WO2007048904A1 - Dispositif de fabrication d'un ruban de silicium ou autres materiaux cristallins et procede de fabrication - Google Patents
Dispositif de fabrication d'un ruban de silicium ou autres materiaux cristallins et procede de fabrication Download PDFInfo
- Publication number
- WO2007048904A1 WO2007048904A1 PCT/FR2006/002349 FR2006002349W WO2007048904A1 WO 2007048904 A1 WO2007048904 A1 WO 2007048904A1 FR 2006002349 W FR2006002349 W FR 2006002349W WO 2007048904 A1 WO2007048904 A1 WO 2007048904A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- slot
- ribbon
- crucible
- crystallization
- silicon
- Prior art date
Links
- 239000002178 crystalline material Substances 0.000 title claims abstract description 16
- 238000004519 manufacturing process Methods 0.000 title claims description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title description 35
- 229910052710 silicon Inorganic materials 0.000 title description 35
- 239000010703 silicon Substances 0.000 title description 35
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000002425 crystallisation Methods 0.000 claims abstract description 27
- 230000008025 crystallization Effects 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 3
- 239000012535 impurity Substances 0.000 description 13
- 239000007788 liquid Substances 0.000 description 10
- 238000007711 solidification Methods 0.000 description 10
- 230000008023 solidification Effects 0.000 description 10
- 238000005204 segregation Methods 0.000 description 7
- 239000007791 liquid phase Substances 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000007790 solid phase Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000011449 brick Substances 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 238000002231 Czochralski process Methods 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000012297 crystallization seed Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000010494 dissociation reaction Methods 0.000 description 1
- 230000005593 dissociations Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 239000006199 nebulizer Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011819 refractory material Substances 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004781 supercooling Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
- H01L31/182—Special manufacturing methods for polycrystalline Si, e.g. Si ribbon, poly Si ingots, thin films of polycrystalline Si
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/546—Polycrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1092—Shape defined by a solid member other than seed or product [e.g., Bridgman-Stockbarger]
Definitions
- the invention relates to a device for producing a ribbon of crystalline material by directed crystallization.
- the solidification of silicon from a liquid silicon bath is obtained typically by directed crystallization, that is to say by migration of a solidification front (solid / liquid interface) from an initially solidified part. , in particular a seed or a first layer crystallized by local cooling.
- the solid silicon block grows progressively by feeding on the liquid bath.
- the two methods conventionally used are the Czochralski process, the Bridgman process or their variants.
- a seed often oriented with respect to a crystalline axis of the solid silicon, is soaked in the molten bath to be slowly raised.
- the liquid silicon bath and the thermal gradient then remain stationary, whereas according to the Bridgman type method, the bath is displaced with respect to the thermal gradient, or the thermal gradient with respect to the bath.
- a known method is the segregation of elements having a low coefficient of segregation.
- the impurities in order for the impurities to remain in the liquid phase, it is necessary to establish a thermal gradient such that the solid / liquid interface remains sufficiently stable at a rate of progression of this given interface, in order to avoid non-directed, equiaxed or dendritic growth of the silicon grains.
- the methods according to the prior art do not make it possible to integrate the production of silicon wafers from liquid silicon in a photovoltaic cell manufacturing line.
- the article "Ribbon Cast For Low Cost Solar CeIIs" by Hide et al. (0160-8371 / 88 / 0000-1400, 1988 IEEE) discloses a method of molding a photovoltaic silicon ribbon having a thickness of 0.5mm and a width of 100mm.
- the method uses a crucible opening into a bent mold disposed below a central opening of the crucible.
- the bent mold narrows to form a narrow and elongated guide channel constituting an elongated die moving horizontally away from the crucible axis.
- the starting material is semi-conductive grade silicon melted in the crucible. After complete melting, the silicon is injected into the bent mold, exerting atmospheric pressure in the crucible. Solidification takes place in the narrow channel. The crystals grow from bottom to top in the narrow channel and the solidification front is very sloping.
- the object of the invention is to overcome the drawbacks of known devices and, in particular, a device and a method for producing crystalline material ribbons by directed crystallization, making it possible to obtain the wafers directly from the liquid raw material, without require additional steps of scouring the ingot, debiting the peeled ingot in bricks and cutting the slab bricks by sawing.
- the invention also aims to integrate the obtaining of platelets directly in a production line of photovoltaic cells.
- the device comprises a crucible having a bottom and side walls, the crucible having at least one lateral slot disposed horizontally at a lower portion of the side walls, the lateral slot having a width greater than 50mm and a height of between 50 and 1000 micrometers.
