WO2008029452A1 - Method of forming partition and apparatus therefor - Google Patents

Method of forming partition and apparatus therefor Download PDF

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Publication number
WO2008029452A1
WO2008029452A1 PCT/JP2006/317571 JP2006317571W WO2008029452A1 WO 2008029452 A1 WO2008029452 A1 WO 2008029452A1 JP 2006317571 W JP2006317571 W JP 2006317571W WO 2008029452 A1 WO2008029452 A1 WO 2008029452A1
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WO
WIPO (PCT)
Prior art keywords
substrate
partition
partition wall
sandblasting
material layer
Prior art date
Application number
PCT/JP2006/317571
Other languages
French (fr)
Japanese (ja)
Inventor
Katsuhiko Kamata
Kengo Hayase
Morimitsu Iwai
Yasuo Yanagibashi
Original Assignee
Hitachi Plasma Display Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Plasma Display Limited filed Critical Hitachi Plasma Display Limited
Priority to JP2008532995A priority Critical patent/JPWO2008029452A1/en
Priority to CNA2006800544983A priority patent/CN101438369A/en
Priority to PCT/JP2006/317571 priority patent/WO2008029452A1/en
Publication of WO2008029452A1 publication Critical patent/WO2008029452A1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20Constructional details
    • H01J11/34Vessels, containers or parts thereof, e.g. substrates
    • H01J11/36Spacers, barriers, ribs, partitions or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/10AC-PDPs with at least one main electrode being out of contact with the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24Manufacture or joining of vessels, leading-in conductors or bases
    • H01J9/241Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
    • H01J9/242Spacers between faceplate and backplate

Definitions

  • the present invention relates to a plasma display panel (hereinafter referred to as PDP) manufacturing method and manufacturing apparatus, and more particularly to a PDP partition wall forming method and apparatus.
  • PDP plasma display panel
  • a PDP has a structure in which a plurality of electrodes are provided on two opposing glass substrates, and a gas mainly composed of Ne, Xe, or the like is enclosed therebetween. Then, a voltage is applied between a plurality of electrodes defining the discharge cell to generate a discharge, thereby causing each cell to emit light for display.
  • One substrate of the PDP has address electrodes, barrier ribs, and phosphor layers to constitute a back substrate.
  • a glass paste partition wall forming material
  • a mask having sandblast resistance is formed in a pattern.
  • sand blasting is performed through this mask to cut the partition wall forming material layer and pattern the desired shape partition walls, followed by firing.
  • glass beads with a particle size of about 2 to 50 ⁇ m, stainless steel, SiC, SiO, Al 2 O 3 and inorganic fine particles such as ZrO are used as cutting materials.
  • the present invention provides a plasma display panel in which a mask for sandblasting of a partition wall forming material layer formed on a substrate is provided, and a portion is cut with a cutting material to form a partition having a desired shape. Then, a protective plate having a predetermined height extending in the substrate transport direction is provided vertically above the desired portion of the substrate so as to contact the surface of the partition wall forming material layer or the surface of the substrate.
  • the present invention also provides a partition forming method characterized in that a desired portion of a partition forming material layer is protected from cutting of a cutting material sprayed from a sandblasting nozzle that moves in a direction perpendicular to the substrate transport direction.
  • the partition wall forming material layer of the protective plate or the portion in sliding contact with the substrate may be formed of a material having a lower hardness than the substrate.
  • the cutting action may be controlled by replacing the protective plate with another protective plate having a different width.
  • a partition having a desired shape is formed by cutting a portion of the partition wall forming material layer formed on the substrate, which is not provided with a sandblast-resistant mask, with a cutting material.
  • a substrate transport device that transports a substrate provided with a partition wall forming material layer and a sandblast-resistant mask in a predetermined direction, a nozzle for sandblast processing that injects a cutting material, and the nozzle.
  • a partition wall forming apparatus provided with a protective plate of a predetermined height that is provided vertically and extends in the substrate transport direction is provided.
  • the support plate further includes a support member that supports the protection plate, and the protection plate has a flat belt-like body member, an abrasion-resistant member that protects the body member from the cutting action of sandblasting, and a hardness lower than that of the substrate. It may also be a sliding member that contacts the partition wall forming material layer surface or the substrate surface.
  • the support member may support the protection plate so that the protection plate can be replaced with another protection plate having a different width.
  • the support member may support the protective plate so as to be displaceable in the transport direction of the sandblasting nozzle.
  • the protective plate is perpendicular to the desired portion of the substrate that is susceptible to cutting damage. Since sandblasting is performed in contact, damage caused by cutting materials, resist peeling, and chipping of partition walls can be reliably prevented.
  • FIG. 1 is an exploded perspective view of a main part of a PDP according to the present invention.
  • FIG. 2 is a cross-sectional view of a substrate to be processed according to the present invention.
  • FIG. 3 is a longitudinal sectional view of a sandblasting chamber according to the present invention.
  • FIG. 4 is a cross-sectional view taken along the I-I arrow in FIG.
  • FIG. 5 is a top view of the protective plate according to the present invention.
  • FIG. 6 is a side view of the protective plate according to the present invention.
  • FIG. 7 is a cross-sectional view taken along arrow II in FIG.
  • FIG. 8 is a cross-sectional view taken along arrow III-III in FIG.
  • FIG. 9 is an enlarged view of the main part of FIG.
  • FIG. 10 is a view corresponding to FIG. 4 showing a modification of the present invention.
  • FIG. 11 is a view corresponding to FIG. 4, showing another modification of the present invention.
  • FIG. 12 is a view corresponding to FIG. 4, showing still another modification of the present invention.
  • FIG. 13 is a view corresponding to FIG. 4, showing still another modification of the present invention.
  • FIG. 14 is an explanatory view showing the action of the protective plate of the present invention.
  • the PDP to which the present invention is applied is a three-electrode surface discharge type PDP as shown in FIG. 1, and includes a pair of substrate assemblies, that is, a back substrate 50 and a front substrate 50a. In the figure, one pixel is shown.
  • an inner surface of glass substrate 11 is arranged as a laterally extending electrode X for generating surface discharge along the substrate surface, and a display electrode pair S defining a display row. Is done.
  • the electrodes X and Y are each composed of a wide band-shaped transparent electrode 41 made of a thin film and a narrow band-shaped bus electrode 42 made of a metal thin film.
  • the nose electrode 42 is an auxiliary electrode for ensuring proper conductivity.
  • a dielectric layer 17 is provided so as to cover the electrodes X and ⁇ .
  • the surface of the dielectric layer 17 is covered with a protective film 18. Both the dielectric layer 17 and the protective film 18 have translucency!
  • the address electrodes 43 are arranged on the inner surface of the glass substrate 21 in the vertical direction orthogonal to the display electrode pair S, and the dielectric layer 25 is provided so as to cover the address electrodes 43.
  • a linear rib (partition) 29 force S1 is provided between each address electrode 43 on the dielectric layer 25 .
  • the ribs 29 can also be formed in a lattice shape.
  • discharge spaces (discharge cells) 30 are partitioned by these ribs 29 for each subpixel (unit light emission region) EU, and the gap size of the discharge space 30 is defined.
  • a phosphor layer 28 of three colors R, G, and ⁇ for color display is provided so as to cover the cell wall on the back side including the upper portion of the dielectric layer 25 and the side surface of the rib 29. It is done.
  • the rib 29 also has a material strength mainly composed of low-melting glass, and is formed transparent or opaque depending on the type of additive.
  • a method for forming the ribs 29, as will be described later a process of providing a cutting mask on a solid film-like low melting point glass layer (partition wall forming material layer) and patterning by sandblasting is used.
