along the groove 24 and then flows from the joint 40 toward the external space 6 side. As a result, the ability S to control that the gas in the outer space 6 is brought to the joint 40 is reduced.
  • FIG. 7 is an enlarged perspective view of a part of the optical device 1 according to the third embodiment. Similar to the first embodiment described above, a plurality of joints 40 are set in the rotation direction around the optical axis AX.
  • the gas seal mechanism 20B of the present embodiment has a groove 25 formed in an annular shape in the XY plane on the upper surface 30 of the holding member 3A.
  • a plurality of grooves 25 are formed on the upper surface 30 so as to surround the joint portion 40 (region where the adhesive is disposed). That is, in the present embodiment, the groove 25 is formed on the upper surface 30 so as to surround the facing surface 31 on which the joint portion 40 is formed.
  • the gas supply port 21 is formed at a predetermined position inside the groove 25! /.
  • the gas supply port 21 is disposed on the inner space 4 side of the joint 40 inside the groove 25. That is, in the present embodiment, the facing surface 31 on which the joint 40 is formed is disposed between the external space 6 and the gas supply port 21.
  • At least a part of the groove 25 is formed on the outer space 6 side with respect to the facing surface 31. Change In other words, a part of the groove 25 is formed on the facing surface 32 on the outer space 6 side with respect to the joint portion 40 in the upper surface 30.
  • the gas seal mechanism 20B can generate a gas flow according to the shape of the groove 25 between the flange surface 9F and the facing surface 31 by the gas supplied from the gas supply port 21. At least a part of the gas supplied from the gas supply port 21 flows along the groove 25. As described above, at least a part of the groove 25 is formed on the facing surface 32 on the external space 6 side with respect to the facing surface 31 including the joint 40, and the gas seal mechanism 20B is supplied from the gas supply port 21. In addition, a predetermined gas flow can be generated between the second surface 12 on the outer space 6 side and the facing surface 32 with respect to the joint portion 40 by the gas flowing according to the shape of the groove 25.
  • FIG. 8 is a side sectional view showing a part of the optical device 1 according to the fourth embodiment.
  • gaps 26 and 27 are formed between the inner space 4 and the outer space 6 between the terminal optical element 2A and the holding member 3A.
  • the gas seal mechanism 20C of the present embodiment includes a gas supply port on the facing surface 32! /,! /.
  • the gas seal mechanism 20C of the present embodiment is formed between the facing surface 31 and the first surface 11 so as to communicate the inner space 4 and the outer space 6, and the gas in the inner space 4 faces the second surface 12. It includes gaps 26 and 27 between the surface 32 and a first gas supply device 60 for supplying gas to the internal space 4.
  • the gas seal mechanism 20C supplies gas from the first gas supply device 60 to the internal space 4A, and makes the pressure of the internal space 4 higher than at least the pressure of the external space 6 (for example, atmospheric pressure).
  • the gas seal mechanism 20 ⁇ / b> C uses the first gas supply device 60 to supply gas to the internal space 4 to positively pressure the internal space 4.
  • the internal space 4 By positively pressurizing the internal space 4, the internal space 4 can be moved through the gaps 26 and 27.
  • Gas is supplied to the gap between the second surface 12 and the opposing surface 32, and the internal space 4 force is also directed between the second surface 12 and the opposing surface 32 via the gaps 26 and 27, generating a gas flow. Is done.
  • the gas supplied between the second surface 12 and the opposing surface 32 from the gaps 26 and 27 flows toward the external space 6. That is, when the internal space 4 is positively pressurized, a flow of gas and gas is generated from the internal space 4 through the gaps 26 and 27 to the external space 6, and the second surface 12 and the opposing surface 32 are in contact with each other. In the middle, a gas flow is generated from the periphery of the joint 40 toward the external space 6 side. Gassi The mechanism 20C suppresses that the gas in the external space 6 is brought to the joint 40 by this gas flow.
  • FIG. 9 is a side sectional view showing a part of the optical device 1 according to the fifth embodiment.
  • the present embodiment is a modification of the first to third embodiments.
  • the gas seal mechanism 20D according to this embodiment includes a gas suction mechanism 50 that sucks the gas between the second surface 12 and the facing surface 32.
  • the gas suction mechanism 50 includes a gas suction port 51 formed in the holding member 3, and a gas suction device 52 including a vacuum system that can suck gas through the gas suction port 51.
  • the gas suction device 52 and the gas suction port 51 are connected to each other through a suction channel 53 formed inside the suction pipe 53 and the holding member 3.
  • the gas suction port 51 is formed on the facing surface 32 on the external space 6 side of the upper surface 30 of the holding member 3 ⁇ ⁇ ⁇ ⁇ with respect to the facing surface 31, and between the second surface 12 and the facing surface 32. Gas can be sucked. As in the above-described embodiment, gaps 26 and 27 are formed between the second surface 12 and the facing surface 32.
  • a gap 26 is formed between the facing surface 31 and the first surface 11 so as to communicate the internal space 4 and the external space 6.
  • the gap 26 allows gas to flow between the internal space 4 and the external space 6, and the gas in the internal space 4 flows between the second surface 12 and the facing surface 32.
