WO2007043192A1 - Dispositif de soudage - Google Patents

Dispositif de soudage Download PDF

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Publication number
WO2007043192A1
WO2007043192A1 PCT/JP2005/022925 JP2005022925W WO2007043192A1 WO 2007043192 A1 WO2007043192 A1 WO 2007043192A1 JP 2005022925 W JP2005022925 W JP 2005022925W WO 2007043192 A1 WO2007043192 A1 WO 2007043192A1
Authority
WO
WIPO (PCT)
Prior art keywords
region
welding apparatus
opening
reactor
heat
Prior art date
Application number
PCT/JP2005/022925
Other languages
English (en)
Japanese (ja)
Inventor
Shinsuke Shimabayashi
Motoyasu Nagano
Naoki Kobayashi
Yoshiyuki Tabata
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Publication of WO2007043192A1 publication Critical patent/WO2007043192A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/003—Cooling means

Definitions

  • the present invention relates to a welding apparatus that mounts a heat generating component such as an inverter circuit to generate an arc.
  • inverter-controlled welding apparatuses equipped with an inverter circuit capable of high-speed switching in a power control circuit have become widespread. Also, as the control frequency is increased, the heat generated by the switching element increases, and cooling of the switching element is regarded as important.
  • a conventional inverter welding apparatus disclosed in Japanese Utility Model Laid-Open No. 61-53074 or Japanese Patent Laid-Open No. 8-214549 has a cooling fin for cooling a semiconductor element necessary for driving the inverter and generates heat. It is equipped with a transformer and reactor that reach high temperatures. They are all arranged in one area inside the enclosure, and cooling fins, transformers and reactors are cooled by large cooling fans.
  • the semiconductor element is a switching element such as a diode, a thyristor, or a transistor.
  • FIG. 5 is a side perspective view of a conventional welding apparatus 5001 disclosed in Japanese Utility Model Laid-Open No. 61-53074.
  • the welding apparatus 5001 includes a semiconductor element 102 such as a thyristor transistor, a cooling fin 103 for cooling the semiconductor element 102, a transformer 104 for converting electric power, a reactor 105 for smoothing an output current, a cooling fin 103, and a transformer. 104 and a fan 106 for cooling the reactor 105, a control device 107 for controlling the semiconductor element 102, and a partition member 108 provided to secure an area for preventing the control device 107 from dust. These are arranged in the housing 101.
  • the fan 106 is installed so that the wind flows in the vertical direction.
  • the partition member 108 divides the interior of the housing 101 above the fan 106 into an upper region 111 and a lower region 109.
  • a control device 107 is arranged in the area 111.
  • the semiconductor element 102 that generates heat at a high temperature in the region 109, the cooling fin 103 that cools the semiconductor element 102, the transformer 104, and the reactor 105 are arranged to exhaust or absorb external air
  • the fan 106 enters and is blown to cool it.
  • the welding apparatus 5001 further includes wiring and various components necessary for welding, but a description thereof is omitted.
  • FIG. 6 is a side perspective view of another conventional welding apparatus 5002 disclosed in Japanese Patent Laid-Open No. 8-214549.
  • the welding apparatus 5002 includes a semiconductor element 2102 necessary for driving the inverter, a cooling fin 2103 for cooling the semiconductor element 2102, a transformer 2104 for converting electric power, a reactor 2105 for smoothing the output current, and a cooling P fin. 2103, fan lance 2104, fan 106 for cooling reactor 2105, control device 2107 for controlling inverter drive, partition member 2108 for securing an area for preventing semiconductor element 2102 and control device 2107 from dust These are arranged inside the housing 2101.
  • the partition member 2108 is provided with a through hole 2110 having a size that allows the semiconductor element 2102 to pass therethrough.
  • the partition member 2108 separates the inside of the housing 2101 into an upper region 2111 and a lower region 2109.
  • the semiconductor element 2102 is passed through the through hole 2110 of the partition member 2108.
  • a control device 2107 is arranged on the partition member 2108 in the region 2111.
