WO2008018526A1 - Procédé de vérification des soudures, procédé de soudage, et appareil de soudage - Google Patents

Procédé de vérification des soudures, procédé de soudage, et appareil de soudage Download PDF

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Publication number
WO2008018526A1
WO2008018526A1 PCT/JP2007/065580 JP2007065580W WO2008018526A1 WO 2008018526 A1 WO2008018526 A1 WO 2008018526A1 JP 2007065580 W JP2007065580 W JP 2007065580W WO 2008018526 A1 WO2008018526 A1 WO 2008018526A1
Authority
WO
WIPO (PCT)
Prior art keywords
solder
soldering
image data
light
wavelength
Prior art date
Application number
PCT/JP2007/065580
Other languages
English (en)
Japanese (ja)
Inventor
Yoshiomi Munesawa
Seiichi Kitano
Tsuyoshi Kobayashi
Original Assignee
National University Corporation Okayama University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National University Corporation Okayama University filed Critical National University Corporation Okayama University
Priority to CN2007800298983A priority Critical patent/CN101501444B/zh
Publication of WO2008018526A1 publication Critical patent/WO2008018526A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/28—Measuring arrangements characterised by the use of optical techniques for measuring areas
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B23K3/047—Heating appliances electric
    • B23K3/0478—Heating appliances electric comprising means for controlling or selecting the temperature or power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/163—Monitoring a manufacturing process

Definitions

  • Soldering inspection method soldering method, and soldering apparatus
  • the present invention relates to a soldering inspection method, a soldering method, and a soldering apparatus, and in particular, automatically supplies solder to a solder melting means such as a soldering iron that melts solder.
  • a soldering inspection method, a soldering method, and a soldering apparatus that can automatically perform soldering.
  • a member that is always subjected to stress such as an electrode body in contact with a battery electrode, is bonded to the mounting substrate, or a so-called power electronics component used at high power is bonded to the mounting substrate.
  • solder is fed while supplying thread solder that has been processed into a thread shape. It had to be soldered while being raised into a mountain shape by melting.
  • the soldering state is monitored in real time by the infrared sensor, the soldering state is detected by a CCD camera (hereinafter simply referred to as a CCD camera) using a silicon photodiode array as an image sensor.
  • a CCD camera hereinafter simply referred to as a CCD camera
  • silicon photodiode array as an image sensor.
  • soldering state is monitored with a CCD camera
  • at least first image data and second image data are generated by photographing the soldering state with a predetermined time difference, and this first
  • the difference image data By generating the difference image data by taking the difference between the first image data and the second image data, the soldering iron melts between the first image data generation timing and the second image data generation timing.
  • the amount of solder that has been detected can be detected, and the soldering state can be monitored based on the detected amount of solder.
  • solder melted by a solder melting means such as a soldering iron generally has a spherical shape due to its extremely high surface tension. Therefore, when the melted solder is photographed with a CCD camera, The surface of the melted solder that is in front of the camera becomes a plane that can be regarded as a flat surface, and even if the solder is further melted, the surface change has become extremely small.
  • the portion of the surface that can be regarded as approximately a flat surface is extracted in the differential processing for generating the differential image data because no change with time is seen like the substrate portion other than the soldering region.
  • the solder specified by the difference image data cannot be This shows all the solder melted by the field melting means! / ,!
  • the CCD camera cannot accurately detect the solder melted by the solder melting means, so the soldering state cannot be completely monitored! /, And! / was there.
  • the present inventor has conducted research and development to perform soldering while reliably monitoring the soldering state even in the case of soldering using lead-free solder, thereby forming the present invention. Has been reached.
  • soldering inspection method of the present invention in the soldering inspection method in which the solder melting means for melting the solder is disposed in a soldering area where soldering is performed and the solder is supplied to the solder melting means.
  • solder melting is performed in the soldering method of the present invention.