  • the gas suction device 52 When the gas suction device 52 is driven, the gas between the second surface 12 and the facing surface 32 is sucked by the gas suction port 51. As shown in FIG. 9, when the gas suction port 51 sucks the gas, the gas is sucked from the inner space 4 of the lens barrel 5 through the gap 26 to the gas suction port 51 from around the joint 40. A flow of is generated.
  • the gas suction port 51 is disposed on the outer space 6 side from the joint 40, and a gas flow is generated from the joint 40 side toward the outer space 6 side.
  • the gas suction port 51 sucks the gas
  • the gas flow from the external space 6 to the gas suction port 51 is generated.
  • the gas suction port 51 is disposed on the outer space 6 side with respect to the joint portion 40, and the gas from the outer space 6 absorbs the gas almost without reaching the joint portion 40. It is sucked into the outlet 51.
  • the gas seal mechanism 20D generates a gas flow from the joining portion 40 side toward the outer space 6 side, and travels from the outer space 6 toward the joining portion 40.
  • the gas can be sucked at the gas suction port 51 before being brought to the joint 40. This suppresses the gas in the external space 6 from being brought to the joint 40.
  • a concave portion may be formed on the second surface 12 so as to face the gas suction port 51.
  • a circumferential groove may be formed on the second surface 12.
  • FIG. 10 is an enlarged perspective view of a part of the optical device 1 according to the sixth embodiment.
  • the gas seal mechanism 20E of the present embodiment includes a gas supply port 21 for supplying a gas and a gas suction port 51 for sucking the gas.
  • a groove 24 is formed in the facing surface 32 of the holding member 3A.
  • a plurality of grooves 24 are formed on the upper surface 30A so as to correspond to the plurality of joints 40.
  • the circumferential length of the groove 24 is longer than the circumferential length of the joint 40.
  • the groove 24 is formed in a substantially arc shape in the XY plane.
  • the gas supply port 21 is formed at a first position in the circumferential direction of the groove 24, and the gas suction port 51 is formed at a second position in the circumferential direction of the groove 24.
  • a gas supply port 21 is formed at one end of the substantially arc-shaped groove 24 in the circumferential direction, and a gas suction port 51 is formed at the other end.
  • the groove 24 is disposed closer to the external space 6 than the facing surface 31. That is, the groove 24 including the gas supply port 21 and the gas suction port 51 is formed on the facing surface 32 disposed on the outer space 6 side with respect to the facing surface 31 including the joint portion 40.
  • the gas seal mechanism 20E performs the gas supply operation using the gas supply port 21 and the gas suction operation using the gas suction port 51 in parallel.
  • a predetermined gas flow is generated between the second surface 12 and the opposing surface 32 on the outer space 6 side from 40.
  • both the gas supply port 21 and the gas suction port 51 can be formed on the facing surface 32.
  • the gas flow between the second surface 12 and the opposing surface 32 can be controlled.
  • the gas seal mechanism 20E is removed from the gap between the second surface 12 and the opposing surface 32. It is possible to suppress an excessive flow of gas to the partial space 6 side. If excessive gas flows to the external space 6 side, the liquid LQ in the immersion space LS is easily vaporized, or bubbles are generated in the liquid LQ. May be affected.
  • the gas flow is controlled by appropriately performing the gas supply operation using the gas supply port 21 and the gas suction operation using the gas suction port 51, thereby generating the desired gas flow. be able to.
  • the positional relationship and the number of the gas supply port 21 and the gas suction port 51 shown in FIG. 10 are examples, and the positional relationship and the number are between the second surface 12 and the opposing surface 32. Is appropriately set so that a desired gas flow can be generated.
  • FIG. 11 is an enlarged side sectional view of a part of the optical device 1 according to the seventh embodiment
  • FIG. 12 is a perspective view.
  • the gas seal mechanism 20F of the present embodiment includes a gas supply port 21 disposed on the inner space 4 side with respect to the opposing surface 31 including the joint 40, and an opposing surface 31.
  • a gas suction port 51 arranged on the external space 6 side is provided.
  • a plurality of joints 40 are formed in the rotational direction around the optical axis AX.
  • the first groove 28 formed on the inner space 4 side with respect to the facing surface 31 is formed on the upper surface 30 of the holding member 3A, and the outer space 6 side is formed with respect to the facing surface 31.
  • a second groove 29 is formed.
  • Each of the first groove 28 and the second groove 29 is formed on the upper surface 30 so as to sandwich a plurality of joint portions 40 (regions where the adhesive is disposed) disposed in an island shape.
  • the gas supply port 21 is formed inside the first groove 28.
  • the first groove 28 is formed in a substantially arc shape in the XY plane, and the gas supply port 21 is formed substantially at the center in the axial direction of the first groove 28.
  • the gas supply port 21 is formed in the vicinity of the joint 40.
  • the gas suction port 51 is formed inside the second groove 29.
  • the second groove 29 is formed in a substantially arc shape in the XY plane, and the gas suction port 51 is formed in each of one end and the other end of the arc-shaped second groove 29. ing.