  • cooling fins 2103, a transformer 2104, and a reactor 2105 for cooling a semiconductor element 2102 that generates heat at a high temperature are arranged in a region 2109, and a fan 2106 that exhausts or sucks air from the outside is used to generate air. Is hit and cooled. Fan 2106 blows wind horizontally.
  • the welding apparatus 5002 further includes wiring and various components necessary for welding, but the description is omitted.
  • the fan 106 is relatively large and cools all the heating elements in the regions 109 and 2109 so that the wind flows in a wide range in the regions 109 and 2109.
  • components that generate heat at high temperatures such as transformer 104 and reactor 105, are arranged in the same region 109 as cooling fin 103. Therefore, the temperature in the region 109 increases due to the heat generated by the transformer 104, and the cooling efficiency of the cooling fin 103 decreases due to the influence.
  • the fan 106 since the region 109 is wide, the fan 106 needs to be enlarged. Even if the fan 106 is large-sized, the cooling air generated by the fan 106 is diffused in the region 109, and high-temperature parts such as the transformer 104 can be preferentially cooled, so that it cannot be locally cooled. Therefore, cooling fin 103, The cooling efficiency of the lance 104 and the reactor 105 is lowered, and the reliability of the welding devices 5001 and 5002 is lowered.
  • the amount of heat generated in the region 109 increases, so that the temperature in the region 109 further increases.
  • This welding apparatus has a casing, a partition member that divides the interior of the casing into a first region and a second region, and a tunnel-shaped passage that allows air to flow through the first region and the second region.
  • FIG. 1 is a circuit block diagram of a welding apparatus in an embodiment of the present invention.
  • FIG. 2 is a perspective perspective view of the welding apparatus in the embodiment.
  • FIG. 3 is a perspective perspective view of the welding apparatus in the embodiment.
  • FIG. 4 is a perspective view of a heat dissipation unit used in the welding apparatus in the embodiment.
  • FIG. 5 is a side perspective view of a conventional welding apparatus.
  • FIG. 6 is a side perspective view of another conventional welding apparatus.
  • FIG. 1 is a circuit block diagram of welding apparatus 1001 according to the embodiment of the present invention.
  • the voltage supplied from the commercial power source 21 is rectified by the rectifier diode 22 and smoothed by the reactor 23 and the smoothing capacitor 24 to become a DC voltage.
  • the DC voltage is switched by the semiconductor element 25. It is switched to a high frequency voltage.
  • the main transformer 26 boosts the high frequency voltage.
  • the boosted high-frequency voltage is converted into a DC voltage by the rectifier diode 27.
  • the high frequency component of the DC voltage is cut by the reactor 28 to improve the quality of the weld.
  • a torch cable 29A and a base material cable 29B are connected to the output terminal 29, so that welding force S can be achieved.
  • the control device 30 includes a DC power supply board 31 and a control board 32, and controls the semiconductor element 25 in order to realize a value set by the operator, thereby stabilizing the quality of welding.
  • the semiconductor element 25 has a snubber 14 for overvoltage protection.
  • the reactor 23, the smoothing capacitor 24, the main transformer 26, and the reactor 28 are electric elements that generate a large amount of heat.
  • the rectifier diode 22, the semiconductor element 25, the rectifier diode 27, and the snubber 14 are electrical elements that generate a large amount of heat and require heat dissipation.
  • the control device 30 is an electric element that is less susceptible to heat than these electric elements and whose reliability decreases at a high temperature.
  • FIG. 2 and 3 are perspective perspective views of the welding apparatus 1001.
  • FIG. The welding apparatus 1001 has a housing 1.
  • the partition members 2 and 3 divide the inside of the housing 1 into a plurality of regions. That is, the interior of the housing 1 is divided into an upper region 4 and a region 4 above the partition member 2, a region 5 below the partition member 2 and above the partition member 3, and a region 6 below the partition member 3. Regions 4, 5, and 6 are located from the top.
  • the welding apparatus 1001 includes a grommet 7, a heat radiating unit 8 provided in the region 5, a fan 11, a side plate 12 constituting the housing 1, a snubber 14, and a bottom plate 16 constituting the housing 1. Include.
