KR20090013175A - Method of forming partition and apparatus therefor - Google Patents

Abstract

A method of forming a partition of plasma display panel; and an apparatus therefor. Board (33) to be wrought into a board for plasma display panel is one composed of glass substrate (21) and, superimposed thereon, partition material layer (31) and mask (32a,32b). When the board to be wrought is sandblasted, portion of the layer not covered by the mask is shaved off while only portion of the layer covered by the mask remains and provides a partition. During the sandblasting treatment, the board to be wrought at its both end areas is provided with protective plates of given height (61,62) to thereby prevent excessive shaving of the layer. Eachof the protective plates is composed of main body part (65) and slide contact member (67). The main body part is protected by a member resistant to abrasion so as to avoid shaving by the sandblasting treatment, and the slide contact member is made of a material of low hardness so as to avoid injuring of the board to be wrought.

Description

Bulkhead Forming Method and Forming Apparatus {METHOD OF FORMING PARTITION AND APPARATUS THEREFOR}

TECHNICAL FIELD This invention relates to the manufacturing method and manufacturing apparatus of a plasma display panel (henceforth PDP), and especially relates to the formation method of the partition wall of a PDP, and its formation apparatus.

In general, a PDP has a structure in which a plurality of electrodes are provided on two opposing glass substrates, and a gas mainly containing Ne, Xe, or the like is enclosed therebetween. Then, a discharge is generated by applying a voltage between a plurality of electrodes that define the discharge cells to clearly define the boundary, thereby causing each cell to emit light to display.

One substrate of the PDP has an address electrode, a partition, and a phosphor layer to form a back substrate. As a method of forming a partition wall in such a back substrate, a glass paste (partial partition material) is applied to a predetermined thickness on the surface of a dielectric layer covering an address electrode on a glass substrate, dried, and sand blast resistant thereon. A mask having (sandblasting) is formed in a pattern shape. Then, by performing sandblasting through this mask, a method of cutting the barrier rib forming material layer and patterning the desired barrier rib is then fired. In sandblasting, inorganic materials such as glass beads (glass beads), stainless steel, SiC, SiO ₂ , Al ₂ O ₃ , ZrO _2, etc., having a particle diameter of about 2 to 50 μm as cutting materials are used. ) Fine particles are used. In order to prevent occurrence of peeling of resist used for a so-called side cut, tearing of partition walls, reduction of cutting height of partition walls, etc., in which the bottom portion of the partition end is excessively cut. It is known to provide a sand blast treatment by providing an auxiliary mask which forms an auxiliary partition near the end of the partition (for example, see WO2002 / 084689).

[Problems that the invention tries to solve]

However, in such a conventional technique, there is a problem that it is difficult to reliably protect the end portion of the main bulkhead because overcutting of the auxiliary bulkhead cannot be prevented.

[Means for solving the problem]

This invention is a partition wall formation method of the plasma display panel which cuts the part which is not provided with the mask for sandblasting of the partition formation material layer formed on the board | substrate with a cutting material, and forms the partition of desired shape. A sand having a predetermined height extending in the conveying direction of the substrate vertically above the desired portion of the substrate so as to contact the surface of the partition forming material layer or the surface of the substrate and moving in a direction orthogonal to the substrate conveying direction. A partition wall forming method is provided which protects a desired portion of a partition wall forming material layer from cutting of a cutting material injected from a blasting nozzle.

The portion of the protective plate which is in contact with the barrier rib forming material layer or the substrate may be formed of a material having a lower hardness than the substrate.

The cutting action may be controlled by replacing the protective plate with another protective plate having a different width.

Moreover, this invention is a partition forming apparatus which cuts the part which is not provided with the mask for sandblast of the partition formation material layer formed on the board | substrate with a cutting material from another viewpoint, and forms the partition of desired shape. A substrate conveying apparatus for conveying a substrate on which a partition forming material layer and a sandblast mask are provided in a predetermined direction, a sandblast processing nozzle for ejecting cutting material, and a nozzle in the direction perpendicular to the substrate conveying direction. The nozzle conveying apparatus to convey and the desired part of a board | substrate to be conveyed are installed vertically so that the surface of a partition formation material layer or the surface of a board | substrate may contact between the head of a sandblasting process, and a board | substrate, and a board | substrate conveyance direction It is to provide a partition forming apparatus having a protective plate of a predetermined height extending.