  • the gas seal mechanism 20F performs the gas supply operation using the gas supply port 21 and the gas suction operation using the gas suction port 51 in parallel, and the second surface on the external space 6 side from the joint 40. A predetermined gas flow is generated between 12 and the opposite surface 32.
  • the gas seal mechanism 20F supplies gas from the gas supply port 21 disposed on the inner space 4 side with respect to the facing surface 31, and is disposed on the outer space 6 side with respect to the facing surface 31.
  • the gas suction port 51 By sucking the gas from the gas suction port 51, it is possible to generate a flow of gas and gas from the joint 40 side to the external space 6 side.
  • the gas suction port 51 is disposed on the outer space 6 side with respect to the joint portion 40, and the gas from the outer space 6 is sucked into the gas suction port 51 without almost reaching the joint portion 40.
  • the gas seal mechanism 20F generates a flow of gas and gas flowing from the joint 40 side to the external space 6 side, and travels from the external space 6 to the joint 40.
  • the gas can be sucked at the gas suction port 51 before being brought to the joint 40. This suppresses the gas in the external space 6 from being brought to the joint 40.
  • the second groove 29 is formed in a substantially arc shape in the XY plane, but may be a short straight line.
  • FIG. 13 is an enlarged side view of a part of the optical device 1 according to the eighth embodiment.
  • the facing surface 31 and the facing surface 32 are the force S formed on the upper surface 30 facing the + Z side of the holding member 3A, as shown in FIG.
  • the surface 31 and the opposing surface 32 may be formed on surfaces facing different directions.
  • the facing surface 31 of the holding member 3A is formed so as to face the side surface 9T of the terminal optical element 2A, and the facing surface 32 faces a part of the flange surface 9F of the terminal optical element 2A. It is formed as follows.
  • the first surface 11 of the surface of the terminal optical element 2A is set to the side surface 9T, and the second surface 12 on the outer space 6 side with respect to the first surface 11 is the flange surface 9F. Is set.
  • the gas supply port 21 of the gas seal mechanism 20G is formed on the opposing surface 32, and the gas seal mechanism 20G By supplying gas from the port 21, a predetermined gas flow is generated between the second surface 12 and the facing surface 32. Also in the present embodiment, deterioration of the joint 40 can be suppressed by the flow of gas generated by the gas seal mechanism 20G.
  • FIG. 14 is an enlarged side view of a part of the optical device 1 according to the ninth embodiment.
  • the facing surface 31 of the holding member 3A is formed to face the side surface 9T of the terminal optical element 2A, and the facing surface 32 is also formed to face the side surface 9T of the terminal optical element 2A.
  • the first surface 11 of the surface of the terminal optical element 2A is set to the side surface 9T, and the second surface 12 on the external space 6 side is also set to the side surface 9T with respect to the first surface 11.
  • the gas supply port 21 of the gas seal mechanism 20H is formed on the facing surface 32.
  • the gas seal mechanism 20H supplies the gas from the gas supply port 21 to the second surface 12 and the facing surface 32. During this period, a predetermined gas flow is generated. Also in the present embodiment, deterioration of the joint 40 can be suppressed by the flow of gas generated by the gas seal mechanism 20H.
  • FIG. 15 is an enlarged side view of a part of the optical device 1 according to the tenth embodiment.
  • an upper surface 9U facing the + Z side and substantially parallel to the XY plane is formed on the edge of the terminal optical element 2A.
  • the facing surface 31 of the holding member 3A is formed to face the upper surface 9U of the terminal optical element 2A, and the facing surface 32 is formed to face the side surface 9T of the terminal optical element 2A. That is, in this embodiment, the first surface 11 of the surface of the terminal optical element 2A is set to the upper surface 9U, and the second surface 12 on the external space 6 side is set to the side surface 9T with respect to the first surface 11. Has been.
  • the gas supply port 21 of the gas seal mechanism 201 is formed in the facing surface 32, and the gas seal mechanism 201 supplies the gas from the gas supply port 21 to thereby form the second surface 12 and the facing surface 32. In the meantime, a predetermined gas flow is generated. Also in the present embodiment, deterioration of the joint 40 can be suppressed by the flow of gas generated by the gas seal mechanism 201.
  • the opposing surface 32 of the gas seal mechanism is formed on the holding member 3A having the opposing surface 31. 1S
  • the characteristic part of this embodiment is that the opposing surface 32 is different from the holding member 3A having the opposing surface 31. It is in the point formed in the member.
  • FIG. 16 is a side sectional view showing a part of the optical device 1 according to the eleventh embodiment.
  • the facing surface 32 of the gas seal mechanism 20J is formed on a member 32B different from the holding member 3A. Further, a gas supply port 21 is formed in the facing surface 32. A supply flow path 23 connected to the gas supply port 21 is formed inside the member 32B. Also in the present embodiment, deterioration of the joint 40 can be suppressed by the flow of gas generated by the gas seal mechanism 20J.
  • the configuration of the eleventh embodiment can also be applied to the above-described first to tenth embodiments.
  • the bonding portion has the first surface 11 and the opposing surface 31 bonded with an adhesive, but as shown in FIG. Surface 11 and opposing surface 31 can be bonded by direct bonding
  • Direct bonding includes an optical contact and joins two well-cleaned surfaces by adhering them without adhesive.