- Such a device also makes it possible to carry out purification by segregation and, thus, to obtain silicon ribbons from a less pure silicon, such as metallurgical silicon, and therefore less expensive than semi-high quality semi-pure silicon. conductive.
- the object of the invention is also a process for producing crystalline material ribbons by crystallization directed along an axis of crystallization by means of a device according to the invention, the crystallization axis being substantially perpendicular to a drawing axis of the device.
- FIGS 1, 2 and 4 show, in section, three particular embodiments of the device according to the invention.
- FIGS. 3, 5 and 8 show, in section along the axis AA of FIG. 2, three variants of a crucible according to FIG. 2.
- FIG. 6 illustrates the direct integration of the device according to the invention in a line of FIG. production of photovoltaic cells.
- FIG. 7 illustrates the inclination of the crucible and the ribbon in a particular embodiment of the device according to the invention.
- the device shown in Figure 1 comprises a crucible 1 having a bottom 2 and side walls 3.
- the crucible 1 has a lateral slot 4 disposed horizontally in the lower part of the right-hand side wall in FIG. 1.
- the lateral slot 4 has a width L (perpendicular to FIG. 1) greater than 50 mm and preferably between 100 mm. and 500mm.
- the height H of the slot 4 is between 50 and 1000 micrometers.
- a ribbon R of crystalline material is thus obtained by directed crystallization of the material exiting through the lateral slot 4 which is drawn as represented by the arrow 5 in FIG. 1.
- the crystalline material is, for example, silicon (Si) or germanium. (Ge), gallium arsenide (GaAs), Gallium phosphide (GaP), etc.
- the thickness of the ribbon R is determined by the height H of the slot 4 and by the pulling speed. Indeed, the higher the pulling speed, the more the thickness of the ribbon R decreases.
- the width of the ribbon R is determined by the width L of the slot 4. The ribbon R can subsequently be cut into platelets, the surface of the platelets being directly constituted by the surface of the ribbon R.
- the solidification front that is to say the solid / liquid interface, is located in the slot 4.
- the manufacture of the ribbon, and thus platelets, via a device according to the invention makes it possible to obtain a crystallization directed along an axis of crystallization C substantially perpendicular to a pulling axis T of the device.
- a thermal gradient is established substantially perpendicularly to the ribbons R and / or to the direction of pull of the ribbons issuing from an opening of the crucible which comprises the liquid raw material.
- the thermal gradient is preferably located at the opening of the crucible, as for example the slot 4.
- the crystallization axis C is in particular determined by the direction of the thermal gradient.
- the crystallization axis C is thus substantially perpendicular to the ribbons, and thus to the platelets.
- the grain boundaries of the multicrystalline material are thus perpendicular to the surface of the wafer and, for photovoltaic applications, perpendicular to the P / N junctions of the photovoltaic cells, which makes it possible to improve the electrical properties of the material and the performance of the photovoltaic cells. .
- the crucible must withstand temperatures up to 1500 0 C and have a low reactivity with the material to be crystallized, for example with silicon.
- Crucible 1 is, for example, made of quartz, silicon nitride, graphite, quartz coated with silicon nitride or other refractory materials.
- the lateral slot 4 is disposed between the bottom 2 of the crucible 1 and the corresponding lateral wall 3, which must then be kept at a distance from the bottom 2.
- the height H of the slot 4 can optionally be adjusted by through an additional wall 6 adjustable in height, disposed on the outer face of the crucible and for varying the height H of the lateral slot 4, as shown in Figure 1.
- the material of the additional wall 6 is, Preferably, the same as the material of the crucible 1.
- the crucible may comprise several lateral slots 4 arranged, for example, respectively in two opposite side walls 3.
- the lateral slots 4 are machined in the lower parts of the corresponding walls 3.
- Figure 3 illustrates the lateral slot 4 extending horizontally along its width L, at the bottom of the corresponding side wall 3.
- the device preferably comprises a supply source 7 supplying the crucible continuously the material intended to be crystallized, as represented by the arrow 8 in Figure 2.
- the material may be provided in solid phase or in the liquid phase.
- the device can be integrated in a purification system of the raw material.
- a complementary heating system and a siphoning feed can be envisaged and the purification can for example be carried out by plasma.
- the crucible is heated to its upper part and cooled by the bottom 2.
- the cooling must be calculated to allow the crystallization of the material and absorb the latent heat corresponding to the crystallization. Depending on the impurities, supercooling phenomena must be taken into account.
- the crucible is preferably cooled locally at the lateral slot 4, for example by means of one or more cooling turns arranged in contact with the bottom 2 of the crucible.
