WO2008029452A1 - Method of forming partition and apparatus therefor - Google Patents
Method of forming partition and apparatus therefor Download PDFInfo
- Publication number
- WO2008029452A1 WO2008029452A1 PCT/JP2006/317571 JP2006317571W WO2008029452A1 WO 2008029452 A1 WO2008029452 A1 WO 2008029452A1 JP 2006317571 W JP2006317571 W JP 2006317571W WO 2008029452 A1 WO2008029452 A1 WO 2008029452A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- partition
- partition wall
- sandblasting
- material layer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/36—Spacers, barriers, ribs, partitions or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/10—AC-PDPs with at least one main electrode being out of contact with the plasma
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/241—Manufacture or joining of vessels, leading-in conductors or bases the vessel being for a flat panel display
- H01J9/242—Spacers between faceplate and backplate
Definitions
- the present invention relates to a plasma display panel (hereinafter referred to as PDP) manufacturing method and manufacturing apparatus, and more particularly to a PDP partition wall forming method and apparatus.
- PDP plasma display panel
- a PDP has a structure in which a plurality of electrodes are provided on two opposing glass substrates, and a gas mainly composed of Ne, Xe, or the like is enclosed therebetween. Then, a voltage is applied between a plurality of electrodes defining the discharge cell to generate a discharge, thereby causing each cell to emit light for display.
- One substrate of the PDP has address electrodes, barrier ribs, and phosphor layers to constitute a back substrate.
- a glass paste partition wall forming material
- a mask having sandblast resistance is formed in a pattern.
- sand blasting is performed through this mask to cut the partition wall forming material layer and pattern the desired shape partition walls, followed by firing.
- glass beads with a particle size of about 2 to 50 ⁇ m, stainless steel, SiC, SiO, Al 2 O 3 and inorganic fine particles such as ZrO are used as cutting materials.
- the present invention provides a plasma display panel in which a mask for sandblasting of a partition wall forming material layer formed on a substrate is provided, and a portion is cut with a cutting material to form a partition having a desired shape. Then, a protective plate having a predetermined height extending in the substrate transport direction is provided vertically above the desired portion of the substrate so as to contact the surface of the partition wall forming material layer or the surface of the substrate.
- the present invention also provides a partition forming method characterized in that a desired portion of a partition forming material layer is protected from cutting of a cutting material sprayed from a sandblasting nozzle that moves in a direction perpendicular to the substrate transport direction.
- the partition wall forming material layer of the protective plate or the portion in sliding contact with the substrate may be formed of a material having a lower hardness than the substrate.
- the cutting action may be controlled by replacing the protective plate with another protective plate having a different width.
- a partition having a desired shape is formed by cutting a portion of the partition wall forming material layer formed on the substrate, which is not provided with a sandblast-resistant mask, with a cutting material.
- a substrate transport device that transports a substrate provided with a partition wall forming material layer and a sandblast-resistant mask in a predetermined direction, a nozzle for sandblast processing that injects a cutting material, and the nozzle.
- a partition wall forming apparatus provided with a protective plate of a predetermined height that is provided vertically and extends in the substrate transport direction is provided.
- the support plate further includes a support member that supports the protection plate, and the protection plate has a flat belt-like body member, an abrasion-resistant member that protects the body member from the cutting action of sandblasting, and a hardness lower than that of the substrate. It may also be a sliding member that contacts the partition wall forming material layer surface or the substrate surface.
- the support member may support the protection plate so that the protection plate can be replaced with another protection plate having a different width.
- the support member may support the protective plate so as to be displaceable in the transport direction of the sandblasting nozzle.
- the protective plate is perpendicular to the desired portion of the substrate that is susceptible to cutting damage. Since sandblasting is performed in contact, damage caused by cutting materials, resist peeling, and chipping of partition walls can be reliably prevented.
- FIG. 1 is an exploded perspective view of a main part of a PDP according to the present invention.
- FIG. 2 is a cross-sectional view of a substrate to be processed according to the present invention.
- FIG. 3 is a longitudinal sectional view of a sandblasting chamber according to the present invention.
- FIG. 4 is a cross-sectional view taken along the I-I arrow in FIG.
- FIG. 5 is a top view of the protective plate according to the present invention.
- FIG. 6 is a side view of the protective plate according to the present invention.
- FIG. 7 is a cross-sectional view taken along arrow II in FIG.
- FIG. 8 is a cross-sectional view taken along arrow III-III in FIG.
- FIG. 9 is an enlarged view of the main part of FIG.
- FIG. 10 is a view corresponding to FIG. 4 showing a modification of the present invention.
- FIG. 11 is a view corresponding to FIG. 4, showing another modification of the present invention.