  • the holding member 3A is formed of the same glass (quartz or the like) as the terminal optical element 2A, and the first surface 11 of the terminal optical element 2A and the opposing surface 31 of the holding member 3A have no adhesive. The opposing surface 31 and the first surface 11 are joined together by bringing them into close contact with each other.
  • the gas seal mechanism 20L is configured so that the opposing surface 31 (first surface 11) joined by direct bonding is opposed to the second surface 12 on the external space 6 side and the opposing surface. A gas flow is generated between the two. Even in the joint 40 'for direct bonding, if the gas force is wet or the gas force S is low in purity, the joint 40' may deteriorate or the joint strength may be reduced. .
  • the gas seal mechanism 20L can suppress deterioration of the joint portion 40 ′ by generating a gas flow in order to prevent the gas in the outer space 6 from being brought to the joint portion 40 ′.
  • the joint 40 including the adhesive may be provided in an annular shape so as to surround the force-termination optical element 2A provided in an island shape. Good.
  • the gas supply port 21 or the groove in which the gas supply port 21 is formed may be formed in an annular shape.
  • the gas suction port 51 or the groove in which the gas suction port 51 is formed may be formed in an annular shape. That is, the groove may be formed over the entire circumference of the facing surface 32 of the holding member 3A! /.
  • the terminal optical element 2A may be a parallel plate.
  • the joint 40 may be provided on the optical surface of the terminal optical element 2A.
  • the gap 27 may be filled with grease.
  • an air bearing system (a configuration in which a gas recovery port is provided adjacent to the gas supply port 21) may be used.
  • the upper surface 9U is not formed.
  • the holding member 3A may be opposed to a part of the optical surface of the last optical element 2A so as not to block the optical path.
  • the optical apparatus 1 described in the first to twelfth embodiments is the projection optical system PL of the exposure apparatus EX as an example.
  • FIG. 18 is a schematic block diagram that shows an exposure apparatus EX according to the thirteenth embodiment.
  • the exposure apparatus EX illuminates the mask stage 71 that can move while holding the mask M, the substrate stage 72 that can move while holding the substrate P, and the pattern of the mask M with the exposure light EL.
  • the substrate P here is a substrate in which a photosensitive material (photoresist) is applied on a base material such as a semiconductor wafer such as a silicon wafer, or a protective film (top coat film) in addition to the photosensitive material.
  • the mask M includes a reticle on which a device pattern to be projected on the substrate P is formed.
  • a force reflection type mask using a transmission type mask as a mask may be used.
  • the transmission type mask is not limited to a binary mask in which a pattern is formed by a light shielding film, and also includes, for example, a phase shift mask such as a halftone type or a spatial frequency modulation type.
  • the exposure apparatus EX of the present embodiment is an immersion exposure apparatus to which the immersion method is applied in order to substantially shorten the exposure wavelength and improve the resolution, and to substantially increase the depth of focus.
  • a nozzle member 80 capable of forming a predetermined immersion space LS so that the optical path space of the exposure light EL is filled with the liquid LQ.
  • the immersion space LS is a space filled with the liquid LQ
  • the optical path space of the exposure light EL is a space including the optical path through which the exposure light EL travels.
  • decalin (C H) is used as the liquid LQ for forming the immersion space LS.
  • liquid LQ water (pure water), a fluorinated liquid, or the like can be used.
  • the nozzle member 80 includes a liquid supply port 81 (not shown in FIG. 18) capable of supplying the liquid LQ for forming the immersion space LS, and a liquid recovery port 82 (FIG. 18) capable of recovering the liquid LQ. And the liquid supply operation using the liquid supply port 81 and at least a part of the liquid recovery operation using the liquid recovery port 82 are performed in parallel.
  • the predetermined immersion space LS can be formed so that the optical path space is filled with the liquid LQ.
  • the nozzle member 80 is disposed so as to face the surface of the substrate P, and can hold the liquid LQ between the surface of the substrate P and the surface of the substrate P.
  • the immersion space LS can be formed.
  • the terminal optical element 2A closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL is arranged.
  • the terminal optical element 2A is arranged so as to face the surface of the substrate P, can hold the liquid LQ with the surface of the substrate P, and can form an immersion space LS with the surface of the substrate P. It is.
  • the exposure apparatus EX uses the nozzle member 80 to immerse the surface of the substrate P between the nozzle member 80 facing the surface of the substrate P and the terminal optical element 2A. Between form LS. Thereby, the optical path space of the exposure light EL between the terminal optical element 2A of the projection optical system PL and the surface of the substrate P is filled with the liquid LQ.
  • the immersion space LS is formed so that a part of the region on the substrate P including the projection region of the projection optical system PL is covered with the liquid LQ. That is, this embodiment employs a local liquid immersion method in which a liquid immersion area is formed on a part of the substrate P including the projection area of the projection optical system PL.
  • the illumination system IL illuminates a predetermined illumination area on the mask M with the exposure light EL having a uniform illuminance distribution.