  • the fan 11 is provided in the opening 9 of the heat dissipation unit 8.
  • An opening 13 is formed in a portion of the side plate 12 facing the region 5.
  • An opening 15 is provided in a portion of the side plate 12 facing the region 6.
  • An opening 17 is formed in the bottom plate 16.
  • a control device 30 is arranged in the region 4 of the housing 1.
  • the partition member 2 that separates the region 4 and the region 5 is provided with a hole 7A for passing the wiring.
  • Grommet 7 is attached to hole 7A so that air does not enter from area 5 to area 4 through hole 7A, allowing only wiring to pass.
  • the heat dissipating unit 8 includes an outer peripheral portion 8B that forms a hollow portion inside, and has a substantially tunnel shape for allowing air to flow between the region 5 and the region 6.
  • An opening 9 and an opening 10 through which air flows are provided at both ends of the cavity of the heat dissipation unit 8. Opening 9 is located in region 5.
  • the opening 10 is located on the surface of the partition member 3 or in the region 6 and opens in the region 6.
  • the fan 11 is disposed in the opening 9, and air is circulated through the cavity of the heat dissipation unit 8.
  • the partition member 3 is provided with a through-hole having the same size as the opening 10 at a position facing the opening 10.
  • FIG. 4 is a perspective view of the heat dissipation unit 8.
  • the heat radiating fins 18 are disposed substantially in parallel with the flow of air flowing through the cavity 8 A in the heat radiating unit 8. The explanation is omitted because it is the same as
  • a rectifier diode 22 and a semiconductor element 25 are arranged in direct contact with the outer peripheral portion 8B of the heat dissipation unit 8.
  • the smoothing capacitor 24 is indirectly disposed at a predetermined interval from the outer peripheral portion 8B of the heat dissipation unit 8.
  • a plurality of openings 13 are provided at positions facing the region 5 of the side plate 12 constituting the housing 1. When the cooling fan 11 is driven, outside air is sucked into the housing 1 from the opening 13 and the sucked air flows into the fan 11.
  • the opening position and the number of the openings 13 are appropriately determined so that the air flowing into the fan 11 wraps around the smoothing capacitor 24 and the snubber 14, and the smoothing capacitor 24 and the snubber 14 are efficiently cooled.
  • the partition member 3 that separates the region 5 and the region 6 is provided with a hole 7B through which wiring is passed.
  • a grommet 7 is attached to the hole 7B and only the wiring passes.
  • a reactor 23, a main transformer 26, and a reactor 28 are disposed below the opening 10 of the heat dissipating unit 8 in the region 6.
  • the heat radiation unit 8 may be arranged at a position where the reactor 23, the main transformer 26, and the reactor 28 have a high cooling effect. Since the main transformer 26 and the reactor 28 generate a large amount of heat, it is effective to arrange the opening 10 of the heat radiating unit 8 directly above the main transformer 26 and the reactor 28. With such an arrangement, the air that has passed through the cavity 8A of the heat radiating unit 8 and is blown out from the opening 10 directly hits the main transformer 26 and the reactor 28, and these can be efficiently cooled. The same effect can be obtained by fixing the heat radiating unit 8 without changing the position and disposing the main transformer 26 and the reactor 28 directly below the opening 10 of the heat radiating unit 8.
  • a plurality of openings 15 are provided at positions facing the region 6 of the side plate 12 constituting the housing 1.
  • a plurality of openings 17 are provided at positions facing the region 6 of the bottom plate 16 constituting the housing 1. Air in the heated area 6 is discharged from the openings 15, 17 to the outside of the housing 1. , The temperature in region 6 can be lowered. Air flows from the opening 10 of the heat dissipation unit 8 into the region 6 by the fan 11, flows so as to wrap around the reactor 23, the main transformer 26, and the reactor 28, and is discharged from the opening 15 and 17 to the outside of the housing 1. Is done. The positions and number of the openings 15 and 17 are determined so as to obtain the air flow that cools the reactor 23, the main transformer 26, and the reactor 28 most efficiently.
