JPS5596267A - Parts working method - Google Patents

Parts working method

Info

Publication number
JPS5596267A
JPS5596267A JP245379A JP245379A JPS5596267A JP S5596267 A JPS5596267 A JP S5596267A JP 245379 A JP245379 A JP 245379A JP 245379 A JP245379 A JP 245379A JP S5596267 A JPS5596267 A JP S5596267A
Authority
JP
Japan
Prior art keywords
base plate
water
bonding
impregnated
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP245379A
Other languages
Japanese (ja)
Other versions
JPS6317589B2 (en
Inventor
Katsura Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP245379A priority Critical patent/JPS5596267A/en
Publication of JPS5596267A publication Critical patent/JPS5596267A/en
Publication of JPS6317589B2 publication Critical patent/JPS6317589B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To prevent the decrease of the strength of parts due to the evaporation of water and maintain the bonding strength thereof for a long period of time by using a sintered body of a high porosity as a base plate. CONSTITUTION:The bonded surface of a base plate 2 is subjected to mirror surface working of less than 0.1S, and in the case of bonding, water is impregnated in the inner part of the base plate 2. Since the inner part is of a porous composition, when water is contained in the base plate, it is impregnated in its interior by a capillary phenomenon. At least the bonded surface of a work 1 is worked into a mirror surface, and water is applied in bonding of the work 1 to the base plate 2. The moisture at a part close to the surface is evaporated by the lapse of time or by drying.
JP245379A 1979-01-12 1979-01-12 Parts working method Granted JPS5596267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP245379A JPS5596267A (en) 1979-01-12 1979-01-12 Parts working method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP245379A JPS5596267A (en) 1979-01-12 1979-01-12 Parts working method

Publications (2)

Publication Number Publication Date
JPS5596267A true JPS5596267A (en) 1980-07-22
JPS6317589B2 JPS6317589B2 (en) 1988-04-14

Family

ID=11529698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP245379A Granted JPS5596267A (en) 1979-01-12 1979-01-12 Parts working method

Country Status (1)

Country Link
JP (1) JPS5596267A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137555A (en) * 1982-02-09 1983-08-16 Kyocera Corp Polishing board and polishing method using it
EP1951490B1 (en) * 2005-11-09 2011-06-22 Wolfgang Coenen Device and method for dividing up substrates in wafer form by using adhesion forces

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50133596A (en) * 1974-04-10 1975-10-22

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50133596A (en) * 1974-04-10 1975-10-22

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58137555A (en) * 1982-02-09 1983-08-16 Kyocera Corp Polishing board and polishing method using it
EP1951490B1 (en) * 2005-11-09 2011-06-22 Wolfgang Coenen Device and method for dividing up substrates in wafer form by using adhesion forces
US8043890B2 (en) 2005-11-09 2011-10-25 Wolfgang Coenen Process for separating disk-shaped substrates with the use of adhesive powers

Also Published As

Publication number Publication date
JPS6317589B2 (en) 1988-04-14

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