WO2008029852A1 - Optical device, exposure apparatus, and method for manufacturing device - Google Patents

Optical device, exposure apparatus, and method for manufacturing device Download PDF

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Publication number
WO2008029852A1
WO2008029852A1 PCT/JP2007/067324 JP2007067324W WO2008029852A1 WO 2008029852 A1 WO2008029852 A1 WO 2008029852A1 JP 2007067324 W JP2007067324 W JP 2007067324W WO 2008029852 A1 WO2008029852 A1 WO 2008029852A1
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WO
WIPO (PCT)
Prior art keywords
gas
surface
space
optical element
optical device
Prior art date
Application number
PCT/JP2007/067324
Other languages
French (fr)
Japanese (ja)
Inventor
Takaya Okada
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2006-241969 priority Critical
Priority to JP2006241969 priority
Application filed by Nikon Corporation filed Critical Nikon Corporation
Publication of WO2008029852A1 publication Critical patent/WO2008029852A1/en

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/70216Systems for imaging mask onto workpiece
    • G03F7/70341Immersion
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B13/00Optical objectives specially designed for the purposes specified below
    • G02B13/14Optical objectives specially designed for the purposes specified below for use with infra-red or ultra-violet radiation
    • G02B13/143Optical objectives specially designed for the purposes specified below for use with infra-red or ultra-violet radiation for use with ultra-violet radiation
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B3/00Simple or compound lenses
    • G02B3/12Fluid-filled or evacuated lenses

Abstract

An optical device holds an optical element arranged at the boundary between a first space and a second space different from the first space. The optical device comprises a holding member having a facing surface which faces a first surface of the optical element, a bonding unit for bonding the facing surface and the first surface, and a gas sealing mechanism for suppressing approach of at least one of the gas of the first space and the gas of the second space to the bonding unit by generating a gas flow between a facing surface and a surface of the optical element.

Description

Specification

Optical apparatus, exposure apparatus, and device manufacturing method

Technical field

[0001] The present invention relates to an optical apparatus, an exposure apparatus, and a device manufacturing method.

Priority is claimed on Japanese Patent Application No. 2006- 241969, filed on Sep. 6, 2006, which is incorporated herein by reference.

BACKGROUND

[0002] In more photolithographic Ye, one of the micro device of a manufacturing process of semiconductor devices or the like, an exposure apparatus is used to project the image of the pattern on the mask onto a photosensitive substrate through a projection optical system. In the manufacture of microdevices for densification of the device, miniaturization of a pattern to be formed on the substrate is required. To meet this demand, higher resolution of the exposure apparatus is desired. As a means for realizing this higher resolution, satisfying the optical path space of the exposure light between the optical element and the substrate of the projection optical system in the liquid body, the substrate via the projection optical system and the liquid immersion exposure apparatus is devised to be exposed. The following Patent Document 1, an example of a technique related to the holding member for holding the optical element of the projection optical system in an immersion exposure apparatus is disclosed.

Patent Document 1: WO 2005/054955 pamphlet

Disclosure of the Invention

Problems that the Invention is to you'll solve

[0003] When joining the holding member of the optical element, for example, there is a possibility that the surrounding environment is the junction by (temperature, humidity, including chemical reaction, etc.) to deteriorate. When the junction is degraded, for example, equal to the position of the light optical element varies, it may become impossible satisfactorily hold the optical element. If this happens, the optical characteristics of the projection optical system varies, it may become impossible satisfactorily expose a substrate.

[0004] The present invention aims to provide an optical apparatus capable of satisfactorily holding the optical element. Also, the exposure apparatus the substrate can be exposed satisfactorily through the optical element, and an object thereof is to provide a device manufacturing method Ru using the exposure apparatus. Means for Solving the Problems

[0005] The present invention adopts the following constructions corresponding to respective drawings as illustrated in embodiments. However, parenthesized reference numerals affixed to respective elements merely exemplify the elements by way of example and are not intended to limit the respective elements.

According to a first aspect of the [0006] present invention, the first space (6), the optical elements arranged in the boundary between the different second space (4) and the first space (6) and (2A) , bonding for bonding the retaining member having a first face (11) and the opposing surface you face of the optical element (2A) (31) (3A), an opposing surface (31) a first surface (11) parts (40), the gas seal mechanism at least one of the gas in the gas and a second space of the first space (6) (4) to generate the inhibiting gas stream to be brought into junction (40) (20) When an optical apparatus equipped with (1) is provided.

According to a first aspect of the [0007] present invention, it can be satisfactorily hold the optical element.

According to a second aspect of the [0008] present invention, the optical exposure light (with have you to an exposure apparatus which exposes a substrate (P) by EU, with the optical device of the above aspect of (1), an optical device (1) the exposure light on the substrate (P) through the device (exposure apparatus for irradiating the EU (EX) is provided.

According to a second aspect of the [0009] present invention, the substrate can be exposed satisfactorily through the optical element.

According to a third aspect of the [0010] present invention, a device manufacturing method using the exposure apparatus of the above aspect (EX) is provided.

According to a third aspect of the [0011] present invention can be produced device using an exposure apparatus that the substrate can be exposed satisfactorily.

Effect of the invention

[0012] According to the present invention, it can be satisfactorily hold the optical element. According to the present invention, the substrate can be exposed satisfactorily through the optical element. According to the present invention can be produced devices having a desired performance.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] FIG. 1 is a schematic configuration diagram showing an optical apparatus according to the first embodiment.

It is a [2] a partially enlarged cross-sectional view of FIG.

3 is a A- A cross-sectional view taken along the line of FIG. 2.

It is an enlarged view of a portion of FIG. 4 FIG. 5 is a fragmentary perspective view of FIG.

6 is a fragmentary perspective view of an optical device according to a second embodiment.

7 is a fragmentary perspective view of an optical device according to a third embodiment.

8 is a sectional view of a partially enlarged optical device according to the fourth embodiment.

9 is a sectional view of a partially enlarged optical device according to a fifth embodiment.

FIG. 10 is a fragmentary perspective view of an optical device according to a sixth embodiment.

11 is a sectional view of a partially enlarged optical device according to a seventh embodiment.

12 is a fragmentary perspective view of an optical device according to a seventh embodiment.

13 is a sectional view of a partially enlarged optical device according to the eighth embodiment.

14 is a sectional view of a partially enlarged optical device according to a ninth embodiment.

15 is a sectional view of a partially enlarged optical device according to the tenth embodiment.

16 is a sectional view of a partially enlarged optical device according to an eleventh embodiment.

17 is a sectional view of a partially enlarged optical device according to a twelfth embodiment.

FIG. 18 is a schematic block diagram showing an exposure apparatus according to the thirteenth embodiment.

19 is a sectional view of a partially enlarged in FIG. 18.

Is a flow chart illustrating an example of FIG. 20 microdevice manufacturing processes.

DESCRIPTION OF SYMBOLS

[0014] 1 - - - optical device, 2.alpha · · · last optical element, 3.alpha., ... holding member, 4 ... and internal space, 5 - - - barrel, 6 ... outer space, 11 ... first surface, 12 ... second surface 20 ... gas sealing mechanism, 21 ... gas inlet, 2 6 ... gap, 31 ... facing surface 32 ... facing surface 40 ... junction, 50 ... gas suction mechanism, 51 ... gas suction mouth, EL ... exposure apparatus, ΕΧ · · · exposure apparatus, LS ... immersion space, Ρ · · · board, PL ... throw projection optical system

BEST MODE FOR CARRYING OUT THE INVENTION

[0015] Hereinafter, the force present invention will be described with reference to the accompanying drawings, embodiments of the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system, with reference to the XY Z orthogonal coordinate system of the positional relationship between the respective members will be described. Then, X-axis direction is a predetermined direction in a horizontal plane, the direction perpendicular to the X-axis direction Y-axis direction in the horizontal plane, a direction orthogonal to both the X-axis direction and the Y-axis direction (i.e., vertical direction) and the Z-axis direction to. Further, X-axis, Y-axis, and rotation about the Z-axis (inclination) directions, theta X, theta Y, and 及 beauty theta Zeta direction.

[0016] <First Embodiment>

A first embodiment will be described. Figure 1 is a schematic approximately configuration diagram showing an optical device 1 according to the first embodiment. In Figure 1, the optical device 1 includes a plurality of optical elements 2A-2E, and the holding member 3A~3E for holding each of the plurality of optical elements 2A-2E, it has an inner space 4, a plurality of optical elements 2A and a lens barrel 5 that holds through the holding member 3A~3E inside space within 4 ~2E.

[0017] The optical device 1 can project an image of an object plane Os on the image plane Is. In the present embodiment, the optical axis AX of the plurality of optical elements 2A~2E of the optical device 1 is parallel to the Z axis. Each object plane Os and field Is is parallel to the XY plane. Object plane Os is, in the figure, is arranged on the + Z side of the optical device 1, the image surface Is is located in the Z side.

[0018] Of the plurality of optical elements 2A~2E of the optical device 1, the closest light optical element 2A on the image plane Is of the optical device 1 includes an internal space 4 of the barrel 5, different external space and the internal space 4 It is placed at the boundary between 6. In the following description, among the plurality of optical elements 2A~2E of the optical device 1, appropriate optical elements 2A disposed at the boundary between the inner space 4 and the external space 6 of the barrel 5, end-optic element 2A, It referred to.