- a coolant such as water or helium.
- the device comprises, by way of example, a refractory plate 9 and a nebulizer 10 for depositing a cooling liquid on the refractory plate 9. It is of course possible to envisage any other local cooling device.
- the location of the cooling must be controlled so as to obtain a meniscus of the molten material formed at the slot 4, capable of crystallizing during contact with a crystallization seed.
- the corresponding solidification temperature is included between 1400 ° C and 1450 ° C, while the silicon bath contained in the crucible can be heated to a temperature between 1420 0 C and 155O 0 C.
- the silicon flows through the slot 4 and crystallizes at the 4.
- the thickness of the lateral wall 3 increases as it moves away from the slot 4.
- the device may also comprise an additional heating element 15 disposed above the slot 4 for locally heating the wall 3 and the silicon being solidified, at the level of the slot 4.
- the slot 4 is arranged between a hot source, disposed above the slot 4, and a cold source, disposed under the slot 4. This makes it possible to establish and control the thermal gradient in the silicon during solidification and, thus, the orientation of the directed crystallization.
- an additional height-adjustable wall 6 it can be brought into contact with the additional heating element.
- the additional wall 6 can serve as a heat conductor for supplying heat to the slot 4.
- the thermal gradient is substantially vertical and must be between 5 and 20 ° C / cm in the silicon during cooling. This gradient is necessary for the segregation of impurities and for the growth of grains along the substantially vertical thermal axis. Thus, the grain growth direction is perpendicular to the upper surface of the ribbon R.
- the device comprises an apparatus 11 for gripping the ribbon R of crystalline material exiting through the lateral slot 4 of the crucible 1.
- the apparatus 11 comprises, for example, a support 12 holding a seed 13 of crystallization allowing the seed 13 to come into contact with the seed with the material exiting through the lateral slot 4.
- a seed 13 made of mono- or polycrystalline silicon is preferably cut along an axis of low growth rate, for example along axes ⁇ 112> or ⁇ 110>, to limit grain growth in the direction of the draw.
- the seed material is preferably the same as the material which is crystallizing.
- the seed may, however, be of a different material from the crystallization material, for example quartz, nitride, polycrystalline silicon or mullite, the main thing being to avoid melting and not to generate impurities.
- the thickness and the width of the seed 13 correspond to the thickness and the width of the ribbon R.
- the apparatus 11 preferably also includes a displacement motor for pulling the ribbon R of crystalline material as shown by the arrow 14 in Fig. 4.
- a displacement motor for pulling the ribbon R of crystalline material as shown by the arrow 14 in Fig. 4.
- the ribbon R can be pulled to a desired length to be cut. then at the slot 4.
- FIG. 5 represents another particular embodiment of the device according to the invention, comprising a plurality of lateral slots 4 disposed in the same wall 3 of the crucible, each having, for example, a width of 150 mm.
- the silicon in the crucible is heated, for example by induction, resistance, infrared or a combination of these methods.
- the choice of methods is particularly related to the materials used.
- the ribbon R can be cut, for example by laser.
- the ribbon R is cut by means of an abrupt and temporal acceleration of the drawing speed causing the rupture of the ribbon R.
- a second gripping apparatus 11 can be put in place to take the initial part of the next ribbon R.
- a lateral gripping system makes it possible to move the ribbons (or platelets, depending on the degree of cutting) one after the other.
- the manufacturing device can be integrated directly and in continuous form in a photovoltaic cell production line, even before cutting into platelets the ribbon R of the material coming out of the slot
- Figure 6 illustrates a doping furnace 16 in which the ribbon R is directly introduced.
- An apparatus 11 for gripping and moving the ribbon R makes it possible, in particular, to conduct the ribbon R in the oven 16. Since the ribbon R leaving the crucible is already at a high temperature, an additional preheating step is saved before the ribbon R is introduced into the oven
- the device integrates both upstream for the reception of the raw material, and downstream for the production steps of photovoltaic cells.
- the method preferably comprises a step of contacting a seed 13 of crystallization with the material exiting through the lateral slot 4 and a horizontal displacement step 14 of the ribbon R.
- the crucible 1 is inclined at an angle ⁇ with respect to a horizontal plane 17 by means of any appropriate mechanical device, for example a pivoting support.
- the direction of pulling of the ribbon R, and thus the ribbon R, is inclined at an angle ⁇ relative to the horizontal plane 17.
- This makes it possible, in particular, to facilitate the crystalline growth perpendicular to the plane of the ribbon R.