- FIG. 12 is a view corresponding to FIG. 4, showing still another modification of the present invention.
- FIG. 13 is a view corresponding to FIG. 4, showing still another modification of the present invention.
- FIG. 14 is an explanatory view showing the action of the protective plate of the present invention.
- the PDP to which the present invention is applied is a three-electrode surface discharge type PDP as shown in FIG. 1, and includes a pair of substrate assemblies, that is, a back substrate 50 and a front substrate 50a. In the figure, one pixel is shown.
- an inner surface of glass substrate 11 is arranged as a laterally extending electrode X for generating surface discharge along the substrate surface, and a display electrode pair S defining a display row. Is done.
- the electrodes X and Y are each composed of a wide band-shaped transparent electrode 41 made of a thin film and a narrow band-shaped bus electrode 42 made of a metal thin film.
- the nose electrode 42 is an auxiliary electrode for ensuring proper conductivity.
- a dielectric layer 17 is provided so as to cover the electrodes X and ⁇ .
- the surface of the dielectric layer 17 is covered with a protective film 18. Both the dielectric layer 17 and the protective film 18 have translucency!
- the address electrodes 43 are arranged on the inner surface of the glass substrate 21 in the vertical direction orthogonal to the display electrode pair S, and the dielectric layer 25 is provided so as to cover the address electrodes 43.
- a linear rib (partition) 29 force S1 is provided between each address electrode 43 on the dielectric layer 25 .
- the ribs 29 can also be formed in a lattice shape.
- discharge spaces (discharge cells) 30 are partitioned by these ribs 29 for each subpixel (unit light emission region) EU, and the gap size of the discharge space 30 is defined.
- a phosphor layer 28 of three colors R, G, and ⁇ for color display is provided so as to cover the cell wall on the back side including the upper portion of the dielectric layer 25 and the side surface of the rib 29. It is done.
- the rib 29 also has a material strength mainly composed of low-melting glass, and is formed transparent or opaque depending on the type of additive.
- a method for forming the ribs 29, as will be described later a process of providing a cutting mask on a solid film-like low melting point glass layer (partition wall forming material layer) and patterning by sandblasting is used.
- a display electrode pair S corresponds to one row in the matrix display, and one address electrode corresponds to one column. And 3 columns correspond to 1 pixel (pixel) EG. That is, one pixel EG is composed of three subpixels EU, R, G, and B, arranged in the line direction.
- wall charges are formed in the dielectric layer 17 corresponding to the cells selected for display.
- a surface discharge main discharge
- the phosphor layer 28 is excited by ultraviolet rays generated by the surface discharge and emits visible light of a predetermined color. Of this visible light, light that passes through the glass substrate 11 on the front side becomes display light.
- a method of putting the partition wall by sandblasting is adopted.
- a partition wall forming material layer 31 is formed by applying partition wall glass paste to a partition wall forming region on a glass substrate 21 on which address electrodes 43 and a dielectric layer 25 are formed, and drying.
- a photosensitive resist layer having sandblast resistance is provided on the partition wall forming material layer 31, and then selectively irradiated with actinic rays through a photomask, followed by development to provide a sandblast resistant mask.
- Form 32 is
- sandblasting is performed on the glass substrate 21 (hereinafter referred to as a substrate to be processed 33 for convenience of description) provided with the partition wall forming material layer 31 and the sandblast-resistant mask 32.
- glass beads with a particle size of 2 to 50 ⁇ m, stainless steel, SiC, A1 are used as cutting materials.
- Inorganic fine particles such as O and ZrO are used.
- FIG. 3 is a longitudinal sectional view showing the configuration of the partition forming apparatus by sandblasting
- FIG. 4 is a sectional view taken along the arrow II in FIG.
- a plurality of transport rollers 52 are arranged in parallel in the processing chamber 51, and the substrate to be processed 33 is transported in the direction of the arrow 53 thereon. Yes.
- Cutting material injection guns 54 and 55 are arranged above the substrate to be conveyed 33, and the guns 54 and 55 are respectively moved in the direction of the arrow 56 (FIG. 4) by the conveying devices 54a and 55a.
- the substrate 33 is reciprocally conveyed in a direction orthogonal to the conveyance direction (arrow 53).
- a recovery device 57 (Fig. 3) is disposed below the transport roller 52, and the cutting material sprayed from the cutting material spray guns 54 and 55 is recovered and supplied to the cutting agent spray guns 54 and 55. Returned to the source (not shown) for reuse.
- the processing chamber 51 is provided with frames 58, 59, and 60 forces parallel to the transport roller 52, that is, in the direction of the arrow 56.
