JPS50133596A - - Google Patents
Info
- Publication number
- JPS50133596A JPS50133596A JP49039993A JP3999374A JPS50133596A JP S50133596 A JPS50133596 A JP S50133596A JP 49039993 A JP49039993 A JP 49039993A JP 3999374 A JP3999374 A JP 3999374A JP S50133596 A JPS50133596 A JP S50133596A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49039993A JPS5911423B2 (en) | 1974-04-10 | 1974-04-10 | wrapping device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP49039993A JPS5911423B2 (en) | 1974-04-10 | 1974-04-10 | wrapping device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS50133596A true JPS50133596A (en) | 1975-10-22 |
JPS5911423B2 JPS5911423B2 (en) | 1984-03-15 |
Family
ID=12568445
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49039993A Expired JPS5911423B2 (en) | 1974-04-10 | 1974-04-10 | wrapping device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5911423B2 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5258206A (en) * | 1975-11-08 | 1977-05-13 | Mitsui Toatsu Chemicals | Method of drain grid crib work for face of siope |
JPS5596267A (en) * | 1979-01-12 | 1980-07-22 | Citizen Watch Co Ltd | Parts working method |
JPH0679618A (en) * | 1991-12-20 | 1994-03-22 | Cybeq Syst Inc | Method and device for using edge retainer of polishing head |
US5916412A (en) * | 1996-02-16 | 1999-06-29 | Ebara Corporation | Apparatus for and method of polishing workpiece |
US6033520A (en) * | 1995-10-09 | 2000-03-07 | Ebara Corporation | Apparatus for and method of polishing workpiece |
US6231428B1 (en) | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6368189B1 (en) | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2826009A (en) * | 1954-12-10 | 1958-03-11 | Crane Packing Co | Work holder for lapping machines |
-
1974
- 1974-04-10 JP JP49039993A patent/JPS5911423B2/en not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2826009A (en) * | 1954-12-10 | 1958-03-11 | Crane Packing Co | Work holder for lapping machines |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5258206A (en) * | 1975-11-08 | 1977-05-13 | Mitsui Toatsu Chemicals | Method of drain grid crib work for face of siope |
JPS5596267A (en) * | 1979-01-12 | 1980-07-22 | Citizen Watch Co Ltd | Parts working method |
JPS6317589B2 (en) * | 1979-01-12 | 1988-04-14 | Citizen Watch Co Ltd | |
JPH0679618A (en) * | 1991-12-20 | 1994-03-22 | Cybeq Syst Inc | Method and device for using edge retainer of polishing head |
JP2597449B2 (en) * | 1991-12-20 | 1997-04-09 | サイベック・システムズ | How to use polishing head and retainer |
US6033520A (en) * | 1995-10-09 | 2000-03-07 | Ebara Corporation | Apparatus for and method of polishing workpiece |
US6432258B1 (en) * | 1995-10-09 | 2002-08-13 | Ebara Corporation | Apparatus for and method of polishing workpiece |
US5916412A (en) * | 1996-02-16 | 1999-06-29 | Ebara Corporation | Apparatus for and method of polishing workpiece |
US6350346B1 (en) | 1996-02-16 | 2002-02-26 | Ebara Corporation | Apparatus for polishing workpiece |
US6231428B1 (en) | 1999-03-03 | 2001-05-15 | Mitsubishi Materials Corporation | Chemical mechanical polishing head assembly having floating wafer carrier and retaining ring |
US6309290B1 (en) | 1999-03-03 | 2001-10-30 | Mitsubishi Materials Corporation | Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control |
US6368189B1 (en) | 1999-03-03 | 2002-04-09 | Mitsubishi Materials Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US7029382B2 (en) | 1999-03-03 | 2006-04-18 | Ebara Corporation | Apparatus for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
US7311586B2 (en) | 1999-03-03 | 2007-12-25 | Ebara Corporation | Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure |
Also Published As
Publication number | Publication date |
---|---|
JPS5911423B2 (en) | 1984-03-15 |