  • a display electrode pair S corresponds to one row in the matrix display, and one address electrode corresponds to one column. And 3 columns correspond to 1 pixel (pixel) EG. That is, one pixel EG is composed of three subpixels EU, R, G, and B, arranged in the line direction.
  • wall charges are formed in the dielectric layer 17 corresponding to the cells selected for display.
  • a surface discharge main discharge
  • the phosphor layer 28 is excited by ultraviolet rays generated by the surface discharge and emits visible light of a predetermined color. Of this visible light, light that passes through the glass substrate 11 on the front side becomes display light.
  • a method of putting the partition wall by sandblasting is adopted.
  • a partition wall forming material layer 31 is formed by applying partition wall glass paste to a partition wall forming region on a glass substrate 21 on which address electrodes 43 and a dielectric layer 25 are formed, and drying.
  • a photosensitive resist layer having sandblast resistance is provided on the partition wall forming material layer 31, and then selectively irradiated with actinic rays through a photomask, followed by development to provide a sandblast resistant mask.
  • Form 32 is
  • sandblasting is performed on the glass substrate 21 (hereinafter referred to as a substrate to be processed 33 for convenience of description) provided with the partition wall forming material layer 31 and the sandblast-resistant mask 32.
  • glass beads with a particle size of 2 to 50 ⁇ m, stainless steel, SiC, A1 are used as cutting materials.
  • Inorganic fine particles such as O and ZrO are used.
  • FIG. 3 is a longitudinal sectional view showing the configuration of the partition forming apparatus by sandblasting
  • FIG. 4 is a sectional view taken along the arrow II in FIG.
  • a plurality of transport rollers 52 are arranged in parallel in the processing chamber 51, and the substrate to be processed 33 is transported in the direction of the arrow 53 thereon. Yes.
  • Cutting material injection guns 54 and 55 are arranged above the substrate to be conveyed 33, and the guns 54 and 55 are respectively moved in the direction of the arrow 56 (FIG. 4) by the conveying devices 54a and 55a.
  • the substrate 33 is reciprocally conveyed in a direction orthogonal to the conveyance direction (arrow 53).
  • a recovery device 57 (Fig. 3) is disposed below the transport roller 52, and the cutting material sprayed from the cutting material spray guns 54 and 55 is recovered and supplied to the cutting agent spray guns 54 and 55. Returned to the source (not shown) for reuse.
  • the processing chamber 51 is provided with frames 58, 59, and 60 forces parallel to the transport roller 52, that is, in the direction of the arrow 56.
  • Flat belt-shaped protection plates 61, 62 between the frames 58, 59 are provided between the frames 59, 60 in parallel to the transport direction of the substrate 33 (in the direction of arrow 53), respectively. It has been.
  • FIG. 5 is a top view showing details of the protective plates 61 to 64
  • FIG. 6 is a side view showing details of the protective plates 61 to 64
  • FIG. 7 is a cross-sectional view taken along II II in FIG. 6,
  • FIG. FIG. 6 is a cross-sectional view taken along III-III.
  • each of the protective plates 61 to 64 is a main body member 65 made of a strip-shaped stainless steel plate having a cut portion on the upper side, and the main body portion fitted into the cut portion.
  • a ceramic wear-resistant (sand blast-resistant) member 66 that covers the upper side of the material 65 and is fixed to the side surface of the main body member 65 by fastening members (a combination of bolts, nuts, and washers) 70 and 71 is provided.
  • the protection plates 61 to 64 further include a sliding contact member 67 on the lower side.
  • the sliding contact member 67 is bonded to the side surface of the main body member 65 using an adhesive or a double-sided adhesive tape.
  • the slidable contact member 67 protrudes 1 to 2 mm downward from the lower side of the main body member 65, and is slidably contacted (sliding while contacting) as described later.
  • the sliding contact member 67 is formed of a material whose hardness is lower than that of the substrate to be processed 33 so as not to damage the substrate to be processed 33, for example, polyethylene (a film having a thickness of 0.5 mm).
  • Each of the protection plates 61 to 64 is supported by the frames 58, 59 or 59, 60 via brackets 68, 69 at both ends. Both ends of each of the protective plates 61 to 64 and the brackets 68, 69 or 59, 60 are fastened by fastening members (a combination of bolts, nuts and washers) 72, 73, and the brackets 68, 69 ⁇ , respectively, the frame 58, 59 or ⁇ MA 59, 60 ⁇ Shoe ligation material (bonole) 74, 75 ⁇ As shown in Fig. 5, brackets 68 and 69 have long holes 76 and 77, respectively, and are displaced in the direction of arrow 56 (moving direction of the cutting agent spray gun) with respect to frames 58, 59 or 59, 60. Fixed as possible.
  • the protective plates 61 to 64 are set on a desired portion of the substrate 33 to be cut easily (in the vicinity of the auxiliary partition wall in this example),
  • the workpiece substrate 33 is conveyed by the conveyance roller 52 in the direction of the arrow 53 at a constant speed.
  • 9 and 10 are a top view and a side view showing the positional relationship between the substrate to be processed 33 and the protective plates 61, 62 or 63, 64, respectively.
  • a plurality of auxiliary partition wall masks 32b arranged in parallel to the direction) are provided so as to cover the partition wall forming material layer 31.
  • the auxiliary partition is provided in order to prevent so-called side cut in which the bottom portion of the end of the main partition is cut.
  • each of the protective plates 61, 62 and 63, 64 has a flammable member 67 extending downward from the lower edge of the main body member 65, and the partition forming material layer 31 of the substrate 33 to be processed. surface It is set so that it slides on.
  • the cutting material injection guns 54 and 55 are moved accordingly.
  • the reciprocating motion is repeated while spraying the cutting agent along the arrow 56 at a speed of 600 mmZ.
  • the partition wall forming material layer 31 of the substrate to be processed 33 is cut by the cutting agent, and partition walls are formed under the masks 32a and 32b, respectively.
  • the protection plates 61 to 64 are in an upright state with respect to the substrate to be coated 33 in the vicinity of the auxiliary partition mask 32b.
  • the protective plates 61 to 64 When moving from position (A) to (B) in the direction of arrow 81 and approaching the protective plates 61 to 64, the reflected flow generated by the cutting material injection of the cutting material injection gun 54 or 55 at the position (A) (Blow-up flow) 78 and the direct jet flow 79 generated by the cutting material injection of the cutting material injection gun 54 or 55 at the position (B) cancel each other in the region 80. Therefore, the protective plates 61 to 64 have the effect of weakening the cutting action of the direct jet 79 on the auxiliary partition wall in the peripheral region 82 and preventing excessive cutting of the auxiliary partition wall. Further, the protective plates 61 to 64 are brought into contact with the surface of the partition wall forming material layer of the substrate to be processed 33. Therefore, the auxiliary and main bulkheads are effectively protected from the cutting action from the lateral direction of the cutting material and are not damaged.
  • the protective plates 61 to 64 are placed vertically in contact with the substrate to be processed 33, so that the cutting material ejected from the spray guns 54 and 55 is a desired portion of the substrate to be processed 33. It protects against cutting material that runs laterally by reflecting the surface force of the substrate after cutting. Accordingly, the protective plates 61 to 64 are provided so as to correspond to the peripheral edge of the partition wall forming region 34 (FIG. 9) of the substrate 33 to be processed.
  • the protection plates 61 to 64 are brought into sliding contact with the surface of the partition wall forming material layer 31 of the work substrate 33 to form partition walls. Risk of damaging the surface of material layer 31.
  • the protective plates 61 to 64 come into contact with the partition wall forming material layer 31 of the substrate 33 to be processed through the sliding contact member 67 having a lower hardness than the substrate 33 to be processed. Speak.