The support plate further comprises a support member for supporting the protection plate, wherein the protection plate has a flat, strip-shaped body member, an abrasion resistant member that protects the body member from sandblasting cutting action, and a lower hardness than the substrate. It may be a soldering member which is in contact with the surface of the barrier rib material layer or the substrate surface.

The supporting member may support the protective plate so that the protective plate can be replaced with another protective plate having a different width. The supporting member may support the protective plate so as to be displaceable in the conveying direction of the sandblasting nozzle.

[Effects of the Invention]

According to the present invention, sandblasting is performed in a state in which the protective plate is in vertical contact with a desired portion of the substrate which is susceptible to cutting damage, so that damage caused by the cutting material, peeling of the resist and cracking of the partition wall are reliably prevented. do.

1 is a partial partial perspective view of a PDP according to the present invention.

2 is a cross-sectional view of a substrate to be processed according to the present invention.

3 is a longitudinal sectional view of a sandblast processing chamber according to the present invention.

4 is a cross-sectional view taken along the line I-I of FIG. 3.

5 is a surface view of a protective plate according to the present invention.

6 is a side view of a protective plate according to the present invention.

7 is a cross-sectional view taken along the line II-II of FIG. 6.

8 is a cross-sectional view taken along the line III-III of FIG. 6.

9 is an enlarged view illustrating main parts of FIG. 4.

Fig. 10 is a view corresponding to Fig. 4 showing a modification of the present invention.

Fig. 11 is a view corresponding to Fig. 4 showing another modification of the present invention.

12 is a view corresponding to FIG. 4 showing still another modification of the present invention.

FIG. 13 is a view corresponding to FIG. 4 showing still another modification of the present invention. FIG.

It is explanatory drawing which shows the effect | action of the protective plate of this invention.

[Description of the code]

11, 12 glass substrate

31 bulkhead forming material layer

32 Mask for Sandblast

32a main bulkhead mask

32b Auxiliary Bulkhead Mask

33 Processed Board

34 Bulkhead Forming Area

34a bulkhead forming area

34b bulkhead forming area

50 backplane

50a front panel

51 Processing Room

52 conveying roller

53 Transfer direction of the substrate to be processed

54, 55 Sandblasting Nozzles

54a, 55a Carriers

56 Movement direction of sandblasting head

57 Recovery Device

58-60 frames

61 ~ 64 Shield

65 Body member

66 Abrasion Resistant Member

67 Slide contact member

68, 69 bracket

70 ~ 75 fastening member

76, 77 Long hole

78 Fountains (upward flow)

79 Direct classification (flow of straight fluid)

80 zones

81 Sandblasting nozzle movement direction

EMBODIMENT OF THE INVENTION Hereinafter, this invention is demonstrated in detail using embodiment shown in drawing. This does not limit the present invention.

The PDP to which the present invention is applied is a three-electrode surface discharge type PDP as shown in Fig. 1, and is composed of a pair of substrate assemblies, namely, the back substrate 50 and the front substrate 50a. In the figure, only one pixel is shown.

In the front substrate 50a, on the inner surface of the glass substrate 11, electrodes X and Y extending laterally for causing surface discharge along the substrate surface, display electrode pairs S defining the display rows. Is arranged. The electrodes X and Y are each composed of a wide strip-shaped transparent electrode 41 made of ITO thin film and a narrow strip-shaped bus electrode 42 made of metal thin film. The bus electrode 42 is an auxiliary electrode for ensuring proper conductivity. Dielectric layer 17 is provided to cover electrodes X and Y. The protective film 18 is coated on the surface of the dielectric layer 17. The dielectric layer 17 and the protective film 18 together transmit light.

Next, in the back substrate 50, the address electrode 43 is arranged on the inner surface of the glass substrate 21 in the vertical direction orthogonal to the display electrode pair S, and the dielectric layer covers the address electrode 43. FIG. 25 is provided, and between each address electrode 43 on the dielectric layer 25, one linear rib (bulk) 29 is provided. The rib 29 can also be formed in a lattice shape. In the back substrate 50, the discharge spaces (discharge cells) 30 are divided into subpixels (unit light emitting regions) EU by these ribs 29, and the space dimensions of the discharge spaces 30 are defined. do.

The phosphor layers 28 of three colors R, G, and B are provided for color display so as to cover the cell wall on the rear side including the upper side of the dielectric layer 25 and the side surfaces of the ribs 29. The rib 29 is made of a material mainly composed of low melting glass (glass made of 130 ~ 350 ° C. by adding selenium, thallium, arsenic, sulfur, etc.), and transparent by the type of additive. Or opaque. In addition, as a method of forming the ribs 29, as described later, a step of forming a cutting mask on a low-melting-point glass layer (partition forming material layer) in the form of a beta film and patterning by sandblasting is used.