[0019] In this embodiment, the inner space 4 of the barrel 5 is filled with a gas. External spatial 6 of the barrel 5 comprises a liquid immersion space LS filled with liquid LQ. Immersion space LS is formed in the vicinity of the last optical element 2A in the image plane Is side of the optical device 1. The optical device 1, the image of the first object B1 located on the object plane Os, through the liquid LQ of the immersion space LS, is capable projected on the second object B2, which is located on the image plane Is. In the present embodiment, the liquid immersion space LS is formed between the second object B2 arranged at the end-optic element 2A and the image plane Is.

[0020] The optical device 1 of this embodiment, the air supply ports 61 formed in the lens barrel 5, a first gas supply unit for supplying a gas through the air supply port 61 and the supply pipe 61P in the inner space 4 60 It is equipped with a door. In this embodiment, the first gas supply unit 60, the internal space 4, for supplying an inert gas drying. In this embodiment, the first gas supply unit 60 is chemically purified, concentration transmits almost 100% of the nitrogen gas. As the gas (inert gas) supplied to the internal space 4, may be helium, or a mixed gas of nitrogen and helium. The first gas supply unit 60, into the inner space 4, dry air (dry air) may be supplied.

[0021] FIG. 2 is a side sectional view showing the vicinity of a holding member 3A which holds the last optical element 2A and the last optical element 2A is disposed at the boundary between the inner space 4 and the external space 6 of the barrel 5, FIG. 3 is a A- a cross-sectional view taken along the line of FIG. 2. Further, FIG. 4 is a partially enlarged view of FIG. 2, FIG. 5 is a perspective view of a portion of FIG.

[0022] As shown in FIG. 2, in the present embodiment, the last optical element 2A has an incident surface 7 where light from the object plane Os incident, an exit surface 8 for emitting light incident from the incident surface 7 , and a peripheral surface 9 which connects the outer circumference of the incident surface 7 and the outer periphery of the exit surface 8. Incident surface 7 is disposed in the internal space 4 of the object plane Os countercurrent memorial. Exit surface 8 is arranged in the outer space 6 so as to face the image surface Is. At least a portion of the outer peripheral surface 9 is arranged in the outer space 6.

[0023] As described above, the inner space 4 of the barrel 5 is filled with gas, the incident surface 7 of the terminating optical element 2A which is disposed in the internal space 4 is in contact with the gas. Outer space 6 of the barrel 5 comprises a liquid immersion space LS filled with liquid LQ, the exit surface 8 disposed in the outer space 6 is in contact with the liquid LQ. Name your, in FIG. 2 (not shown) of the liquid LQ.

[0024] In this embodiment, the incident surface 7 of the last optical element 2A is a Rise ram convex curved surface toward the object plane Os, exit surface 8 of the last optical element 2A is substantially parallel to the XY plane is a plan. The outer peripheral surface 9 of the last optical element 2A has a slope 9S which is inclined to the incident surface 9 side with respect to the exit plane 8 so as to surround the exit surface 8, is disposed so as to surround the inclined surface 9S, XY plane substantially flat and a plane 9F facing rows of Z side. In the following description, among the outer peripheral surface 9 of the last optical element 2A, the plane 9F facing substantially parallel Z side with the XY plane appropriate flange surface 9F, and referred to.

[0025] 2, 3, 4, and 5, the optical device 1 includes a holding member 3 A having a facing surface 31 which pair toward the first surface 11 of the flange surface 9F, opposed holding members 3A and junction 40 joining the surfaces 31 and the first surface 11, to generate a flow of gas between the second surface 1 2 of the outer space 6 side with respect to the first surface 11 of the flange surface 9F, gas in the external space 6 and a suppressing gas sealing mechanism 20 to be brought into junction 40. [0026] In this embodiment, first surface 11 is set in a part even without least the outer edge region of the flange surface 9F (first region), the second surface 12, outer than the first surface 11 It is set to at least a portion of the inner edge region of the space 6 side of the flange surface 9F (second region). The second surface 12 is set on the flange surface 9F so as to surround the liquid immersion space LS and the exit surface 8 which is arranged outside spatial 6, the first surface 11, external including immersion space LS and the exit surface 8 It is set to have a far position than the second surface 12 relative to the space 6.

[0027] holding member 3A has a facing surface 3 1 facing the first surface 11 of the flange surface 9F of the last optical element 2A. In the present embodiment, the holding member 3A is disposed so as to face the flange surface 9F of the last optical element 2A, and has a top surface 30 facing substantially parallel + Z side to the XY plane. Facing surface 31 is set to a portion of the top surface 30.

[0028] upper surface 30 of the flange surface 9F opposed holding member 3A of the last optical element 2A is formed annularly so as to surround the liquid immersion space LS and the exit surface 8 disposed in the outer space 6. In the present implementation embodiment, the opposing surface 31, so as to face the first surface 11 of the flange surface 9F, it is set to at least a portion of the outer edge region of the upper surface 3 0. In the present embodiment, the flange surface 9F of terminating optical element 2A, the predetermined distance away from the upper surface 30 of the holding member 3A! /, Ru

[0029] joint 40 joining the first surface 11 of the opposing surface 31 and the last optical element 2A of the holding member 3A adheres to the first surface 11 and the facing surface 31 with an adhesive. Facing surface 31 is a surface joint 40 Ru is formed, a plane including the junction 40. Similarly, the first surface 11 also is a surface joint 40 is formed, a plane including the junction 40.

[0030] As shown in FIG. 3, in the present embodiment, each of the opposing surfaces 31 of the first surface 11 and the holding member 3A of the end-optic element 2A which is bonded via the bonding portion 40, the optical axis AX It is set in each of a plurality of predetermined areas in the direction of rotation about. In other words, junction 40 (area where the adhesive is disposed) is set to a plurality islands in the direction of rotation around the optical axis AX.

[0031] In this embodiment, the last optical element 2A is formed, for example, quartz (silica). Incidentally, the last optical element 2A is calcium fluoride (fluorite), barium fluoride, Kas strontium, may be formed of a single crystal material of lithium fluoride, and fluoride compounds such as sodium fluoride. Further, the optical element 2B-2E, can be formed of the above materials.

[0032] In the present embodiment, the holding member 3A is made closer as or a linear expansion coefficient of the optical element 2A are the same, for example a ceramic, an inorganic material such as glass, and is formed of metal. The holding member 3A may be comprise a boron, it may be formed of glass

[0033] As the adhesive for bonding the opposite surface 31 of the first surface 11 and the holding member 3A of the last optical element 2A, for example as disclosed in WO 2005/054955 pamphlet, metal, ceramics, or those containing an inorganic material such as glass. As the adhesive for adhering the first surface 11 and the facing surface 31, an organic material such as epoxy resin may be Dressings containing. Further, as the adhesive, it may include a UV hardening resin material which is cured by irradiation of ultraviolet light. The joining portion 40, and a first surface 11 and the facing surface 31 may be bonded by solder metals including indium.

[0034] In the present embodiment, since the holding member 3A and the last optical element 2A is engaged against using an adhesive, an increase in the size of the mechanism for holding the terminal end optical element 2A, complicated or the like is suppressed ing.

[0035] Gas sealing mechanism 20 is the generation available-gas flow between the second face 12 of the last optical element 2A. In the present embodiment, the gas sealing mechanism 20 has a facing surface 32 that is disposed a predetermined distance apart relative to the second surface 12 of the last optical element 2A.

[0036] In this embodiment, at least a portion of the gas seal mechanism 20 is provided on the holding member 3A for holding the terminal end optical element 2 A. In the present embodiment, the facing surface 32 of the Gasushi Lumpur mechanism 20 is formed in the holding member 3A. In this embodiment, the opposing surface 32 of the gas seal mechanism 20 is set to a portion of the upper surface 30 of the holding member 3A.

[0037] That is, in the present embodiment, the upper surface 30 of the holding member 3A has a second surface 12 and the facing opposing surface of the opposing surfaces 31, and the last optical element 2A opposite to the first surface 11 of the final optical element 2A including each of the 32. In the present embodiment, the facing surface 31 is set to at least a portion of the outer edge area of ​​the upper surface 30, opposite surface 32, the outer space 6 side from the facing surface 31 (the optical axis side of the end-optic element 2A) It is set to at least a portion of the inner edge region. Facing surface 32 is set on the upper surface 30 so as to surround the liquid immersion space LS and the exit surface 8 disposed in the outer space 6. Facing surface 31, a far than the counter surface 3 2 to the external space 6 including the immersion space LS and the exit plane 8! /, It is set at a position? /, Ru.

[0038] In this embodiment, the gas seal mechanism 20, a second surface formed on the flange surface 9F

12, it is possible to generate that flow of gas between the counter surface 32 are arranged by a predetermined distance apart with respect to the second surface 12. In this embodiment, the spacing between the second surface 12 and the facing surface 32 (gap) is set to, for example, 1 μ m~100 μ m.