  • the protective plate may be disposed at a position avoiding the partition wall forming material layer, that is, on the surface of the substrate to be processed (glass substrate) in the vicinity of the partition wall forming material layer.
  • the protective plates 61 to 64 it is preferable to prepare a plurality of types having different widths W (Fig. 6) in the range of 10 to 40 mm, for example. If the width W, that is, the height of the protective plates 61 to 64 from the processed substrate 33 is changed according to the shape and type of the partition wall to be formed on the processed substrate 33, the protection range of the protective plates 61 to 64 and Protective action can be controlled. At that time, the mounting positions of the protection members 61 to 64 can also be displaced in the direction of the arrow 56 by using the long holes 76 and 77 (FIG. 5).
  • FIG. 11 is a plan view of the embodiment shown in FIG. 4. In the embodiment shown in FIG. An example of partial changes is shown.
  • FIG. 12 shows an example in which the protective plates 61 and 62 are removed and the protective plates 63 and 64 are used for protection in the embodiment shown in FIG.
  • FIG. 13 is a modified example of the embodiment shown in FIG. 12, and an example of a so-called multi-chamfering type (in this case, two-chamfering type) in which the substrate to be processed 33 includes two partition wall formation regions 34a and 34b. It is shown.
  • multi-chamfering type in this case, two-chamfering type
  • protective plates 61 and 62 and protective plates 63 and 64 are installed corresponding to the gaps between the frames 59 and 60 and the partition wall formation regions 34a and 34b, respectively.
  • peripheral portions (auxiliary partition walls) of the partition forming regions 34a and 34b as well as the cutting material spray injected from the spray gun 55 are protected.
  • the life of the main body member 65 can be extended.

Abstract

A method of forming a partition of plasma display panel; and an apparatus therefor. Board (33) to be wrought into a board for plasma display panel is one composed of glass substrate (21) and, superimposed thereon, partition material layer (31) and mask (32a,32b). When the board to be wrought is sandblasted, portion of the layer not covered by the mask is shaved off while only portion of the layer covered by the mask remains and provides a partition. During the sandblasting treatment, the board to be wrought at its both end areas is provided with protective plates of given height (61,62) to thereby prevent excessive shaving of the layer. Eachof the protective plates is composed of main body part (65) and slide contact member (67). The main body part is protected by a member resistant to abrasion so as to avoid shaving by the sandblasting treatment, and the slide contact member is made of a material of low hardness so as to avoid injuring of the board to be wrought.

Description

明 細 書  Specification
隔壁形成方法とその形成装置  Partition forming method and apparatus therefor
技術分野  Technical field
[0001] この発明は、プラズマディスプレイパネル(以下、 PDPという)の製造方法および製 造装置に関し、とくに、 PDPの隔壁形成方法およびその形成装置に関する。  TECHNICAL FIELD [0001] The present invention relates to a plasma display panel (hereinafter referred to as PDP) manufacturing method and manufacturing apparatus, and more particularly to a PDP partition wall forming method and apparatus.
背景技術  Background art
[0002] 一般に PDPは、 2枚の対向するガラス基板に複数の電極を設け、その間に Ne、 Xe 等を主体とするガスを封入した構造になっている。そして、放電セルを画定する複数 の電極間に電圧を印加し、放電を発生させることにより、各セルを発光させて表示を 行うようにしている。  In general, a PDP has a structure in which a plurality of electrodes are provided on two opposing glass substrates, and a gas mainly composed of Ne, Xe, or the like is enclosed therebetween. Then, a voltage is applied between a plurality of electrodes defining the discharge cell to generate a discharge, thereby causing each cell to emit light for display.
[0003] PDPの一方の基板は、アドレス電極と隔壁と蛍光体層を有して背面基板を構成す る。このような背面基板における隔壁の形成方法としては、ガラス基板上のアドレス電 極を被った誘電体層表面にガラスペースト(隔壁形成材料)を所定の厚さで塗布して 乾燥させ、その上に耐サンドブラスト性を有するマスクをパターン状に形成する。そし て、このマスクを介してサンドブラスト加工を施すことにより隔壁形成材料層を切削し て所望形状の隔壁をパターユングした後で焼成すると 、う方法が採られて 、る。 なお、サンドブラストカ卩ェでは、切削材として粒径が 2〜50 μ m程度のガラスビーズ 、ステンレス鋼、 SiC、 SiO、 Al O、 ZrO等の無機微粒子が用いられている。  [0003] One substrate of the PDP has address electrodes, barrier ribs, and phosphor layers to constitute a back substrate. As a method of forming a partition wall on such a back substrate, a glass paste (partition wall forming material) is applied to a surface of a dielectric layer covered with an address electrode on a glass substrate with a predetermined thickness and dried. A mask having sandblast resistance is formed in a pattern. Then, sand blasting is performed through this mask to cut the partition wall forming material layer and pattern the desired shape partition walls, followed by firing. In sand blasting, glass beads with a particle size of about 2 to 50 μm, stainless steel, SiC, SiO, Al 2 O 3 and inorganic fine particles such as ZrO are used as cutting materials.
2 2 3 2  2 2 3 2
そして、隔壁端部の底部部分が過剰に切削される、いわゆるサイドカットに起用す るレジストのはがれ、隔壁の欠け、隔壁の切削高さの減少などの発生を防止するため に、隔壁端部の近傍に補助隔壁を形成する補助マスクを設けてサンドブラスト処理 するものが知られている(例えば、 WO2002Z084689号公報参照)。  In addition, in order to prevent the resist from being peeled off in the so-called side cut, where the bottom portion of the partition wall end portion is excessively cut, the chipping of the partition wall, and the reduction in the cutting height of the partition wall are prevented. There is known one in which an auxiliary mask for forming an auxiliary partition wall is provided in the vicinity for sandblasting (see, for example, WO2002Z084689).
発明の開示  Disclosure of the invention
発明が解決しょうとする課題  Problems to be solved by the invention
[0004] し力しながら、このような従来の技術では、補助隔壁の過剰切削を防ぐことができな V、ために主隔壁の端部部分を確実に保護することが難 、と 、う問題があった。 課題を解決するための手段 [0005] この発明は、基板上に形成された隔壁形成材料層の耐サンドブラスト用マスクが設 けられて 、な 、部分を切削材によって切削し、所望の形状の隔壁を形成するプラズ マディスプレイパネルの隔壁形成方法にぉ 、て、前記基板の所望部分の上方に基 板の搬送方向に延びる所定高さの保護板を隔壁形成材料層の表面または基板の表 面に接触するように垂直に設け、基板搬送方向に直交する方向に移動するサンドブ ラスト加工用ノズルから噴射される切削材の切削から隔壁形成材料層の所望部分を 保護することを特徴とする隔壁形成方法を提供するものである。 [0004] However, with such a conventional technique, it is difficult to reliably protect the end portion of the main partition wall due to the V being unable to prevent overcutting of the auxiliary partition wall. was there. Means for solving the problem [0005] The present invention provides a plasma display panel in which a mask for sandblasting of a partition wall forming material layer formed on a substrate is provided, and a portion is cut with a cutting material to form a partition having a desired shape. Then, a protective plate having a predetermined height extending in the substrate transport direction is provided vertically above the desired portion of the substrate so as to contact the surface of the partition wall forming material layer or the surface of the substrate. The present invention also provides a partition forming method characterized in that a desired portion of a partition forming material layer is protected from cutting of a cutting material sprayed from a sandblasting nozzle that moves in a direction perpendicular to the substrate transport direction.