  • the air from the region 5 does not enter the region 4 where the control device 30 is located by the partition member 2 and the grommet 7. Therefore, the temperature in the region 4 can be kept lower than the temperature in the region 5 heated by the semiconductor element 25 or the like, and the reliability of the control device 30 can be improved.
  • the main transformer 26 and reactors 23 and 28 arranged in the region 6 have a very high temperature in the region 6 that generates a large amount of heat.
  • the temperature in the region 5 is determined from the reactor 23, the main transformer 26, and the reactor 28. It can be kept at a relatively low temperature without being affected by the heat. Accordingly, since the air in the region 5 sent to the heat radiating unit 8 by the fan 11 is relatively low in temperature, the rectifier diode 22 and the semiconductor element 25 arranged directly on the outer peripheral portion 8B of the heat radiating unit 8 are efficiently cooled.
  • the partition member 3 when the partition member 3 is not present, air heated by a member having a large calorific value such as the reactor 23, the main transformer 26, the reactor 28, etc. disposed in the region 6 Get in. In this case, the air is sucked into the fan 11 arranged in the region 5, and the heated air flows in the cavity 8A of the heat radiating unit 8, so that the heat radiating efficiency of the heat radiating unit 8 is lowered.
  • the heat dissipation efficiency of the heat dissipation unit 8 is lowered, the temperature of the rectifier diode 22 and the semiconductor element 25 is increased, and the reliability of the rectifier diode 22 and the semiconductor element 25 is lowered.
  • the temperature difference between the region 5 and the region 6 when the partition member 3 is provided is about 20 ° C.
  • the rectifier diode 27 is also directly mounted on the outer peripheral portion 8 B of the heat radiating unit 8. Like the diode 22 and the semiconductor element 25, the rectifier diode 27 can be efficiently cooled and improved in reliability by separating the interior of the housing 1 into the regions 5 and 6 by the cutting member 3. it can.
  • a main transformer 26 and a reactor 28, which generate heat and become high temperature, are disposed below the opening 10 of the heat dissipation unit 8 through which air from the fan 11 is blown. With this arrangement, air can be directly applied to the main transformer 26 and the reactor 28, and the main transformer 26 and the reactor 28 can be efficiently cooled.
  • the side plate 12 can be replaced to change the opening.
  • the position and number of the part 13 and the opening 15 can be changed.
  • the position and number of the openings 17 can be changed by replacing the bottom plate 16.
  • the direction of the wind can be changed so that the wind flows through the parts to be cooled, and the cooling efficiency can be increased.
  • the dust in the region 6 can be discharged to the lower side of the bottom plate 17 through the opening 17 and the accumulation of dust in the region 6 can be suppressed.
  • the height of the side plate 12 is changed and the attachment position of the partition member 2 is changed even if the number of parts of the control apparatus 30 and the size of the parts are changed. By changing it, the height of area 4 can be changed, and the necessary space can be secured. Even in this case, since the basic structure of the welding apparatus 1001 does not change, the above-described effects relating to cooling can be obtained.
  • the interior of the housing 1 is divided into three regions by two partition members.
  • the number of partition members and areas is not limited to this one
  • the inside of the housing 1 can be divided into two areas, for example, the area 4 and the area 5 or the area 5 and the area 6 can be divided.
  • the interior of the housing 1 may be divided into four or more areas by three or more partition members.
  • the embodiment is widely useful not only for welding apparatuses but also for apparatuses that incorporate an electrical element with a large amount of heat generation and require cooling.
  • the welding apparatus according to the present invention can efficiently cool a member provided in the casing, and is useful as an electric device incorporating a member that generates high heat.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Arc Welding Control (AREA)
  • Generation Of Surge Voltage And Current (AREA)

