JPS5596267A - Parts working method - Google Patents
Parts working methodInfo
- Publication number
- JPS5596267A JPS5596267A JP245379A JP245379A JPS5596267A JP S5596267 A JPS5596267 A JP S5596267A JP 245379 A JP245379 A JP 245379A JP 245379 A JP245379 A JP 245379A JP S5596267 A JPS5596267 A JP S5596267A
- Authority
- JP
- Japan
- Prior art keywords
- base plate
- water
- bonding
- impregnated
- work
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To prevent the decrease of the strength of parts due to the evaporation of water and maintain the bonding strength thereof for a long period of time by using a sintered body of a high porosity as a base plate. CONSTITUTION:The bonded surface of a base plate 2 is subjected to mirror surface working of less than 0.1S, and in the case of bonding, water is impregnated in the inner part of the base plate 2. Since the inner part is of a porous composition, when water is contained in the base plate, it is impregnated in its interior by a capillary phenomenon. At least the bonded surface of a work 1 is worked into a mirror surface, and water is applied in bonding of the work 1 to the base plate 2. The moisture at a part close to the surface is evaporated by the lapse of time or by drying.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP245379A JPS5596267A (en) | 1979-01-12 | 1979-01-12 | Parts working method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP245379A JPS5596267A (en) | 1979-01-12 | 1979-01-12 | Parts working method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5596267A true JPS5596267A (en) | 1980-07-22 |
JPS6317589B2 JPS6317589B2 (en) | 1988-04-14 |
Family
ID=11529698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP245379A Granted JPS5596267A (en) | 1979-01-12 | 1979-01-12 | Parts working method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5596267A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58137555A (en) * | 1982-02-09 | 1983-08-16 | Kyocera Corp | Polishing board and polishing method using it |
EP1951490B1 (en) * | 2005-11-09 | 2011-06-22 | Wolfgang Coenen | Device and method for dividing up substrates in wafer form by using adhesion forces |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50133596A (en) * | 1974-04-10 | 1975-10-22 |
-
1979
- 1979-01-12 JP JP245379A patent/JPS5596267A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50133596A (en) * | 1974-04-10 | 1975-10-22 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58137555A (en) * | 1982-02-09 | 1983-08-16 | Kyocera Corp | Polishing board and polishing method using it |
EP1951490B1 (en) * | 2005-11-09 | 2011-06-22 | Wolfgang Coenen | Device and method for dividing up substrates in wafer form by using adhesion forces |
US8043890B2 (en) | 2005-11-09 | 2011-10-25 | Wolfgang Coenen | Process for separating disk-shaped substrates with the use of adhesive powers |
Also Published As
Publication number | Publication date |
---|---|
JPS6317589B2 (en) | 1988-04-14 |
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