[0006] 保護板の隔壁形成材料層または基板と摺接する部分は、基板より低!、硬度の材料 で形成されてもよい。  [0006] The partition wall forming material layer of the protective plate or the portion in sliding contact with the substrate may be formed of a material having a lower hardness than the substrate.
[0007] 保護板を、幅が異なる他の保護板と交換することにより切削作用を制御してもよい。  [0007] The cutting action may be controlled by replacing the protective plate with another protective plate having a different width.
[0008] また、この発明は、別の観点から、基板上に形成された隔壁形成材料層の耐サンド ブラスト用マスクが設けられていない部分を切削材によって切削し所望の形状の隔壁 を形成する隔壁形成装置にぉ ヽて、隔壁形成材料層および耐サンドブラスト用マス クが設けられた基板を所定の方向に搬送する基板搬送装置と、切削材を噴射するサ ンドブラスト加工用ノズルと、そのノズルを基板搬送方向に直交する方向に搬送する ノズル搬送装置と、搬送される基板の所望部分にぉ ヽてサンドブラスト加工用ヘッド と基板との間で隔壁形成材料層の表面または基板の表面と接触するように垂直に設 けられ、かつ基板の搬送方向に延びる所定高さの保護板とを備える隔壁形成装置を 提供するものである。 [0008] Further, according to another aspect of the present invention, a partition having a desired shape is formed by cutting a portion of the partition wall forming material layer formed on the substrate, which is not provided with a sandblast-resistant mask, with a cutting material. A substrate transport device that transports a substrate provided with a partition wall forming material layer and a sandblast-resistant mask in a predetermined direction, a nozzle for sandblast processing that injects a cutting material, and the nozzle. In contact with the surface of the partition forming material layer or the surface of the substrate between the nozzle conveying device and the sandblasting head and the substrate over the desired portion of the substrate to be conveyed. Thus, a partition wall forming apparatus provided with a protective plate of a predetermined height that is provided vertically and extends in the substrate transport direction is provided.
[0009] 保護板を支持する支持部材をさらに備え、保護板は、平坦で帯状の本体部材と、 サンドブラスト加工の切削作用から本体部材を保護する耐磨耗性部材と、基板より低 い硬度を有し隔壁形成材料層表面または基板表面に接触する摺接部材であっても よい。  [0009] The support plate further includes a support member that supports the protection plate, and the protection plate has a flat belt-like body member, an abrasion-resistant member that protects the body member from the cutting action of sandblasting, and a hardness lower than that of the substrate. It may also be a sliding member that contacts the partition wall forming material layer surface or the substrate surface.
[0010] 支持部材は、保護板を幅が異なる他の保護板と交換できるように支持してもよい。  [0010] The support member may support the protection plate so that the protection plate can be replaced with another protection plate having a different width.
支持部材は、保護板をサンドブラスト加工用ノズルの搬送方向に変位可能に支持 してちよい。  The support member may support the protective plate so as to be displaceable in the transport direction of the sandblasting nozzle.
発明の効果  The invention's effect
[0011] この発明によれば切削ダメージを受けやすい基板の所望部分に保護板が垂直に 接触した状態でサンドブラスト加工が行われるので、切削材によるダメージ、レジスト のはがれ、隔壁の欠けなどの発生が確実に防止される。 [0011] According to the present invention, the protective plate is perpendicular to the desired portion of the substrate that is susceptible to cutting damage. Since sandblasting is performed in contact, damage caused by cutting materials, resist peeling, and chipping of partition walls can be reliably prevented.
図面の簡単な説明  Brief Description of Drawings
[0012] [図 1]この発明に係る PDPの要部分解斜視図である。  FIG. 1 is an exploded perspective view of a main part of a PDP according to the present invention.
[図 2]この発明に係る被加工基板の断面図である。  FIG. 2 is a cross-sectional view of a substrate to be processed according to the present invention.
[図 3]この発明に係るサンドブラストカ卩ェ室の縦断面図である。  FIG. 3 is a longitudinal sectional view of a sandblasting chamber according to the present invention.
[図 4]図 3の I I矢視断面図である。  FIG. 4 is a cross-sectional view taken along the I-I arrow in FIG.
[図 5]この発明に係る保護板の上面図である。  FIG. 5 is a top view of the protective plate according to the present invention.
[図 6]この発明に係る保護板の側面図である。  FIG. 6 is a side view of the protective plate according to the present invention.
[図 7]図 6の II II矢視断面図である。  FIG. 7 is a cross-sectional view taken along arrow II in FIG.
[図 8]図 6の III III矢視断面図である。  8 is a cross-sectional view taken along arrow III-III in FIG.
[図 9]図 4の要部拡大図である。  FIG. 9 is an enlarged view of the main part of FIG.
[図 10]この発明の変形例を示す図 4対応図である。  FIG. 10 is a view corresponding to FIG. 4 showing a modification of the present invention.
[図 11]この発明の他の変形例を示す図 4対応図である。  FIG. 11 is a view corresponding to FIG. 4, showing another modification of the present invention.
[図 12]この発明のさらに他の変形例を示す図 4対応図である。  FIG. 12 is a view corresponding to FIG. 4, showing still another modification of the present invention.
[図 13]この発明のさらに他の変形例を示す図 4対応図である。  FIG. 13 is a view corresponding to FIG. 4, showing still another modification of the present invention.
[図 14]この発明の保護板の作用を示す説明図である。  FIG. 14 is an explanatory view showing the action of the protective plate of the present invention.
符号の説明  Explanation of symbols
[0013] 11, 12 ガラス基板 [0013] 11, 12 Glass substrate
31 隔壁形成材料層  31 Bulkhead forming material layer
32 耐サンドブラスト用マスク  32 Anti-sandblast mask
32a 主隔壁用マスク  32a Main bulkhead mask
32b 補助隔壁用マスク  32b Auxiliary partition mask
33 被加工基板  33 Substrate
34 隔壁形成領域  34 Partition formation area
34a 隔壁形成領域  34a Partition formation area
34b 隔壁形成領域  34b Partitioning area
50 背面基板 50a 前面基板 50 Back board 50a Front board
51 加工室  51 Processing room
52 搬送ローラ  52 Transport roller
53 被加工基板の搬送方向  53 Substrate transport direction
54, 55 サンドブラスト加工用ノズル(噴射ガン)  54, 55 Nozzle for sandblasting (spray gun)
54a, 55a 搬送装置  54a, 55a Transfer device
56 サンドブラスト加工ヘッドの移動方向  56 Direction of sandblasting head movement
57 回収装置  57 Recovery device
58〜60 フレーム  58-60 frames
61〜64 保護板  61-64 Protection plate
65 本体部材  65 Body parts
66 耐磨耗性部材  66 Wear resistant parts
67 摺接部材  67 Sliding member
68, 69 ブラケッ卜  68, 69 brackets
70〜75 締結部材  70 to 75 Fastening member
76, 77 長穴  76, 77 slotted hole
78 吹き上げ流  78 Blow-up flow
79 直噴流  79 Direct jet
80 領域  80 area
81 サンドブラスト加工用ノズルの移動方向  81 Movement direction of nozzle for sandblasting
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0014] 以下、図面に示す実施形態を用いてこの発明を詳述する。これによつてこの発明が 限定されるものではない。 Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings. This does not limit the invention.
この発明が適用される PDPは、図 1に示すような 3電極面放電型の PDPであって、 一対の基板アッセンプリつまり、背面基板 50と前面基板 50aから構成される。なお、 図では 1画素分を示している。  The PDP to which the present invention is applied is a three-electrode surface discharge type PDP as shown in FIG. 1, and includes a pair of substrate assemblies, that is, a back substrate 50 and a front substrate 50a. In the figure, one pixel is shown.