  • the exposure light EL emitted from the illumination system IL includes, for example, bright ultraviolet rays (g-line, h-line, i-line) emitted from a mercury lamp and far ultraviolet light (DU V light) such as KrF excimer laser light (wavelength 248 nm). Or ArF excimer laser light (wavelength 193nm), F laser light (wavelength 157nm)
  • Vacuum ultraviolet light VUV light
  • ArF excimer laser light is used.
  • the mask stage 71 is movable in the X axis, Y axis, and ⁇ Z directions while holding the mask M by driving a mask stage driving device 71D including an actuator such as a linear motor.
  • Position information of the mask stage 71 (and thus the mask M) is measured by a laser interferometer 71L.
  • the laser interferometer 71L measures position information of the mask stage 71 using a measurement mirror 71R provided on the mask stage 71.
  • the control device 73 drives the mask stage driving device 71D based on the measurement result of the laser interferometer 71L, and controls the position of the mask M held by the mask stage 71 !.
  • the projection optical system PL can project the pattern image of the mask M onto the substrate P at a predetermined projection magnification, and includes the optical device 1 described in the first to thirteenth embodiments.
  • the projection optical system PL projects an image of the pattern of the mask M onto the substrate P via the liquid LQ in the immersion space LS.
  • the projection optical system PL of this embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, 1/8 or the like.
  • the projection optical system PL may be any of a reduction system, a unity magnification system, and an enlargement system.
  • the projection optical system PL may be any of a refractive system that does not include a reflective optical element, a reflective system that does not include a refractive optical element, and a catadioptric system that includes a reflective optical element and a refractive optical element. Further, the projection optical system PL may form either an inverted image or an erect image.
  • the substrate stage 72 has a substrate holder 72H that holds the substrate P. The substrate stage 72 is held in a state in which the substrate P is held on the substrate holder 72H by driving a substrate stage driving device 72D including an actuator such as a linear motor.
  • the substrate holder 72 ⁇ of the substrate stage 72 holds the substrate ⁇ ⁇ so that the surface of the substrate ⁇ is substantially parallel to the ⁇ ⁇ plane.
  • the position information of the substrate stage 72 (H! /) Is measured by the laser interferometer 72L.
  • the laser interferometer 72L measures positional information of the substrate stage 72 in the X axis, vertical axis, and ⁇ vertical directions using a measurement mirror 72R provided on the substrate stage 72.
  • the exposure apparatus ⁇ is capable of detecting surface position information (position information on the ⁇ axis, ⁇ X, and ⁇ ⁇ directions) of the surface of the substrate ⁇ held by the substrate stage 72.
  • a detection system is provided.
  • the control device 73 drives the substrate stage driving device 72D based on the measurement result of the laser interferometer 72L and the detection result of the focus leveling detection system, and is held by the substrate stage 72! / Perform position control.
  • a recess 72C is provided on the substrate stage 72, and the substrate holder 72 ⁇ is disposed in the recess 72C.
  • the upper surface 72F of the substrate stage 2 other than the recess 72C is substantially flat, and the upper surface 72F of the substrate stage 2 and the surface of the substrate substrate held by the substrate holder 72 ⁇ are substantially the same height (level).
  • the nozzle member 80 can also form the immersion space LS between the nozzle stage 80 and the upper surface 72F of the substrate stage 72.
  • FIG. 19 is a side sectional view showing the vicinity of the nozzle member 80.
  • the nozzle member 80 has a liquid supply port 81 for supplying the liquid LQ for forming the liquid immersion space LS and a liquid recovery port 82 for recovering the liquid LQ.
  • the nozzle member 80 is disposed in the vicinity of the last optical element 2 and so as to face the surface of the substrate surface (and / or the upper surface 2F of the substrate stage 2).
  • the nozzle member 80 is an annular member, and is disposed above the base plate (substrate stage 2) so as to surround the optical path space of the exposure light EL.
  • the nozzle member 80 has a bottom plate 83 having a lower surface 90 mm that can face the surface of the substrate surface. In the center of the bottom plate 83, an opening 84 through which the exposure light EL can pass is formed.
  • the liquid supply port 81 supplies liquid LQ between the upper surface of the bottom plate 83 and the exit surface 8 of the last optical element 2 mm.
  • the liquid supply port 81 is connected to the liquid supply device 86 via a liquid supply channel 85 and a liquid supply pipe 85P formed inside the nozzle member 80.
  • the liquid supply device 86 can deliver a clean liquid LQ whose temperature is adjusted.
  • the liquid supply device 86 can supply the liquid LQ for forming the immersion space LS via the liquid supply pipe 85P, the liquid supply channel 85, and the liquid supply port 81.
  • the operation of the liquid supply device 86 is controlled by the control device 73.
  • the liquid recovery port 82 is provided so as to surround the lower surface 90A of the bottom plate 83, and a porous member 87 is disposed in the liquid recovery port 82.
  • the lower surface 90B of the porous member 87 and the lower surface 90A of the bottom plate 83 are substantially flush.
  • the liquid recovery port 82 is connected to the liquid recovery device 89 via a liquid recovery flow path 88 and a liquid recovery pipe 88P formed inside the nozzle member 80.
