WO2008005773A3 - outil multiposte pour un traitement frontal avancé - Google Patents

outil multiposte pour un traitement frontal avancé Download PDF

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Publication number
WO2008005773A3
WO2008005773A3 PCT/US2007/072264 US2007072264W WO2008005773A3 WO 2008005773 A3 WO2008005773 A3 WO 2008005773A3 US 2007072264 W US2007072264 W US 2007072264W WO 2008005773 A3 WO2008005773 A3 WO 2008005773A3
Authority
WO
WIPO (PCT)
Prior art keywords
utilized
generally provide
end processing
cluster tool
reduce
Prior art date
Application number
PCT/US2007/072264
Other languages
English (en)
Other versions
WO2008005773A2 (fr
Inventor
Randhir Thakur
Arkadii Samoilov
Per-Ove Hansson
Original Assignee
Applied Materials Inc
Randhir Thakur
Arkadii Samoilov
Per-Ove Hansson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/460,864 external-priority patent/US20070134821A1/en
Application filed by Applied Materials Inc, Randhir Thakur, Arkadii Samoilov, Per-Ove Hansson filed Critical Applied Materials Inc
Priority to EP07812383A priority Critical patent/EP2041774A2/fr
Priority to JP2009518542A priority patent/JP2009543355A/ja
Publication of WO2008005773A2 publication Critical patent/WO2008005773A2/fr
Publication of WO2008005773A3 publication Critical patent/WO2008005773A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

L'invention concerne un appareil et un procédé pour traiter des substrats à l'aide d'un système de traitement à chambres multiples qui est adapté pour traiter des substrats et analyser les résultats des processus réalisés sur le substrat. Dans un aspect de l'invention, une ou plusieurs étapes d'analyse et/ou étapes de pré-nettoyage sont utilisées pour réduire l'effet du temps d'attente sur le rendement du dispositif. Dans un aspect de l'invention, un dispositif de commande de système et ladite ou lesdites chambres d'analyse sont utilisés pour surveiller et commander une recette de chambre de processus et/ou une séquence de processus afin de réduire les débris de substrat dûs à des défauts dans le dispositif formé et les problèmes de variabilité de performance du dispositif. Des modes de réalisation de la présente invention concernent aussi généralement des procédés et un système pour former de manière répétitive et fiable des dispositifs à semi-conducteurs utilisés dans un grand nombre d'applications.
PCT/US2007/072264 2006-07-03 2007-06-27 outil multiposte pour un traitement frontal avancé WO2008005773A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP07812383A EP2041774A2 (fr) 2006-07-03 2007-06-27 Outil multiposte pour un traitement frontal avance
JP2009518542A JP2009543355A (ja) 2006-07-03 2007-06-27 進歩型フロントエンド処理のためのクラスターツール

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US80651806P 2006-07-03 2006-07-03
US60/806,518 2006-07-03
US11/460,864 US20070134821A1 (en) 2004-11-22 2006-07-28 Cluster tool for advanced front-end processing
US11/460,864 2006-07-28

Publications (2)

Publication Number Publication Date
WO2008005773A2 WO2008005773A2 (fr) 2008-01-10
WO2008005773A3 true WO2008005773A3 (fr) 2008-02-28

Family

ID=38895329

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/072264 WO2008005773A2 (fr) 2006-07-03 2007-06-27 outil multiposte pour un traitement frontal avancé

Country Status (5)

Country Link
EP (1) EP2041774A2 (fr)
JP (1) JP2009543355A (fr)
KR (1) KR20090035578A (fr)
TW (1) TW200811916A (fr)
WO (1) WO2008005773A2 (fr)