[0039] Slight present embodiment, Te, the gas seal mechanism 20 is provided with a gas supply port 21 formed on the opposite surface 32, and a second gas supply unit 22 for supplying gas to the gas supply port 21 ing. The second gas supply unit 22 and the gas supply port 21 is connected through a supply channel 23 formed inside the feed pipe 23P and the holding member 3A. The second gas supply system 22 can supply dry gas to the gas supply port 21. Gas sealing mechanism 20, the gas delivered from the second gas supply unit 22 is supplied from the gas supply port 21, the gap between the second surface 12 and the facing surface 32.

[0040] to the present embodiment us! /, Te, the gas seal mechanism 20, from the gas supply port 21, supplies the dry inert gas. In the present embodiment, the second gas supply unit 22 is chemically purified, concentration transmits almost 100% of the nitrogen gas. Thus, the gas seal mechanism 20, from the gas supply port 21, supplies dry nitrogen. As the gas (inert gas) that will be supplied from the gas supply port 21 may be a helium carbon dioxide (CO), argon (Ar),

2

Krypton (Cr), a mixed gas thereof with nitrogen, or a mixture of nitrogen and helium. Further, the gas seal mechanism 20, from the gas supply port 21, dry air (dry air) may be by Unishi supply. It is also possible to reuse the supplied gas in the lens barrel 5. The gas supplied Gasushi Honoré mechanism 20 through the gas supply port 21, the first gas supply unit 60 may be the same as the gas supplied to the internal spatial 4.

[0041] As described above, in the present embodiment, the gas supply port 21 is Ri Contact is formed on the opposing surface 32, it is formed in the outer space 6 side to the joint portion 40 formed on the opposite surface 31 there. In other words, the gas supply port 21 is disposed between the outer space 6 and the joining portion 40, near! / The outer space 6 than the joint 40, it is formed at a position? /, Ru. [0042] As shown in FIG. 3, in this embodiment, the gas supply port 21 so as to correspond to each of the joint portions 40 of the number of multiple, which is formed in an island shape, formed with a plurality on the opposite surface 32 there. Ie, each of the plurality of gas supply ports 21 are located closer to each of the plurality of joints 40. Then, each of the plurality of gas supply ports 21 are arranged in the outer space 6 side to the joint portion 40.

[0043] Next, the operation of the optical device 1, mainly describes the operation of the gas seal mechanism 20. Gas (dry gas) is sent from the second gas supply device 22 of the gas seal mechanism 20, the gas is supplied to the gas supply port 21. Gas supply port 21 is formed on the opposing surface 32 is disposed a predetermined distance apart relative to the second surface 12 of the last optical element 2A, the supplied gas from the second gas supply unit 22, a second surface supplied to the gap between the 12 and the facing surface 32. The gap between the second surface 12 and the facing surface 32, gas is supplied from the gas supply port 21 disposed in the outer space 6 side from the joint portion 40.

[0044] By gas is supplied from the gas supply port 21 into the gap between the opposing surfaces 32 of the second surface 12 and the holding member 3A of the last optical element 2A, the second surface 12 and the facing surface 32 during the flow of a predetermined gas is generated.

[0045] In the present embodiment, as shown in FIGS. 4 and 5, the gas sealing mechanism 20, to supply the gas to the gap between the gas supply port 21 and the second surface 12 and the facing surface 32 Accordingly, between the second surface 12 and the facing surface 32, Kochikara from junction 40 side to the outer space 6 side, the flow of Ugasu be generate.

[0046] In the present embodiment, the second gas supply unit 22 is capable of feeding the gas is low degree of humidity than gas in the external space 6, a gas seal mechanism 20, the second surface 12 and the facing surface between 32, humidity than gas in the external space 6 is low! /, to generate a flow of gas.

[0047] In the present embodiment, the gap between the second surface 12 and the facing surface 32 is set to a predetermined value (e.g., 1 H 111~100 m), to supply gas to the gap especially good connexion, gas sealing mechanism 20, the pressure between the second surface 12 and the facing surface 32, can be made higher than at least the outer spatial 6 pressure (e.g. atmospheric pressure). That is, Te embodiment odor, gas sealing mechanism 20 is positive pressurization to at least its neighbor space a space between the second surface 12 and the facing surface 32. [0048] As described above, in the present embodiment, the outer space 6 includes a liquid immersion space LS, the gas of the external spatial 6 is likely to have a high humidity. When the gas humidity is high outer space 6 is brought to the junction 40, it is possible that the joint portion 40 is deteriorated. For example, there is a possibility that a high degree of humidity gas (gas damp) is once brought into the joint 40, a change in characteristics of the junction 40 comprising an adhesive. Specifically, the gases charged with moisture leads to the adhesive joint 40, for example, or the adhesive to swell, Ri volume of the adhesive is changed, a possibility that properties of the adhesive or changes there is. In that case, there is a possibility that the or position varies of the last optical element 2A, a defect in which at least one of the incident surface 7 and an exit surface 8 or deformed caused. There is also a possibility that a problem that the bonding strength of the bonding portion 40 is lowered. Then, there is a possibility that the optical characteristics of the optical device 1 is changed (degraded).

[0049] In this embodiment, the gas seal mechanism 20, by generating a flow of a predetermined gas between the second surface 12 and the facing surface 32, may have damp in the external space 6 It can be suppressed to be brought to a certain care stamina junction 40.

[0050] That is, in this embodiment, the gas seal mechanism 20 is provided between the second surface 12 and the facing surface 32, Kochikara from junction 40 side to the outer space 6 side, and generates a flow of Ugasu since it is, the gas in the external space 6 that may be tinged with moisture vapor is leaving by force S to ί 卬制 to be exposure to the junction 40 from the outer space 6 side.

[0051] Further, the gas seal mechanism 20, by Rukoto to supply gas to the gap between the second surface 12 and the facing surface 32, and between the second surface 12 and the facing surface 32 and positive pressurization since, it is possible to prevent the air of the outer space 6 enters the gap, it is brought into junction 40.

[0052] In the present embodiment, the gas seal mechanism 20 is provided between the second surface 12 and the facing surface 32, the humidity than gas in at least the outer space 6 by supplying a low gas, its humidity since generating a flow of low gas can joint 40 is prevented from being degraded by moisture.

[0053] and the first surface 11 of the opposing surface 31 and the flange surface 9F of the holding member 30, in the direction of rotation about the optical axis Arufakai, it is joined by a plurality of joints 40 spaced. By holding member 3Α and end optical element 2 Alpha is joined by a plurality of joints 40, the gap between the last optical element 2A and the holding member 3A, communicating the internal space 4 and the external space 6 26 , 27 are formed. Gear-up 26 is formed between the counter surface 31 and first surface 11, also the gap 27 has a side surface 9T of the last optical element 2A, the inner surface of the holding member 3A opposing the side surface 9T of It is formed between.

[0054] Therefore, in the present embodiment, in order to suppress the gas flow between the inner space 4 and the outer space 6, and side 9T of the last optical element 2A, the entire periphery between the inner surface 3T of the holding member 3A , in other words, it is filled with grease to the gap 27.

[0055] In order to suppress the gas flow between the inner space 4 and the outer space 6, instead of filling Daly scan the gap 27, by adjusting the supply amount of the gas supplied from the first gas supply device 60 , it may be higher than the pressure in the external space 6 the pressure in the inner space 4 (e.g. atmospheric pressure).

[0056] That is, by positive pressurization of the interior space 4 through the gap 26, 27, toward the force from the inner space between 4 to the outside space 6, it is possible to generate a flow of Ugasu. A synergistic effect between the gas flow and gas seal mechanism 20, it is possible to prevent the deterioration of the joint portion 40.

[0057] As described above, in the present embodiment, in the state where the gas flow between the inner space 4 and the external space 6 was blocked by grease, joint by generating a flow of a predetermined gas by the gas sealing mechanism 20 it is possible to suppress the deterioration of 40. Between the inner space 4 and the outer space 6, from the inner space 4 in the state like that generated a flow of gas toward the outer space 6 side, the flow of gas in the gas flow and gas seal mechanism 20 a synergistic effect, it is possible to suppress the deterioration of the junction 40.

[0058] Further, the present embodiment Niore, Te, since the holding member 3A and the last optical element 2A are joined with an adhesive, an increase in the size of the mechanism for holding the terminal end optical element 2A, complex and the like is suppressed. Thus, in the present embodiment, an increase in the size of the mechanism that holds the last optical element 2A, while suppressing the complexity, leaving at Rukoto force S to hold its last optical element 2A in a desired state.

[0059] If the you'll realize a high numerical aperture optical device 1, for example, in order to light incident from the object plane Os side satisfactorily reach the image plane Is through the liquid LQ, convex entrance surface 7 or a curved surface, it might be necessary to increase the size of the entire optical system 1 including the final optical element 2A. In such a case, a mechanism for holding the terminal end optical element 2A is the larger, which may lead to further increase in the overall size of the optical device 1. Further, there is or incident surface 7 (curved) size KuNatsu, the last optical element 2A is enlarged, the arrangement of the machine structure for holding the terminal end optical element 2A, a possibility that such structure is constrained. Furthermore, can not be satisfactorily retain the terminal end optical element 2A having a curved surface, the position of the last optical element 2A having the curved surface varies, there is a possibility that the optical characteristics of the optical device 1 may fluctuate greatly.