  • the step of sequentially shooting the solder melted by the means at a predetermined timing with a camera and sequentially generating image data reflected from the solder and having a longer wavelength than red, and the timing of shooting among the image data At least two different images
  • the difference image data is sequentially generated by taking the difference of the data, the difference image data is sequentially superimposed and synthesized to generate the synthesized image data, and the solder in the soldering area of the synthesized image data
  • the solder is supplied to the solder melting means in the soldering apparatus for soldering the component to a predetermined position of the substrate by melting the solder with the solder melting means for melting the solder.
  • the generation timing of the image data differs from the solder supply device and the camera that sequentially generates image data of light having a longer wavelength than red, reflected from the solder melted by the solder melting means, at a predetermined timing.
  • Difference image data is sequentially generated by taking a difference between at least two pieces of image data, and the generated difference image data is sequentially superimposed on each other to be combined to generate combined image data.
  • a control unit for detecting the area of the solder melted by the melting means is provided.
  • soldering apparatus of the present invention is also characterized by the following points. That is,
  • the wavelength of light having a longer wavelength than red is in the range of 670 to UOOnm.
  • Light shielding means force S at least a cover body covering the substrate and camera
  • a light source for projecting light having a wavelength longer than that of red toward the solder melted by the solder melting means is provided.
  • the solder melting means is a soldering iron.
  • the solder melting means is a focused laser beam spot.
  • the laser beam spot is formed by the output light of the laser diode.
  • the light source is a laser diode or a light emitting diode.
  • the wavelength of the light projected from the light source is the output light of the laser diode as the solder melting means. If it is longer than the wavelength of this output light.
  • the wavelength of the light emitted from the light source is shorter than the wavelength of the output light when the solder melting means is the output light of the laser diode.
  • image data is generated by sequentially photographing the solder melted by the solder melting means for melting the solder in the soldering region at a predetermined timing with a camera, and at least two image data having different photographing timings.
  • the difference image data is sequentially generated by taking the difference between the generated difference image data, and the generated difference image data is sequentially superimposed and combined to generate composite image data.
  • the difference image data is generated. Undetected solder that occurs during data generation can be supplemented with other differential image data, and the area of the solder can be reliably detected from the composite image data.
  • the camera generates image data using light having a wavelength longer than that of the red color reflected from the solder melted by the solder melting means, so that smoke generated during soldering is reflected in an image photographed by the camera. It is possible to generate image data obtained by accurately photographing the solder melted by the solder melting means that cannot be inserted.
  • FIG. 1 is an explanatory diagram of a method for detecting the area of solder.
  • FIG. 2 is a schematic explanatory diagram of the soldering apparatus of the first embodiment.
  • FIG. 3 is a flowchart of a soldering process by the soldering apparatus of the first embodiment.
  • FIG. 4 is a schematic explanatory diagram of a soldering apparatus according to a second embodiment.
  • the soldering inspection method, soldering method, and soldering apparatus of the present invention are soldered using a relatively inexpensive imaging device such as a CCD camera rather than an expensive infrared sensor!
  • a relatively inexpensive imaging device such as a CCD camera rather than an expensive infrared sensor!
  • an imaging device using a semiconductor imaging device consisting of a silicon photodiode, such as a CCD camera or CMOS camera is simply referred to as a “camera”.
  • the camera is capable of detecting light in the infrared region, and an image is obtained by light having a wavelength longer than that of red reflected from solder melted by a solder melting means such as a soldering iron or a laser beam spot.
  • a solder melting means such as a soldering iron or a laser beam spot. The data is being generated.
  • the smoke generated during soldering is composed of particles having a particle size distribution centered around 300 nm due to the performance of the dust collection filter provided in the duct provided for the removal of the smoke. It is inferred that Particles of this size cause light scattering called so-called mi-scattering in the visible light wavelength range, and appear as whitish smoke with scattering. It is what.
  • soldering in soldering, a surface tension acting on the solder melted by the solder melting means. Since the melted solder tends to spheroidize due to the force, the amount of solder can be estimated from a two-dimensional image of the solder obtained by photographing the solder melted by the solder melting means with a camera. . Therefore, the soldering apparatus only needs to monitor the solder melted by the solder melting means with the camera.