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US7838431B2 (en) * 2008-06-14 2010-11-23 Applied Materials, Inc. Method for surface treatment of semiconductor substrates
US7964858B2 (en) 2008-10-21 2011-06-21 Applied Materials, Inc. Ultraviolet reflector with coolant gas holes and method
US20120118227A1 (en) * 2009-08-13 2012-05-17 Kim Nam Jin Apparatus for forming layer
US8999798B2 (en) * 2009-12-17 2015-04-07 Applied Materials, Inc. Methods for forming NMOS EPI layers
US9076827B2 (en) 2010-09-14 2015-07-07 Applied Materials, Inc. Transfer chamber metrology for improved device yield
US9653340B2 (en) 2011-05-31 2017-05-16 Veeco Instruments Inc. Heated wafer carrier profiling
KR102317822B1 (ko) * 2012-07-02 2021-10-25 어플라이드 머티어리얼스, 인코포레이티드 물리 기상 증착에 의한 알루미늄-질화물 버퍼 및 활성 층들
KR102374689B1 (ko) * 2012-08-08 2022-03-14 어플라이드 머티어리얼스, 인코포레이티드 링크된 진공 프로세싱 툴들 및 그 사용 방법들
KR101463984B1 (ko) * 2013-02-15 2014-11-26 최대규 플라즈마 처리 시스템
US9627608B2 (en) * 2014-09-11 2017-04-18 Lam Research Corporation Dielectric repair for emerging memory devices
US9624578B2 (en) * 2014-09-30 2017-04-18 Lam Research Corporation Method for RF compensation in plasma assisted atomic layer deposition
US20160240405A1 (en) * 2015-02-12 2016-08-18 Applied Materials, Inc. Stand alone anneal system for semiconductor wafers
TWI677046B (zh) * 2015-04-23 2019-11-11 美商應用材料股份有限公司 半導體處理系統中的外部基板材旋轉
US10879177B2 (en) * 2015-06-19 2020-12-29 Applied Materials, Inc. PVD deposition and anneal of multi-layer metal-dielectric film
JP6441499B2 (ja) * 2015-10-28 2018-12-19 東京エレクトロン株式会社 基板処理方法、基板処理装置、基板処理システム及び記憶媒体
CN108352300B (zh) * 2015-11-13 2022-03-29 应用材料股份有限公司 半导体装置处理方法、系统及设备
WO2018052479A1 (fr) * 2016-09-15 2018-03-22 Applied Materials, Inc. Système intégré pour processus semi-conducteur
TWI700750B (zh) * 2017-01-24 2020-08-01 美商應用材料股份有限公司 用於介電薄膜的選擇性沉積之方法及設備
JP7158133B2 (ja) * 2017-03-03 2022-10-21 アプライド マテリアルズ インコーポレイテッド 雰囲気が制御された移送モジュール及び処理システム
US11673170B2 (en) 2017-04-28 2023-06-13 Applied Materials, Inc. Method for cleaning a vacuum system used in the manufacture of OLED devices, method for vacuum deposition on a substrate to manufacture OLED devices, and apparatus for vacuum deposition on a substrate to manufacture OLED devices
US10697059B2 (en) 2017-09-15 2020-06-30 Lam Research Corporation Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching
KR102434943B1 (ko) * 2017-09-20 2022-08-23 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램
WO2019182913A1 (fr) * 2018-03-20 2019-09-26 Tokyo Electron Limited Plate-forme hétérogène auto-sensible et de correction incorporant des modules intégrés de traitement de semi-conducteur et son procédé d'utilisation
JP7295359B2 (ja) * 2018-03-20 2023-06-21 東京エレクトロン株式会社 統合的な計測を伴う基板処理ツール並びに使用方法
CN112106182A (zh) * 2018-03-20 2020-12-18 东京毅力科创株式会社 结合有集成半导体加工模块的自感知校正异构平台及其使用方法
JP7443250B2 (ja) * 2018-05-16 2024-03-05 アプライド マテリアルズ インコーポレイテッド 原子層自己整合基板の処理及び統合型ツールセット
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CN111507076B (zh) * 2019-01-29 2022-07-05 北京新唐思创教育科技有限公司 一种用于教学系统的共案课件制作方法、装置和终端
JP7206961B2 (ja) * 2019-01-30 2023-01-18 日立金属株式会社 半導体製造装置の管理システム及びその方法
KR20220041358A (ko) * 2020-09-25 2022-04-01 에스케이하이닉스 주식회사 반도체장치 및 그 제조 방법
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JP7485729B2 (ja) * 2021-07-07 2024-05-16 アプライド マテリアルズ インコーポレイテッド エピタキシャル成長のための統合湿式洗浄
JP7478776B2 (ja) * 2021-07-07 2024-05-07 アプライド マテリアルズ インコーポレイテッド ゲートスタック形成のための統合湿式洗浄
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KR102418530B1 (ko) * 2021-10-12 2022-07-07 주식회사 바코솔루션 반도체 기판 처리 장치
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US20060021702A1 (en) * 2004-07-29 2006-02-02 Ajay Kumar Cluster tool and method for process integration in manufacture of a gate structure of a field effect transistor

Also Published As

Publication number Publication date
KR20090035578A (ko) 2009-04-09
TW200811916A (en) 2008-03-01
JP2009543355A (ja) 2009-12-03
WO2008005773A2 (fr) 2008-01-10
EP2041774A2 (fr) 2009-04-01

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