[0060] In this embodiment, joining a holding member 3A and the last optical element 2A junction 40, since the deterioration of the joint portion 40 is suppressed by using a gas seal mechanism 20, the entire optical device 1 size of, while suppressing the complexity, it is possible to maintain the optical characteristics of the optical device 1.

[0061] In the present embodiment, the outer space 6 includes a liquid immersion space LS, for the outer space 6 side of the gas that may moist from moisture to prevent the introduced at the junction 40 , the force outer space 6 that is generating a flow of a predetermined gas by the gas sealing mechanism 20 is immersion space LS is formed! /, I without! /,. Immersion space LS is formed! /, It! /, Even when, for example, an impurity outer space 6 than the internal space 4 if it contains a large amount of (chemicals, including particles or the like), in other words, the purity of the gas in the outer space 6 is lower than the purity of the gas in the inner space 4, the gas seal mechanism 20, by the gas in the outer space 6 is prevented from being brought into junction 40, the junction 40 but it is possible to prevent the deteriorated by a low vapor body of its purity in the inner space 4 gas in the external space 6 flows.

[0062] <Second Embodiment>

Next, a second embodiment will be described. In the following description, the same reference numerals for the embodiment identical or similar to those of the aforementioned, simplified or omitted.

[0063] FIG. 6 is a perspective view enlarging a part of the optical device 1 according to the second embodiment. And have your 6, the optical device 1 includes a first surface 11 and the opposing facing surfaces 31 of the last optical element 2A, the holding member 3A and a second surface 1 2 and the opposing facing surfaces 32. The facing surfaces 32 supplies the gas the gas supply port 21 is formed. Similarly to the first embodiment described above, the gas supply port 21 so as to correspond to each of the plurality of joint portions 40, and a plurality formed on the opposite surface 32.

[0064] Gas sealing mechanism 20A of this embodiment has a groove 24 formed on the opposite surface 32.

Gas supply port 21 is formed inside the groove 24. Groove 24 is formed with a plurality to correspond to the gas supply port 21. The length of the circumferential groove 24 is longer than the circumferential length of the joint portion 40. In the present embodiment, grooves 24 are formed in a substantially arcuate shape in the XY plane, the gas supply port 21 is formed in the axial direction substantially in the center of the groove 24. Grooves 24 and gas supply port 21 is formed, the facing surface 32 that faces the second surface 12, the adhesive portion 40 is formed, arranged in the outer space 6 side from the facing surface 31 that faces the first surface 1 1 and It is.

[0065] Thus, the facing surface 32 can form a groove 24, it is possible to arrange the gas supply port 21 to the inside of the groove 24. In this embodiment, the gas sealing mechanism 20A is provided between the second surface 12 and the facing surface 32 of the outer space 6 side of the junction 40 can be force S to produce a flow of a predetermined gas. In this embodiment, at least a portion of the gas supplied from the gas supply port 21, after flowing so as to extend along the groove 24, flows from the junction 40 toward the outer space 6 side. Thus, leaving by force S to old 卬制 that gas in the external space 6 is brought to the junction 40.

[0066] <Third Embodiment>

Next, a third embodiment will be described. Figure 7 is an enlarged perspective view of a part of the optical device 1 according to the third embodiment. Similarly to the first embodiment described above, the joint 40 is set in a plurality in the rotational direction around the optical axis AX.

[0067] Gas sealing mechanism 20B of this embodiment, the upper surface 30 of the holding member 3A, has a groove 25 formed in a ring shape have you in the XY plane. Grooves 25 are formed in plurality on the upper surface 30 so as to surround the joint portion 40 (region in which the adhesive is disposed). That is, in this embodiment, the grooves 25, so as to surround the opposite surface 31 the junction 40 is formed, is formed on the top surface 30. Gas supply port 21 is formed in a predetermined position inside the groove 25! /, Ru.

[0068] In this embodiment, the gas supply port 21 is inside the groove 25, is arranged in the internal space 4 side of the joint portion 40. That is, in this embodiment, the opposing surface 31 joint 40 is made form is disposed between the outer space 6 and the gas supply port 21.

[0069] At least a portion of the groove 25 is formed in the outer space 6 side to the opposing surface 31. If conversion words, of the upper surface 30, the opposing surface 32 of the outer space 6 side to the joint portion 40 is formed a portion of the groove 25.

[0070] Gas sealing mechanism 20B is the gas supplied from the gas supply port 21, between the flange surface 9F and the facing surface 31, it is possible to generate a flow of gas in accordance with the shape of the groove 25. At least a portion of the gas supplied from the gas supply port 21 flows along the groove 25. As described above, at least some of the grooves 25 are formed on the facing surface 32 of the outer space 6 side to the opposing surface 31 including the joint 40, the gas seal mechanism 20B is supplied from the gas supply port 21 is, by the gas flowing in response to the shape of the groove 25, between the second surface 12 and the facing surface 32 of the outer space 6 side to the joint portion 40, it is possible to generate a flow of a predetermined gas.

[0071] <Fourth Embodiment>

Next, a fourth embodiment will be described. Figure 8 is a side sectional view showing a part of the optical device 1 according to the fourth embodiment. Similar to the embodiment described above, between the last optical element 2A and the holding member 3A, the gap 26, 27 is formed between the inner space 4 and the external space 6.

[0072] Gas sealing mechanism 20C of this embodiment is provided with a gas supply port on the opposite surface 32! /, It! /,. Gas sealing mechanism 20C of this embodiment, the opposing surface 31 so as to communicate the inner space 4 and the outer space 6 is formed between the first surface 11, second surface 12 facing the gas in the space 4 the gap 26, 27 between the surface 32, and a first gas supply unit 60 supplies gas to the internal space 4.

[0073] Gas sealing mechanism 20C, the gas is supplied to the internal space 4A of the first gas supply unit 60, the pressure in the internal space 4, is higher than at least the pressure of the outer space 6 (e.g. atmospheric pressure). In other words, the gas seal mechanism 20C, using the first gas supply unit 60, by supplying the gas to the interior space 4, the inner space 4 to positive pressurization.

[0074] By the inner space 4 is positive pressurization, the from the inner space 4 through the gap 26, 27

Gas gap between the second surface 12 and the facing surface 32 is supplied, Kochikara between the second surface 12 and the facing surface 32 via the inner space 4 force even gaps 26, 27, the flow of Ugasu generation It is. Supplied gas between the gap 2 6, 27 and second surface 12 and the facing surface 32 is a flow toward the outer space 6. That is, the internal space 4 is positive pressurization, to the outer space 6 through the internal space 4 from the gap 26, 27 Kochikara, flow Ugasu is generated between the second surface 12 and the facing surface 32 between, Kochikara, the flow of Ugasu is generated from around the joint 40 to the outer space 6 side. Gasushi Lumpur mechanism 20C is by the flow of this gas to ί 卬制 that gas in the external space 6 is cod to junction 40.

[0075] <Fifth Embodiment>

Next, a fifth embodiment will be described. Figure 9 is a side sectional view showing a part of the optical device 1 according to the fifth embodiment. This embodiment is a modified example of the first to third embodiments. As shown in FIG. 9, the gas sealing mechanism 20D according to this embodiment includes a gas suction mechanism 50 for sucking the gas between the second surface 12 and the facing surface 32. Gas suction mechanism 50 includes a gas suction port 51 formed in the holding member 3.alpha., And a gas suction device 52 through the gas suction port 51 containing inhalable vacuum system such as a gas. The gas suction device 52 and the gas suction port 51 is connected through a suction passage 53 formed inside the suction tube 53Ρ and the holding member 3.alpha..

[0076] Gas suction port 51 of the upper surface 30 of the holding member 3.alpha., Is formed on the opposite surface 32 of the outer space 6 side to the opposing surface 31, between the second surface 12 and the facing surface 32 gas is a possible suction. Similar to the embodiment described above, the gap 26, 27 is formed between the second surface 12 and the facing surface 32.

[0077] Further, similar to the embodiment described above, between the facing surfaces 31 and the first surface 11, the gap 26 so as to communicate the inner space 4 and the outer space 6 is formed. Gap 26 allows the passage of gas between the interior space 4 and the outer space 6, a gas in the interior space 4 flows between the second surface 12 and the facing surface 3 2.

[0078] When the gas suction device 52 is driven, the gas between the second surface 12 and the facing surface 32 is sucked by the gas suction port 51. As shown in FIG. 9, depending on the gas suction port 51 to suck the gas from the inner space 4 of the barrel 5 through the gap 26, Kochikara from around the joint 40 to the gas suction port 51, Ugasu the flow is generated. Gas suction port 51, the joint portion 40 is disposed in the outer space 6 side, Kochikara, the flow of Ugasu generated from the junction 40 side to the outer space 6 side

[0079] Also, by the gas suction port 51 to suck the gas, Kochikara from outer space 6 to the gas suction port 51, the flow of Ugasu is generated. Gas suction port 51, the joint portion 40 is disposed in the outer space 6 side, gas from the external space 6 is sucked in immediately gas absorption 引口 51 be substantially reaches the junction 40.

[0080] Thus, in the present embodiment, the gas seal mechanism 20D is adapted to generate a flow of gas toward the external space 6 side from the joint portion 40 side, it suited the junction 40 from the external space 6 gas, before it is brought to the junction 40, can be sucked in the gas suction port 51. This suppresses the gas in the external space 6 is brought to the junction 40.