  • the liquid recovery device 89 includes a vacuum system and can recover the liquid LQ.
  • the liquid recovery device 89 can recover the liquid LQ in the immersion space LS via the liquid recovery port 82, the liquid recovery flow path 88, and the liquid recovery pipe 88P.
  • the operation of the liquid recovery device 89 is controlled by the control device 73.
  • At least part of the lower surface 90A of the bottom plate 83 of the nozzle member 80 and the lower surface 90B of the porous member 87 can hold the liquid LQ between the surface of the substrate P and the liquid between the surface of the substrate P.
  • LQ immersion space LS can be formed.
  • the control device 73 drives the liquid supply device 86 and the liquid recovery device 89, and uses the liquid supply operation using the liquid supply port 81 and the liquid recovery port 82. Perform each liquid recovery operation.
  • the liquid LQ delivered from the liquid supply device 86 flows through the liquid supply channel 85 of the nozzle member 80, and then passes through the liquid supply port 81 between the exit surface 8 of the terminal optical element 2A and the upper surface of the bottom plate 83. Supplied in between.
  • the liquid LQ supplied between the exit surface 8 of the last optical element 2A and the upper surface of the bottom plate 83 passes through the opening 84 formed in the approximate center of the bottom plate 83 and the lower surfaces 90A and 90B of the nozzle member 80.
  • An immersion space LS is formed so as to flow into the space between the substrate P (substrate stage 2) and fill the optical path space K of the exposure light EL.
  • the control device 73 supplies a predetermined amount of liquid LQ per unit time to the optical path space K of the exposure light EL from the liquid supply port 81, and supplies a predetermined amount of liquid LQ per unit time to the liquid collection port 82.
  • the immersion space LS is formed so that the optical path space K of the exposure light EL between the terminal optical element 2A and the surface of the substrate P is filled with the liquid LQ.
  • the exposure apparatus EX forms the immersion space LS using the nozzle member 80 at least while the pattern image of the mask M is projected onto the substrate P.
  • the exposure apparatus EX irradiates the exposure light EL emitted from the illumination system IL and passed through the mask M onto the substrate P through the projection optical system PL and the liquid LQ in the immersion space LS. As a result, an image of the pattern of the mask M is projected onto the substrate P, and the substrate P is exposed.
  • the control device 73 At least while the immersion space LS is formed, the control device 73 generates a predetermined gas flow using the gas seal mechanism 20 (20A to 20U), and the external space 6 Is prevented from being introduced to the joint 40 between the last optical element 2A and the holding member 3A.
  • the configuration in which the terminal optical element 2A is held by the lens barrel 5 has been described.
  • the terminal optical element 2A may be held by the nozzle member 80. That is, the configuration of the holding member 3A in the present embodiment may be provided in the nozzle member 80.
  • the exposure apparatus EX can satisfactorily expose the substrate P by using the projection optical system PL that maintains desired optical characteristics.
  • the force with which the optical path space on the projection surface side of the terminal optical element of the projection optical system (optical device) is filled with the liquid is disclosed in, for example, WO 2004/019128 pamphlet.
  • the optical path space on the object plane side of the last optical element may be filled with liquid.
  • the optical element close to the image plane of the projection optical system after the terminal optical element includes a first space including an immersion space, and a second space different from the first space. Placed on the border.
  • the substrate P of the above-described embodiment includes not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device and a ceramic for a thin film magnetic head. Wafers, masks or reticle masters (synthetic quartz, silicon wafers) used in exposure apparatuses, film members, etc. are applied. Also, the substrate can be in other shapes, such as a rectangle, which is not limited to a circular shape.
  • the exposure apparatus EX in addition to the step-and-scanning-type scanning exposure apparatus (scanning stepper) that moves the mask M and the substrate P synchronously to scan and expose the pattern of the mask M,
  • the present invention can also be applied to a step-and-repeat projection exposure apparatus (steno) in which the pattern of the mask M is collectively exposed while the mask M and the substrate P are stationary, and the substrate P is sequentially moved stepwise.
  • steno step-and-repeat projection exposure apparatus
  • a reduced image of the first pattern is projected with the first pattern and the substrate P substantially stationary (for example, a refraction without a reflective element at a 1/8 reduction magnification). It can also be applied to an exposure apparatus that performs batch exposure on the substrate P using a mold projection optical system. In this case, after that, with the second pattern and the substrate P almost stationary, a reduced image of the second pattern is collectively exposed on the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus. Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P, and the substrate P is sequentially moved.
  • the optical elements (such as the final optical element 2A) of the projection optical system PL are not limited to single crystal materials of fluoride compounds.
  • the optical element may be formed of a material having a higher refractive index than quartz and fluorite (eg, 1.6 or more).
  • materials having a refractive index of 1.6 or more include sapphire and germanium dioxide disclosed in International Publication No. 2005/059617, or potassium chloride disclosed in International Publication No. 2005/059618. (Refractive index is about 1.75) can be used.
  • a thin film having a lyophilic property and / or a dissolution preventing function may be formed on a part of the surface of the optical element (including at least a contact surface with the liquid) or all of the surface.