[0015] 前面基板 50aにおいては、ガラス基板 11の内面に、基板面に沿った面放電を生じ させるための横方向に延びる電極 X, 表示行を定める表示電極対 Sとして配列 される。電極 X, Yは、それぞれが ΙΤΟ薄膜からなる幅の広い帯状の透明電極 41と、 金属薄膜からなる幅の狭い帯状のバス電極 42から構成される。 [0015] In front substrate 50a, an inner surface of glass substrate 11 is arranged as a laterally extending electrode X for generating surface discharge along the substrate surface, and a display electrode pair S defining a display row. Is done. The electrodes X and Y are each composed of a wide band-shaped transparent electrode 41 made of a thin film and a narrow band-shaped bus electrode 42 made of a metal thin film.
ノ ス電極 42は、適正な導電性を確保するための補助電極である。電極 X, Υを被 覆するように誘電体層 17が設けられる。誘電体層 17の表面には保護膜 18が被覆さ れる。誘電体層 17及び保護膜 18はともに透光性を有して!/、る。  The nose electrode 42 is an auxiliary electrode for ensuring proper conductivity. A dielectric layer 17 is provided so as to cover the electrodes X and Υ. The surface of the dielectric layer 17 is covered with a protective film 18. Both the dielectric layer 17 and the protective film 18 have translucency!
[0016] 次に、背面基板 50においては、ガラス基板 21の内面に、表示電極対 Sと直交する 縦方向にアドレス電極 43が配列され、アドレス電極 43を被覆するように誘電体層 25 が設けられ、誘電体層 25上の各アドレス電極 43の間には、直線状のリブ(隔壁) 29 力 S1つずつ設けられる。なお、リブ 29は格子状に形成することも可能である。 Next, in the rear substrate 50, the address electrodes 43 are arranged on the inner surface of the glass substrate 21 in the vertical direction orthogonal to the display electrode pair S, and the dielectric layer 25 is provided so as to cover the address electrodes 43. In addition, between each address electrode 43 on the dielectric layer 25, a linear rib (partition) 29 force S1 is provided. The ribs 29 can also be formed in a lattice shape.
背面基板 50では、これらのリブ 29によって放電空間(放電セル) 30がサブピクセル (単位発光領域) EU毎に区画され、且つ放電空間 30の間隙寸法が規定される。  In the rear substrate 50, the discharge spaces (discharge cells) 30 are partitioned by these ribs 29 for each subpixel (unit light emission region) EU, and the gap size of the discharge space 30 is defined.
[0017] そして、誘電体層 25の上部及びリブ 29の側面を含めて背面側のセル壁面を被覆 するように、カラー表示のための R, G, Βの 3色の蛍光体層 28が設けられる。 [0017] Then, a phosphor layer 28 of three colors R, G, and Β for color display is provided so as to cover the cell wall on the back side including the upper portion of the dielectric layer 25 and the side surface of the rib 29. It is done.
リブ 29は低融点ガラスを主体とする材料力もなり、添加剤の種類によって透明又は 不透明に形成される。なお、リブ 29の形成方法としては、後述するように、ベタ膜状 の低融点ガラス層(隔壁形成材料層)の上に切削マスクを設け、サンドブラスト加工で パター-ングする工程が用いられる。  The rib 29 also has a material strength mainly composed of low-melting glass, and is formed transparent or opaque depending on the type of additive. As a method for forming the ribs 29, as will be described later, a process of providing a cutting mask on a solid film-like low melting point glass layer (partition wall forming material layer) and patterning by sandblasting is used.
[0018] マトリクス表示における 1行には表示電極対 Sが対応し、 1列には 1本のアドレス電 極 Αが対応する。そして、 3列が 1ピクセル (画素) EGに対応する。つまり、 1ピクセル EGはライン方向に並ぶ R, G, Bの 3つのサブピクセル EUから構成される。  [0018] A display electrode pair S corresponds to one row in the matrix display, and one address electrode corresponds to one column. And 3 columns correspond to 1 pixel (pixel) EG. That is, one pixel EG is composed of three subpixels EU, R, G, and B, arranged in the line direction.
アドレス電極 Aと表示電極 Yとの間の対向放電によって、表示すべく選択されたセ ル対応の誘電体層 17に壁電荷が形成される。表示電極 X, Yに交互にパルスを印 加すると、壁電荷が形成された前記選択セルで面放電 (主放電)が生じる。面放電で 生じた紫外線によって蛍光体層 28が励起されて所定色の可視光を放つ。この可視 光の内、前面側のガラス基板 11を透過する光が表示光となる。  Due to the counter discharge between the address electrode A and the display electrode Y, wall charges are formed in the dielectric layer 17 corresponding to the cells selected for display. When pulses are alternately applied to the display electrodes X and Y, a surface discharge (main discharge) occurs in the selected cell in which wall charges are formed. The phosphor layer 28 is excited by ultraviolet rays generated by the surface discharge and emits visible light of a predetermined color. Of this visible light, light that passes through the glass substrate 11 on the front side becomes display light.
[0019] 次に、 PDPの製造に用いられるサンドブラスト処理について説明する。  [0019] Next, the sand blasting process used for manufacturing the PDP will be described.
PDPの製造では、サンドブラスト処理により隔壁をパターユングする方法が採用さ れる。 [0020] まず、図 2に示すようにアドレス電極 43と誘電体層 25が形成されたガラス基板 21上 の隔壁形成領域に隔壁用のガラスペーストを塗布して乾燥させることにより隔壁形成 材料層 31を形成する。次に、隔壁形成材料層 31上に耐サンドブラスト性を有する感 光性レジスト層を設けた後、フォトマスクを介して活性光線を選択的に照射し、続けて 現像することにより耐サンドブラスト用のマスク 32を形成する。その後、隔壁形成材料 層 31と耐サンドブラスト用マスク 32が設けられたガラス基板 21 (以下、説明の便宜上 被加工基板 33と記す)に対してサンドブラスト処理を施す。サンドブラスト処理におい ては、切削材として粒径が 2〜50 μ m程度のガラスビーズ、ステンレス鋼、 SiC、 A1 In manufacturing the PDP, a method of putting the partition wall by sandblasting is adopted. First, as shown in FIG. 2, a partition wall forming material layer 31 is formed by applying partition wall glass paste to a partition wall forming region on a glass substrate 21 on which address electrodes 43 and a dielectric layer 25 are formed, and drying. Form. Next, a photosensitive resist layer having sandblast resistance is provided on the partition wall forming material layer 31, and then selectively irradiated with actinic rays through a photomask, followed by development to provide a sandblast resistant mask. Form 32. Thereafter, sandblasting is performed on the glass substrate 21 (hereinafter referred to as a substrate to be processed 33 for convenience of description) provided with the partition wall forming material layer 31 and the sandblast-resistant mask 32. In sandblasting, glass beads with a particle size of 2 to 50 μm, stainless steel, SiC, A1 are used as cutting materials.
2 2
O、 ZrO等の無機微粒子が用いられる。 Inorganic fine particles such as O and ZrO are used.
3 2  3 2
[0021] 次に、サンドブラスト処理による隔壁形成装置について説明する。  Next, an apparatus for forming a partition wall by sandblasting will be described.
図 3はサンドブラスト処理による隔壁形成装置の構成を示す縦断面図、図 4は図 3 の I I矢視断面図である。  FIG. 3 is a longitudinal sectional view showing the configuration of the partition forming apparatus by sandblasting, and FIG. 4 is a sectional view taken along the arrow II in FIG.