[0081] Note that the second surface 12, to face the gas suction port 51 may be a recess. Also, the second surface 12 may be formed circumferential groove.

[0082] <Sixth Embodiment>

Next, a sixth embodiment will be described. Figure 10 is an enlarged perspective view of a part of the optical device 1 according to a sixth embodiment. As shown in FIG. 10, the gas seal mechanism 20E of the present embodiment, equipped with a gas suction port 51 for sucking the gas supply port 21 and the gas supplying gas

In [0083] Figure 10, the opposed surface 32 of the holding member 3A is formed a groove 24. Groove 24 is formed with a plurality on the upper surface 30A so as to correspond to a plurality of joints 40. Circumferential direction length of the direction of the groove 24 is longer than the circumferential length of the joint portion 40. Groove 24 is formed in a substantially arcuate shape in the XY plane. Gas supply port 21 is formed in the first position in the circumferential direction of the groove 24, the gas suction port 51, that is formed on the second position in the circumferential groove 24. In this embodiment, the gas supply port 21 is formed at one end in the circumferential direction of the approximately arc-shaped grooves 24, the gas suction port 51 is formed at the other end.

[0084], the groove 24 is arranged in the outer space 6 side from the facing surface 31. That is, the groove 24 comprises a gas supply port 2 1 and the gas suction port 51 is formed on the opposite surface 32 which is arranged outside the space 6 side to the opposing surface 31 which includes a joint portion 40.

[0085] Slight present embodiment, Te, the gas seal mechanism 20E is performed in parallel with the gas supply operation using the gas supply port 21, a gas suction operation using the gas suction port 51, the joint between the second surface 12 and the facing surface 32 of the outer space 6 side from 40, to produce a flow of a predetermined gas.

[0086] Thus, as possible out to form both the gas supply port 21 and the gas suction port 51 on the opposite surface 32. Thus, as possible out to control the flow of gas between the second surface 12 and the facing surface 32. For example, the gas seal mechanism 20E can be a gas to an external space 6 side from the gap between the second surface 12 and the facing surface 32 is prevented from excessively flowing. When the gas in the outer space 6 side is excessively flows, immersion space or the liquid LQ is summer easily vaporized LS, or the like bubbles in the liquid LQ is generated, the gas immersion space LS flowing to the outer space 6 there is a possibility to influence. In the present embodiment, by performing the gas suction operation using the gas supply operation and the gas suction port 51 using the gas supply port 21 as appropriate, to control the flow of gas to produce a flow of Nozomu Tokoro gas be able to.

[0087] The positional relationship between the gas supply port 21 and the gas suction port 51 shown in FIG. 10, an example is, number, etc. thereof positional relationship and number, between the second surface 12 and the facing surface 32 It is appropriately set to be able to generate desired flow of gas in.

[0088] <Seventh Embodiment>

Next, a description will be given of a seventh embodiment. Figure 11 is a side sectional view enlarging a part of the optical device 1 according to the seventh embodiment, FIG. 12 is a perspective view. As shown in FIGS. 11 and 12, the gas seal mechanism 20F of this embodiment includes a gas supply port 21 arranged in four side between the internal air to the opposing surface 31 including the joint 40, the facing surface 31 and a gas suction port 51 disposed in the outer space 6 side against.

[0089] Similarly to the first embodiment described above, the joint 40 is formed with a plurality in the rotational direction around the optical axis AX. In the present embodiment, the upper surface 30 of the holding member 3A, the first groove 28 formed in the internal space 4 side against the opposing surface 31, which is formed in the outer space 6 side to the opposing surface 31 a second groove 29 is formed. Each of the first grooves 28 and second grooves 29, the upper surface 30, a plurality of joints 40 arranged in an island shape is formed so as to sandwich the (adhesive realm arranged).

[0090] gas supply port 21 is formed inside the first groove 28. In the present embodiment, the first groove 28 is formed in a substantially arcuate shape in the XY plane, the gas supply port 21 is formed in the axial direction substantially in the center of the first groove 28. Gas supply port 21 is formed in the vicinity of the joint portion 40.

[0091] Gas suction port 51 is formed inside the second groove 29. In the present embodiment, the second groove 29 is formed in a substantially arcuate shape in the XY plane, the gas suction port 51 is formed in each of one end and the other end of the second groove 29 of the circular arc ing. [0092] Gas sealing mechanism 20F includes a gas supply operation using the gas supply port 21 is performed in parallel with the gas suction operation using the gas suction port 51, the second surface of the outer space 6 side from the joint portion 40 between 12 and pairs facing surfaces 32, it generates a flow of a predetermined gas.

[0093] That is, the gas sealing mechanism 20F supplies the gas from the gas supply port 21 disposed in the internal space 4 side with respect to the opposing surface 31, is arranged outside the space 6 side to the opposing surface 31 was by sucking gas from the gas suction port 51, toward the force from the junction 40 side to the outer space 6 side, it is possible to generate a flow of Ugasu.

[0094] Further, by sucking the gas from the gas suction port 51, Kochikara from outer space 6 to the gas suction port 51, the flow of Ugasu is generated. Gas suction port 51, the joint portion 40 is disposed in the outer space 6 side, gas from the external space 6 is sucked in immediately gas absorption 引口 51 be substantially reaches the junction 40.

[0095] Thus, also in this embodiment, the gas seal mechanism 20F is Kochikara from the junction 40 side to the outer space 6 side, and generates a flow of Ugasu, directed from the outer space 6 to the junction 40 gas, before it is brought to the junction 40, can be sucked in the gas suction port 51. This suppresses the gas in the external space 6 is brought to the junction 40.

[0096] In the present embodiment, the second groove 29 is formed in a substantially arc shape in the XY plane, it may be a short straight.

[0097] <Eighth Embodiment>

It will now be described an eighth embodiment. Figure 13 is a side view showing an enlarged portion of the optical device 1 according to the eighth embodiment. In the first to seventh embodiments described above, the facing surface 31 and opposing surface 32, a force S which is formed on the upper surface 30 facing the out + Z side of the holding member 3A, as shown in FIG. 1 3, the opposite the surface 31 and the facing surface 32 may be formed on the surface facing in different directions. In the present embodiment, the facing surface 31 of the holding member 3A is formed so as to face the side surface 9T of the last optical element 2A, the facing surface 32 faces the portion of the flange surface 9F of the last optical element 2A It is formed so as to. That is, in the present embodiment, the first surface 11 of the surface of the last optical element 2A is set to the side surface 9T, the second surface 12 of the outer spatial 6 side with respect to the first surface 11 thereof to the flange surface 9F It has been set. Then, and gas sealing mechanism 20G of the gas supply port 21 is formed on the opposite surface 32, the gas seal mechanism 20G, by supplying the gas from the gas supply port 21, between the second surface 12 and the facing surface 32 generating a flow of a predetermined gas. In the present embodiment, it is possible by the flow of gas generated by the gas seal mechanism 20G, to suppress degradation of the joint 40.

[0098] <Ninth Embodiment>

Next is a description of a ninth embodiment. Figure 14 is a side view showing an enlarged portion of the optical device 1 according to a ninth embodiment. In the present embodiment, the facing surface 31 of the holding member 3A is formed so as to face the side surface 9T of the last optical element 2A, the opposing surface 32, are formed so as to face the side surface 9T of the last optical element 2A there. That is, in the present embodiment, the first surface 11 of the surface of the last optical element 2A is set to the side surface 9T, the second surface 12 of the outer space 6 side against the first surface 11 thereof is also set to the side surface 9T ing. The gas supply port 21 of the gas seal Organization 20H are formed on the opposite surface 32, the gas seal mechanism 20H, by supplying the gas from the gas supply port 21, a second surface 12 and the facing surface 32 generating a flow of a predetermined gas between. In the present embodiment, it is possible by the flow of gas generated by the gas seal mechanism 20H, to suppress degradation of the joint 40.

[0099] <Tenth Embodiment>

Next is a description of a tenth embodiment. Figure 15 is a side view showing an enlarged portion of the optical device 1 according to the tenth embodiment. In the present embodiment, the Etsu di of the last optical element 2A, + Z side direction, substantially parallel top 9U is formed with the XY plane. Facing surface 31 of the holding member 3 A is formed so as to face the upper surface 9U of the last optical element 2A, opposing surfaces 3 2 are formed to face the side surface 9T of the last optical element 2A. That is, in the present implementation embodiment, the first surface 11 of the surface of the last optical element 2A is set to the upper surface 9U, the second surface 12 of the outer space 6 side with respect to the first surface 11 thereof set to the side surface 9T It is. The gas supply port 21 of the gas seal mechanism 201 is formed on the opposite surface 32, the gas sealing Organization 201, by supplying the gas from the gas supply port 21, the second surface 12 and the facing surface 32 generating a flow of a predetermined gas between. In the present embodiment, it is possible by the flow of gas generated depending on the gas seal mechanism 201, to suppress deterioration of the joint portion 40.

[0100] <Eleventh Embodiment>

It will now be described eleventh embodiment. In the first to tenth embodiments described above, the facing surface 32 of the gas seal mechanism, characteristic features of the 1S present embodiment is formed in the holding member 3A having opposed surfaces 31, facing surface 32, the holding member 3A having a facing surface 31 in that it is formed in a separate member.