  • the first image data is obtained by photographing the state before the supply of solder to the solder melting means with the camera. Then, the supply of solder to the solder melting means is started, and a state in which a predetermined amount of solder is melted is photographed with a camera to generate second image data.
  • the first image data and the second image data Difference image data is generated by taking the difference between and the amount of solder that is detected from the difference image data.
  • the soldering iron or the soldering means that is the solder melting means in the first image data is soldered There is a risk of errors due to the influence of leads and the like.
  • image data composed of an image in a state before starting the supply of solder to the solder melting means is used as the first image data. Is not suitable.
  • the present inventor sequentially generates image data with a camera while performing soldering, and at the same time, the difference between at least two image data having different shooting timings among the generated image data.
  • the difference image data? & 13 Pd is generated sequentially, and these difference image data Pa, Pb, Pc, Pd are sequentially superimposed on each other.
  • the synthesized image data Pe is generated as shown in FIG.
  • difference image data? & 13 (By combining 1 and generating composite image data? 6, the undetected area L can be eliminated with other difference image data, and by using the composite image data Pe, solder melting is performed. The amount of solder melted by the means can be accurately detected.
  • FIG. 2 is a schematic diagram of the soldering apparatus A1 according to the first embodiment.
  • the power to explain the solder melting means as a general soldering iron.
  • solder melting means using a laser light source such as a laser diode is also known, and a laser light source is provided instead of the soldering iron.
  • Any solder melting means that can sequentially melt the supplied solder using a solder melting device may be used.
  • the base 10 provided with the mounting portion 11 on which the mounting substrate 20 on which the required electronic components 21 are temporarily mounted is mounted, and the mounting substrate 20 is soldered to be soldered.
  • a solder supplier 17 as supply means, and a control unit 18 for controlling the solder supplier 17 and analyzing the output signal of the camera 13 are provided.
  • 19 is a guide body that guides the yarn solder 16 toward the soldering iron 15.
  • the soldering apparatus A1 is provided with a transfer device that transfers the mounting board 20 to the mounting unit 11 and transfers the mounting board 20 that has undergone the soldering process to a subsequent process.
  • the transfer device is provided with a rectangular lift body (not shown) that moves in the transfer direction and can be moved up and down.
  • the lift body has a tip that contacts the mounting substrate 20 from below.
  • a plurality of support columns (not shown) are provided in contact with each other.
  • the mounting substrate 20 is placed on the placement unit 11 by transferring the substrate 20 to the placement unit 11 and lowering the lifting body. With the same transfer device, the mounting substrate 20 of the mounting portion 11 can be transferred to a subsequent process.
  • the mounting portion 11 includes a plurality of pillars 11a projectingly contacting the upper surface of the base 10, and the mounting bodies 20 are placed in a horizontal state by arranging the pillars 11a at predetermined intervals. Can be supported.
  • a CCD camera capable of photographing in the infrared region is used.
  • This CCD camera can use what is generally used as a surveillance camera, for example.
  • an infrared cut filter may be built in depending on the case. It is desirable to remove this infrared cut filter before use.
  • the camera 13 is equipped with a filter F that transmits only light having a longer wavelength than red.
  • the filter F is preferably a filter that blocks light outside the wavelength range of 670 to UOOnm and transmits light with a wavelength of 670 to 1100 nm, and is preferably the highest in the infrared light range of 800 to 900 nm. It is desirable to use a filter that has transmittance. This filter F prevents light in the visible light range from entering the image sensor of the camera 13, and suppresses the reflection of smoke generated during soldering!
  • the light 14 is provided to increase the amount of reflected light composed of light having a longer wavelength than that of the red color from the solder melted by the soldering iron 15.
  • the light 14 has a longer wavelength than that of the red light.
  • the one that irradiates is used.
  • the light 14 is preferably irradiated with light having a wavelength longer than 600 nm, and more preferably irradiated with light having a wavelength of about 800 to 900 nm. Even if the light 14 is not irradiated, the light 14 is not necessarily provided if the amount of light reflected from the solder by light having a longer wavelength than red is sufficiently large.
  • a light of a special light source it is not necessary to use a light of a special light source.