- the inclination of the crucible 1 and / or the direction of pull makes it possible to correct this effect and to obtain a crystallization C perpendicular to the ribbon R. It is also possible to consider angles ⁇ and ⁇ negative or opposite signs, to control the axis of crystallization C.
- the slot 4 is constituted by a series of orifices 18, spaced so that threads of material passing through the orifices 18 meet at the outlet of the orifices. to form the ribbon R.
- the spacing between the orifices 18 may be adapted so that the individual threads out through the orifices 18 meet by capillary action.
- the invention is not limited to the embodiments shown.
- a first crucible makes it possible to produce ribbons R of N-type material and a second crucible makes it possible to produce ribbons R made of P-type material, according to the doping of the silicon bath in the crucible.
- the lateral slot 4 being arranged at a lower part of the side walls 3 of the crucible, the depth D of the slot 4 corresponds to the thickness of the wall, which is between 2.5 mm and 15 mm and preferably between 4 mm. and 10mm.
- the crucible then has a very short outlet channel of a corresponding length, that is to say a few millimeters.
- the depth of the lateral slot 4 corresponds to the thickness of the lateral wall 3 at the level of the slot.
- the depth D of the slot 4 or generally the length of the outlet channel, is between 2.5 mm and 15 mm and preferably between 4 and 10 mm.
- Solidification causes segregation of the impurities, i.e., a decrease in the impurity concentration in the solid phase and a increasing the concentration of impurities in the liquid phase, according to the segregation coefficient of each element.
- the slot according to the invention the solidification front is disposed in the main volume of the crucible, or at least very close thereto.
- the impurities are thus dispersed in the entire volume of the crucible, particularly through the usual mixing.
- the solid phase is thus much more pure than the liquid phase. Consequently, the device according to the invention actually makes it possible to use a less pure starting silicon than the desired final silicon and to purify it during crystallization.
- the device described in the article by Hide et al. above is limited to the use of semiconductor quality silicon, having very few impurities. Indeed, the device according to Hide et al. does not allow to obtain a good dispersion of the impurities in the entire volume of the liquid phase, because the segregation at the solidification front causes the confinement of the impurities in the narrow channel. The impurities are then necessarily included in the solid phase, especially in the upper layer of the ribbon, which has a degradation of the quality of the ribbon.
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/992,754 US20090139445A1 (en) | 2005-10-26 | 2006-10-19 | Device for Fabricating a Ribbon of Silicon or Other Crystalline Materials and Method of Fabrication |
JP2008537131A JP2009513469A (ja) | 2005-10-26 | 2006-10-19 | シリコンまたは他の結晶性物質のリボンを製造する装置および方法 |
CA002626063A CA2626063A1 (fr) | 2005-10-26 | 2006-10-19 | Dispositif de fabrication d'un ruban de silicium ou autres materiaux cristallins et procede de fabrication |
EP06820238A EP1941553A1 (fr) | 2005-10-26 | 2006-10-19 | Dispositif de fabrication d'un ruban de silicium ou autres materiaux cristallins et procede de fabrication |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0510940 | 2005-10-26 | ||
FR0510940A FR2892426B1 (fr) | 2005-10-26 | 2005-10-26 | Dispositif de fabrication d'un ruban de silicium ou autres materiaux cristallins et procede de fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007048904A1 true WO2007048904A1 (fr) | 2007-05-03 |
WO2007048904A8 WO2007048904A8 (fr) | 2008-06-19 |
Family
ID=36685772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2006/002349 WO2007048904A1 (fr) | 2005-10-26 | 2006-10-19 | Dispositif de fabrication d'un ruban de silicium ou autres materiaux cristallins et procede de fabrication |
Country Status (7)
Country | Link |
---|---|
US (1) | US20090139445A1 (fr) |
EP (1) | EP1941553A1 (fr) |