[0022] これらの図に示すように、加工室 51の内部には複数の搬送ローラ 52が水平に平行 配列され、その上を被加工基板 33が矢印 53の方向に搬送されるようになっている。 搬送される被カ卩ェ基板 33の上方には切削材噴射ガン 54, 55が配置され、ガン 54, 55は、それぞれ搬送装置 54a, 55aにより、矢印 56 (図 4)の方向、つまり被加工基板 33の搬送方向(矢印 53)に直交する方向に往復搬送されるようになっている。また、 搬送ローラ 52の下方には回収装置 57 (図 3)が配置され、切削材噴射ガン 54, 55か ら噴射された切削材が回収され、切削剤噴射ガン 54, 55への切削材供給源(図示し な 、)へ戻されて再利用されるようになって 、る。  As shown in these drawings, a plurality of transport rollers 52 are arranged in parallel in the processing chamber 51, and the substrate to be processed 33 is transported in the direction of the arrow 53 thereon. Yes. Cutting material injection guns 54 and 55 are arranged above the substrate to be conveyed 33, and the guns 54 and 55 are respectively moved in the direction of the arrow 56 (FIG. 4) by the conveying devices 54a and 55a. The substrate 33 is reciprocally conveyed in a direction orthogonal to the conveyance direction (arrow 53). A recovery device 57 (Fig. 3) is disposed below the transport roller 52, and the cutting material sprayed from the cutting material spray guns 54 and 55 is recovered and supplied to the cutting agent spray guns 54 and 55. Returned to the source (not shown) for reuse.
[0023] 図 4に示すように、加工室 51には搬送ローラ 52に平行に、つまり、矢印 56方向にフ レーム 58, 59, 60力設けられる。そして、フレーム 58, 59間に平坦な帯状の保護板 61, 62力 フレーム 59, 60間に平坦な帯状の保護板 63, 64が、それぞれ基板 33 の搬送方向(矢印 53方向)に平行に設けられている。  As shown in FIG. 4, the processing chamber 51 is provided with frames 58, 59, and 60 forces parallel to the transport roller 52, that is, in the direction of the arrow 56. Flat belt-shaped protection plates 61, 62 between the frames 58, 59 are provided between the frames 59, 60 in parallel to the transport direction of the substrate 33 (in the direction of arrow 53), respectively. It has been.
[0024] 図 5は保護板 61〜64の詳細を示す上面図、図 6は保護板 61〜64の詳細を示す 側面図、図 7は図 6の II II矢視断面図、図 8は図 6の III III矢視断面図である。 これらの図に示すように、保護板 61〜64の各々は、上辺に切り込み部を有する帯 状のステンレス鋼板力 なる本体部材 65と、その切り込み部に嵌め込まれて本体部 材 65の上辺を覆い、本体部材 65の側面に締結部材(ボルト,ナット,ヮッシャの組合 せ) 70, 71で固定されるセラミック製の耐磨耗性 (耐サンドブラスト性)部材 66を備え る。保護板 61〜64は、さらに下辺に摺接部材 67を備える。摺接部材 67は、本体部 材 65の側面に接着剤又は両面接着テープなどを用いて接着される。摺接部材 67は 本体部材 65の下辺から下方へ l〜2mm突出し、後述するように被カ卩ェ基板 33に摺 接する (接触しながら摺動する)ようになつている。従って、摺接部材 67は、被加工基 板 33に傷を付けないように硬度が被加工基板 33よりも低い材料、例えば、ポリェチ レン(厚さ 0. 5mmのフィルム)により形成される。 FIG. 5 is a top view showing details of the protective plates 61 to 64, FIG. 6 is a side view showing details of the protective plates 61 to 64, FIG. 7 is a cross-sectional view taken along II II in FIG. 6, and FIG. FIG. 6 is a cross-sectional view taken along III-III. As shown in these figures, each of the protective plates 61 to 64 is a main body member 65 made of a strip-shaped stainless steel plate having a cut portion on the upper side, and the main body portion fitted into the cut portion. A ceramic wear-resistant (sand blast-resistant) member 66 that covers the upper side of the material 65 and is fixed to the side surface of the main body member 65 by fastening members (a combination of bolts, nuts, and washers) 70 and 71 is provided. The protection plates 61 to 64 further include a sliding contact member 67 on the lower side. The sliding contact member 67 is bonded to the side surface of the main body member 65 using an adhesive or a double-sided adhesive tape. The slidable contact member 67 protrudes 1 to 2 mm downward from the lower side of the main body member 65, and is slidably contacted (sliding while contacting) as described later. Accordingly, the sliding contact member 67 is formed of a material whose hardness is lower than that of the substrate to be processed 33 so as not to damage the substrate to be processed 33, for example, polyethylene (a film having a thickness of 0.5 mm).
[0025] 保護板 61〜64の各々は両端がブラケット 68, 69を介してフレーム 58, 59又は 59 , 60に支持される。保護板 61〜64の各々の両端とブラケット 68, 69又は 59, 60は それぞれ締結部材 (ボルト,ナット,ヮッシャの組合せ) 72, 73により締結され、ブラケ ッ卜 68, 69ίま、それぞれフレーム 58, 59又 ίま 59, 60【こ蹄結咅材(ボノレ卜) 74, 75【こ より締結される。なお、ブラケット 68, 69は、図 5に示すように、それぞれ長穴 76, 77 を有し、フレーム 58, 59又は 59, 60に対して矢印 56方向(切削剤噴射ガンの移動 方向)に変位可能に固定される。  [0025] Each of the protection plates 61 to 64 is supported by the frames 58, 59 or 59, 60 via brackets 68, 69 at both ends. Both ends of each of the protective plates 61 to 64 and the brackets 68, 69 or 59, 60 are fastened by fastening members (a combination of bolts, nuts and washers) 72, 73, and the brackets 68, 69ί, respectively, the frame 58, 59 or ίMA 59, 60 【Shoe ligation material (bonole) 74, 75】 As shown in Fig. 5, brackets 68 and 69 have long holes 76 and 77, respectively, and are displaced in the direction of arrow 56 (moving direction of the cutting agent spray gun) with respect to frames 58, 59 or 59, 60. Fixed as possible.
[0026] このような構成において、図 3, 4に示すように、保護板 61〜64が切削ダメージを受 けやすい被加工基板 33の所望部分 (この例では補助隔壁の近傍)にセットされ、この 状態で加工室 51に被加工基板 33が搬入されると、被加工基板 33は搬送ローラ 52 により矢印 53の方向へ一定の速度で搬送される。図 9と図 10は、被加工基板 33と保 護板 61、 62又は 63, 64との位置関係を示す上面図と側面図である。  In such a configuration, as shown in FIGS. 3 and 4, the protective plates 61 to 64 are set on a desired portion of the substrate 33 to be cut easily (in the vicinity of the auxiliary partition wall in this example), When the workpiece substrate 33 is carried into the processing chamber 51 in this state, the workpiece substrate 33 is conveyed by the conveyance roller 52 in the direction of the arrow 53 at a constant speed. 9 and 10 are a top view and a side view showing the positional relationship between the substrate to be processed 33 and the protective plates 61, 62 or 63, 64, respectively.
[0027] 被加工基板 33の隔壁形成領域 34には、矢印 56の方向(切削材噴射ガンの移動 方向)に平行に配列された複数の主隔壁用マスク 32aと矢印 53の方向(基板の搬送 方向)に平行に配列された複数の補助隔壁用マスク 32bが隔壁形成材料層 31を被 うように設けられている。  [0027] In the partition forming region 34 of the substrate 33 to be processed, a plurality of main partition masks 32a arranged in parallel to the direction of arrow 56 (moving direction of the cutting material spray gun) and the direction of arrow 53 (substrate transfer) A plurality of auxiliary partition wall masks 32b arranged in parallel to the direction) are provided so as to cover the partition wall forming material layer 31.