- Flat belt-shaped protection plates 61, 62 between the frames 58, 59 are provided between the frames 59, 60 in parallel to the transport direction of the substrate 33 (in the direction of arrow 53), respectively. It has been.
- FIG. 5 is a top view showing details of the protective plates 61 to 64
- FIG. 6 is a side view showing details of the protective plates 61 to 64
- FIG. 7 is a cross-sectional view taken along II II in FIG. 6,
- FIG. FIG. 6 is a cross-sectional view taken along III-III.
- each of the protective plates 61 to 64 is a main body member 65 made of a strip-shaped stainless steel plate having a cut portion on the upper side, and the main body portion fitted into the cut portion.
- a ceramic wear-resistant (sand blast-resistant) member 66 that covers the upper side of the material 65 and is fixed to the side surface of the main body member 65 by fastening members (a combination of bolts, nuts, and washers) 70 and 71 is provided.
- the protection plates 61 to 64 further include a sliding contact member 67 on the lower side.
- the sliding contact member 67 is bonded to the side surface of the main body member 65 using an adhesive or a double-sided adhesive tape.
- the slidable contact member 67 protrudes 1 to 2 mm downward from the lower side of the main body member 65, and is slidably contacted (sliding while contacting) as described later.
- the sliding contact member 67 is formed of a material whose hardness is lower than that of the substrate to be processed 33 so as not to damage the substrate to be processed 33, for example, polyethylene (a film having a thickness of 0.5 mm).
- Each of the protection plates 61 to 64 is supported by the frames 58, 59 or 59, 60 via brackets 68, 69 at both ends. Both ends of each of the protective plates 61 to 64 and the brackets 68, 69 or 59, 60 are fastened by fastening members (a combination of bolts, nuts and washers) 72, 73, and the brackets 68, 69 ⁇ , respectively, the frame 58, 59 or ⁇ MA 59, 60 ⁇ Shoe ligation material (bonole) 74, 75 ⁇ As shown in Fig. 5, brackets 68 and 69 have long holes 76 and 77, respectively, and are displaced in the direction of arrow 56 (moving direction of the cutting agent spray gun) with respect to frames 58, 59 or 59, 60. Fixed as possible.
- the protective plates 61 to 64 are set on a desired portion of the substrate 33 to be cut easily (in the vicinity of the auxiliary partition wall in this example),
- the workpiece substrate 33 is conveyed by the conveyance roller 52 in the direction of the arrow 53 at a constant speed.
- 9 and 10 are a top view and a side view showing the positional relationship between the substrate to be processed 33 and the protective plates 61, 62 or 63, 64, respectively.
- a plurality of auxiliary partition wall masks 32b arranged in parallel to the direction) are provided so as to cover the partition wall forming material layer 31.
- the auxiliary partition is provided in order to prevent so-called side cut in which the bottom portion of the end of the main partition is cut.
- each of the protective plates 61, 62 and 63, 64 has a flammable member 67 extending downward from the lower edge of the main body member 65, and the partition forming material layer 31 of the substrate 33 to be processed. surface It is set so that it slides on.
- the cutting material injection guns 54 and 55 are moved accordingly.
- the reciprocating motion is repeated while spraying the cutting agent along the arrow 56 at a speed of 600 mmZ.
- the partition wall forming material layer 31 of the substrate to be processed 33 is cut by the cutting agent, and partition walls are formed under the masks 32a and 32b, respectively.
- the protection plates 61 to 64 are in an upright state with respect to the substrate to be coated 33 in the vicinity of the auxiliary partition mask 32b.
- the protective plates 61 to 64 When moving from position (A) to (B) in the direction of arrow 81 and approaching the protective plates 61 to 64, the reflected flow generated by the cutting material injection of the cutting material injection gun 54 or 55 at the position (A) (Blow-up flow) 78 and the direct jet flow 79 generated by the cutting material injection of the cutting material injection gun 54 or 55 at the position (B) cancel each other in the region 80. Therefore, the protective plates 61 to 64 have the effect of weakening the cutting action of the direct jet 79 on the auxiliary partition wall in the peripheral region 82 and preventing excessive cutting of the auxiliary partition wall. Further, the protective plates 61 to 64 are brought into contact with the surface of the partition wall forming material layer of the substrate to be processed 33. Therefore, the auxiliary and main bulkheads are effectively protected from the cutting action from the lateral direction of the cutting material and are not damaged.
- the protective plates 61 to 64 are placed vertically in contact with the substrate to be processed 33, so that the cutting material ejected from the spray guns 54 and 55 is a desired portion of the substrate to be processed 33. It protects against cutting material that runs laterally by reflecting the surface force of the substrate after cutting. Accordingly, the protective plates 61 to 64 are provided so as to correspond to the peripheral edge of the partition wall forming region 34 (FIG. 9) of the substrate 33 to be processed.