JP (1) | JP2009513469A (fr) |
CN (1) | CN101300686A (fr) |
CA (1) | CA2626063A1 (fr) |
FR (1) | FR2892426B1 (fr) |
WO (1) | WO2007048904A1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2913434B1 (fr) * | 2007-03-08 | 2009-11-20 | Apollon Solar | Dispositif et procede de fabrication de plaques autosupportees de silicium ou autres materiaux cristallins. |
DE102009015236B4 (de) * | 2009-04-01 | 2015-03-05 | H.C. Starck Gmbh | Tiegel und seine Verwendung |
US20110168081A1 (en) * | 2010-01-12 | 2011-07-14 | Tao Li | Apparatus and Method for Continuous Casting of Monocrystalline Silicon Ribbon |
NL2004209C2 (en) * | 2010-02-08 | 2011-08-09 | Rgs Dev B V | Apparatus and method for the production of semiconductor material foils. |
KR101281033B1 (ko) * | 2011-05-19 | 2013-07-09 | 한국에너지기술연구원 | 온도 조절이 용이한 연속주조법을 이용한 태양전지용 실리콘 기판 제조 장치 및 이를 이용한 실리콘 기판 제조 방법 |
US20120329203A1 (en) * | 2011-06-22 | 2012-12-27 | Liang-Tung Chang | Method for Forming Silicon Thin Film |
KR101483693B1 (ko) * | 2012-04-05 | 2015-01-19 | 한국에너지기술연구원 | 실리콘 기판 제조 장치 |
KR101406705B1 (ko) | 2012-04-05 | 2014-06-12 | 한국에너지기술연구원 | 실리콘 기판 제조 장치 |
FR3081856B1 (fr) * | 2018-06-05 | 2020-11-27 | Inst Polytechnique Grenoble | Dispositif de production de silicium fondu |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4251570A (en) * | 1979-11-19 | 1981-02-17 | Honeywell Inc. | Cold substrate growth technique for silicon-on-ceramic |
EP0424981A1 (fr) * | 1982-12-27 | 1991-05-02 | Sri International | Creuset en forme parallélépipédique pour lingots en silicium mono- ou quasi monocristallins |
DE4236827A1 (de) * | 1992-10-30 | 1994-05-05 | Wacker Chemitronic | Vorrichtung zur Herstellung multikristalliner Halbleiter-Blöcke mit kolumnarer Kristallstruktur |
WO2004094704A2 (fr) * | 2003-04-17 | 2004-11-04 | Apollon Solar | Creuset pour un dispositif de fabrication d’un bloc de materiau cristallin et procede de fabrication |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1487587A (en) * | 1974-12-04 | 1977-10-05 | Metals Res Ltd | Crystal growth |
US4225378A (en) * | 1978-12-27 | 1980-09-30 | Burroughs Corporation | Extrusion mold and method for growing monocrystalline structures |
JP3992469B2 (ja) * | 2001-09-21 | 2007-10-17 | 独立行政法人科学技術振興機構 | 酸化物系共晶体のバルクの製造装置と製造方法 |
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2005
- 2005-10-26 FR FR0510940A patent/FR2892426B1/fr not_active Expired - Fee Related
-
2006
- 2006-10-19 EP EP06820238A patent/EP1941553A1/fr not_active Withdrawn
- 2006-10-19 JP JP2008537131A patent/JP2009513469A/ja active Pending
- 2006-10-19 WO PCT/FR2006/002349 patent/WO2007048904A1/fr active Application Filing
- 2006-10-19 CA CA002626063A patent/CA2626063A1/fr not_active Abandoned
- 2006-10-19 CN CNA2006800404668A patent/CN101300686A/zh active Pending
- 2006-10-19 US US11/992,754 patent/US20090139445A1/en not_active Abandoned
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US4251570A (en) * | 1979-11-19 | 1981-02-17 | Honeywell Inc. | Cold substrate growth technique for silicon-on-ceramic |
EP0424981A1 (fr) * | 1982-12-27 | 1991-05-02 | Sri International | Creuset en forme parallélépipédique pour lingots en silicium mono- ou quasi monocristallins |
DE4236827A1 (de) * | 1992-10-30 | 1994-05-05 | Wacker Chemitronic | Vorrichtung zur Herstellung multikristalliner Halbleiter-Blöcke mit kolumnarer Kristallstruktur |
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HELMREICH D ET AL COMMISSION OF THE EUROPEAN COMMUNITIES: "FAST SILICON RIBBON GROWTH METHODS", PROCEEDINGS OF THE INTERNATIONAL PHOTOVOLTAIC SOLAR ENERGY CONFERENCE. KAVOURI, GREECE, 17 - 21 OCTOBER, 1983, DORDRECHT, REIDEL, NL, vol. CONF. 5, 17 October 1983 (1983-10-17), pages 955 - 962, XP000012974 * |
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Also Published As
Publication number | Publication date |
---|---|
FR2892426A1 (fr) | 2007-04-27 |
CN101300686A (zh) | 2008-11-05 |
FR2892426B1 (fr) | 2008-01-11 |
US20090139445A1 (en) | 2009-06-04 |
WO2007048904A8 (fr) | 2008-06-19 |
CA2626063A1 (fr) | 2007-05-03 |
JP2009513469A (ja) | 2009-04-02 |
EP1941553A1 (fr) | 2008-07-09 |
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