The display electrode pair S corresponds to one row in the matrix display, and one address electrode A corresponds to one column. Three columns correspond to one pixel (EG). That is, one pixel EG is composed of three subpixels EU of R, G, and B arranged in the line direction. By counter discharge between the address electrode A and the display electrode Y, wall charges are formed in the dielectric layer 17 corresponding to the selected cell to be displayed. When pulses are alternately applied to the display electrodes X and Y, surface discharge (main discharge) occurs in the selected cell in which wall charges are formed. The ultraviolet light generated by the surface discharge excites the phosphor layer 28 to emit visible light of a predetermined color. Among the visible light, light passing through the glass substrate 11 on the front side becomes display light.

Next, the sandblasting process used for manufacture of PDP is demonstrated. In the production of the PDP, a method of patterning a partition by sandblasting is adopted.

First, as shown in FIG. 2, the barrier rib forming material layer 31 is applied by drying a glass paste for barrier ribs on the barrier rib forming region on the glass substrate 21 on which the address electrode 43 and the dielectric layer 25 are formed. To form. Next, after providing the photosensitive resist layer which has a sandblast resistance on the partition formation material layer 31, selectively irradiates an actinic light through a photomask, and it develops continuously, and is used for sandblasting Mask 32 is formed. Thereafter, sandblasting is performed on the glass substrate 21 (hereinafter referred to as the substrate 33 for convenience of explanation) provided with the partition forming material layer 31 and the mask for sand blast resistance 32. Do it. In the sandblasting process, inorganic fine particles such as glass beads, stainless steel, SiC, Al ₂ O ₃ , ZrO ₂ and the like having a particle diameter of about 2 to 50 μm are used as cutting materials.

Next, the partition forming apparatus by sandblasting process is demonstrated. FIG. 3 is a vertical sectional view showing the structure of a partition wall forming apparatus by sandblasting, and FIG. 4 is a sectional view taken along the line I-I of FIG.

As shown in these diagrams, a plurality of conveying rollers 52 are arranged horizontally and parallel to the inside of the processing chamber 51, and the substrate 33 to be processed has the direction of the arrow 53 thereon. It is supposed to be conveyed by. Cutting material injection guns 54 and 55 are disposed above the substrate 33 to be conveyed, and the guns 54 and 55 are respectively conveyed by the conveying devices 54a and 55a. It reciprocates and conveys in the direction of the arrow 56 (FIG. 4), ie, the direction orthogonal to the conveyance direction (arrow 53) of the to-be-processed board | substrate 33. FIG. Further, a recovery device 57 (FIG. 3) is disposed below the transfer roller 52, and the cutting material injected from the cutting material injection guns 54, 55 is recovered, and the cutting material injection guns 54, 55 are disposed. It is returned to the cutting material supply source (not shown), and is recycled.

As shown in FIG. 4, the frames 58, 59, and 60 are provided in the processing chamber 51 in parallel with the conveying roller 52, that is, in the direction of the arrow 56. Then, the band-shaped protective plates 61 and 62 which are flat between the frames 58 and 59 and the band-shaped protective plates 63 and 64 which are flat between the frames 59 and 60 are respectively conveyed directions (arrows) of the substrate 33. (53) direction) is installed in parallel.

5 is a surface view showing the details of the protective plates 61 to 64, FIG. 6 is a side view showing the details of the protective plates 61 to 64, FIG. 7 is a cross-sectional view taken along the line II-II in FIG. 6, and FIG. It is sectional drawing at arrow III-III. As shown in these figures, each of the protective plates 61 to 64 is inserted into the main body member 65 made of a strip-shaped stainless steel sheet having a cutting portion at its upper side and the cutting portion thereof, so that the upper side of the main body member 65 is cut. Abrasion-resistant (sandblast-resistant) member 66 made of ceramic, which covers the upper part and is fixed to the side surface of the main body member 65 by a fastening member (a combination of bolts, nuts and washers) 70 and 71. ). The protective plates 61 to 64 further include a solder joint 67 on the lower side. The soldering member 67 is bonded to the side surface of the main body member 65 using an adhesive or a double-sided adhesive tape. The soldering member 67 protrudes 1 to 2 mm downward from the lower side of the main body member 65, and is soldered (slides in contact with) to the substrate 33 as described later. Therefore, the soldering member 67 is formed of a material whose hardness is lower than that of the substrate 33, for example, polyethylene (film having a thickness of 0.5 mm) so as not to damage the substrate 33.