  • a continuous spectrum light such as a tungsten lamp, a halogen lamp, or sunlight
  • the light amount of the infrared component is simply increased.
  • the light 14 may be used as a state in which the ratio of the infrared component is increased by using it below the rated current.
  • the solder melting means is a solder melting means using a laser light source
  • halation is caused by the laser light spot melting the solder and the light emitted from the light 14, and the camera 13 It may be difficult to generate appropriate image data.
  • the light 14 is irradiated with 780 nm light using a GaAlAs laser diode, or GaAs It is desirable to irradiate light of 800 to 900nm using a system diode.
  • a light emitting diode such as GaAs or GalnAs is used for the light 14. 850 ⁇ ; It is desirable to irradiate UOOnm light.
  • the light 14 serving as the light source can prevent the occurrence of halation by irradiating light having a wavelength different from that of the output light of the laser light source of the solder melting means.
  • the wavelength of light emitted from the light 14 may be as short as possible only when it is longer than the wavelength of the output light of the laser light source. desirable.
  • an appropriate light shielding body such as a filter or a polarizing plate that can shield light other than the wavelength 670 to light other than UOOnm as much as possible or completely is used. And solder that is the subject.
  • the camera 13 and the light 14 are arranged apart from the position immediately above the placement unit 11 instead of being arranged at a position directly above the placement unit 11. It is desirable not to hit light 14. Further, since the camera 13 needs to photograph the solder melted by the soldering iron 15, it is disposed at an obliquely upper position of the mounting portion 11.
  • the light 14 is attached to the camera 13 and arranged as close to the camera 13 as possible. Therefore, the light 14 can be easily arranged, and the force lens 13 can easily obtain a strong reflected light from the solder, so that the camera 13 can reliably photograph the solder.
  • the soldering iron 15 is mounted on a lifting device (not shown) so that the soldering iron 15 can be raised and lowered.
  • the soldering iron 15 is lowered after the mounting board 20 is placed on the placing portion 11, so that the supplied thread solder can be melted. Yes.
  • the lifting device may be provided with moving means in the X and Y directions so that the position of the soldering iron 15 can be moved appropriately.
  • the substrate 20 may be moved as appropriate using an XY table or the like.
  • the solder supplier 17 can feed the thread solder 16 processed into a thread shape by a predetermined amount at a predetermined timing.
  • the thread solder 16 fed out from the solder feeder 17 is placed in the guide body 19 and fed to the soldering iron 15 at the joint.
  • the control unit 18 can execute an appropriate program.
  • the control unit 18 is composed of a personal computer, analyzes the output signal of the camera 13, and finishes the feeding of the thread solder 16 from the solder supplier 17. The timing is detected, and a control signal for stopping the operation of the solder supplier 17 is output in accordance with the detection of the end timing.
  • the mounting board 20 is transferred and placed on the placement unit 11 (step S).
  • step S2 1) Light having a longer wavelength than red is irradiated onto the soldering region of the mounting board 20 with the light 14 as the light source (step S2).
  • step S3 supply of the thread solder 16 is started by the solder supplier 17 (step S3), and photographing of the soldering area by the camera 13 is started (step S4).
  • smoke S is generated due to soldering S, and shooting using light having a wavelength longer than red, suppresses smoke from appearing in the image taken by camera 13. Use the power S to obtain clear images.
  • the camera 13 sequentially photographs the soldering area at a predetermined timing, and inputs an output signal to the control unit 18 of the soldering apparatus A1.
  • the control unit 18 sequentially generates image data from the input output signal of the camera 13. Further, the control unit 18 takes the difference between the first image data generated from the output signal of the camera 13 and the second image data whose shooting timing is later than the first image data. (Step S5).
  • the first image data and the second image data have different shooting timings, so that only the solder shape in the soldering area is different.
  • the change in the solder shape is extracted.
  • the Rukoto In the difference image data of the present embodiment, the area where the difference value between the first image data and the second image data is smaller than a predetermined threshold is “0”, and the area above the threshold is “1”. Yes.
  • the control unit 18 sets the image data provided for temporarily storing the image data.