なお、補助隔壁は主隔壁の端部の底部部分が切削される、いわゆるサイドカットを 防ぐために設けられて 、る。  The auxiliary partition is provided in order to prevent so-called side cut in which the bottom portion of the end of the main partition is cut.
図 10に示すように、保護板 61, 62および 63, 64の各々は、本体部材 65の下側ェ ッジから下方へ延びる可焼性部材 67が被加工基板 33の隔壁形成材料層 31の表面 に摺接するように設定される。 As shown in FIG. 10, each of the protective plates 61, 62 and 63, 64 has a flammable member 67 extending downward from the lower edge of the main body member 65, and the partition forming material layer 31 of the substrate 33 to be processed. surface It is set so that it slides on.
[0028] 加工室 51 (図 3)の中を被カ卩ェ基板 33が、例えば、 300mmZ分の速度で矢印 53 に沿って搬送されると、それに合わせて、切削材噴射ガン 54, 55が、例えば、 600m mZ秒の速度で矢印 56に沿って切削剤を噴射しながらの往復運動をくり返す。これ によって、被加工基板 33の隔壁形成材料層 31は、切削剤により切削され、マスク 32 a, 32bの下にそれぞれ隔壁が形成される。この時、図 14に示すように保護板 61〜6 4が補助隔壁用マスク 32bの近傍位置において被カ卩ェ基板 33に対して直立した状 態にあるので、切削材噴射ガン 54又は 55が位置 (A)から(B)へ矢印 81の方向に移 動して保護板 61〜64に接近すると、 (A)の位置の切削材噴射ガン 54又は 55の切 削材噴射によって生じた反射流 (吹き上げ流) 78と、 (B)の位置にある切削材噴射ガ ン 54又は 55の切削材噴射によって生じる直噴流 79とが、領域 80にて打ち消し合う。 従って、保護板 61〜64は、周辺領域 82にある補助隔壁に対する直噴流 79の切削 作用を弱め、補助隔壁の過剰な切削を防止するという効果を奏する。また、保護板 6 1〜64を被加工基板 33の隔壁形成材料層表面に接触させて 、るので、被加工基板 33の隔壁形成材料層に衝突した後に向きを変えて隔壁形成材料層の表面に平行 に走る切削材の動きを止めることができ、つまり切削材の横方向からの切削作用から 補助および主隔壁が効果的に保護され、損傷をうけることがない。  [0028] When the substrate to be covered 33 is conveyed along the arrow 53 at a speed of 300 mmZ in the processing chamber 51 (Fig. 3), the cutting material injection guns 54 and 55 are moved accordingly. For example, the reciprocating motion is repeated while spraying the cutting agent along the arrow 56 at a speed of 600 mmZ. As a result, the partition wall forming material layer 31 of the substrate to be processed 33 is cut by the cutting agent, and partition walls are formed under the masks 32a and 32b, respectively. At this time, as shown in FIG. 14, the protection plates 61 to 64 are in an upright state with respect to the substrate to be coated 33 in the vicinity of the auxiliary partition mask 32b. When moving from position (A) to (B) in the direction of arrow 81 and approaching the protective plates 61 to 64, the reflected flow generated by the cutting material injection of the cutting material injection gun 54 or 55 at the position (A) (Blow-up flow) 78 and the direct jet flow 79 generated by the cutting material injection of the cutting material injection gun 54 or 55 at the position (B) cancel each other in the region 80. Therefore, the protective plates 61 to 64 have the effect of weakening the cutting action of the direct jet 79 on the auxiliary partition wall in the peripheral region 82 and preventing excessive cutting of the auxiliary partition wall. Further, the protective plates 61 to 64 are brought into contact with the surface of the partition wall forming material layer of the substrate to be processed 33. Therefore, the auxiliary and main bulkheads are effectively protected from the cutting action from the lateral direction of the cutting material and are not damaged.
従って、所望の断面形状の隔壁が得られる。  Therefore, a partition wall having a desired cross-sectional shape can be obtained.
[0029] このように、保護板 61〜64は、被加工基板 33に接触して垂直に設置されることに より、噴射ガン 54, 55から噴出される切削材が被加工基板 33の所望部分に過剰に 当たらないようにし、また切削後の基板面力 反射して横方向に走る切削材が当たら ないように保護するものである。従って、保護板 61〜64は、被加工基板 33の隔壁形 成領域 34 (図 9)の周縁に対応するように設けられる。  [0029] Thus, the protective plates 61 to 64 are placed vertically in contact with the substrate to be processed 33, so that the cutting material ejected from the spray guns 54 and 55 is a desired portion of the substrate to be processed 33. It protects against cutting material that runs laterally by reflecting the surface force of the substrate after cutting. Accordingly, the protective plates 61 to 64 are provided so as to correspond to the peripheral edge of the partition wall forming region 34 (FIG. 9) of the substrate 33 to be processed.
[0030] 固定された保護板 61〜64に移動する被加工基板 33が接触すると、保護板 61〜6 4が被加工基板 33の隔壁形成材料層 31の表面に摺接することになり、隔壁形成材 料層 31の表面に損傷を与える危険性がある。これを回避するため、前述のように保 護板 61〜64は被加工基板 33より低い硬度を有する摺接部材 67を介して被加工基 板 33の隔壁形成材料層 31に接触するようになって ヽる。 なお、保護板は隔壁形成材料層を避けた位置、つまり隔壁形成材料層の近傍の被 加工基板 (ガラス基板)表面に配置してもよ ヽ。 [0030] When the work substrate 33 to be moved contacts the fixed protection plates 61 to 64, the protection plates 61 to 64 are brought into sliding contact with the surface of the partition wall forming material layer 31 of the work substrate 33 to form partition walls. Risk of damaging the surface of material layer 31. In order to avoid this, as described above, the protective plates 61 to 64 come into contact with the partition wall forming material layer 31 of the substrate 33 to be processed through the sliding contact member 67 having a lower hardness than the substrate 33 to be processed. Speak. The protective plate may be disposed at a position avoiding the partition wall forming material layer, that is, on the surface of the substrate to be processed (glass substrate) in the vicinity of the partition wall forming material layer.
[0031] 保護板 61〜64については、幅 W (図 6)が例えば 10〜40mmの範囲で異なるもの を予め複数種類用意しておくことが好ましい。そして、被加工基板 33に形成すべき 隔壁の形状や種類に応じて幅 W、つまり保護板 61〜64の被加工基板 33からの高さ を変更すれば、保護板 61〜64の保護範囲や保護作用を制御することができる。 なお、その時、保護部材 61〜64の取付け位置も、長穴 76, 77 (図 5)を利用して矢 印 56の方向に変位することができる。  [0031] Regarding the protective plates 61 to 64, it is preferable to prepare a plurality of types having different widths W (Fig. 6) in the range of 10 to 40 mm, for example. If the width W, that is, the height of the protective plates 61 to 64 from the processed substrate 33 is changed according to the shape and type of the partition wall to be formed on the processed substrate 33, the protection range of the protective plates 61 to 64 and Protective action can be controlled. At that time, the mounting positions of the protection members 61 to 64 can also be displaced in the direction of the arrow 56 by using the long holes 76 and 77 (FIG. 5).
[0032] 図 11は、図 4に示す実施形態において、サイズの小さいパネルに対応すべく保護 板 63と 64の間隔を狭くして、保護板 63, 64による被加工基板 33上の保護部分を部 分的に変更した例を示す。 [0032] FIG. 11 is a plan view of the embodiment shown in FIG. 4. In the embodiment shown in FIG. An example of partial changes is shown.
