ATE513664T1 - Vorrichtung und verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften - Google Patents
Vorrichtung und verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräftenInfo
- Publication number
- ATE513664T1 ATE513664T1 AT06819340T AT06819340T ATE513664T1 AT E513664 T1 ATE513664 T1 AT E513664T1 AT 06819340 T AT06819340 T AT 06819340T AT 06819340 T AT06819340 T AT 06819340T AT E513664 T1 ATE513664 T1 AT E513664T1
- Authority
- AT
- Austria
- Prior art keywords
- adhesion forces
- shaped substrates
- separating disk
- substrates
- industry
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/10—Methods
- Y10T225/12—With preliminary weakening
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200510053410 DE102005053410B4 (de) | 2005-11-09 | 2005-11-09 | Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften |
DE200610021647 DE102006021647A1 (de) | 2005-11-09 | 2006-05-09 | Verfahren zur Vereinzelung von scheibenförmigen Substraten unter Nutzung von Adhäsionskräften |
PCT/EP2006/068253 WO2007054525A1 (de) | 2005-11-09 | 2006-11-08 | Verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE513664T1 true ATE513664T1 (de) | 2011-07-15 |
Family
ID=37709714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT06819340T ATE513664T1 (de) | 2005-11-09 | 2006-11-08 | Vorrichtung und verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften |
Country Status (6)
Country | Link |
---|---|
US (1) | US8043890B2 (de) |
EP (1) | EP1951490B1 (de) |
JP (1) | JP2009515349A (de) |
AT (1) | ATE513664T1 (de) |
DE (2) | DE102006021647A1 (de) |
WO (1) | WO2007054525A1 (de) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5388862B2 (ja) * | 2006-12-19 | 2014-01-15 | アールイーシー・ウェーハ・ピーティーイー・リミテッド | シリコンウェハを分離させるための方法および装置 |
GB2465591B (en) * | 2008-11-21 | 2011-12-07 | Coreflow Ltd | Method and device for separating sliced wafers |
US8436324B2 (en) | 2009-02-22 | 2013-05-07 | Mapper Lithography Ip B.V. | Preparation unit for lithography machine |
GB2469112A (en) | 2009-04-03 | 2010-10-06 | Mapper Lithography Ip Bv | Wafer support using controlled capillary liquid layer to hold and release wafer |
WO2011044871A1 (de) | 2009-10-13 | 2011-04-21 | Huebel Egon | Verfahren und vorrichtung zur substratablösung |
US9176397B2 (en) | 2011-04-28 | 2015-11-03 | Mapper Lithography Ip B.V. | Apparatus for transferring a substrate in a lithography system |
JP2013004627A (ja) * | 2011-06-14 | 2013-01-07 | Shinryo Corp | ウエハの分離装置 |
US20140150244A1 (en) * | 2012-11-30 | 2014-06-05 | General Electric Company | Adhesive-free carrier assemblies for glass substrates |
TWI498990B (zh) * | 2012-12-19 | 2015-09-01 | Genesis Photonics Inc | 劈裂裝置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5596267A (en) * | 1979-01-12 | 1980-07-22 | Citizen Watch Co Ltd | Parts working method |
JPS59145034U (ja) * | 1983-03-17 | 1984-09-28 | 第一精機株式会社 | ウエハ−取扱装置 |
JPS61125767A (ja) | 1984-11-20 | 1986-06-13 | Sumitomo Metal Ind Ltd | ワイヤソ−のウエハ取出方法 |
JPS63251165A (ja) * | 1987-04-01 | 1988-10-18 | Nec Corp | 半導体ウエ−ハの保持方法 |
WO1994001279A1 (en) * | 1992-07-08 | 1994-01-20 | Mann George E | Adhesion testing |
JPH0717628A (ja) * | 1993-06-30 | 1995-01-20 | Sumitomo Sitix Corp | 薄板搬送方法とその装置 |
DE4446489C1 (de) | 1994-12-23 | 1996-05-15 | Fraunhofer Ges Forschung | Verfahren zum Manipulieren von Mikrobauteilen und Vorrichtung zur Durchführung des Verfahrens |
CH691169A5 (fr) | 1996-04-16 | 2001-05-15 | Hct Shaping Systems Sa | Dispositif pour la mise en élément de stockage de tranches obtenues par découpage d'un bloc. |
JPH11156708A (ja) * | 1997-11-27 | 1999-06-15 | Speedfam Co Ltd | バッキングパッド貼付形成装置 |
JP3832994B2 (ja) * | 1998-06-23 | 2006-10-11 | 株式会社日平トヤマ | ウエハ分離搬送装置 |
DE19900671C2 (de) | 1999-01-11 | 2002-04-25 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung |
TW468181B (en) * | 1999-02-03 | 2001-12-11 | Origin Electric | Manufacturing method and apparatus for optical disc |
FR2796491B1 (fr) * | 1999-07-12 | 2001-08-31 | Commissariat Energie Atomique | Procede de decollement de deux elements et dispositif pour sa mise en oeuvre |
DE19950068B4 (de) | 1999-10-16 | 2006-03-02 | Schmid Technology Systems Gmbh | Verfahren und Vorrichtung zum Vereinzeln und Ablösen von Substratscheiben |
JP2005019591A (ja) * | 2003-06-25 | 2005-01-20 | Central Glass Co Ltd | 吸着パッドよりガラス基板を剥離する方法 |
DE10359732A1 (de) | 2003-12-19 | 2005-07-14 | Leica Microsystems Semiconductor Gmbh | Substratträger zur Aufnahme und Lagerfixierung eines flächigen Körpers |
EP1730737B1 (de) * | 2004-03-22 | 2013-01-16 | Singulus Technologies AG | Verfahren und vorrichtung zum trennen scheibenförmiger substrate |
-
2006
- 2006-05-09 DE DE200610021647 patent/DE102006021647A1/de not_active Ceased
- 2006-11-08 US US12/092,618 patent/US8043890B2/en not_active Expired - Fee Related
- 2006-11-08 EP EP06819340A patent/EP1951490B1/de not_active Not-in-force
- 2006-11-08 AT AT06819340T patent/ATE513664T1/de active
- 2006-11-08 WO PCT/EP2006/068253 patent/WO2007054525A1/de active Application Filing
- 2006-11-08 JP JP2008539433A patent/JP2009515349A/ja active Pending
- 2006-11-08 DE DE200620020827 patent/DE202006020827U1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20080286947A1 (en) | 2008-11-20 |
EP1951490B1 (de) | 2011-06-22 |
DE202006020827U1 (de) | 2010-08-26 |
JP2009515349A (ja) | 2009-04-09 |
DE102006021647A1 (de) | 2007-11-15 |
US8043890B2 (en) | 2011-10-25 |
EP1951490A1 (de) | 2008-08-06 |
WO2007054525A1 (de) | 2007-05-18 |
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