  • the stored stored image data is read from the data memory (step S6).
  • the stored image data is composite image data generated by superposing and combining the difference image data as will be described later.
  • the image data memory stores image data that is “0” in all areas as a default!
  • the control unit 18 performs a logical OR process on the difference image data generated from the first image data and the second image data and the saved image data (synthesized image data) read from the image data memory.
  • the composition is performed by superimposing the difference image data to generate new composite image data (step S7).
  • control unit 18 detects the area of the solder melted by the soldering iron 15 in the soldering area from the composite image data (step S8). Specifically, “1” areas in the combined difference image are counted.
  • the control unit 18 compares the detected solder area with a preset end condition threshold (step S9), and when the detected solder area is smaller than the end condition threshold (step S9).
  • step S9: NO the composite image data generated in step S7 is stored in the image data memory (step S10), the process returns to step S5, and the previous second image data and the second image data are used. Also, the difference image data is generated from the third image data whose shooting timing is later, and new difference image data is generated.
  • control unit 18 combines the difference image data with the stored image data (synthesized image data) stored in the image data memory read out in step S6, thereby generating new synthesized image data. (Step S7), the solder area is detected from this composite image data.
  • control unit 18 sequentially generates the difference image data, and sequentially generates the combined image data by synthesizing the generated difference image data, so that the soldering iron 15 in the soldering area 15 Control that stops the operation of the solder feeder 17 when the area of the melted solder can be detected correctly and the solder area becomes larger than the preset threshold value of the end condition in step S9 (step S9: YES).
  • a signal is being output (step Sll).
  • Step SI 2 the mounting substrate 20 is removed from the mounting portion 11, and the process proceeds to a subsequent process.
  • the camera 13 equipped with the filter F that transmits only light having a wavelength longer than red is used to photograph the solder melted by the soldering iron 15.
  • the state of solder can be monitored, and by detecting the area of the solder based on composite image data generated by overlaying difference image data, Solder can be detected with high accuracy.
  • soldering apparatus A1 of the present embodiment it is possible to perform soldering with the minimum necessary solder, and to shorten the soldering work time.
  • the soldering apparatus A1 of the present embodiment can detect the soldering abnormality by detecting the solder with high precision, it also serves as an inspection apparatus, and the soldering part after soldering The inspection process can be eliminated, and the manufacturing cost can be reduced by shortening the manufacturing process.
  • the detection of the soldering abnormality at the time of soldering may be a shape abnormality detected from an image photographed by the camera 13, or the feeding time of the thread solder 16 by the solder feeder 17. It is possible to determine that an abnormality has occurred when this feeding time exceeds a predetermined time. In the present invention, a state in which such an abnormality has not occurred is regarded as a state in which correct soldering is performed.
  • FIG. 4 is a schematic diagram of a soldering apparatus A2 according to the second embodiment.
  • the cover that covers the mounting substrate 20 mounted on the mounting portion 11 that does not mount the filter F on the camera 13 like the soldering apparatus A1 of the first embodiment.
  • the body 12 is provided.
  • the configuration is the same as that of the soldering apparatus A1 of the first embodiment except that a cover body 12 is provided instead of the filter F, and the same reference numerals are used for the same parts as the soldering apparatus A1 of the first embodiment. Detailed description will be omitted.
  • the cover body 12 is composed of a sheet-like filter that transmits only light having a wavelength longer than that of red.
  • a cover formed in a box shape with a transparent acrylic plate is longer than red.
  • a sheet-like filter that transmits only light having a wavelength was pasted and formed.
  • the sheet-shaped finerator is preferably one that has the highest transmittance in the infrared light region of 800 to 900 nm.
  • the cover body 12 is large enough to cover not only the mounting substrate 20 placed on the placement portion 11 but also the camera 13.
  • the solder supply device 17 and, in some cases, the control unit 18 may be covered with the cover body 12.
  • the light that passes through the cover body 12 and is incident on the cover body 12 is converted into light having a wavelength longer than that of red, and then a soldering iron.