また、図 12は、図 4に示す実施形態において、保護板 61と 62を除去して、保護板 63と 64のみにより保護するようにした例を示す。  FIG. 12 shows an example in which the protective plates 61 and 62 are removed and the protective plates 63 and 64 are used for protection in the embodiment shown in FIG.
また、図 13は、図 12に示す実施形態の変形例であり、被加工基板 33が 2つの隔壁 形成領域 34a、 34bを備えた所謂、多面取り形式 (この場合は 2面取り形式)の例を示 している。  FIG. 13 is a modified example of the embodiment shown in FIG. 12, and an example of a so-called multi-chamfering type (in this case, two-chamfering type) in which the substrate to be processed 33 includes two partition wall formation regions 34a and 34b. It is shown.
この例では、フレーム 59と 60との間〖こ、隔壁形成領域 34a、 34bのそれぞれに対応 して、保護板 61、 62および保護板 63、 64が設置されている。そして、噴射ガン 55か ら噴射される切削材カゝら隔壁形成領域 34a、 34bの周縁部分 (補助隔壁)が保護され るようになっている。  In this example, protective plates 61 and 62 and protective plates 63 and 64 are installed corresponding to the gaps between the frames 59 and 60 and the partition wall formation regions 34a and 34b, respectively. In addition, the peripheral portions (auxiliary partition walls) of the partition forming regions 34a and 34b as well as the cutting material spray injected from the spray gun 55 are protected.
この多面取り形式では切削材の横方向の切削作用に対して保護板 62, 63の保護 が顕著になる。  In this multi-chamfering type, protection of the protective plates 62 and 63 becomes remarkable against the cutting action in the lateral direction of the cutting material.
なお、保護板 61〜64のステンレス鋼板製の本体部材 65において、切削材の噴射 を直接受ける部分は、図 8に示すようにセラミック製の耐磨耗性 (耐サンドブラスト性) 部材 66で保護されている。従って、本体部材 65の長寿命化がはかられる。  In addition, in the main body member 65 made of stainless steel plate of the protective plates 61 to 64, the portion that receives the injection of cutting material directly is protected by a ceramic wear resistance (sand blast resistance) member 66 as shown in FIG. ing. Therefore, the life of the main body member 65 can be extended.

Claims

請求の範囲 The scope of the claims
[1] 基板上に形成された隔壁形成材料層の耐サンドブラスト用マスクが設けられていな V、部分を切削材によって切削し、所望の形状の隔壁を形成するプラズマディスプレイ パネルの隔壁形成方法にお 1、て、前記基板の所望部分の上方に基板の搬送方向 に延びる所定高さの保護板を隔壁形成材料層の表面または基板の表面に接触する ように垂直に設け、基板搬送方向に直交する方向に移動するサンドブラスト加工用ノ ズルカゝら噴射される切削材の切削カゝら隔壁形成材料層の所望部分を保護することを 特徴とする隔壁形成方法。  [1] In a method for forming a partition for a plasma display panel, a partition forming material layer formed on a substrate is not provided with a sandblasting-resistant mask V, and the portion is cut with a cutting material to form a partition having a desired shape. 1. A protective plate having a predetermined height extending in the substrate transport direction is provided vertically above the desired portion of the substrate so as to be in contact with the surface of the partition wall forming material layer or the surface of the substrate, and orthogonal to the substrate transport direction. A partition forming method comprising: protecting a desired portion of a partition wall forming material layer of a cutting material of a cutting material sprayed from a nozzle for sandblasting that moves in a direction.
[2] 保護板の隔壁形成材料層または基板と摺接する部分は、基板より低!ヽ硬度の材料 で形成されて!ヽる請求項 1記載の隔壁形成方法。  [2] The partition wall forming method according to claim 1, wherein the partition wall forming material layer of the protective plate or the portion in sliding contact with the substrate is formed of a material having a lower hardness than the substrate.
[3] 保護板を、幅が異なる他の保護板と交換することにより切削作用を制御する請求項 1または 2記載の隔壁形成方法。  [3] The partition wall forming method according to claim 1 or 2, wherein the cutting action is controlled by replacing the protective plate with another protective plate having a different width.
[4] 基板上に形成された隔壁形成材料層の耐サンドブラスト用マスクが設けられていな い部分を切削材によって切削し所望の形状の隔壁を形成する隔壁形成装置におい て、隔壁形成材料層および耐サンドブラスト用マスクが設けられた基板を所定の方向 に搬送する基板搬送装置と、切削材を噴射するサンドブラスト加工用ノズルと、そのノ ズルを基板搬送方向に直交する方向に搬送するノズル搬送装置と、搬送される基板 の所望部分においてサンドブラスト加工用ヘッドと基板との間で隔壁形成材料層の 表面または基板の表面と接触するように垂直に設けられ、かつ基板の搬送方向に延 びる所定高さの保護板とを備える隔壁形成装置。  [4] In a partition forming apparatus that forms a partition having a desired shape by cutting a portion of the partition forming material layer formed on the substrate that is not provided with a sandblasting-resistant mask with a cutting material. A substrate transfer device for transferring a substrate provided with a sandblast-resistant mask in a predetermined direction, a sandblasting nozzle for injecting a cutting material, and a nozzle transfer device for transferring the nozzle in a direction perpendicular to the substrate transfer direction; A predetermined height extending in the substrate transport direction is provided perpendicular to the surface of the partition wall forming material layer or the surface of the substrate between the sandblasting head and the substrate at a desired portion of the substrate to be transported. A partition wall forming apparatus comprising a protective plate.
[5] 保護板を支持する支持部材をさらに備え、保護板は、平坦で帯状の本体部材と、 サンドブラスト加工の切削作用から本体部材を保護する耐磨耗性部材と、基板より低 い硬度を有し隔壁形成材料層表面または基板表面に接触する摺接部材とからなる 請求項 4記載の隔壁形成装置。  [5] A support member for supporting the protection plate is further provided. The protection plate has a flat belt-like body member, a wear-resistant member that protects the body member from the cutting action of sandblasting, and a hardness lower than that of the substrate. 5. The partition forming apparatus according to claim 4, comprising a sliding contact member that contacts the surface of the partition wall forming material layer or the substrate surface.
[6] 支持部材は、保護板を幅が異なる他の保護板と交換できるように支持する請求項 5 記載の隔壁形成装置。  6. The partition wall forming apparatus according to claim 5, wherein the support member supports the protection plate so that the protection plate can be replaced with another protection plate having a different width.
[7] 支持部材は、保護板をサンドブラスト加工用ノズルの搬送方向に変位可能に支持 する請求項 5記載の隔壁形成装置。  7. The partition forming apparatus according to claim 5, wherein the support member supports the protective plate so as to be displaceable in the transport direction of the sandblasting nozzle.
PCT/JP2006/317571 2006-09-05 2006-09-05 Method of forming partition and apparatus therefor WO2008029452A1 (en)

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Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH0284689A (en) * 1988-09-21 1990-03-26 Toshiba Corp Video memory device
JP2001222946A (en) * 1999-11-30 2001-08-17 Dainippon Printing Co Ltd Method of forming rib of plasma display panel
JP2003127064A (en) * 2001-10-22 2003-05-08 Nec Corp Solid mask, processing method using it, and solid mask manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0284689A (en) * 1988-09-21 1990-03-26 Toshiba Corp Video memory device
JP2001222946A (en) * 1999-11-30 2001-08-17 Dainippon Printing Co Ltd Method of forming rib of plasma display panel
JP2003127064A (en) * 2001-10-22 2003-05-08 Nec Corp Solid mask, processing method using it, and solid mask manufacturing method

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