  • Quartz has a high affinity with liquid and does not require a dissolution preventing film, but fluorite can form at least a dissolution preventing film.
  • Liquid LQ with a refractive index higher than that of pure water includes, for example, C-H such as isopropanol having a refractive index of about 1 ⁇ 50 and glycerol (glycerin) having a refractive index of about 1 ⁇ 61.
  • Predetermined liquid having a bond or O—H bond predetermined liquid (organic solvent) such as hexane, heptane, decane, etc. Or decalin (Decalin: Decahydronaphthalene) with a refractive index of about 1 ⁇ 60.
  • the liquid LQ may be a mixture of any two or more of these liquids, or a liquid obtained by adding (mixing) at least one of these liquids to pure water.
  • the liquid was added (mixed) to a pure water with a base or acid such as H + , Cs + , K +, Cl—, SO 2 —, PO 2 etc.
  • Liquid LQ includes a projection optical system with a small light absorption coefficient and a low temperature dependence, and / or a photosensitive material (or topcoat film or antireflection film, etc.) that is applied to the surface of the substrate! It is preferable that it is stable with respect to).
  • the substrate can be provided with a top coat film for protecting the photosensitive material or the base material from the liquid.
  • the present invention relates to JP-A-10-163099 and JP-A-10-214783 (corresponding to US Pat. Nos. 6,341,007, 6,400,441, 6,549,269 and 6,590,634),
  • the present invention can also be applied to a multistage exposure apparatus having a plurality of substrate stages as disclosed in Table 2000-505958 (corresponding US Pat. No. 5,969,441).
  • a substrate stage for holding a substrate and a reference mark are disclosed.
  • the present invention can also be applied to an exposure apparatus that includes a measurement member equipped with a measuring member capable of performing measurement related to exposure, such as a reference member on which is formed, and various photoelectric sensors.
  • a force that employs an exposure apparatus that locally fills a liquid between the projection optical system PL and the substrate P relates to Japanese Patent Application Laid-Open No. 6-124873.
  • an immersion exposure apparatus that performs exposure in a state where the entire surface of a substrate to be exposed is immersed in a liquid as disclosed in Japanese Patent Application Laid-Open No. 10-303114 and US Pat. No. 5,825,043. Is also applicable.
  • the type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, Widely applied to exposure devices for manufacturing imaging devices (CCD), micromachines, MEMS, DNA chips, or reticles or masks it can.
  • CCD imaging devices
  • MEMS micromachines
  • DNA chips DNA chips
  • a light transmission type mask in which a predetermined light shielding pattern (or phase pattern 'dimming pattern) is formed on a light transmission substrate is used instead of this mask.
  • a predetermined light shielding pattern or phase pattern 'dimming pattern
  • a transmission pattern or a reflection pattern there is a light emission pattern!
  • Electronic masks also called variable shaped masks, including DMD (Digital Micro-mirror Device), which is a kind of non-light emitting image display element (also called Spatial Light Modulator (SLM)
  • SLM Spatial Light Modulator
  • an exposure apparatus that exposes a line “and” space pattern on the substrate P by forming interference fringes on the substrate P.
  • the present invention can also be applied to (lithography system).
  • two mask patterns are formed on a substrate via a projection optical system.
  • the present invention can also be applied to an exposure apparatus that combines and double-exposes one shot area on the substrate almost simultaneously by one scanning exposure.
  • the present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.
  • the exposure apparatus EX of the above embodiment is manufactured by assembling various subsystems including each component so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy.
  • various optical systems! /, Adjustments to achieve optical accuracy, various mechanical systems! /, Mechanical accuracy Adjustments to achieve this and various electrical systems are adjusted to achieve electrical accuracy.
  • the assembly process from the various subsystems to the exposure apparatus includes mechanical connections, electrical circuit wiring connections, and pneumatic circuit piping connections between the various subsystems. Before the assembly process from the various subsystems to the exposure equipment, Needless to say, there is an individual assembly process. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustments are performed to ensure various accuracies for the exposure apparatus as a whole. It is desirable to manufacture the exposure equipment in a tailored room where the temperature and cleanliness are controlled!
  • a microdevice such as a semiconductor device has a function-performance design step 201, a mask (reticle) production step 202 based on the design step, and a device substrate.
  • Step 203 for manufacturing a substrate substrate processing step 204 including substrate processing (exposure processing) for exposing a mask pattern to the substrate and developing the exposed substrate according to the above-described embodiment, device assembly step (dicing process) Manufacturing process such as bonding process, packaging process, etc.) 205, inspection step 206, etc.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Lens Barrels (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

La présente invention concerne un dispositif optique qui contient un élément optique disposé à la limite entre un premier espace et un second espace différent du premier espace. Le dispositif optique comprend un élément de retenue possédant une face qui est située en face d'une première surface de l'élément optique, une unité de liaison pour lier la face et la première surface, et un mécanisme d'étanchéité à gaz pour supprimer l'approche d'au moins un parmi le gaz du premier espace et le gaz du second espace en direction de l'unité de liaison en générant un écoulement gazeux entre une face et une surface de l'élément optique.