  • the reflected light from the solder melted by 15 can be made light having a longer wavelength than red. As a result, it is possible to suppress the reflection of smoke generated by soldering when the solder is photographed by the camera 13, and to reliably photograph the solder.
  • a light 14 that irradiates light having a wavelength longer than red is provided in the cover body 12, and the amount of light that passes through the cover body 12 and enters the cover body 12 is not sufficient.
  • the light emitted from the light 14 is used to ensure that the camera 13 can photograph the solder.
  • the light 14 is preferably irradiated with light having a wavelength longer than 600 nm, and is preferably irradiated with light having a wavelength of about 800 to 900 nm.
  • the cover body 12 is not necessarily required to transmit light having a wavelength longer than that of red, and the cover body 12 is integrated with a light shielding plate that completely shields light. May be configured.
  • the camera 13 has at least a filter for cutting light with a wavelength of 670 to UOOnm and necessary. It is desirable to install a light shielding body such as a polarizing plate according to the conditions.
  • the cover body 12 can be moved up and down by a lifting device (not shown).
  • a lifting device not shown.
  • the cover body 12 is retracted upward to transfer the mounting board 20.
  • the cover 12 is lowered to cover the mounting board 20 during soldering.
  • the present invention is not limited to the case where an elevating device is provided in the cover body 12.
  • a feeding opening (not shown) for introducing the mounting substrate 20 into the cover body 12 in a part of the wall surface of the cover body 12.
  • a delivery opening (not shown) for delivering the mounting board 20 after soldering to the outside of the cover body 12 may be provided so that the mounting board 20 can be taken in and out of the cover body 12. .
  • the cover body 12 is provided with an exhaust device such as an exhaust fan (not shown) to prevent the smoke generated by soldering from filling the cover body 12. Better Yes.
  • an exhaust device such as an exhaust fan (not shown) to prevent the smoke generated by soldering from filling the cover body 12. Better Yes.
  • soldering device A1 of the first embodiment is used. It is desirable to use the finoleta F.
  • the filter F and the cover body 12 are used in combination, and the cover body 12 suppresses extraneous light from entering the soldering area while ensuring a certain degree of visibility, and the filter F is longer than red.
  • the light blocking effect by the filter F may be improved by making light in a wavelength band incident on the image sensor of the camera 13.
  • soldering inspection method, soldering method, and soldering apparatus of the present invention can reliably monitor the solder in the soldering area without using an expensive infrared sensor, and can be a low-cost soldering inspection method.
  • a soldering method and a soldering apparatus can be provided.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un procédé de vérification des soudures qui est exécuté tout en détectant avec précision une soudure fondue par des moyens de fusion de la soudure tels qu'un fer à souder. Un procédé de soudage et un appareil de soudage sont également fournis. Dans un procédé de soudage et un appareil de soudage pour exécuter une soudure en fournissant de la soudure aux moyens de fusion de la soudure, tels qu'un fer à souder disposé dans une région de soudage, la soudure fondue par les moyens de fusion de la soudure est photographiée séquentiellement au moyen d'un appareil-photo selon une synchronisation prédéterminée, des données d'images sont produites par une lumière qui est réfléchie par la soudure et présente une longueur d'onde plus longue que celle du rouge, des données d'images différentielles sont produites séquentiellement en prenant la différence d'au moins deux données d'image prises selon une synchronisation de prises de vue différente, des données d'images composées sont produites en composant les données d'images différentielles par superposition séquentielle, la zone de la soudure dans la zone de soudage des données d'images composées est détectée et, ensuite, la quantité de soudure fournie aux moyens de fusion de la soudure est détectée à partir de la surface de la soudure.
PCT/JP2007/065580 2006-08-11 2007-08-09 Procédé de vérification des soudures, procédé de soudage, et appareil de soudage WO2008018526A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2007800298983A CN101501444B (zh) 2006-08-11 2007-08-09 焊接检查方法、焊接方法、以及焊接装置

Applications Claiming Priority (2)

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JP2006220723A JP3962782B1 (ja) 2006-08-11 2006-08-11 半田付けの検査方法、半田接合方法、及び半田接合装置
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