Each of the protective plates 61 to 64 is supported at the frame 58, 59 or 59, 60 via both brackets 68 and 69. Both ends of the protective plates 61 to 64 and the brackets 68, 69 or 59 and 60 are fastened by fastening members (a combination of bolts, nuts and washers) 72 and 73, respectively, and the brackets 68 and 69. Silver is fastened to the frames 58, 59 or 59, 60 by fastening members (bolts) 74 and 75, respectively. In addition, the brackets 68 and 69 have long holes 76 and 77, respectively, as shown in FIG. 5, and the arrow 56 direction (cutting-off gun) with respect to the frame 58, 59, or 59, 60, respectively. In the direction of movement).

In such a configuration, as shown in Figs. 3 and 4, the protective plates 61 to 64 are set in a desired portion (in this example, in the vicinity of the auxiliary bulkhead) of the substrate 33 to be subjected to cutting damage. When the to-be-processed board | substrate 33 is carried in to the process chamber 51 in the state, the to-be-processed board | substrate 33 is conveyed by the conveyance roller 52 at the constant speed in the direction of the arrow 53. 9 and 10 are surface and side views showing the positional relationship between the substrate 33 to be protected and the protective plates 61, 62 or 63, 64. FIG.

In the partition formation area 34 of the to-be-processed board | substrate 33, the direction of the some principal bulkhead mask 32a and the arrow 53 which were arrange | positioned in parallel in the direction of the arrow 56 (moving direction of a cutting material injection gun). A plurality of auxiliary barrier rib masks 32b arranged in parallel in the conveying direction of the substrate are provided to surround the barrier rib material layer 31. In addition, the auxiliary bulkhead is provided to prevent so-called side cuts in which the bottom portion of the end of the main bulkhead is cut. As shown in FIG. 10, each of the protection plates 61, 62, 63, and 64 has a plastic member 67 extending downward from the lower edge of the main body member 65. It is set so that the surface of the partition formation material layer 31 of ()) may be soldered.

When the substrate 33 to be processed in the processing chamber 51 (FIG. 3) is conveyed along the arrow 53 at a speed of 300 mm / min, for example, the cutting material spray guns 54 and 55. For example, the reciprocating motion while spraying the cutting agent along the arrow 56 is repeated at a speed of 600 mm / sec. Thereby, the partition formation material layer 31 of the to-be-processed board | substrate 33 is cut by a cutting agent, and a partition is formed under the masks 32a and 32b, respectively. At this time, as shown in FIG. 14, since the protective plates 61-64 are upright with respect to the to-be-processed board 33 in the vicinity of the mask 32b for auxiliary partitions, the cutting material injection gun 54 or 55 ) Moves from the position (A) to (B) in the direction of the arrow 81 to approach the protective plates 61 to 64, the cutting material injection of the cutting material spray gun 54 or 55 at the position of (A). Reflecting flows (fountain flows) 78 and the direct flows 79 generated by the cutting material injection of the cutting material injection gun 54 or 55 at the position of (B) And collide with one another in the region 80 to be extinguished. Accordingly, the protective plates 61 to 64 weaken the cutting action of the direct classification 79 with respect to the auxiliary partition wall in the peripheral region 82, and bring about an effect of preventing excessive cutting of the auxiliary partition wall. In addition, since the protective plates 61 to 64 are in contact with the surface of the partition formation material layer of the substrate 33, the surface of the partition formation material layer is changed after changing the direction after colliding with the partition formation material layer of the substrate 33 to be processed. It is possible to stop the movement of the cutting material moving in parallel to the end, so that the auxiliary and the main bulkheads are effectively protected in the cutting action from the cross direction of the cutting material, and there is no damage. Thus, a partition of a desired cross-sectional shape is obtained.

As described above, the protective plates 61 to 64 are disposed vertically in contact with the substrate 33, so that the cutting material ejected from the injection guns 54, 55 is excessive in the desired portion of the substrate 33. It is to prevent the cutting material running in the transverse direction from reflecting from the substrate surface after cutting so as not to touch. Accordingly, the protective plates 61 to 64 are provided so as to correspond to the edges of the partition wall forming region 34 (FIG. 9) of the substrate 33 to be processed.

