DE60219034D1 - Vorrichtungen zum abtrennen von substraten und zugehörige verfahren - Google Patents

Vorrichtungen zum abtrennen von substraten und zugehörige verfahren

Info

Publication number
DE60219034D1
DE60219034D1 DE60219034T DE60219034T DE60219034D1 DE 60219034 D1 DE60219034 D1 DE 60219034D1 DE 60219034 T DE60219034 T DE 60219034T DE 60219034 T DE60219034 T DE 60219034T DE 60219034 D1 DE60219034 D1 DE 60219034D1
Authority
DE
Germany
Prior art keywords
substrate
wafers
apart
clamping
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60219034T
Other languages
English (en)
Other versions
DE60219034T2 (de
Inventor
Thierry Barge
Walter Schwarzenbach
Jean-Marc Waechter
Thuan Truong
Bruno Ghyselen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Soitec SA
Original Assignee
Soitec SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soitec SA filed Critical Soitec SA
Publication of DE60219034D1 publication Critical patent/DE60219034D1/de
Application granted granted Critical
Publication of DE60219034T2 publication Critical patent/DE60219034T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/32—Methods and apparatus specially adapted for working materials which can easily be split, e.g. mica, slate, schist
    • B28D1/322—Splitting of the working materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/10—Methods
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T225/00—Severing by tearing or breaking
    • Y10T225/30—Breaking or tearing apparatus
    • Y10T225/371—Movable breaking tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0476—Including stacking of plural workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE60219034T 2001-08-07 2002-07-24 Vorrichtungen zum abtrennen von substraten und zugehörige verfahren Expired - Lifetime DE60219034T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0110537 2001-08-07
FR0110537A FR2828428B1 (fr) 2001-08-07 2001-08-07 Dispositif de decollement de substrats et procede associe
PCT/FR2002/002646 WO2003013815A1 (fr) 2001-08-07 2002-07-24 Dispositif de decollement de substrats et procede associe

Publications (2)

Publication Number Publication Date
DE60219034D1 true DE60219034D1 (de) 2007-05-03
DE60219034T2 DE60219034T2 (de) 2007-12-13

Family

ID=8866341

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60219034T Expired - Lifetime DE60219034T2 (de) 2001-08-07 2002-07-24 Vorrichtungen zum abtrennen von substraten und zugehörige verfahren

Country Status (9)