PCT/JP2007/067324 2006-09-06 2007-09-05 Dispositif optique, appareil d'exposition et procédé de fabrication du dispositif WO2008029852A1 (fr)

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JP2011033900A (ja) * 2009-08-03 2011-02-17 Ntt Electornics Corp 光学部品保持ホルダ及び光構造物
JP2011159971A (ja) * 2010-02-02 2011-08-18 Asml Netherlands Bv リソグラフィ装置及びデバイス製造方法
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US8018591B2 (en) 2008-05-15 2011-09-13 Hamamatsu Photonics K.K. Spectroscopy module
US8027034B2 (en) 2008-05-15 2011-09-27 Hamamatsu Photonics K.K. Method for manufacturing spectroscopy module, and spectroscopy module
US8035814B2 (en) 2008-05-15 2011-10-11 Hamamatsu Photonics K.K. Spectroscopy module
US8040507B2 (en) 2008-05-15 2011-10-18 Hamamatsu Photonics K.K. Spectrometer
WO2011158740A1 (fr) * 2010-06-15 2011-12-22 富士フイルム株式会社 Barillet de lentille et procédé d'assemblage de barillet de lentille
US8139214B2 (en) 2008-05-15 2012-03-20 Hamamatsu Photonics K.K. Spectroscopy module, and method for manufacturing the same
US8604412B2 (en) 2008-05-15 2013-12-10 Hamamatsu Photonics K.K. Spectral module and method for manufacturing spectral module
JP2013251580A (ja) * 2009-12-09 2013-12-12 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
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JP2016532141A (ja) * 2013-10-07 2016-10-13 コーニング インコーポレイテッド レンズアセンブリおよびそれを組み込んだ光学系
TWI640799B (zh) * 2015-10-12 2018-11-11 德商卡爾蔡司Ｓｍｔ有限公司 光學構件、投影系統、量測系統及極紫外光微影設備

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US8604412B2 (en) 2008-05-15 2013-12-10 Hamamatsu Photonics K.K. Spectral module and method for manufacturing spectral module
US8013993B2 (en) 2008-05-15 2011-09-06 Hamamatsu Photonics K.K. Spectroscopy module
WO2009139316A1 (fr) * 2008-05-15 2009-11-19 浜松ホトニクス株式会社 Procédé de fabrication d’un module spectral et module spectral
US8804118B2 (en) 2008-05-15 2014-08-12 Hamamatsu Photonics K.K. Spectral module
US8035814B2 (en) 2008-05-15 2011-10-11 Hamamatsu Photonics K.K. Spectroscopy module
US8018591B2 (en) 2008-05-15 2011-09-13 Hamamatsu Photonics K.K. Spectroscopy module
US8027034B2 (en) 2008-05-15 2011-09-27 Hamamatsu Photonics K.K. Method for manufacturing spectroscopy module, and spectroscopy module
US8742320B2 (en) 2008-05-15 2014-06-03 Hamamatsu Photonics K.K. Spectral module and method for manufacturing spectral module
US8040507B2 (en) 2008-05-15 2011-10-18 Hamamatsu Photonics K.K. Spectrometer
JP2009300417A (ja) * 2008-05-15 2009-12-24 Hamamatsu Photonics Kk 分光モジュールの製造方法及び分光モジュール
US8139214B2 (en) 2008-05-15 2012-03-20 Hamamatsu Photonics K.K. Spectroscopy module, and method for manufacturing the same
US8564773B2 (en) 2008-05-15 2013-10-22 Hamamatsu Photonics K.K. Spectroscopy module
JP2011033900A (ja) * 2009-08-03 2011-02-17 Ntt Electornics Corp 光学部品保持ホルダ及び光構造物
JP2016075935A (ja) * 2009-12-09 2016-05-12 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
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JP2013251580A (ja) * 2009-12-09 2013-12-12 Asml Netherlands Bv リソグラフィ装置およびデバイス製造方法
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JP2017161943A (ja) * 2009-12-09 2017-09-14 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
JP2011159971A (ja) * 2010-02-02 2011-08-18 Asml Netherlands Bv リソグラフィ装置及びデバイス製造方法
US9618835B2 (en) 2010-02-02 2017-04-11 Asml Netherlands B.V. Lithographic apparatus and a device manufacturing method involving an elongate liquid supply opening or an elongate region of relatively high pressure
WO2011158740A1 (fr) * 2010-06-15 2011-12-22 富士フイルム株式会社 Barillet de lentille et procédé d'assemblage de barillet de lentille
JP2016532141A (ja) * 2013-10-07 2016-10-13 コーニング インコーポレイテッド レンズアセンブリおよびそれを組み込んだ光学系
CN104793466A (zh) * 2014-01-20 2015-07-22 上海微电子装备有限公司 一种用于浸没式光刻机的流体限制机构
TWI640799B (zh) * 2015-10-12 2018-11-11 德商卡爾蔡司Ｓｍｔ有限公司 光學構件、投影系統、量測系統及極紫外光微影設備
US10146048B2 (en) 2015-10-12 2018-12-04 Carl Zeiss Smt Gmbh Optical assembly, projection system, metrology system and EUV lithography apparatus

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