When the to-be-processed substrate 33 which moves to the fixed protection plates 61-64 contacts, the protection plates 61-64 will contact the surface of the partition formation material layer 31 of the to-be-processed board 33, and a partition There is a risk of damaging the surface of the forming material layer 31. To avoid this, as described above, the protective plates 61 to 64 come into contact with the partition forming material layer 31 of the substrate 33 through a soldering member 67 having a hardness lower than that of the substrate 33. It is supposed to.

The protective plate may be disposed on the surface of the substrate (glass substrate) near the partition forming material layer, that is, in the vicinity of the partition forming material layer.

About protective plates 61-64, it is preferable to prepare two or more types by which width W (FIG. 6) differs, for example in the range of 10-40 mm previously. If the width W, that is, the height from the substrate 33 of the protective plates 61 to 64 is changed in accordance with the shape or type of the partition wall to be formed on the substrate 33, the protective plates 61 to 64. It can control the protection scope and protection action of. At this time, the installation positions of the protective members 61 to 64 can also be displaced in the direction of the arrow 56 by using the long holes 76 and 77 (FIG. 5).

In FIG. 11, in the embodiment shown in FIG. 4, the space | interval of the protection plates 63 and 64 which should respond to the small size panel is narrowed, and the protection part on the to-be-processed board 33 by the protection plates 63 and 64 is shown. The example which changed partially is shown. In addition, in embodiment shown in FIG. 4, the protection plate 61 and 62 are removed, and the example which made it protect by only the protection plate 63 and 64 is shown. FIG. 13 is a modified example of the embodiment shown in FIG. 12, in which the substrate 33 has a so-called multi-faced surface provided with two partition wall forming regions 34a and 34b (in this case, two surfaces). Form). In this example, the protective plates 61 and 62 and the protective plates 63 and 64 are provided between the frames 59 and 60 in correspondence with each of the partition formation regions 34a and 34b. Then, the edge portions (secondary partition walls) of the partition formation regions 34a and 34b are protected from the cutting material injected from the injection gun 55. In this multi-faceted type, the protection plates 62 and 63 are remarkably protected against the lateral cutting action of the cutting material. In the main body member 65 made of stainless steel sheet of the protective plates 61 to 64, the portion directly receiving injection of the cutting material is made of ceramic wear-resistant (sandblast-resistant) member 66 as shown in FIG. Protected). Therefore, the life of the main body member 65 is extended.

Claims (7)

A partition wall forming method of a plasma display panel in which a portion of the partition wall forming material layer formed on a substrate is not provided with a mask for sandblasting is cut by a cutting material to form a partition wall having a desired shape. A sandblasting nozzle which is installed vertically so as to contact the surface of the barrier rib forming material layer or the surface of the substrate, with a protective plate having a predetermined height extending above the desired portion in the conveying direction of the substrate, and moving in a direction perpendicular to the substrate conveying direction. A partition forming method, wherein a desired portion of a partition forming material layer is protected from cutting of a cutting material injected from the cutting material. The method of claim 1, A partition forming method, wherein a portion of the protective plate that is in contact with the partition forming material layer or the substrate is formed of a material having a lower hardness than the substrate. The method according to claim 1 or 2, A partition forming method, characterized in that the cutting action is controlled by replacing the protective plate with another protective plate having a different width. In the partition type growth value which forms the partition of desired shape by cutting with the cutting material the part which is not provided with the mask for sandblasting of the partition formation material layer formed on the board | substrate, a partition formation material layer and sand-resistant A substrate conveying apparatus for conveying a substrate provided with a blast mask in a predetermined direction, a sandblasting nozzle for ejecting cutting material, a nozzle conveying apparatus for conveying the nozzle in a direction orthogonal to the substrate conveying direction, and conveying In the desired portion of the substrate to be provided, the sandblasting head and the substrate are vertically provided so as to contact the surface of the barrier formation material layer or the surface of the substrate, and have a protective plate of a predetermined height extending in the conveying direction of the substrate. Partition wall forming apparatus, characterized in that. The method of claim 4, wherein And a support member for supporting the protection plate, wherein the protection plate includes a flat and band-shaped body member, an abrasion resistant member for protecting the body member from the sandblasting cutting action, and a barrier forming material layer having a lower hardness than the substrate. A partition forming apparatus, comprising a soldering member in contact with a surface or a substrate surface. The method of claim 5, The support member is a partition forming apparatus, characterized in that for supporting the protective plate so as to be interchangeable with other protective plates of different widths. The method of claim 5, The support member is a partition forming apparatus, characterized in that for supporting the protective plate so as to be displaceable in the conveying direction of the sandblasting nozzle.

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