[0101] FIG. 16 is a side sectional view showing a part of the optical device 1 according to the eleventh embodiment. As shown in FIG. 16, in the present embodiment, the facing surface 32 of the gas seal mechanism 20J is formed in a separate member 32B and the holding member 3A. The gas supply port 21 is formed in the facing surface 32. Inside the member 32B, the supply passage 23 connecting to the gas supply port 21 is formed. In the present embodiment, it is possible by the flow of gas generated by the gas seal mechanism 20 J, to suppress degradation of the joint 40.

[0102] Incidentally, the configuration of the eleventh embodiment can also be applied to the first to tenth embodiments described above.

[0103] <Twelfth Embodiment>

Next is a description of a twelfth embodiment. In the first to eleventh embodiments described above, the junction is a first surface 11 and the opposing surface 31 are adhered with an adhesive, as shown in FIG. 17, the junction 40 ', first It can be bonded to the surface 11 and the opposing surface 31 by direct bonding

[0104] Direct bonding includes optical contact, joined by adhesion without glue two faces each other which are sufficiently cleaned. In the present embodiment, the holding member 3A is formed in the terminal end optical element 2A similar glass (such as quartz), without adhesive and the facing surface 31 of the holding member 3A and the first surface 11 of the last optical element 2A by close contact in a facing surface 31 and first surface 11 is bonded.

[0105] The present embodiment Niore, Te is the gas sealing mechanism 20L includes a second surface 12 and the facing surface of the outer space 6 side to the opposing surfaces 31 joined by direct bonding (first surface 11) between 32 to generate a flow of gas. 'Also in, or is hit gas stamina damp, if the purity is brought low vapor strength S, the joint 40' direct bond connection 40 or is deteriorated, the bonding strength may be reduced . Gas sealing mechanism 20L may be 'Te cowpea to generate a flow of gas in order to suppress be brought into junction 40' air of the outer space 6 is joint 40 to suppress degradation of the . [0106] In the first to twelfth embodiments described above, the junction 40 including the adhesive, so as to surround the force last optical element 2A provided in an island shape, be provided in the annular good.

[0107] Incidentally, in the first to twelfth embodiments described above, a groove the gas supply port 21 or a gas supply port 21, is formed may be formed in an annular shape. Similarly, the gas suction port 51, Oh Rui grooves that gas suction port 51 is formed may be formed in an annular shape. That is, grooves, cotton the entire circumference of the opposing surface 32 of the holding member 3A I be connexion formed! /,.

[0108] Incidentally, in the first to twelfth embodiments described above, the last optical element 2A may parallel plate der connexion.

[0109] Incidentally, the above-described FIG. 13, in the embodiment described with reference to FIG. 14 may be a joint 40 provided on the optical surface of the last optical element 2A.

[0110] The second above, the sixth, the seventh embodiment, by filling the grease in the gap 27 Ayoi.

[0111] Incidentally, the ninth above, in the eleventh embodiment, an air bearing system (adjacent to the gas supply port 21, constituting provided gas recovery port) at a I be! /,.

[0112] Incidentally, in the embodiment described with reference to FIG. 15 described above, without forming a top 9U

, So as not to block the optical path, the holding member 3A may be opposed to a part of the optical surface of the last optical element 2A.

[0113] Incidentally, the configuration of each of the above embodiments, it is of course possible to combine any

[0114] <Thirteenth Embodiment>

Next is a description of a thirteenth embodiment. In the present embodiment, the optical device 1 described in the first to twelfth embodiments described above, the case where the projection optical system PL of the exposure apparatus EX will be described as an example.

[0115] FIG. 18 is a schematic block diagram showing an exposure apparatus EX according to the thirteenth embodiment. And have your 18, the exposure apparatus EX includes a mask stage 71 which is movable while holding a mask M, a substrate stage 72 which is movable while holding a substrate P, to illuminate the pattern of the mask M with the exposure light EL an illumination system IL, and includes a projecting projection optical system PL the image of the pattern of the mask M illuminated with the exposure light EL onto the substrate P, and a control unit 73 for controlling the operation of the entire exposure apparatus EX! /, that. [0116] The substrate P referred to herein is, for example, a photosensitive material on a semiconductor wafer or the like of the base material on such as a silicon wafer that has been coated with a (photoresist), or protection in addition to the photosensitive material film (topcoat over preparative layer ) includes those obtained by coating the various films, such as, mask M includes a reticle wherein a device pattern is formed that is reduction projected onto the substrate P. In the present embodiment, it may be used a force reflective mask using the transmission mask as a mask. Transmissive mask is not limited to a binary mask on which a pattern is formed with the light shielding film, including a phase shift mask, for example Hafuto emission type or a spatial frequency modulation type.

[0117] The exposure apparatus EX of this embodiment is a an immersion exposure apparatus that applies the liquid immersion method to substantially widen the monitor depth of focus and the enhance resolution by substantially shortening the exposure wavelength Te, and the optical path space of the exposure light EL having a predetermined liquid immersion space LS formable Roh Zunore member 80 to fill the liquid LQ. Immersion space LS is a space filled with the liquid LQ, an optical path space of the exposure light EL is a space including the optical path through which the exposure light EL progresses. Oite to this embodiment, as the liquid LQ for forming the liquid immersion space LS, using decalin (CH)

10 18

. As the liquid LQ, water (pure water) can be used a fluorine-based liquid, or the like.

[0118] The nozzle member 80 is, immersion and space LS can supply the liquid LQ for forming the liquid supply port 81 (not shown in FIG. 18), recoverable liquid recovery port of the liquid LQ 82 (FIG. 18 by concurrently performing at least a portion of the liquid body recovery operation using the liquid supply operation and the liquid recovery port 82 using has a not shown), the liquid supply port 81, the exposure light EL the optical path space to fill with liquid LQ, it is possible to form a predetermined immersion space LS.

[0119] In this embodiment, the nozzle member 80 is disposed so as to face the surface of the substrate P, it is capable of retaining the liquid LQ between the surface of the substrate P, between the surface of the substrate P It can form a liquid immersion space LS in.

[0120] In the vicinity of the nozzle member 80, among the plurality of optical elements of the projection optical system PL, the nearest terminal optical element 2A on the image plane of the projection optical system PL is arranged. Last optical element 2A is disposed so as to face the surface of the substrate P, are capable of retaining the liquid LQ between the surface of the substrate P, it can form a liquid immersion space LS between the surface of the substrate P it is.

[0121] In the present embodiment, the exposure apparatus EX uses the nozzle member 80, immersion sky between the surface of the substrate P, the nozzle member 80 and the last optical element 2A that faces the surface of the substrate P forming between LS. Accordingly, the optical path space for the exposure light EL between the last optical element 2A and the front surface of the substrate P of the projection optical system PL is filled with the liquid LQ.

[0122] In the present embodiment, as part of the area on the substrate P including the projection area of ​​the projection optical system PL is covered in liquid LQ, the liquid immersion space LS is formed. In other words, you! /, In the present embodiment Te, the local liquid immersion method in which the liquid immersion area is formed on a part of the substrate P including the projection area of ​​the projection optical system PL is employed.

[0123] The illumination system IL illuminates a prescribed illumination region on the mask M with the exposure light EL having a uniform illuminance distribution. As the exposure light EL emitted from the illumination system IL, for example, emission lines (g-ray, h-ray, i-ray) and KrF excimer laser beam (wavelength 248 nm) far ultraviolet light such as (DU V light) or ArF excimer laser beam (wavelength 193 nm), F laser beam (wavelength 157 nm)

2

Such as vacuum ultraviolet light and the like (VUV light) is used. ArF excimer laser light is used in this embodiment.

[0124] The mask stage 71, by driving the mask stage drive equipment 71D including Akuchiyueta such as a linear motor, while holding the mask M, X axis is movable in the Y-axis, and theta Z direction. Positional information of the mask stage 71 (and hence mask M) is measured by a laser interferometer 71L. Laser interferometers 71L measures the positional information of the mask stage 71 by using a measurement mirror 71R provided on the mask stage 71. Controller 73 drives the mask stage-driving device 71D based on the measurement results of the laser interferometers 71L, held in Masques stage 71! /, Controls the position of the Ru mask M.

[0125] the projection optical system PL is a projection available-the substrate P an image of the pattern of the mask M at a predetermined projection magnification, comprising an optical device 1 described in the first to thirteenth embodiments described above. Oite to the present embodiment, the projection optical system PL, the image of the pattern of the mask M via the liquid LQ of the immersion space LS is projected onto the substrate P. Projection optical system PL of the present embodiment, 1/4 For example is the projection magnification, 1/5, is a reduction system such as 1/8. The projection optical system PL may be a reduction system, an equal magnification system 及 beauty enlargement system. Further, the projection optical system PL, a dioptric system including no catoptric element, a catoptric system that does not include refractive optical element may be either a catadioptric system comprising a reflecting optical element and the refractive optical element. Further, the projection optical system PL may form a Re and inverted image erect and noise. [0126] The substrate stage 72 has a substrate holder 72H for holding the substrate P, by driving the substrate stage drive apparatus 72D including Akuchiyueta such as a linear motor, while holding the substrate P on the substrate holder 72 H , on the base member BP, X axis, Y axis, Z axis, theta chi, theta Upsilon, and is movable 6 in the direction of freedom of theta Zeta direction. Substrate Hol da 72Η of the substrate stage 72, so that the surface ΧΥ plane of the substrate [rho is substantially parallel to hold a substrate [rho.