Abstract

L'invention concerne un dispositif de soudage comprenant un boîtier, un élément de partition destiné à diviser l'espace intérieur du boîtier en une première région et une seconde région, une unité de dissipation thermique en forme de tunnel destinée à faire circuler l'air entre la première région et la seconde région, un ventilateur destiné à faire passer l'air à travers une partie creuse de l'unité de dissipation thermique, un premier élément électrique agencé dans la première région, et un second élément électrique agencé dans la seconde région. Ce dispositif de soudage permet d'atteindre un degré de fiabilité élevé étant donné que la température dans la seconde région est abaissée.
PCT/JP2005/022925 2005-10-11 2005-12-14 Dispositif de soudage WO2007043192A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005296308A JP2007105741A (ja) 2005-10-11 2005-10-11 溶接装置
JP2005-296308 2005-10-11

Publications (1)

Publication Number Publication Date
WO2007043192A1 true WO2007043192A1 (fr) 2007-04-19

Family

ID=37942459

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2005/022925 WO2007043192A1 (fr) 2005-10-11 2005-12-14 Dispositif de soudage

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JP (1) JP2007105741A (fr)
CN (1) CN100488691C (fr)
WO (1) WO2007043192A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100922181B1 (ko) * 2008-11-28 2009-10-19 김순기 이산화탄소 아크 용접기
KR200447665Y1 (ko) 2009-03-11 2010-02-11 최금주 인버터 용접기
JP5641645B2 (ja) * 2010-11-17 2014-12-17 株式会社ダイヘン 溶接電源
CN102189358B (zh) * 2010-03-10 2015-09-30 株式会社大亨 焊接电源
JP6387530B2 (ja) * 2013-10-21 2018-09-12 パナソニックＩｐマネジメント株式会社 電源制御装置
JP6319074B2 (ja) * 2014-12-15 2018-05-09 富士電機株式会社 電力変換装置
EP3858600A4 (fr) 2018-09-28 2022-06-22 Dai Nippon Printing Co., Ltd. Feuille décorative et matériau décoratif l'utilisant

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57136586U (fr) * 1981-02-20 1982-08-26
JPS61187399A (ja) * 1985-02-15 1986-08-21 松下電器産業株式会社 発熱体の冷却装置
JP2000196274A (ja) * 1998-12-22 2000-07-14 Esab Group Inc:The 電力供給装置

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JPS5243925Y2 (fr) * 1972-03-06 1977-10-05
JPS5393519U (fr) * 1976-12-28 1978-07-31
JPS55154688U (fr) * 1979-04-23 1980-11-07
JPS56142885U (fr) * 1980-03-31 1981-10-28
JPS5977578U (ja) * 1982-11-16 1984-05-25 株式会社三社電機製作所 小型溶接機の冷却装置
JPH0293077U (fr) * 1989-01-06 1990-07-24
JPH0697688A (ja) * 1992-09-16 1994-04-08 Toshiba Corp 電子機器の冷却構造
JPH0686872U (ja) * 1993-05-19 1994-12-20 東洋電機株式会社 プラズマアーク切断・溶接機
JP2907746B2 (ja) * 1995-01-31 1999-06-21 株式会社三社電機製作所 電源装置
JP3253882B2 (ja) * 1997-01-14 2002-02-04 株式会社ケンウッド 強制空冷放熱器
JP3323418B2 (ja) * 1997-03-17 2002-09-09 株式会社三社電機製作所 電源装置用ケース

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57136586U (fr) * 1981-02-20 1982-08-26
JPS61187399A (ja) * 1985-02-15 1986-08-21 松下電器産業株式会社 発熱体の冷却装置
JP2000196274A (ja) * 1998-12-22 2000-07-14 Esab Group Inc:The 電力供給装置

Also Published As

Publication number Publication date
JP2007105741A (ja) 2007-04-26
CN101039773A (zh) 2007-09-19
CN100488691C (zh) 2009-05-20

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