- the protection plates 61 to 64 are brought into sliding contact with the surface of the partition wall forming material layer 31 of the work substrate 33 to form partition walls. Risk of damaging the surface of material layer 31.
- the protective plates 61 to 64 come into contact with the partition wall forming material layer 31 of the substrate 33 to be processed through the sliding contact member 67 having a lower hardness than the substrate 33 to be processed. Speak.
- the protective plate may be disposed at a position avoiding the partition wall forming material layer, that is, on the surface of the substrate to be processed (glass substrate) in the vicinity of the partition wall forming material layer.
- the protective plates 61 to 64 it is preferable to prepare a plurality of types having different widths W (Fig. 6) in the range of 10 to 40 mm, for example. If the width W, that is, the height of the protective plates 61 to 64 from the processed substrate 33 is changed according to the shape and type of the partition wall to be formed on the processed substrate 33, the protection range of the protective plates 61 to 64 and Protective action can be controlled. At that time, the mounting positions of the protection members 61 to 64 can also be displaced in the direction of the arrow 56 by using the long holes 76 and 77 (FIG. 5).
- FIG. 11 is a plan view of the embodiment shown in FIG. 4. In the embodiment shown in FIG. An example of partial changes is shown.
- FIG. 12 shows an example in which the protective plates 61 and 62 are removed and the protective plates 63 and 64 are used for protection in the embodiment shown in FIG.
- FIG. 13 is a modified example of the embodiment shown in FIG. 12, and an example of a so-called multi-chamfering type (in this case, two-chamfering type) in which the substrate to be processed 33 includes two partition wall formation regions 34a and 34b. It is shown.
- multi-chamfering type in this case, two-chamfering type
- protective plates 61 and 62 and protective plates 63 and 64 are installed corresponding to the gaps between the frames 59 and 60 and the partition wall formation regions 34a and 34b, respectively.
- peripheral portions (auxiliary partition walls) of the partition forming regions 34a and 34b as well as the cutting material spray injected from the spray gun 55 are protected.
- the life of the main body member 65 can be extended.
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008532995A JPWO2008029452A1 (en) | 2006-09-05 | 2006-09-05 | Partition forming method and apparatus therefor |
CNA2006800544983A CN101438369A (en) | 2006-09-05 | 2006-09-05 | Method and apparatus for forming bulkhead |
PCT/JP2006/317571 WO2008029452A1 (en) | 2006-09-05 | 2006-09-05 | Method of forming partition and apparatus therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/317571 WO2008029452A1 (en) | 2006-09-05 | 2006-09-05 | Method of forming partition and apparatus therefor |
Publications (1)
Publication Number | Publication Date |
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WO2008029452A1 true WO2008029452A1 (en) | 2008-03-13 |
Family
ID=39156897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2006/317571 WO2008029452A1 (en) | 2006-09-05 | 2006-09-05 | Method of forming partition and apparatus therefor |
Country Status (3)
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JP (1) | JPWO2008029452A1 (en) |
CN (1) | CN101438369A (en) |
WO (1) | WO2008029452A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102335880B (en) * | 2010-07-15 | 2014-07-16 | 鸿富锦精密工业(深圳)有限公司 | Glass processing equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284689A (en) * | 1988-09-21 | 1990-03-26 | Toshiba Corp | Video memory device |
JP2001222946A (en) * | 1999-11-30 | 2001-08-17 | Dainippon Printing Co Ltd | Method of forming rib of plasma display panel |
JP2003127064A (en) * | 2001-10-22 | 2003-05-08 | Nec Corp | Solid mask, processing method using it, and solid mask manufacturing method |
-
2006
- 2006-09-05 WO PCT/JP2006/317571 patent/WO2008029452A1/en active Application Filing
- 2006-09-05 JP JP2008532995A patent/JPWO2008029452A1/en active Pending
- 2006-09-05 CN CNA2006800544983A patent/CN101438369A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0284689A (en) * | 1988-09-21 | 1990-03-26 | Toshiba Corp | Video memory device |
JP2001222946A (en) * | 1999-11-30 | 2001-08-17 | Dainippon Printing Co Ltd | Method of forming rib of plasma display panel |
JP2003127064A (en) * | 2001-10-22 | 2003-05-08 | Nec Corp | Solid mask, processing method using it, and solid mask manufacturing method |
Also Published As
Publication number | Publication date |
---|---|
CN101438369A (en) | 2009-05-20 |
JPWO2008029452A1 (en) | 2010-01-21 |
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