[0127] Position information of the substrate stage 72 (shed! /, [Rho substrate Te) is measured by a laser interferometer 72L. Laser interferometers 72L measures the positional information about the X-axis, Upsilon axis, and theta Zeta direction of the substrate stage 72 with a measuring mirror 72R provided on the substrate stage 72. Further, EXPOSURE APPARATUS ΕΧ, the surface position information of the surface of the substrate Ρ held by the substrate stage 72 focus detectable not illustrated (Zeta axis, theta X, and theta Upsilon positional information related to the direction) 'the leveling It is equipped with a detection system. Controller 73 drives the substrate stage-driving device 72D based on the measurement results of the laser interferometers 72L and focus. Leveling detection system detection result held by the substrate stage 72! /, Ru substrate Ρ of the position control is carried out.

[0128] In the present embodiment, on the substrate stage 72 is provided with a recess 72C, the substrate holder 72Η is disposed in the recess 72C. The upper surface 72F of the substrate stage 2 other than the recess 72C is substantially flat, is the upper surface 72F of the substrate stage 2, and retained substrate Ρ surface to the substrate holder 72Η is approximately the same height (flush). Nozzle member 80, also between the upper surface 72F of the substrate stages 72 can form a liquid immersion space LS.

[0129] FIG. 19 is a side sectional view showing the vicinity of the nozzle member 80. As shown in FIG. 19, the nozzle member 80 includes a liquid supply port 81 for supplying the liquid LQ for forming the liquid immersion space LS, and a liquid recovery port 82 for recovering the liquids LQ. Nozzle member 80, you! / In the vicinity of the last optical element 2.alpha, Te, are placed so that face the surface of the substrate [rho (and / or the upper surface 2F of the substrate stage 2). In the present embodiment, the nozzle member 80 is an annular member, above the base plate [rho (substrate stage 2), is arranged to surround the optical path space Κ of the exposure light EL.

[0130] The nozzle member 80 is that has a bottom plate 83 having a surface capable of facing the lower surface 90Α substrate [rho. In the center of the bottom plate 83 opening 84 exposing light EL can pass is formed. Liquid supply port 81, it supplies the liquid LQ between the exit surface 8 of the upper surface of the bottom plate 83 and the last optical element 2.alpha. The liquid supply port 81 is connected to the liquid supply unit 86 via a formed within a liquid supply passage 85 and the liquid supply pipe 85P of the nozzle member 80. Liquid supply apparatus 86 is capable of feeding the clean liquid LQ temperature is adjusted. The liquid supply device 86, the liquid supply pipe 8 5P, via the liquid supply passage 85 and the liquid supply ports 81, and can supply the liquid LQ for forming the liquid immersion space LS. Operation of the liquid supply device 86 is controlled by the control unit 73

[0131] The liquid recovery port 82 is provided so as to surround the lower surface 90A of the bottom plate 83, the porous member 87 is arranged in the liquid recovery port 82. In the present embodiment, it is substantially flush with the lower surface 90A of the lower surface 90B and the bottom plate 83 of the porous member 87. The liquid recovery port 82 is connected to the liquid recovery device 89 via the formed within the liquid recovery flow passage 88 and the liquid recovery pipe 88P of the nozzle member 8 0. The liquid recovery apparatus 89 includes a vacuum system or the like, a liquid LQ can be recovered. Liquid recovery unit 89, liquid recovery port 82, the liquid recovery flow passage 88, and through the liquid recovery pipe 88P, is capable of recovering the liquid LQ of the immersion space LS. Operation of the liquid recovery device 89 is controlled by the controller 73.

[0132] At least part of the lower surface 90B of the lower surface 90A and a porous member 87 of the bottom plate 83 of the nozzle member 80 is capable of retaining the liquid LQ between the surface of the substrate P, the liquid between the surface of the substrate P It can form a LQ of the immersion space LS. To continue to form a liquid immersion space LS, the controller 73 drives the respective liquid supply device 86 and liquid recovery device 89, the liquid supply operation using the liquid supply port 81, and with liquid recovery ports 82 to perform each of the liquid recovery operation.

[0133] the liquid LQ fed from the liquid supply device 86, after flowing through the liquid supply passage 85 of the nozzle member 80, the liquid supply port 81, the upper surface of the exit surface 8 and the bottom plate 83 of the final optical element 2A It is supplied between. Supplied liquids LQ between the upper surface of the exit surface 8 and the bottom plate 83 of the last optical element 2A via an opening 84 formed substantially in the center of the bottom plate 83, the lower surface 9 of the nozzle member 80 0A, and 90B It flows into the space between the substrate P (substrate stage 2), to satisfy the optical path space K of the exposure light EL, to form a liquid immersion space LS.

[0134] the lower surface 90A of the nozzle member 80, the liquid LQ of the space between the 90B and the front surface of the substrate P, via the liquid recovery port 82 of the nozzle member 80 flows into the liquid recovery flow passage 88, the liquid recovery flow after flowing the road 88, it is recovered by the liquid recovery device 89.

[0135] Control device 73 with respect to the optical path space K of the exposure light EL, the liquid times the predetermined amount of the liquid LQ per unit time with a predetermined amount of the liquid LQ per unit time supplied from the liquid supply port 81 Osamukuchi 82 by further recovery, the optical path space K of the exposure light EL between the last optical element 2A and the front surface of the substrate P so filled with the liquid LQ, which forms the liquid immersion space LS.

[0136] The exposure apparatus EX forms a liquid immersion space LS using during the Nozzle member 80 that projects the image of the pattern of the at least the mask M on the substrate P. The exposure apparatus EX is emitted from the illumination system IL, the exposure light EL passing through the mask M, is irradiated onto the substrate P via the liquid LQ of the projection optical system PL and immersion space LS. Thereby, the image of the pattern of the mask M is projected onto the substrate P, the substrate P is exposed.

[0137] In the present embodiment, at least while the liquid immersion space LS is formed, the control device 73, the gas seal mechanism 20 (with 20A~20U to produce a stream of given gas, external space 6 the gas is suppression to be brought into junction 40 of the holding member 3A and the last optical element 2A.

[0138] In the present embodiment, although the last optical element 2A has been explained about configuring is held in the lens barrel 5 may hold the terminal end optical element 2A in the nozzle member 80. That is, the configuration of the holding member 3A in this embodiment may be provided in the nozzle member 80.

[0139] Thus, the deterioration of the joint portion 40 is suppressed, the holding member 3A can be force continues to hold the last optical element 2A in good good. Accordingly, the exposure apparatus EX can be desired optical properties using the projection optical system PL that has been maintained, satisfactorily expose the substrate P.

[0140] In the embodiment described above, are disclosed in force for example, in International Publication No. WO 2004/019128 the optical path space of the morphism exit surface side last optical element is filled with the liquid of the projection optical system (optical apparatus) as may be the optical path space on the object plane side of the last optical element is also to meet with the liquid. In this case, among the projection optical system, an optical element closer to the image plane of the projection optical system subsequent to the last optical element, a first space containing a liquid immersion space, and a second space Naru different from the first space It is disposed in the boundary.

[0141] Furthermore, the substrate P in the above-described embodiments, not only a semiconductor wafer for fabricating semiconductor devices but glass substrates for display devices, the mask used in a ceramic wafer or an exposure apparatus, for a thin film magnetic head or precursor of a reticle (synthetic quartz, silicon Kon'weha), or a film member or the like is applied. The substrate good in other shapes such as rectangular Nag in that its shape is limited to a circular les.

[0142] As the exposure apparatus EX, in addition to a scanning exposure apparatus by a step-and 'scan method to 查露 light run the pattern of the mask M by synchronously moving the mask M and the substrate P (scanning scan Tetsu Pas) the pattern of the mask M collectively exposed the mask M and the substrate P in a stationary state, can be applied to a projection exposure apparatus by a step 'and' repeat system for moving sequential steps the board P (Sutetsu Bruno).

[0143] In addition, As for the exposure apparatus EX, in not including reflective elements in the first pattern and the projection optical system a reduced image of the first butter over down the substrate P in substantially stationary state (e.g., 1/8 reduction magnification refraction can also be applied to an exposure apparatus of a system that full-field exposure of the substrate P by using a mold projecting projection optical system). In this case, further subsequently, a reduced image of the second pattern in a state where the second pattern and the substrate P are substantially stationary with the projection optical system, the one-shot exposure in the first pattern partially superposes the substrate P It can also be applied to full-field exposure apparatus Sutitsuchi method to. As the exposure light device Suteitchi method to transfer at least two patterns are partially overlaid and on the substrate P, and also applicable to an exposure apparatus of the step 'and' - Sutitsuchi method for sequentially moving the board P.