Country Link
US (2) US7017570B2 (de)
EP (1) EP1423244B9 (de)
JP (1) JP4509555B2 (de)
KR (1) KR100784579B1 (de)
CN (1) CN1329949C (de)
AT (1) ATE357323T1 (de)
DE (1) DE60219034T2 (de)
FR (1) FR2828428B1 (de)
WO (1) WO2003013815A1 (de)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2773261B1 (fr) 1997-12-30 2000-01-28 Commissariat Energie Atomique Procede pour le transfert d'un film mince comportant une etape de creation d'inclusions
FR2830983B1 (fr) 2001-10-11 2004-05-14 Commissariat Energie Atomique Procede de fabrication de couches minces contenant des microcomposants
US7176108B2 (en) 2002-11-07 2007-02-13 Soitec Silicon On Insulator Method of detaching a thin film at moderate temperature after co-implantation
FR2856844B1 (fr) 2003-06-24 2006-02-17 Commissariat Energie Atomique Circuit integre sur puce de hautes performances
FR2857953B1 (fr) 2003-07-21 2006-01-13 Commissariat Energie Atomique Structure empilee, et procede pour la fabriquer
FR2861497B1 (fr) 2003-10-28 2006-02-10 Soitec Silicon On Insulator Procede de transfert catastrophique d'une couche fine apres co-implantation
US7772087B2 (en) 2003-12-19 2010-08-10 Commissariat A L'energie Atomique Method of catastrophic transfer of a thin film after co-implantation
FR2889887B1 (fr) 2005-08-16 2007-11-09 Commissariat Energie Atomique Procede de report d'une couche mince sur un support
FR2891281B1 (fr) 2005-09-28 2007-12-28 Commissariat Energie Atomique Procede de fabrication d'un element en couches minces.
FR2899378B1 (fr) 2006-03-29 2008-06-27 Commissariat Energie Atomique Procede de detachement d'un film mince par fusion de precipites
US8293619B2 (en) * 2008-08-28 2012-10-23 Silicon Genesis Corporation Layer transfer of films utilizing controlled propagation
FR2906077B1 (fr) * 2006-09-18 2009-03-06 Michel Roche Procede et appareillages associes, destine a la fabrication de substrats semiconducteurs poly ou monocristallins minces
FR2910179B1 (fr) 2006-12-19 2009-03-13 Commissariat Energie Atomique PROCEDE DE FABRICATION DE COUCHES MINCES DE GaN PAR IMPLANTATION ET RECYCLAGE D'UN SUBSTRAT DE DEPART
KR100830998B1 (ko) * 2006-12-28 2008-05-20 주식회사 실트론 웨이퍼 낱장 분리장치
KR20090104839A (ko) * 2007-01-18 2009-10-06 실리콘 제너시스 코포레이션 기판의 제어된 클리빙 처리 및 클리빙 장치
FR2912259B1 (fr) * 2007-02-01 2009-06-05 Soitec Silicon On Insulator Procede de fabrication d'un substrat du type "silicium sur isolant".
FR2919960B1 (fr) * 2007-08-08 2010-05-21 Soitec Silicon On Insulator Procede et installation pour la fracture d'un substrat composite selon un plan de fragilisation
DE102007056115A1 (de) * 2007-11-15 2009-05-20 Freiberger Compound Materials Gmbh Verfahren zum Trennen von Einkristallen
FR2925221B1 (fr) 2007-12-17 2010-02-19 Commissariat Energie Atomique Procede de transfert d'une couche mince
FR2947098A1 (fr) 2009-06-18 2010-12-24 Commissariat Energie Atomique Procede de transfert d'une couche mince sur un substrat cible ayant un coefficient de dilatation thermique different de celui de la couche mince
FR2975627A1 (fr) * 2011-05-24 2012-11-30 Soitec Silicon On Insulator Dispositif de decollement de substrat avec detection d'obstacles
CN102522289B (zh) * 2011-12-30 2014-12-17 四川虹欧显示器件有限公司 等离子显示屏中前基板与后基板的分离方法及装置
FR2995441B1 (fr) * 2012-09-07 2015-11-06 Soitec Silicon On Insulator Dispositif de separation de deux substrats
FR2995440A1 (fr) * 2012-09-07 2014-03-14 Soitec Silicon On Insulator Dispositif de separation de deux substrats
CN105336651B (zh) * 2014-06-10 2018-03-23 北大方正集团有限公司 晶片转置系统