[0144] The optical element of the projection optical system PL (final optical element 2A, etc.) is not limited to single crystal materials of fluoride compound. Optical element has a higher refractive index than quartz and fluorite (e.g. 1.6 or more) may be formed of a material. The refractive index is 1.6 or more materials, for example, sapphire, which is disclosed in WO 2005/059617 pamphlet, germanium dioxide, Or, potassium chloride as disclosed in International Publication No. 2005/059618 Pamphlet (refractive index of about 1.75) or the like can be used. Furthermore, part of the surface of the optical element (including at least a contact surface with the liquids) or the whole, may be formed with a lyophilic and / or dissolution preventing function. Incidentally, quartz is Ru unnecessary der affinity also Kogu and dissolution preventing film with a liquid, fluorite may form at least a dissolution preventing film. The high (e.g. 1, 5 or more) liquid LQ refractive index than that of pure water, for example, a refractive index of about 1 · 50 isopropanol Honoré, such as glycerol having a refractive index of about 1 · 61 (glycerin) C-H bond or a predetermined liquid with a O-H bond, hexane, heptane, predetermined liquid decane (organic solvent), there have in decalin of refractive index of about 1 · 60 (decalin: decahydronaphthalene), and the like. Further, the liquid LQ is stone by even a mixture of any two or more liquids of the foregoing liquids, it may be obtained by adding at least one of these liquid (mixed) in pure water. Further, the liquid, H + in the pure water, Cs +, K +, Cl- , SO 2 -, and adding a base or acid such as PO 2 (mixing)

4 4

May be one, fine particles may be obtained by adding (mixing) of such A1 oxide in pure water. As the liquid LQ, the absorption coefficient of light small tool temperature dependence small tool projection optics, and / or applied to the surface of the substrate! /, Ru photosensitive material (or top coat film, an antireflection film, or the like it is stable with respect to). The substrate can be provided and the top coat film which protects the photosensitive material Ya substrate from the liquid.

[0145] Further, the present invention is, JP 10 163099 and JP-Hei 10- 214783 (corresponding to US Patent No. 6,341, No. 007, No. 6,400,441, No. 6, No. 549,269 and EP 6,590,634), JP Table 2000- 505958 discloses also a multi-stage type exposure apparatus equipped with a plurality of substrate stages as disclosed, such as (corresponding U.S. Pat. No. 5,969,441) cut with application.

[0146] Further, as disclosed in JP-A 11 135400 discloses Ya JP 2000- 164504 Patent Publication (corresponding U.S. Patent No. 6, 897, 963 JP), the substrate stage and the reference mark for holding a substrate There can be applied the reference member is formed, and various photoelectric sensors or the like, the present invention is also applicable to an exposure apparatus equipped with a mounting and measurement stage viable instrument measurements related exposure.

[0147] In the embodiment described above, the force present invention employing an exposure apparatus in which the liquid is locally filled between the projection optical system PL and the substrate P is, JP-A 6 124 873, JP open flat 10- three hundred and three thousand one hundred and fourteen JP, US Patent No. 5, 825, immersion exposure apparatus in which the entire surface of the substrate, such eXPOSURE subject, as disclosed in JP 043 performs exposure in a state in which is immersed in the liquid It can also be applied.

[0148] As the type of the exposure apparatus EX, the present invention is not limited to the exposure apparatus for the semiconductor element manufacture that expose a semiconductor element pattern onto a substrate P, the liquid crystal display device exposure apparatus for manufacturing or display manufacturing, thin-film magnetic heads, the imaging device (CCD), micromachines, MEMS, widely applicable to an exposure apparatus for producing such DNA Chi-up, or reticles and masks.

[0149] In the above-described embodiment, a predetermined light shielding pattern on a transparent substrate (or a phase pattern 'dimming pattern) in place of the force the mask using an optical transmission type mask formed of, for example U.S. Pat. No. 6, 778, 257 Patent as disclosed in Japanese, based on electronic data of exposure to base-out pattern! /, Te transmission pattern or reflection pattern, there! /, forming a light emitting Bruno turn electronic mask (also called a variable shaped mask, for example, non-emission type image display 示素Ko (spatial light modulator: including a type of spatial light modulator (SLM) also called) DMD (Digital Micro-mirror Device)) it may be used. The exposure apparatus had use a DMD is disclosed, for example, in U.S. Pat. No. 6,778,257.

[0150] In addition, International Publication as disclosed in 2001/035168 pamphlet, by forming on the substrate P interference fringes, the substrate P on the line 'and' space pattern exposure light exposure device also possible to apply the present invention to (lithography system).

[0151] For example, as shown open in Kohyo 2004- 519850 discloses (corresponding to US Patent No. 6, 611, 316 issue), the patterns of two masks on a substrate via a projection optical system synthesized, in such a single scan exposure eXPOSURE apparatus for substantially simultaneously double exposure of one shot area on the substrate makes it possible to apply the present invention. Further, it is also possible to apply the present invention to an exposure apparatus, a mirror projector Chillon 'Araina a proximity type.

[0152] In addition, the extent allowed by law, and some of the disclosures, such as all publications and U.S. patents relating to such cited in the above respective embodiments and modified examples EXPOSURE APPARATUS body of serial placement to.

[0153] As described above, the exposure apparatus EX of the embodiment described above, various subsystems, including each element, so that the predetermined mechanical accuracy, the optical accuracy are manufactured by assembling that. To ensure these various accuracies, prior to and following assembly, various types of optical science based Nitsu! /, Adjustment to achieve the optical accuracy Te, various mechanical systems Nitsu! /, Mechanical precision Te adjustment to achieve, for various electrical systems are adjusted to achieve the electrical accuracy is performed. The steps of assembling the various subsystems into the exposure apparatus includes various subsystems, the mechanical interconnection, electrical circuit wiring connections, and the piping connection of the air pressure circuit. Before the process of assembling the exposure apparatus from the various subsystems, there are also the respective subsystem individual assembly steps. After completion of the assembling the various subsystems into the exposure apparatus, overall adjustment is performed and various kinds of accuracy as the entire exposure apparatus are secured. The manufacture of exposure apparatus Shi desired be carried out in tally Nrumu in which the temperature, cleanliness, etc. are controlled! /,.

Microdevices such as semiconductor devices are manufactured, as shown in FIG. 20, functions of the micro device - step 201 the performance design, a mask (reticle) based on this design step the step 202 is manufactured work, in the device base material a step 203 of producing a certain substrate according to the embodiment described above, exposing a pattern of a mask onto a substrate, a substrate processing step 204 including board processing (exposure process) of developing exposed substrate, a device assembly step (dicing ring step , a bonding process, including machining processes such as packaging step) 205, and an inspection step 206, and the like.

Claims

The scope of the claims
[I] a first space, said optical elements arranged in the boundary between the different second space from the first space, and a holding member having a first surface opposite facing surface that of the optical element,
A joint portion for joining the first surface and the opposing surface,
Optical device and a gas seal mechanism of generating a suppressing gas stream that at least one of the gas in the gas and the second space of the first space is hung down even to the junction
[2] the joint is the optical device according to claim 1, wherein bonding the said first surface the facing surface with an adhesive.
[3] the joint is an optical device 請 Motomeko 1, wherein bonding the said opposed surface to the first surface in Direct out bonding.
[4] The first space includes a liquid immersion space,
The gas sealing mechanism, said a second surface located on the first space side to the first surface of the optical element, according to claim supplying gas humidity is lower than the gas of the first space 1 3! /, optical device displacement or one claim.
[5] The gas sealing mechanism, claim to produce a flow of gas along the second surface
The optical device according to 4.
[6] The gas stream, the optical device according to claim 5, wherein toward the first space from the joint
[7] The gas sealing mechanism according to claim is positive pressurization of the space on said second surface;! ~ 3 optical device, whichever is one claim.
[8] The gas sealing mechanism, the optical device of any one of claims 4 7 that having a gas supply port for supplying gas toward the second surface.
[9] The gas sealing mechanism, the optical device of any one of claims 4 8 provided in the holding member.
[10] The gas sealing mechanism, claim to have a gas suction mechanism for sucking the gas between said second surface; optical apparatus according to any one claim of ~ 3!.
[II] The gas suction mechanism, an optical device according to claim 10 having a gas suction port formed in the holding member.
[12] The adhesive may include an organic material,
The gas seal mechanism, an exposure apparatus according to claim 2, wherein to prevent deterioration due to chemical reaction of the organic material.
[13] The adhesive may include an inorganic material,
The gas seal mechanism, the exposure equipment according to claim 2, wherein preventing corrosion of the inorganic material.
[14] further comprises a barrel for holding a plurality of optical elements,
The second space comprises an internal space of the lens barrel,
The optical element held by the holding member, the lens barrel inner space and claims disposed boundary with the external space;! ~ 13 /, the optical device of the deviation or one claim.
[15] In the exposure apparatus which exposes a substrate with an exposure light,
Comprising an optical device according to any one of claims 1 to 14, an exposure apparatus that irradiates exposure light onto the substrate through the front Stories optical element of the optical device.
[16] the immersion space is formed between the optical element held by the holding member between the substrate, the exposure of claim 15, wherein exposing the substrate through the liquid of the optical element and the immersion space apparatus.
[17] A device manufacturing method using the exposure apparatus according to any one of claims 15 or claim 16.
PCT/JP2007/067324 2006-09-06 2007-09-05 Optical device, exposure apparatus, and method for manufacturing device WO2008029852A1 (en)

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