CN104241186B (zh) * 2014-09-19 2017-09-29 上海集成电路研发中心有限公司 一种晶圆提取装置
CN105235079A (zh) * 2015-10-19 2016-01-13 天津市环欧半导体材料技术有限公司 一种多线切割机硅片分切模具
JP6682907B2 (ja) * 2016-02-26 2020-04-15 三星ダイヤモンド工業株式会社 脆性基板の分断方法
CN108447811B (zh) * 2018-02-27 2020-06-12 嘉兴尚能光伏材料科技有限公司 硅片花篮及其控制器
FR3093716B1 (fr) 2019-03-15 2021-02-12 Soitec Silicon On Insulator systeme de fracture d'une pluralitÉ d'assemblages de tranches.
FR3093715B1 (fr) 2019-03-15 2021-03-05 Soitec Silicon On Insulator Dispositif de maintien pour un ensemble à fracturer
CN118658816A (zh) * 2024-08-21 2024-09-17 青岛天仁微纳科技有限责任公司 一种纳米压印硅晶圆分片装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3901423A (en) * 1973-11-26 1975-08-26 Purdue Research Foundation Method for fracturing crystalline materials
US4244348A (en) * 1979-09-10 1981-01-13 Atlantic Richfield Company Process for cleaving crystalline materials
JPS62237744A (ja) * 1986-04-07 1987-10-17 Mitsubishi Electric Corp Ｉｃ基板収納用カセツト
JPH0722177B2 (ja) * 1990-04-26 1995-03-08 三洋電機株式会社 ウェハの移し替え装置
FR2681472B1 (fr) * 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
US5738767A (en) * 1994-01-11 1998-04-14 Intevac, Inc. Substrate handling and processing system for flat panel displays
JP3656254B2 (ja) * 1994-02-28 2005-06-08 三菱住友シリコン株式会社 接着ウエーハの剥離方法及び剥離装置
JP3381443B2 (ja) * 1995-02-02 2003-02-24 ソニー株式会社 基体から半導体層を分離する方法、半導体素子の製造方法およびｓｏｉ基板の製造方法
JPH0969552A (ja) * 1995-08-30 1997-03-11 Toshiba Corp ウェハ移し替え装置
KR0165467B1 (ko) * 1995-10-31 1999-02-01 김광호 웨이퍼 디본더 및 이를 이용한 웨이퍼 디본딩법
JPH09263500A (ja) * 1996-01-22 1997-10-07 Komatsu Electron Metals Co Ltd 貼り合わせｓｏｉウェーハの剥がし治具
FR2752332B1 (fr) * 1996-08-12 1998-09-11 Commissariat Energie Atomique Dispositif de decollement de plaquettes et procede de mise en oeuvre de ce dispositif
CA2225131C (en) * 1996-12-18 2002-01-01 Canon Kabushiki Kaisha Process for producing semiconductor article
SG68035A1 (en) * 1997-03-27 1999-10-19 Canon Kk Method and apparatus for separating composite member using fluid
US6162705A (en) * 1997-05-12 2000-12-19 Silicon Genesis Corporation Controlled cleavage process and resulting device using beta annealing
US6427748B1 (en) * 1998-07-27 2002-08-06 Canon Kabushiki Kaisha Sample processing apparatus and method
FR2785217B1 (fr) * 1998-10-30 2001-01-19 Soitec Silicon On Insulator Procede et dispositif pour separer en deux tranches une plaque de materiau notamment semi-conducteur
US6286685B1 (en) * 1999-03-15 2001-09-11 Seh America, Inc. System and method for wafer thickness sorting
US6171965B1 (en) * 1999-04-21 2001-01-09 Silicon Genesis Corporation Treatment method of cleaved film for the manufacture of substrates
US6271060B1 (en) * 1999-09-13 2001-08-07 Vishay Intertechnology, Inc. Process of fabricating a chip scale surface mount package for semiconductor device
US6415843B1 (en) * 2001-01-10 2002-07-09 Anadigics, Inc. Spatula for separation of thinned wafer from mounting carrier

Also Published As

Publication number Publication date
US20060138189A1 (en) 2006-06-29
CN1564730A (zh) 2005-01-12
JP2004537866A (ja) 2004-12-16
CN1329949C (zh) 2007-08-01
KR100784579B1 (ko) 2007-12-10
KR20040020979A (ko) 2004-03-09
ATE357323T1 (de) 2007-04-15
JP4509555B2 (ja) 2010-07-21
EP1423244B9 (de) 2007-10-03
DE60219034T2 (de) 2007-12-13
WO2003013815A1 (fr) 2003-02-20
US20040188487A1 (en) 2004-09-30
FR2828428A1 (fr) 2003-02-14
US7017570B2 (en) 2006-03-28
EP1423244B1 (de) 2007-03-21
EP1423244A1 (de) 2004-06-02
US7648888B2 (en) 2010-01-19
FR2828428B1 (fr) 2003-10-17

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